JP4732128B2 - 高周波無線モジュール - Google Patents
高周波無線モジュール Download PDFInfo
- Publication number
- JP4732128B2 JP4732128B2 JP2005318134A JP2005318134A JP4732128B2 JP 4732128 B2 JP4732128 B2 JP 4732128B2 JP 2005318134 A JP2005318134 A JP 2005318134A JP 2005318134 A JP2005318134 A JP 2005318134A JP 4732128 B2 JP4732128 B2 JP 4732128B2
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- JP
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- Prior art keywords
- module
- circuit board
- function unit
- antenna
- sealing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15323—Connection portion the connection portion being formed on the die mounting surface of the substrate being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Description
前記アンテナ導体と前記無線機能部を導電接続する接続導体とを有する高周波無線モジュールを提案する。
Claims (3)
- 無線機能部を構成する電子部品と、前記無線機能部に接続されたアンテナ導体とを有し、前記無線機能部と前記アンテナ導体とが同一の配線回路基板に搭載されてなる高周波無線モジュールにおいて、
前記無線機能部を構成する1つ以上の電子部品が、前記配線回路基板上の配線に接続されて配線回路基板の表面に搭載されると共に、
前記配線回路基板上に前記電子部品を覆うように設けられた電気的な絶縁性を有する封止部材と、
前記封止部材の表面に対して裏面が当接するように設けられた誘電体基板と、該誘電体基板の表面に設けられた前記アンテナ導体とからなるアンテナ部と、
前記封止部材と前記誘電体基板との間に配置されるように設けられたシールド電極と、
前記アンテナ導体と前記無線機能部を導電接続する接続導体とを有する
ことを特徴とする高周波無線モジュール。 - 前記接続導体と前記シールド電極との間に導電接続されたインピーダンス整合素子を有する
ことを特徴とする請求項1に記載の高周波無線モジュール。 - 無線機能部を構成する複数の電子部品と、前記無線機能部に接続されたアンテナ導体とを有し、前記無線機能部と前記アンテナ導体とが同一の配線回路基板に搭載されてなる高周波無線モジュールにおいて、
前記無線機能部を構成する1つ以上の電子部品が、前記配線回路基板の配線に接続されて配線回路基板の表面と配線回路基板裏面に形成されたキャビティ内に搭載されると共に、
前記配線回路基板表面上に搭載されている電子部品を覆うように設けられた電気的な絶縁性を有する封止部材と、
前記封止部材の表面に対して裏面が当接するように設けられた誘電体基板と、該誘電体基板の表面に設けられた前記アンテナ導体とからなるアンテナ部と、
前記封止部材と前記誘電体基板との間に配置されるように設けられたシールド電極と、
前記アンテナ導体と前記無線機能部を導電接続する接続導体とを有する
ことを特徴とする高周波無線モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005318134A JP4732128B2 (ja) | 2005-11-01 | 2005-11-01 | 高周波無線モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005318134A JP4732128B2 (ja) | 2005-11-01 | 2005-11-01 | 高周波無線モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007129304A JP2007129304A (ja) | 2007-05-24 |
JP4732128B2 true JP4732128B2 (ja) | 2011-07-27 |
Family
ID=38151626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005318134A Expired - Fee Related JP4732128B2 (ja) | 2005-11-01 | 2005-11-01 | 高周波無線モジュール |
Country Status (1)
Country | Link |
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JP (1) | JP4732128B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111739876A (zh) * | 2020-05-20 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | 封装天线结构、其制作方法和电子设备 |
CN112490201A (zh) * | 2020-12-28 | 2021-03-12 | 浙江威固信息技术有限责任公司 | 一种芯片封装装置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8558637B2 (en) * | 2010-05-12 | 2013-10-15 | Mediatek Inc. | Circuit device with signal line transition element |
