CN1309283C - 电路装置的制造方法 - Google Patents

电路装置的制造方法 Download PDF

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Publication number
CN1309283C
CN1309283C CNB031603319A CN03160331A CN1309283C CN 1309283 C CN1309283 C CN 1309283C CN B031603319 A CNB031603319 A CN B031603319A CN 03160331 A CN03160331 A CN 03160331A CN 1309283 C CN1309283 C CN 1309283C
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conductive foil
parts
manufacture method
circuit arrangement
conductive
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CN1498063A (zh
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酒井纪泰
五十岚优助
野口正人
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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    • H—ELECTRICITY
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    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
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    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Abstract

一种电路装置的制造方法，可防止在进行树脂密封的工序中位于导电箔(10)和下模(28A)之间的气体利用封入压力汇集并将导电箔(10)局部抬起的现象。这种电路装置的制造方法包括下述步骤：将形成多个电路元件(22)的搭载部(15)的导电图案(21)按每个部件(12)形成于导电箔(10)上；将电路元件(22)配置在每个部件(12)的导电图案(21)的各搭载部(15)上；按每个部件(12)，使设有气孔(30)的下模(28A)与导电箔(10)的背面接触，将部件(12)的各搭载部(15)配置在同一模腔内，用绝缘性树脂(20)进行传递模模装，从而使导电箔(10)背面和下模(28A)之间的气体排放到外部，同时进行树脂密封；按每个各搭载部(15)切割绝缘性树脂(20)进行分离。

