CN1993427B - 可固化的有机基聚硅氧烷组合物、其固化方法、半导体器件和粘合促进剂 - Google Patents

可固化的有机基聚硅氧烷组合物、其固化方法、半导体器件和粘合促进剂 Download PDF

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CN1993427B
CN1993427B CN2005800256553A CN200580025655A CN1993427B CN 1993427 B CN1993427 B CN 1993427B CN 2005800256553 A CN2005800256553 A CN 2005800256553A CN 200580025655 A CN200580025655 A CN 200580025655A CN 1993427 B CN1993427 B CN 1993427B
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methacrylate
acrylate
vinyl
molecule
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CN1993427A (zh
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森田好次
加藤智子
植木浩
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Sealing Material Composition (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Led Device Packages (AREA)
CN2005800256553A 2004-07-29 2005-07-28 可固化的有机基聚硅氧烷组合物、其固化方法、半导体器件和粘合促进剂 Expired - Fee Related CN1993427B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP222072/2004 2004-07-29
JP2004222072 2004-07-29
JP2004237719A JP2006063092A (ja) 2004-07-29 2004-08-17 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP237719/2004 2004-08-17
PCT/JP2005/014354 WO2006011676A1 (en) 2004-07-29 2005-07-28 Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter

Publications (2)

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CN1993427A CN1993427A (zh) 2007-07-04
CN1993427B true CN1993427B (zh) 2011-06-22

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US (2) US7842755B2 (https=)
EP (1) EP1781741B1 (https=)
JP (1) JP2006063092A (https=)
KR (1) KR101278456B1 (https=)
CN (1) CN1993427B (https=)
AT (1) ATE406414T1 (https=)
DE (1) DE602005009373D1 (https=)
TW (1) TWI388628B (https=)
WO (1) WO2006011676A1 (https=)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009111196A1 (en) * 2008-03-04 2009-09-11 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5247979B2 (ja) * 2005-06-01 2013-07-24 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 透明な硬化物を与えるポリオルガノシロキサン組成物
JP4628270B2 (ja) * 2006-01-20 2011-02-09 信越化学工業株式会社 熱硬化性組成物
JP4820184B2 (ja) * 2006-02-20 2011-11-24 シチズン電子株式会社 発光装置とその製造方法
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
US20070212556A1 (en) 2006-03-07 2007-09-13 Musa Osama M Curable materials containing siloxane
JP4789663B2 (ja) * 2006-03-17 2011-10-12 信越化学工業株式会社 熱硬化性組成物及び該組成物から得られる層を備えたフィルム
JP5060074B2 (ja) 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2008201971A (ja) * 2007-02-22 2008-09-04 Shin Etsu Chem Co Ltd 繊維強化複合材料用液状付加硬化性シリコーン組成物、繊維強化シリコーン複合材料およびその製造方法
JP2008222828A (ja) * 2007-03-12 2008-09-25 Momentive Performance Materials Japan Kk 凸レンズ形成用シリコーンゴム組成物及びそれを用いた光半導体装置
JP5000566B2 (ja) * 2008-03-27 2012-08-15 信越化学工業株式会社 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置
JP5579371B2 (ja) * 2008-04-23 2014-08-27 東レ・ダウコーニング株式会社 含ケイ素ポリマー、及び硬化性ポリマー組成物
JP5469874B2 (ja) * 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
US8946353B2 (en) 2008-10-31 2015-02-03 Dow Corning Toray Co. Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
JP5732187B2 (ja) * 2009-01-22 2015-06-10 新日鉄住金化学株式会社 硬化物の製造方法
JPWO2010098285A1 (ja) * 2009-02-24 2012-08-30 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
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JP5231472B2 (ja) * 2010-03-15 2013-07-10 信越化学工業株式会社 発光ダイオード用付加硬化型シリコーン樹脂組成物
WO2011162294A1 (ja) * 2010-06-24 2011-12-29 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
EP2599836B1 (en) * 2010-07-27 2015-03-25 Adeka Corporation Curable composition for semiconductor encapsulation
JP2012121950A (ja) * 2010-12-07 2012-06-28 Shin-Etsu Chemical Co Ltd 硬化性シリコーン組成物及びシリコーン樹脂硬化物
JP5553018B2 (ja) * 2010-12-16 2014-07-16 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物、光学素子封止材及び光学素子
JP5522111B2 (ja) 2011-04-08 2014-06-18 信越化学工業株式会社 シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP5893874B2 (ja) * 2011-09-02 2016-03-23 信越化学工業株式会社 光半導体装置
WO2013061908A1 (ja) * 2011-10-25 2013-05-02 株式会社Adeka 光硬化性樹脂組成物及び新規シロキサン化合物
JP2013095805A (ja) * 2011-10-28 2013-05-20 Shin-Etsu Chemical Co Ltd 放射線硬化性シリコーンゴム組成物
WO2013077700A1 (ko) 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
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JP5987221B2 (ja) * 2012-07-27 2016-09-07 エルジー・ケム・リミテッド 硬化性組成物
JP6212122B2 (ja) * 2012-12-28 2017-10-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
EP2945994B1 (en) 2013-01-18 2018-07-11 Basf Se Acrylic dispersion-based coating compositions
JP6213257B2 (ja) * 2013-01-25 2017-10-18 セントラル硝子株式会社 シリコーンを含む硬化性組成物およびその硬化物
JP5977711B2 (ja) * 2013-05-13 2016-08-24 アオイ電子株式会社 半導体装置およびその製造方法
JP6163009B2 (ja) * 2013-05-13 2017-07-12 アオイ電子株式会社 半導体装置の製造方法
EP3039079B1 (en) * 2013-08-29 2022-05-18 Ddp Specialty Electronic Materials Us 9, Llc. Curable silicone composition, cured product thereof, and optical semiconductor device
CN105473664A (zh) * 2013-08-30 2016-04-06 道康宁东丽株式会社 单部分可固化有机硅组合物以及光学半导体器件
WO2015093329A1 (ja) * 2013-12-19 2015-06-25 東レ・ダウコーニング株式会社 シリコーン接着性フィルム、および半導体装置
CN105018022B (zh) * 2014-04-28 2017-08-11 天津德高化成新材料股份有限公司 一种快速固化发光二极管灯丝封装胶及制备方法
CN106462056A (zh) * 2014-06-04 2017-02-22 道康宁公司 用于光学器件的热熔型可固化有机硅组合物的压印工艺
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
CN104403627A (zh) * 2014-11-12 2015-03-11 北京化工大学常州先进材料研究院 一种高折光率紫外光/湿气双固化有机硅粘合剂
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JP6519305B2 (ja) * 2015-05-11 2019-05-29 富士電機株式会社 封止材用シリコーン樹脂組成物及び該組成物を用いたパワー半導体モジュール
US9777203B2 (en) * 2015-06-08 2017-10-03 Momentive Performance Materials Silicone pressure sensitive adhesive compositions and protective films containing the same
KR101695316B1 (ko) 2015-08-13 2017-01-11 주식회사 케이씨씨 경화성 오르가노폴리실록산 조성물 및 이를 이용한 광반도체 장치
CN105199051A (zh) * 2015-11-02 2015-12-30 宋介珍 透明有机硅材料及其制备方法
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JP6799067B2 (ja) * 2016-09-26 2020-12-09 ダウ・東レ株式会社 硬化反応性シリコーンゲルおよびその用途
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US20210246337A1 (en) 2018-06-29 2021-08-12 Dow Silicones Corporation Solventless silicone pressure sensitive adhesive and methods for making and using same
EP3851502A4 (en) * 2018-09-11 2022-06-08 Shin-Etsu Chemical Co., Ltd. PRIMER COMPOSITION FOR BONDING SILICONE RESIN AND POLYOLEFIN RESIN, AND METHOD FOR BONDING SILICONE RESIN AND POLYOLEFIN RESIN
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191914A (ja) * 1998-12-28 2000-07-11 Dow Corning Toray Silicone Co Ltd 硬化性組成物
JP2001240750A (ja) * 2000-02-28 2001-09-04 Dow Corning Toray Silicone Co Ltd 硬化性有機樹脂組成物および硬化樹脂
JP2003147214A (ja) * 2001-11-12 2003-05-21 Dow Corning Toray Silicone Co Ltd 有機樹脂用添加剤、それを含有する硬化性有機樹脂組成物、およびその硬化物
WO2004037927A1 (en) * 2002-10-28 2004-05-06 Dow Corning Toray Silicone Co., Ltd. Curable organopolysiloxane composition and a semiconductor device made with the use of this composition