KR20120035394A (ko) * | 2010-10-05 | 2012-04-16 | 삼성전자주식회사 | 수직구조의 전송선로 트랜지션 및 랜드 그리드 어레이 접합를 이용한 단일 칩 패키지를 위한 장치 |
JP5729186B2 (ja) | 2011-07-14 | 2015-06-03 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
JP5710558B2 (ja) * | 2012-08-24 | 2015-04-30 | 株式会社東芝 | 無線装置、それを備えた情報処理装置及び記憶装置 |
JP6094287B2 (ja) * | 2013-03-15 | 2017-03-15 | 株式会社村田製作所 | アンテナ一体型モジュールの製造方法およびアンテナ一体型モジュール |
EP3080841A4 (en) * | 2013-12-09 | 2017-08-23 | Intel Corporation | Antenna on ceramics for a packaged die |
JP6238239B2 (ja) * | 2014-11-27 | 2017-11-29 | アルプス電気株式会社 | 通信モジュール |
WO2017094836A1 (ja) * | 2015-12-04 | 2017-06-08 | 株式会社村田製作所 | シールドを有するモジュール |
DE102016102742A1 (de) * | 2016-02-17 | 2017-08-17 | Snaptrack, Inc. | HF-Frontend für ein Automobilradarsystem |
JP6500859B2 (ja) * | 2016-08-22 | 2019-04-17 | 株式会社村田製作所 | 無線モジュール |
US10037951B2 (en) * | 2016-11-29 | 2018-07-31 | Cyntec Co., Ltd. | Semiconductor package with antenna |
DE102017200126A1 (de) | 2017-01-05 | 2018-07-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung |
DE102017200127A1 (de) * | 2017-01-05 | 2018-07-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung |
JP2020161853A (ja) * | 2017-07-18 | 2020-10-01 | アルプスアルパイン株式会社 | 電子装置 |
JP7013323B2 (ja) | 2018-05-17 | 2022-01-31 | 株式会社東芝 | 回路装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6181001A (ja) * | 1984-09-28 | 1986-04-24 | Mitsubishi Electric Corp | アンテナ |
JP2542422B2 (ja) * | 1988-06-09 | 1996-10-09 | 古河電気工業株式会社 | 平面アンテナ付き電子回路ユニット |
JP3824742B2 (ja) * | 1997-07-04 | 2006-09-20 | シチズン電子株式会社 | 電子回路のパッケージ構造 |
JP2002135041A (ja) * | 2000-10-26 | 2002-05-10 | Tdk Corp | パッチアンテナおよびそれを含むrfユニット |
JP2002141726A (ja) * | 2000-11-02 | 2002-05-17 | Yokowo Co Ltd | 電子部品一体型のアンテナ |
JP2002299553A (ja) * | 2001-03-29 | 2002-10-11 | Citizen Watch Co Ltd | モジュール及びその製造方法 |
JP2003101320A (ja) * | 2001-09-20 | 2003-04-04 | Toshiba Microelectronics Corp | 半導体集積回路 |
JP2004274259A (ja) * | 2003-03-06 | 2004-09-30 | Tdk Corp | アンテナ一体型モジュールおよび通信機 |
JP2005044999A (ja) * | 2003-07-22 | 2005-02-17 | Renesas Technology Corp | 半導体装置 |
JP2005117139A (ja) * | 2003-10-03 | 2005-04-28 | Mitsubishi Electric Corp | マイクロ波モジュール、及びこれを用いたアレーアンテナ装置 |
CN1774965A (zh) * | 2004-03-30 | 2006-05-17 | 松下电器产业株式会社 | 模块元件及其制造方法 |
-
2005
- 2005-11-01 JP JP2005318134A patent/JP4732128B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111739876A (zh) * | 2020-05-20 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | 封装天线结构、其制作方法和电子设备 |
CN112490201A (zh) * | 2020-12-28 | 2021-03-12 | 浙江威固信息技术有限责任公司 | 一种芯片封装装置 |
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JP2007129304A (ja) | 2007-05-24 |
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