Description

电路装置的制造方法
技术领域
本发明涉及电路装置的制造方法，尤其涉及可防止在进行树脂密封的工序中板状体在模型内部发生变形的电路装置的制造方法。
背景技术
参照图13，说明现有电路装置的制造方法。图13(A)是进行传递模模装的工序的剖面图，图13(B)是导电箔110的平面图，图13(C)是进行模装时的剖面图(例如参照专利文献1)。
参照图13(A)及图13(B)，简单说明进行模装前的工序。首先，通过在导电箔110上形成分离槽111形成导电图案121。导电图案121通过将形成一个电路装置的搭载部形成矩阵状，形成一个部件112。然后，将半导体元件122A及片状电阻122B固定在各搭载部的导电图案121A上。接着，将半导体元件122A用金属配线125A与半导体图案121B电连接。然后，对每个部件112用一个模腔由绝缘性树脂120进行密封。利用以上的工序密封各部件112的电路元件122，在分离槽111中也充填绝缘性树脂120。
参照图13(C)，说明使用模装模型128进行的密封工序。对每个部件112进行树脂密封的模装模腔128由下模128A及上模128B构成。下模128A的与导电箔110接触的面平坦地形成。上模128B具有在固定有电路元件122的导电箔110上方形成模腔的形状。在模型128的侧面部形成浇口，通过自该部位封入绝缘性树脂120进行树脂密封。
在利用上述工序进行模装后，整面除去导电箔110的背面，直至图13(A)的虚线所示的部位，从而将各导电图案121电分离。最后，为了处理背面，形成抗焊剂及外部电极，通过切割分离为一个个装置，从而完成电路装置。
专利文献1为特愿2000-266752。
发明内容
但是，在上述模装工序中，有时在导电箔110的背面和下模128A之间存在气体。这种情况下，在自设于模型128侧面的浇口封入绝缘性树脂120时，气体会汇集在设有浇口的部位的相反侧，气体的压力在模腔内部会使导电箔110局部上浮。而当在模腔内部导电箔110局部上浮后，固定在该部位的导电箔110上的电路元件122及金属配线125A就会接触上模128B。这会引起金属配线125A的折曲等。
本发明就是鉴于上述问题而开发的，本发明的目的在于，提供一种电路装置的制造方法，其可防止在模装工序中导电箔的局部上浮。
本发明的电路装置的制造方法包括下述工序：在导电箔上面形成多个部件的工序，该部件包含由多个导电图案构成的搭载部；在每个所述部件的所述各个搭载部上配置电路元件的工序；使在每个所述部件上设置气孔的下模与所述导电箔的背面接触，通过在同一模腔内配置所述部件的各个搭载部并且利用绝缘性树脂进行传递模制，使所述导电箔的背面和所述下模之间的气体排放到外部，同时进行树脂密封；对每个所述搭载部通过切割对所述绝缘树脂进行分离的工序，设置在所述下模的所述气孔从所述膜腔的内部到所述导电箔的外侧延伸。
因此，在模装工序中，可抑制上述板状体局部弯曲，抑制配置在该板状体表面的电路元件与模腔顶面接触而破损。在此，板状体包括例如导电箔、多张导电箔介由绝缘层层积而成的绝缘板、玻璃环氧树脂衬底、金属衬底、陶瓷衬底等公知的衬底。
附图说明
图1是说明本发明的电路装置制造方法的剖面图(A)、平面图(B)；
图2是说明本发明的电路装置制造方法的剖面图；
图3是说明本发明的电路装置制造方法的剖面图(A)、平面图(B)；
图4是说明本发明的电路装置制造方法的剖面图；
图5是说明本发明的电路装置制造方法的平面图(A)、剖面图(B)；
图6是说明本发明的电路装置制造方法的剖面图(A)、平面图(B)；
图7是说明本发明的电路装置制造方法的剖面图(A)、平面图(B)；
图8是说明本发明的电路装置制造方法的平面图；
图9是说明本发明的电路装置制造方法的剖面图；
图10是说明本发明的电路装置制造方法的剖面图(A)、剖面图(B)、剖面图(C)；
图11是说明本发明的电路装置制造方法的剖面图(A)、平面图(B)；
图12是说明本发明的电路装置制造方法的剖面图(A)、剖面图(B)、剖面图(C)；
图13是说明现有电路装置制造方法的图。
具体实施方式
实施例1
本发明的电路装置的制造方法包括下述工序：将形成多个电路元件22的搭载部15的导电图案21按每个部件12形成于导电箔10上；将电路元件22配置在每个部件12的导电图案21的各搭载部15上；按每个部件12，使设有气孔30的下模28A与导电箔10的背面接触，将部件12的各搭载部15配置在同一模腔内，用绝缘性树脂20进行传递模模装，从而使导电箔10背面和下模128A之间的气体排放到外部，同时进行树脂密封；按每个各搭载部15切割绝缘性树脂20进行分离。下面说明上述各工序。
如图1～图3所示，本发明的第一工序是将形成多个电路元件22的搭载部15的导电图案21按每个部件12形成于导电箔10上的工序。具体地说，例如准备导电箔10，至少在形成多个电路元件22的搭载部的导电图案21之外的区域的导电箔10上形成比导电箔10的厚度浅的分离槽11，形成每个部件12的导电图案21。
在本工序中，首先，如图1(A)所示，准备片状导电箔10。该导电箔10考虑焊剂的附着性、接合性、镀敷性而选择材料，可采用以铜为主材的导电箔、以铝为主材的导电箔或由铁镍等合金构成的导电箔等。
具体地说，如图1(B)所示，在矩形导电箔10上形成多个搭载部的部件12间隔排列有4～5个。各部件12之间设有缝隙13，吸收模装工序等加热处理中产生的导电箔10的应力，在导电箔10的上下周端以一定间隔设有指示孔14，用于在各工序的定位。然后，形成每个部件的导电图案21。
首先，如图2所示，在导电箔10的上面形成光致抗蚀剂(抗蚀刻掩模)PR，对光致抗蚀剂层PR进行制图，使除形成导电图案21的区域之外的导电箔10露出。然后，如图3(A)所示，介由光致抗蚀剂PR选择性蚀刻导电箔10。由蚀刻形成的分离槽11的深度例如是50μm，其侧面形成粗糙面，故提高了与绝缘性树脂20的粘接性。
该分离槽11的侧壁按除去方法形成不同的结构，该除去工序可采用湿式蚀刻、干式蚀刻、激光蒸发及切割。在湿式蚀刻的情况下，蚀刻剂主要采用氯化铁或氯化铜，所述导电箔或浸渍于该蚀刻剂中或由该蚀刻剂喷射。这里，湿式蚀刻通常进行非各向异性蚀刻，故侧面形成弯曲结构。
图3(B)表示具体的导电图案21。本图对应于图1(B)所示的部件12的一个的放大图。一个涂黑的部分是一个搭载部15，构成导电图案21，一个部件12上呈五行十列矩阵状排列多个搭载部15，每个各搭载部15设有相同的导电图案21。在各部件的周边设有框状的图案16，离开它，在其稍微内侧设有切割时的对位标志17。
如图4所示，本发明的第二工序在于，在每个所述部件12的所述导电图案21的各搭载部15上配置电路元件22。作为电路元件22是晶体管、二极管、IC芯片等半导体元件、片状电容器、片状电阻等无源元件。另外，虽然会使厚度增加，但也可安装CSP、BGA等倒装的半导体元件。
这里，裸的晶体管芯片22A装在导电图案21A上，并且，发射极电极和导电图案21B、基极电极和导电图案21B通过金属配线25A连接，该金属配线25A利用热压进行的球形接合或超声波进行的楔形接合等固定。标号22B是片状电容器或无源元件，由焊锡等焊剂或导电膏25B固定。在本工序中，由于各部件12上集成了多个导电图案21，故具有电路元件22的固定及引线接合可极高效地进行的优点。
