CN109314101B - 模块以及用于制造多种模块的方法 - Google Patents

模块以及用于制造多种模块的方法 Download PDF

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Publication number
CN109314101B
CN109314101B CN201680086525.9A CN201680086525A CN109314101B CN 109314101 B CN109314101 B CN 109314101B CN 201680086525 A CN201680086525 A CN 201680086525A CN 109314101 B CN109314101 B CN 109314101B
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module assembly
module
metal
wafer
assembly
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CN109314101A (zh
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A·弗朗茨
J·波特曼
C·赖特林格
S·基夫尔
O·弗罗伊登贝格
K·魏德纳
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TDK Electronics AG
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Epcos AG
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Abstract

本发明涉及一种模块，所述模块具有下部模块组件(1)，所述下部模块组件具有材料(3)，在所述材料中嵌入有至少一个第一构件(4)，以及上部模块组件(2)，所述上部模块组件具有材料(3)，在所述材料中嵌入有至少一个第二构件(16)。所述上部模块组件(2)和所述下部模块组件(1)相互堆叠，其中所述下部模块组件和所述上部模块组件(2)彼此电接触并且机械相连。此外，本发明还涉及一种简单并且成本适宜的方法，用以制造多种模块。通过本发明，能够在面积和高度上缩小所述模块并且/或者通过三维封装实现更高的集成度。

