CN1832659A - 电路装置及其制造方法 - Google Patents
电路装置及其制造方法 Download PDFInfo
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Abstract
一种同时满足散热性和耐压性的电路装置及其制造方法。在电路基板(11)的表面形成有第一绝缘层(12A),在其背面形成有第二绝缘层(12B)。在第一绝缘层(12A)的表面形成有导电图案(13),且在该导电图案(13)上固定有电路元件(15)。另外,在第二绝缘层(12B)的表面粘贴有金属基板(16)。而且,密封树脂(14)将电路基板(11)的表面及侧面包覆,进而,也使金属基板(16)的背面露出地将电路基板(11)背面的周边部包覆,由此,确保电路基板(11)的散热性和耐压性。
Description
技术领域
本发明涉及电路装置及其制造方法,特别是涉及同时满足散热性和耐压性的电路装置及其制造方法。
背景技术
参照图7说明现有的混合集成电路装置100的结构(参照下记专利文献1)。在矩形的基板101表面夹着绝缘层102而形成有导电图案103。而且,通过在导电图案103的所希望的位置固定电路元件105而形成规定的电路。在此,作为电路元件,将半导体元件及片状元件与导电图案103连接。引线104与形成于基板101周边部的导电图案103连接,作为外部端子起作用。密封树脂108具有将形成于基板101表面的电路密封的功能。
密封树脂108的结构有如下两种:第一种是使基板101的背面露出而形成密封树脂108的方法。根据该结构,可经由露出外部的基板101进行良好的散热。第二种是覆盖包含基板101背面的整体而形成密封树脂108的方法。根据该结构,可确保基板101的耐压性及耐湿性。在该图中,将也包括基板101背面的整体密封。包覆基板101背面的部分的密封树脂108的厚度例如为0.5mm左右。特别是在基板101与接地电位连接的情况下,上述第两种结构适用,使基板101与外部绝缘。
专利文献1:特开平5-102645号公报
但是,在为了包覆基板101的背面而形成密封树脂108的情况下,由于包覆基板101背面的密封树脂108的热传导率差,故存在装置整体的散热性低的问题。
将包覆基板101背面的密封树脂108的厚度(T5)形成得较薄,期待散热性的提高。但是,当将密封树脂108的厚度T5设定为小于或等于0.5mm时,存在有如下的问题,即,在通过射出成形而形成密封树脂108的模制工序中,树脂不能遍布基板101的背面。
另外,为提高散热性而使基板101的背面露出外部时,存在不能确保基板101和与基板101相接的散热片的绝缘性的问题。另外,也存在使基板101与密封树脂的连接强度降低的问题。
发明内容
本发明是鉴于上述的问题而构成的,本发明的主要目的在于提供同时满足散热性和耐压性的电路装置及其制造方法。
本发明的电路装置,其特征在于,具有:电路基板,其表面设有第一绝缘层,且背面设有第二绝缘层;电路,其由形成于第一绝缘层表面的导电图案及电路元件构成;金属基板,其粘贴于第二绝缘层的表面;密封树脂,其将电路密封,密封树脂至少将电路基板的表面、侧面及背面的周边部包覆。
另外,本发明的电路装置中,金属基板通过将B级树脂固化来进行粘贴。
另外,本发明的电路装置中,在将金属基板分割成规定的形状时,在金属基板的周边端部形成毛刺,与毛刺突出的面相对的面粘贴于第二绝缘层的表面上。
本发明的电路装置中,金属基板的背面从密封树脂露出。
本发明的电路装置中,形成由金属基板的背面及密封树脂构成的平坦面。
另外,本发明的电路装置的制造方法,其特征在于,具有:夹着绝缘层而将金属基板粘贴到电路基板的背面,且夹着绝缘层将导电箔粘贴在电路基板的表面上的工序;对导电箔进行构图而形成导电图案的工序;形成由电路基板表面的导电图案及电路元件构成的电路的工序;使用模制模具形成密封树脂,使其至少包覆电路基板的表面的工序,金属基板经由B级树脂而粘贴在电路基板背面。
本发明的电路装置的制造方法中,在金属基板的表面涂敷有B级树脂,所述金属基板通过热压装而粘贴在电路基板上。