如图5～图7所示，在本发明的第三工序中，按每个部件12，使设有气孔20的下模28A和导电箔10的背面接触，使部件12的各搭载部15配置在同一模腔内，用绝缘性树脂20进行传递模模装，从而一边将导电箔10的背面和下模28A之间的气体排出到外部，一边进行树脂密封。
首先，参照图5说明用于本工序的传递模模装的模型28的形状等。图5(A)是模型28的平面图，图5(B)是图5(A)的X-X’剖面图。
模型28由上模28B和下模28A构成。下模28A形成有平坦区域，在此该平坦区域载置两张导电箔10，每个形成于各导电箔10的部件12形成有多个气孔30。上模28A按压各部件12周边的剩余部分的导电箔10的表面，在与载置的导电箔10的各部件12的上方对应的部位形成模腔29。
气孔30在按每个部件设置的模腔29的与浇口35相对的边设有多个。气孔30的深度形成为可使导电箔10背面和下模28A之间的气体通过，平面看，自各模腔的内部延伸至导电箔10的外部。气孔30平面看跨越模腔29的端边部及导电箔10的端边部而延伸。每个部件设有多个气孔30，但设于中央部的气孔30的断面大小大于设于周边部的气孔30。位于导电箔10背面的气孔具有汇集于部件12中央部附近的倾向。因此，通过如上所述，使中央部的气孔30大于周边部的气孔30，可更有效地使位于导电箔10背面的气体排出到模型28的外部。
参照图5(A)按并列设置的两个导电箔10的各部件12形成模腔29。在由导电箔10夹着的区域设有多个供给绝缘性树脂的直浇道34。这里，在下模上形成有与各导电箔10上形成的部件12同等个数的直浇道34。然后形成横浇道33，以从一个直浇道34向邻近的两个模腔29供给绝缘性树脂20。
参照图6，详细说明用模型28进行模装的工序。图6(A)是进行模装时各部件12的剖面图，图6(B)是表示在模腔29内部封入绝缘性树脂20的状况的平面图。
参照图6(A)，通过将导电箔10载置于下模28A，使上模28B和下模28A合模，在各部件12的上方形成模腔29。进行模装时，向直浇道34供给绝缘性树脂20固化得到的小片，加热直浇道34，用活塞31按压上方，向各模腔29供给绝缘性树脂120。设于模型28的多个活塞31同时动作，使两个导电箔10具有的所有部件12同时被密封。
参照图6(B)，说明绝缘性树脂20封入模腔29的状态。由于在部件12的外周部设有对位标志17，故该部位未设电路元件等。因此，与形成有电路元件22A或金属配线25A的部件12的中央部附近比较，不存在电路元件22A或金属配线25A的部件12的周边部封入绝缘性树脂20的阻力小。因此，当由浇口35将绝缘性树脂20封入模腔29内时，绝缘性树脂20优先自部件12的周边部充填。因此，如同图所示，与浇口35对向的边的中央部附近最后被树脂密封。因此，位于导电箔10和下模28A之间的气体也集合在与浇口35对向的边的中央部附近。
在本发明中，由于在下模28A的与浇口35对向的部件12的周边部附近设有气孔30，故如上所述，即使位于导电箔10和下模28A之间的气体集合，集合的气体也会从气孔30排出到外部。并且，由于形成有多个气孔30，且设于中央部的气孔30的断面大，因此，即使气体集合在浇口35对向的边的中央部，集合的气体也会从气孔30排出到外部。因此，在进行树脂密封的工序中，可防止气体集合引起导电箔10局部抬起。因此，可防止由此引起的电路元件22的破坏等。
下面参照图7说明树脂密封后的状态。绝缘性树脂20完全覆盖电路元件22A、52B及多个导电图案21A、21B、21C，导电图案21之间的分离槽11被绝缘性树脂20充填，与导电图案21A、51B、51C侧面的弯曲结构嵌合而牢固结合。然后，由绝缘性树脂20支承导电图案21。在本工序中，可使用环氧树脂等热硬性树脂进行传递模模装。
本工序的特征在于，在覆盖绝缘性树脂20之前，构成导电图案21的导电箔10形成支承衬底。因此，具有可大幅度节省结构材料的优点，可降低成本。
然后，通过除去未设分离槽11的厚的部分的导电箔10，将各导电图案21电分离。具体地说，将未设分离槽11的厚的部分的导电箔10的部件12的至少设有导电图案21的区域除去。在本工序中，在图7(A)虚线所示的绝缘性树脂20露出之前，对导电箔10选择性湿式蚀刻设有导电图案21的区域。其结果，形成约40μm厚的导电图案21并分离，构成在绝缘性树脂20上露出导电图案21的背面的结构。
如图8所示，本发明的第四工序中，将部件12的绝缘性树脂20按各搭载部15通过切割分离。
在本工序中，将粘贴在粘接板上的多个部件12利用真空吸附在切割装置的载置台上，用切割刀69沿各搭载部15间的切割线70切割分离槽11的绝缘性树脂20，分离为单独的电路装置53。
参照图9说明上述工序中制造的电路装置的结构。同图所示的电路装置包括：导电图案21、固定在导电图案21上的电路元件22、电连接半导体芯片22A和导电图案22B的金属配线25、使导电图案21的背面露出并支承和密封整体的绝缘性树脂20。自绝缘性树脂20的背面露出的导电图案21由抗蚀剂8覆盖，在所希望的部位形成焊锡等焊剂构成的外部电极9。
实施例2
在上述实施例1中说明了具有单层配线结构的电路装置的制造方法，在本实施例中说明具有多层配线结构的电路装置的制造方法。
首先，参照图10(A)，准备介由绝缘层44层积第一导电箔42及第二导电箔43构成的绝缘板40。第一导电箔42及第二导电箔43的厚度可根据绝缘板40要求的机械强度等在数十μm至数百μm的范围内变化。因此，绝缘板40的厚度也可以在数十μm至数百μm的范围内变化。第一导电箔42为了形成所希望的微细图案，可形成50μ左右的厚度。第二导电箔43考虑到机械强度可较厚地形成为200μm左右的厚度。
然后，参照图10(B)，选择性除去第一导电箔42，形成通过连接部41和第二导电箔43电连接的第一导电图案21A。具体地说，首先除去形成连接部41的预定区域的第一导电箔42及绝缘层44。第一导电箔42的局部除去利用蚀刻进行，绝缘层44的局部除去用激光进行。然后，在通过形成镀膜形成连接部41之后，对第一导电箔42进行制图，形成第一导电图案21A。
然后，参照图10(C)，将由半导体元件22A及片状元件22B构成的电路元件22固定在第一导电图案21A上。
然后，参照图11，覆盖电路元件22，用绝缘性树脂20密封绝缘板40的表面。该工序的详细情况与实施例1中参照图5及图6说明的工序同样，故省略其详细说明。在该实施例1中，安装电路元件22的由单一金属构成的导电箔设置在模腔29的内部，而在此，安装电路元件22的绝缘板40设置在模腔29内部。如上所述，由于绝缘板40形成得很薄，故绝缘板40刚性弱，有可能发生现有例所示的问题。因此，利用本发明的气孔30的功能可抑制模腔29内部绝缘板40的变形(抬起)。这种效果在绝缘板40具有三层以上的多层配线结构时也能够实现。图12(A)表示覆盖半导体元件22A及片状元件22B形成绝缘性树脂20的绝缘板40的剖面。
然后，参照图12(B)局部除去背面的第二导电箔43形成第二导电图案21B。然后，通过形成背面的抗蚀剂8及外部电极9完成图12(C)所示的电路装置。
根据本发明的电路装置的制造方法，通过在进行树脂密封的下模28A的对应各部件的部位设置气孔30，在树脂密封的工序中，可将位于导电箔10背面和下模28A之间的气体排出到外部。因此，可防止由因绝缘性树脂20的封入压力而汇集的气体使导电箔10局部抬起并使电路元件22与上模接触的现象。因此，可防止金属衬底25A的折曲等。
由于可如上所述防止导电箔10的抬起，故可将模腔29的厚度形成得较薄。因此，可制造更薄型的电路装置。