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1235245A (en) * 1984-12-26 1988-04-12 Toshifumi Hirose Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer
JPH0641563A (ja) 1992-07-21 1994-02-15 Kao Corp 潤滑剤及びこれを用いた磁気記録媒体
JPH06145525A (ja) 1992-11-05 1994-05-24 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
EP0635553B1 (en) * 1993-07-22 2000-01-26 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Curable composition
US5506302A (en) * 1993-09-10 1996-04-09 Shin-Etsu Chemical Co., Inc. Organopolysiloxane composition and rubber substrate having a coating thereof
JPH07283441A (ja) 1994-04-15 1995-10-27 Toshiba Corp 光半導体装置及びその製造方法
JP3174713B2 (ja) * 1995-04-21 2001-06-11 信越化学工業株式会社 シリコーン接着性組成物
AUPN585595A0 (en) * 1995-10-06 1995-11-02 Commonwealth Scientific And Industrial Research Organisation Control of molecular weight and end-group functionality in polymers
US5595826A (en) * 1995-10-11 1997-01-21 Dow Corning Corporation Curable organopolysiloxane compositions with improved adhesion
JP2001168398A (ja) 1999-12-13 2001-06-22 Nichia Chem Ind Ltd 発光ダイオード及び製造方法
US6234857B1 (en) * 2000-05-04 2001-05-22 Kevin M. Suellentrop Pet recreation flotation device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191914A (ja) * 1998-12-28 2000-07-11 Dow Corning Toray Silicone Co Ltd 硬化性組成物
JP2001240750A (ja) * 2000-02-28 2001-09-04 Dow Corning Toray Silicone Co Ltd 硬化性有機樹脂組成物および硬化樹脂
JP2003147214A (ja) * 2001-11-12 2003-05-21 Dow Corning Toray Silicone Co Ltd 有機樹脂用添加剤、それを含有する硬化性有機樹脂組成物、およびその硬化物
WO2004037927A1 (en) * 2002-10-28 2004-05-06 Dow Corning Toray Silicone Co., Ltd. Curable organopolysiloxane composition and a semiconductor device made with the use of this composition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP平8-291254A 1996.11.05

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