本发明的电路装置的制造方法中,在金属基板的表面涂敷有B级树脂,将金属基板切断成所希望的形状,在金属基板的背面形成毛刺,将所述金属基板的表面与电路基板的背面粘贴。
根据本发明,在电路装置的背面粘贴有金属基板。因此,可提高由内装于电路装置中的电路元件产生的热的散热性。另外,密封树脂将金属基板露出而包覆电路基板的表面、侧面及背面的周边部。因此,利用密封树脂产生锚定效果(アンカ一効果),可提高密封树脂与电路基板的粘接强度。
根据本发明,由于使用B级树脂作为金属基板与电路基板的固定材料,故不会产生固定材料的溢出或不均等,因此,有助于提高电路装置的品质。
另外,由于将与金属基板形成有毛刺的面相对的面与电路基板粘接,因此,抑制了由于毛刺破坏绝缘层,将金属基板和电路基板导通而造成的绝缘耐压的恶化。
根据本发明,可在使金属基板的背面从密封树脂露出的状态下充分确保金属基板与外部的耐压性。因此,可提供同时满足散热性和耐压性的电路装置。
另外,根据本发明的电路装置的制造方法,将涂敷有B级状树脂的薄片状金属基板粘贴在电路基板上。因此,由于可使由金属基板和树脂构成的厚度稳定,故可提高电路装置的尺寸稳定性。
根据本发明的电路装置的制造方法,由密封树脂包覆电路基板背面的周边部。因此,由包覆背面的密封树脂产生锚定效果,可提高密封树脂和电路基板的粘接强度。
附图说明
图1(A)是表示本发明的电路装置的立体图,(B)是剖面图;
图2(A)、(B)是表示本发明电路装置的制造方法的剖面图;
图3(A)、(B)是表示本发明电路装置的制造方法的剖面图;
图4是表示本发明的电路装置的制造方法的剖面图;
图5(A)-(C)是表示本发明的电路装置的制造方法的剖面图;
图6(A)、(B)是表示本发明的电路装置的制造方法的剖面图;
图7是表示现有的混合集成电路装置的剖面图。
符号说明
10混合集成电路装置
11电路基板
12A第一绝缘层
12B第二绝缘层
13导电图案
14密封树脂
15电路元件
15A半导体元件
15B片状元件
16金属基板
17金属细线
19树脂
22A上模具
22B下模具
23模穴
25引线
29模具
30毛刺
32单元
具体实施方式
参照图1,对本发明的电路装置进行说明。在此,以在同一基板上安装有多个半导体芯片的混合集成电路装置10为例进行说明。
首先,在矩形的电路基板11表面形成有第一绝缘层12A。而且,规定形状的导电图案13形成于第一绝缘层12A表面。另外,经由焊锡、导电膏或金属细线在导电图案13的规定位置电连接有半导体元件15A及片状元件15B。形成于电路基板11表面的导电图案13、半导体元件15A以及片状元件15B由密封树脂14包覆。另外,仅电路基板11背面的周边部被密封树脂14包覆,并且粘贴于电路基板11上的金属基板16露出外部。具体地说,从密封树脂14露出的金属基板16夹着树脂19而粘贴在包覆电路基板11背面的第二绝缘层12B上。
电路基板11是由铝及铜等金属构成的基板。例如在采用由铝构成的基板作为电路基板11时,对电路基板11的表面进行铝表面钝化处理或化学转换处理。由此,提高第一绝缘层12A与电路基板11的粘接性。电路基板11的具体尺寸例如为长×宽×厚=61mm×42.5mm×1.5mm左右。另外,在采用由Cu构成的电路基板时,为提高粘接性,也可以将表面粗面化。特别是考虑到与金属基板的粘接性,背面粗面化是有效的。
形成第一绝缘层12A,使其覆盖电路基板11的整个表面。绝缘层12由高充填了Al2O3、SiO2等热传导性优良的填充物的环氧树脂等构成。由此,可经由电路基板11将由内装的电路元件产生的热积极地排出外部。第一绝缘层12A的具体厚度例如为50μm左右。通过该厚度的绝缘层12,可确保4KV的耐压(绝缘击穿耐压)。
形成第二绝缘层12B,使其覆盖电路基板11的背面。第二绝缘层12B的组成也可以与第一绝缘层12A相同。通过由第二绝缘层12B包覆电路基板11的背面,可确保电路基板11背面的耐压性。因此,即使在散热片等散热装置与电路基板11的背面抵接的情况下,也可以由第二绝缘层12B将散热片与电路基板11绝缘。
导电图案13由铜等金属构成,其形成在第一绝缘层12A的表面,以构成规定的电路。另外,在引线25导出的边上形成由导电图案13构成的焊盘。