Claims (7)

1、一种电路装置的制造方法，其特征在于，包括下述步骤：在导电箔上面形成多个部件的工序，该部件包含由多个导电图案构成的搭载部；在每个所述部件的所述各个搭载部上配置电路元件的工序；使在每个所述部件上设置气孔的下模与所述导电箔的背面接触，通过在同一模腔内配置所述部件的各个搭载部并且利用绝缘性树脂进行传递模制，使所述导电箔的背面和所述下模之间的气体排放到外部，同时进行树脂密封；对每个所述搭载部通过切割对所述绝缘树脂进行分离的工序，设置在所述下模的所述气孔从所述膜腔的内部到所述导电箔的外侧延伸。
2、如权利要求1所述的电路装置的制造方法，其特征在于，所述气孔设置在与所述部件的浇口相对的边上。
3、如权利要求1所述的电路装置的制造方法，其特征在于，并列设置有多个所述气孔。
4、如权利要求3所述的电路装置的制造方法，其特征在于，设于中央部的所述气孔大于设于周边部的所述气孔。
5、如权利要求1所述的电路装置的制造方法，其特征在于，用模装模型夹持所述导电箔的所述部件周边的剩余部分。
6、如权利要求1所述的电路装置的制造方法，其特征在于，所述电路元件固定半导体裸片或片状电路部件之一或者固定该两者。
7、如权利要求1所述的电路装置的制造方法，其特征在于，所述绝缘性树脂同时传递模模装所述导电箔的所有所述部件而形成。
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