CN1774965A - 模块元件及其制造方法 - Google Patents

模块元件及其制造方法 Download PDF

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Publication number
CN1774965A
CN1774965A CNA200580000316XA CN200580000316A CN1774965A CN 1774965 A CN1774965 A CN 1774965A CN A200580000316X A CNA200580000316X A CN A200580000316XA CN 200580000316 A CN200580000316 A CN 200580000316A CN 1774965 A CN1774965 A CN 1774965A
Authority
CN
China
Prior art keywords
module component
separator
substrate
resin
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200580000316XA
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English (en)
Chinese (zh)
Inventor
藤原城二
桧森刚司
恒冈道朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1774965A publication Critical patent/CN1774965A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15159—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CNA200580000316XA 2004-03-30 2005-03-17 模块元件及其制造方法 Pending CN1774965A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP098934/2004 2004-03-30
JP2004098934 2004-03-30

Publications (1)

Publication Number Publication Date
CN1774965A true CN1774965A (zh) 2006-05-17

Family

ID=35125486

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200580000316XA Pending CN1774965A (zh) 2004-03-30 2005-03-17 模块元件及其制造方法

Country Status (4)

Country Link
US (1) US7659604B2 (de)
EP (1) EP1631137A4 (de)
CN (1) CN1774965A (de)
WO (1) WO2005099331A1 (de)

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CN102176438A (zh) * 2010-10-11 2011-09-07 日月光半导体制造股份有限公司 双面封装结构及应用其的无线通信系统
CN102364683A (zh) * 2011-10-21 2012-02-29 华为终端有限公司 封装结构、方法、及电子设备
CN104378962A (zh) * 2013-08-12 2015-02-25 太阳诱电株式会社 电路模块及其制造方法
CN104425461A (zh) * 2013-08-19 2015-03-18 太阳诱电株式会社 电路模块
TWI485839B (zh) * 2012-12-24 2015-05-21 Advanced Semiconductor Eng 電子模組以及其製造方法
CN104838737A (zh) * 2012-12-11 2015-08-12 高通股份有限公司 用于适形屏蔽的方法和装置
CN106033755A (zh) * 2015-03-17 2016-10-19 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽的半导体器件和基板带
CN108630629A (zh) * 2017-03-23 2018-10-09 三星电机株式会社 半导体封装件及其制造方法
CN111244040A (zh) * 2018-11-28 2020-06-05 蔡宗哲 半导体封装及其制作方法
CN111244067A (zh) * 2018-11-28 2020-06-05 蔡宗哲 半导体封装、具有封装内隔室屏蔽的半导体封装及其制作方法
CN111357395A (zh) * 2017-11-20 2020-06-30 株式会社村田制作所 高频模块
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
US11239179B2 (en) 2018-11-28 2022-02-01 Shiann-Tsong Tsai Semiconductor package and fabrication method thereof

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JP6136152B2 (ja) * 2012-09-11 2017-05-31 日本電気株式会社 モジュール部品の製造方法
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JP6262776B2 (ja) * 2014-02-04 2018-01-17 太陽誘電株式会社 回路モジュール
CN105336629B (zh) * 2014-08-08 2018-11-27 日月光半导体制造股份有限公司 电子封装模块的制造方法以及电子封装模块
JP6443458B2 (ja) * 2015-01-30 2018-12-26 株式会社村田製作所 電子回路モジュール
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WO2019135376A1 (ja) * 2018-01-05 2019-07-11 株式会社村田製作所 高周波モジュール
KR102518174B1 (ko) * 2018-04-05 2023-04-05 삼성전기주식회사 전자 소자 모듈
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CN102176438A (zh) * 2010-10-11 2011-09-07 日月光半导体制造股份有限公司 双面封装结构及应用其的无线通信系统
CN102364683A (zh) * 2011-10-21 2012-02-29 华为终端有限公司 封装结构、方法、及电子设备
US10091918B2 (en) 2012-12-11 2018-10-02 Qualcomm Incorporated Methods and apparatus for conformal shielding
CN104838737A (zh) * 2012-12-11 2015-08-12 高通股份有限公司 用于适形屏蔽的方法和装置
TWI485839B (zh) * 2012-12-24 2015-05-21 Advanced Semiconductor Eng 電子模組以及其製造方法
CN104378962A (zh) * 2013-08-12 2015-02-25 太阳诱电株式会社 电路模块及其制造方法
CN104378962B (zh) * 2013-08-12 2019-06-28 太阳诱电株式会社 电路模块及其制造方法
CN104425461A (zh) * 2013-08-19 2015-03-18 太阳诱电株式会社 电路模块
CN104425461B (zh) * 2013-08-19 2018-04-13 太阳诱电株式会社 电路模块
CN106033755A (zh) * 2015-03-17 2016-10-19 晟碟信息科技（上海）有限公司 具有电磁干扰屏蔽的半导体器件和基板带
CN108630629A (zh) * 2017-03-23 2018-10-09 三星电机株式会社 半导体封装件及其制造方法
CN111357395A (zh) * 2017-11-20 2020-06-30 株式会社村田制作所 高频模块
CN111357395B (zh) * 2017-11-20 2022-03-11 株式会社村田制作所 高频模块
CN111244040A (zh) * 2018-11-28 2020-06-05 蔡宗哲 半导体封装及其制作方法
CN111244067A (zh) * 2018-11-28 2020-06-05 蔡宗哲 半导体封装、具有封装内隔室屏蔽的半导体封装及其制作方法
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
US11239179B2 (en) 2018-11-28 2022-02-01 Shiann-Tsong Tsai Semiconductor package and fabrication method thereof

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Publication number Publication date
WO2005099331A1 (ja) 2005-10-20
US7659604B2 (en) 2010-02-09
EP1631137A4 (de) 2009-05-27
US20060258050A1 (en) 2006-11-16
EP1631137A1 (de) 2006-03-01

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