半导体元件15A及片状元件15B的电路元件被固定在导电图案13的规定位置。半导体元件15A采用晶体管、LSI芯片、二极管等。在此,半导体元件15A和导电图案13经由金属细线17连接。片状元件15B采用片状电阻及片状电容等。另外,片状元件15B采用电感器、热敏电阻、天线、振荡器等两端具有电极部的元件。另外,也可以将树脂密封型封装等作为电路元件固定在导电图案13上。
引线25固定在设于电路基板11周边部的焊盘上,具有与外部进行输入、输出的作用。在此,在一个侧边固定有多个引线25。另外,引线25也可以从电路基板11的四个边导出,还可以从相对的两个边导出。
另外,图中未公开,但导电图案13也可以为多层。当然,第一层的配线层和其上的第二配线层、该第二配线层和第三配线层…配置层间绝缘膜。
密封树脂14由使用热固性树脂的传递模制形成。图1(B)中,由密封树脂14将导电图案13、半导体元件15A、片状元件15B、金属细线17密封。而且,电路基板11的表面及侧面也由密封树脂14包覆。另外,在电路基板11的背面,周边部及金属基板的侧面由密封树脂14包覆,金属基板16的背面从密封树脂14露出。这样,通过由密封树脂14将电路基板11背面的周边部包覆,产生锚定效果,提高电路基板11与密封树脂14的粘接强度。而且,通过使金属基板16的背面露出,由半导体元件15A等驱动所产生的热经由金属基板16良好地排出外部。原本第二绝缘层12A、树脂19的热传导性不良,但通过减薄其膜厚或根据需要加入填充物而得到改善。
金属基板16的材料采用铜、铝等热传导性优良的金属。在本实施例中采用铝,夹着树脂19而粘贴到电路基板11的背面。另外,通过使用在表面涂敷有B级(半固化)树脂19的薄片状的铝基板(厚度约0.5mm)将其粘贴到电路基板11上,抑制树脂的不均及溢出。另外,由于以涂敷有树脂19的薄片状粘贴在电路基板上,故由金属基板16和树脂19得到的厚度稳定,电路装置的尺寸稳定性优良。该薄片状的带树脂的铝基板通过冲切而形成所希望的形状。此时,在铝基板的单面上形成毛刺,对与涂敷有树脂19的面相对的面进行冲切,使毛刺突出。因此,防止毛刺贯通第二绝缘层12B而与电路基板11接触,产生绝缘耐压的恶化。
另外,电路装置的背面形成由包覆电路基板11周边部的密封树脂14和金属基板16的背面构成的平坦面。因此,可使混合集成电路装置10的背面容易地与散热片等散热装置抵接。
在本实施例中,在金属基板的背面不形成绝缘层。
如上所述,在本实施例中,在金属基板16的背面不设置绝缘层,但也可以设置氧化膜等绝缘层。例如,氧化膜由通过阳极氧化形成的钝化铝膜构成。在此,电路基板11的厚度为1.5mm左右,而金属基板16的厚度例如为0.5mm左右。而且,氧化膜的厚度例如形成为10μm左右。通过在金属基板16的背面形成氧化膜,从而可抑制将露出的金属基板16的背面损伤的问题。
在本实施例中,通过由密封树脂14包覆电路基板11背面的周边部,从而可确保电路基板11的端部P的耐电压性。具体地说,在电路基板11的整个表面及背面形成有第一绝缘层12A及第二绝缘层12B。因此,确保了电路基板11的表面及背面的耐压性。而电路基板11的侧面不由树脂层包覆而将金属面露出。由此,为了确保电路基板11的绝缘,必须防止电路基板11的侧面(特别是端部P)经由电路基板11和密封树脂14的分界面而与外部(与金属基板固定的底座或散热片等)短路。因此,在本实施例中,在电路基板11背面的周边部形成有密封树脂14,使端部P与外部分开。即,形成密封树脂14,使其将端部P包入。具体地说,参照图1(B),以L1表示由密封树脂14覆盖的区域的宽度,该L1的长度根据所要求的耐压而变化,最好大于或等于2mm~3mm左右。由此,可确保电路基板11的端部P的耐压。例如,在L1的长度为2mm的情况下,可确保端部P的耐压为2KV。另外,在L1的长度为3mm的情况下,可确保端部P的耐压为3KV。另外,包覆电路基板11背面的部分的密封树脂14的厚度T1由于例如与金属基板16相同,故为0.5mm左右。这样,确保电路基板11整体的耐压性。
如上所述,采用电路基板11及金属基板的电路装置由于散热性优良,故例如适用于车载等模块。即,在将高输出的功率元件和抑制该功率元件的电路以及微计算机等高密度地模块化的情况下,需要散热性好且密封性也优良的封装。
参照图2~图6说明上述的结构的混合集成电路装置10的制造方法。
参照图2(A),首先,在电路基板11的表面形成第一绝缘层12A,在电路基板的背面形成第二绝缘层12B。
电路基板11的大小为可将例如数十个程度的单元32矩阵状配置的大小。在此,单元是指构成一个混合集成电路装置的部位。电路基板11可采用铝、铜、铁等。在此,作为一实施例,采用铝基板作为电路基板11。另外,也可以采用将表面及背面进行铝表面钝化处理的铝基板。电路基板11的厚度为1.5mm左右。另外,第一绝缘层12A及第二绝缘层12B的厚度为50μm~60μm左右。另外,电路基板11的表面及背面也可以由氧化膜包覆。该氧化膜例如采用包含Al2O3的钝化铝膜,厚度为1μm~5μm左右。这样,通过较薄地形成氧化膜,可减小热变电阻。
参照图2(B),夹着树脂19而在第二绝缘层12B的表面粘贴金属基板16。在此,使用在厚度为0.5mm左右的金属基板16的表面设有B级(半固化)状的树脂19的薄片状粘贴基板31。该树脂19例如为环氧树脂,是通过热冲压而固化的树脂,在本实施例中,通过在温度150度下进行一小时左右的热冲压,使树脂19完全固化,在第二绝缘层12B的表面粘贴金属基板16。该薄片状的粘贴基板31在被切割成所希望的形状后,粘贴到各单元32的规定的位置。该树脂19具有粘接剂的作用和绝缘层的作用,在进一步提高绝缘性的情况下,也可以在树脂19上设置绝缘膜。
另外,根据金属基板16的厚度的不同,也可以不切割而进行粘贴,在使其固化后,通过进行蚀刻得到小板。
参照图3及图4详细说明粘贴基板31。
首先,参照图3(A),准备在金属基板16表面涂敷有树脂19的粘贴基板31。而且,通过使用模具29进行冲压切割,形成所希望形状的粘贴基板31。但是,通过进行冲压加工,在金属基板16的周边端部形成毛刺。因此,通过进行冲压加工,在与涂敷有树脂19的面相对的面上形成毛刺,形成图3(B)所示的粘贴基板31。这是由于,如图4所示在电路基板11上粘贴有粘贴基板31时,可防止由于毛刺30贯通第二绝缘层12B而使该部分的耐压降低,产生短路的问题。
另外,由于树脂19为B级状态,故加工性优良,且不会产生冲压造成的破损或剥离等。因此,可提高金属基板16与电路基板11的粘接可靠性。另外,例如即使在树脂19的端面产生裂纹,也可以由热压装的工序使树脂19软化,因此,可将裂纹除去。由此,可在金属基板16的整个表面上可靠地形成树脂19得到的绝缘层。
参照图5(A),在电路基板11的表面粘贴导电箔26。在此,导电箔26夹着第一绝缘层12A而粘贴在电路基板11的表面上。作为一例,导电箔26的厚度为70μm左右。另外,粘贴的金属基板16之间的间隔设定为大于或等于图1(B)所示的距离L1的两倍左右,具体地说,大于或等于4mm~6mm左右。
参照图5(B),通过进行蚀刻,对导电箔26进行构图,形成导电图案13。导电图案13通过经由形成于导电箔26上部的抗蚀剂进行蚀刻而形成。在本图中,形成有一层导电图案,但也可以夹着绝缘层在其上形成大于或等于两层的导电图案。
参照图5(C),将各单元32的电路基板11分离。电路基板的分离通过冲压切割、划线、折曲等而进行。在此,在通过划线或折曲将电路基板11分离时,也可以在各单元32分界的电路基板11上从表面及背面形成分离槽。由此,可容易地将各电路基板分离。
参照图6(A),将电路元件与导电图案13电连接。在此,将半导体元件15A及片状元件15B固定在导电图案上。另外,半导体元件15A经由金属细线17与导电图案13电连接。另外,该工序也可以在将各单元32分离之前进行。
参照图6(B),形成密封树脂,以包覆电路基板11。首先,使位于电路基板11下面的金属基板16的背面与下模具22B抵接。然后,通过使上模具22A和下模具22B抵接,将电路基板11收纳到模穴23的内部。在此,由于金属基板16的尺寸比电路基板的尺寸小,故电路基板11的周边部根据金属基板16的厚度从下模具22B离开。由此,注入到模穴23内的密封树脂遍布电路基板下侧的区域A1。
由上述的工序制造图1所示的混合集成电路装置10。
在此,进一步说明优点。如图7所示,在将树脂108密封时,树脂108必须绕入到下模具和基板101之间。但是,电路基板101的尺寸越大,该树脂的绕入越难以进行。这是由于,面积变大,或基板的散热性提高,表示流动性的树脂开始固化。但是,在本申请中,如图6B所示,由金属基板16限制树脂的密封范围,由于只要仅在电路基板背面的周围封入树脂即可,故可抑制未注入部的形成等。
返回图1,说明本申请的效果。通常,在由冲压机冲压电路基板11时,由于无论如何都会在刀刃接触的部分及其附近存在有树脂12A、12B,故在此容易产生裂纹。但是,由于金属基板16采用B级树脂19,故即使由冲压机进行冲压,也难以产生裂纹。其原因是,虽然在常温下固化,但一加热就熔融,故即使产生裂纹,也可以在过热并固化时将其消除。因此,产生短路的通路的反面则是抑制裂纹的产生,可进一步提高耐电压特性。而且,由于以B级均匀地在整个面上设置树脂19,故也不出现空隙,而可在整个面上均匀地设置电路基板和金属基板之间的间隔。因此,也可以抑制热传导率的偏差。
Claims (8)
1、一种电路装置,其特征在于,具有:电路基板,其在表面设有第一绝缘层且在背面设有第二绝缘层;电路,其由形成于所述第一绝缘层表面的导电图案及电路元件构成;金属基板,其粘贴于所述第二绝缘层的表面;密封树脂,其将所述电路密封,
所述密封树脂至少将所述电路基板的表面、侧面及背面的周边部包覆。
2、如权利要求1所述的电路装置,其特征在于,所述金属基板通过将B级树脂固化而进行粘贴。
3、如权利要求1所述的电路装置,其特征在于,在所述金属基板的周边端部形成毛刺,与所述毛刺突出的面相对的面粘贴于所述第二绝缘层的表面上。
4、如权利要求1所述的电路装置,其特征在于,所述金属基板的背面从所述密封树脂露出。
5、如权利要求4所述的电路装置,其特征在于,形成由所述金属基板的背面及所述密封树脂构成的平坦面。
6、一种电路装置的制造方法,其特征在于,具有:夹着绝缘层而将金属基板粘贴到电路基板背面,且夹着绝缘层而将导电箔粘贴到所述电路基板表面的工序;对所述导电箔进行构图而形成导电图案的工序;形成由所述电路基板表面的所述导电图案及电路元件构成的电路的工序;使用模制模具形成密封树脂,使其至少包覆所述电路基板的表面的工序,
所述金属基板经由B级树脂而粘贴在所述电路基板的背面。
7、如权利要求6所述的电路装置的制造方法,其特征在于,在所述金属基板的表面涂敷有B级树脂,所述金属基板通过热压装而粘贴在所述电路基板上。
8、如权利要求6所述的电路装置的制造方法,其特征在于,在所述金属基板的表面涂敷有B级树脂,将所述金属基板切断成所希望的形状,在所述金属基板的背面侧形成毛刺,并将所述金属基板的表面和所述电路基板的背面粘贴。
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JP2005066828A JP4545022B2 (ja) | 2005-03-10 | 2005-03-10 | 回路装置およびその製造方法 |
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CN108884984B (zh) * | 2016-03-15 | 2021-04-16 | 昕诺飞控股有限公司 | 细长引线框架和制造细长引线框架的方法 |
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CN113473691B (zh) * | 2016-03-30 | 2024-06-07 | 株式会社自动网络技术研究所 | 电路结构体 |
CN110829733A (zh) * | 2019-10-24 | 2020-02-21 | 珠海凯邦电机制造有限公司 | 一种控制板、电机和空调系统 |
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US20070102190A1 (en) | 2007-05-10 |
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