Description

模块以及用于制造多种模块的方法
技术领域
本发明涉及一种模块以及一种用于制造多种模块的方法。
背景技术
在模块的开发过程中，力求不断缩小模块同时提高集成度以及同时增加模块的功能性。对于将来不断发展的电子和电气组件在模块中的集成而言，可用的空间极其有限。因此需要开发新型的结构和连接技术。
发明内容
本发明的目的在于提供一种改进的模块，所述模块例如使得进一步提高模块的集成度成为可能。所述模块可能例如适用于移动终端设备、工业应用或自动化领域中。另一目的在于，提出一种结构和连接技术，所述技术使得以简单的方式制造这样的模块成为可能。
给出一种模块，该模块具有下部模块组件，该下部模块组件具有材料，在该材料中嵌入有至少一个第一构件，以及上部模块组件，该上部模块组件具有材料，在该材料中嵌入有至少一个第二构件，其中上部模块组件和下部模块组件相互堆叠，并且下部模块组件和上部模块组件彼此电接触并且机械相连。
该模块不限于仅带两个模块组件的构造方案。相反地，该模块能够具有更多模块组件，这些模块组件相互堆叠并且彼此电接触和机械相连。
通过模块组件的相互堆叠，能够将模块的集成度提升到第三维度、即高度上。在此，每个模块组件均能发挥技术平台的作用，在该技术平台上能够嵌入任意构件。这些构件能够如此嵌入各材料中，即使得无需额外的焊点来实现构件的触点接通。通过这种方式能够进一步降低空间需求。
模块组件的相互堆叠能够实现在低的功率消耗的情况下生成带短的信号路径的模块，因此能够降低寄生电感。例如，对于其构件构成了滤波器的模块能够因此实现改进滤波器特性。
模块组件能够构造成技术平台，在这些技术平台中能够集成各种各样的构件，使得模块能够用于标准化，因为不同类型的构件能够分别嵌入可彼此相连的模块组件中。
具有下部和上部模块组件的材料可以例如是模塑材料。在此，模塑材料能够如此选择，即使得其与嵌入的构件匹配。例如模塑材料和这些构件能够具有非常相近的热膨胀系数，以避免在温度波动时出现机械应力。替选地，该材料还能够是预浸材料(预浸＝预浸渍纤维)。预浸材料能够通过压制或层压过程进行涂覆。这些材料能够在压制和/或层压过程中无气孔地进行涂覆。
替选地，该材料能够为玻璃基片、陶瓷基片、PCB基片(PCB＝多氯联苯)，该PCB基片可以是单侧或双侧覆铜板。
下部模块组件的材料和上部模块组件的材料可以是相同的。然而还可行的是，针对下部和上部模块组件使用不同的材料。在此，针对两个模块组件中的每一个能够分别选择上述材料中的一种。
在此，单元也能称之为模块，该单元具有至少两个构件并且能够安装在一个电路布罩中。该模块能够具有外壳，模块组件封装在其中。该模块能够作为整体放置在电路板上并与之电接触。
模块组件中的至少一个在分别面向另一模块组件的一侧能够具有重新布线层，该重新布线层具有金属层，模块组件通过该金属层彼此电接触。
重新布线层可以是单层或多层。重新布线层能够例如借助光刻法制造。替选地，重新布线层还能够借助二维或三维打印过程或通过激光结构化、例如通过LDI(＝激光直接成像)来制造。LDI是一种借助激光来光敏固化材料的方法。重新布线层的金属层还能够事后进行加厚，例如通过电镀或化学沉积过程。
此外金属层还能够与嵌入到各模块组件中的构件电接触。相应地，构件能够通过重新布线层与各个其他模块组件的构件接触。
重新布线层中的金属层能够实现将安排在模块组件中的构件的触点参考其位置敷设到模块组件的顶侧或底侧。通过这种方式能够如此安排单个构件的触点，即使得可以实现高的集成密度，而又不会将两个触点彼此安排得过近。因此能够避免两个触点以不期望的方式相互影响。通过重新布线层能够相应地将构件安排在周围的触点以平面的安排重新布线在各外表面上，从而能够大大地增加触点的中心距离。
因此，重新布线层能够实现在安排模块组件的顶侧和底侧上的触点时更高的设计灵活性。重新布线层可以构造得十分薄，尤其比传统的基片薄很多，使得重新布线层的使用不会造成模块的厚度大幅增加。重新布线层能够具有生产方面的极高的精确度。
尤其地，模块组件中的每一个能够在其顶侧和/或其底侧具有重新布线层，通过该重新布线层，堆叠起来的模块组件与各相邻的模块组件接触。两个相互堆叠的模块组件中的至少一个能够具有重新布线层，该重新布线层安排在面向各个其他模块组件的侧面上。
模块组件中的至少一个在其底侧上和其与该底侧相对而置的顶侧上分别具有重新布线层，其中重新布线层与电镀通孔相连，该电镀通孔延伸穿过模块组件。
电镀通孔实现了两个重新布线层的电接触。电镀通孔可以是所谓的嵌入式Z线。嵌入式Z线是具有薄铜的条纹，这些条纹从下部模块组件的底侧延伸到下部模块组件的顶侧。
对于电镀通孔替选地或补充地，能够使用特殊的带垂直电气导线连接的部件或在模块外边缘上的触点的结构化来使模块组件的底侧与模块组件的顶侧进行触点连接。还可设想的是其他常见的生成导电凹槽的方式，以进行模块组件的底侧与模块组件的顶侧的触点连接。
在一种实施方案中，下部模块组件能够在其面向上部模块组件的顶侧上具有重新布线层，该重新布线层具有金属层，下部模块组件与上部模块组件通过该金属层进行电接触。
在一种实施方案中，下部模块组件能够在其背向上部模块组件的底侧上具有另一重新布线层，该另一重新布线层与电镀通孔相连，通过该电镀通孔，该另一重新布线层与安排在下部模块组件的顶侧上的重新布线层进行电连接。
在一种实施方案中，上部模块组件能够在其面向下部模块组件的底侧上具有重新布线层，该重新布线层具有金属层，上部模块组件与下部模块组件通过该金属层进行电接触。
第一构件和/或第二构件可以是通过声波工作的滤波器。这样的构件通常具有空穴。该构件能够具有外壳，在该外壳内部构成有空穴，其中该外壳嵌入材料中。由于通过模块的高集成度得到短的信号路径，模块中的多个通过声波工作的滤波器能够相互联接并且通过降低寄生电感得到滤波器特性的改进。
下部模块组件能够在其面向上部模块组件的顶侧上具有金属结构。上部模块组件能够在其面向下部模块组件的底侧上同样具有金属结构。下部模块组件的金属结构和上部模块组件的金属结构能够通过任意方式彼此相连，该方式使得建立持续连接成为可能。金属结构可以构成为金属柱。
金属柱能够尤其通过共晶键合相连。在此，这些金属柱能够具有铜，铜上覆盖有含锡的涂层。铜和锡适用于共晶键合。共晶键合能够以高的精度进行，并且尤其仅需高度极小的结构。相应地例如相比于使用焊球来进行连接，精度能够得以提高并且同时降低连接结构的高度。此外，金属柱的面积范围能够比焊球可以实现的最小面积范围更小。
替选地，金属结构还能够如此设计，即使得由于连接结构的高表面而实现两个模块组件之间的持续连接。因此能够通过使两个结构相互接触来进行连接。尤其能够为线状结构，这些结构大量地安置在两个模块组件上。
例如下部模块组件能够在其面向上部模块组件的顶侧上具有金属结构，并且上部模块组件能够在其面向下部模块组件的底侧上具有金属结构，其中下部模块组件的金属结构和上部模块组件的金属结构彼此相连并且这些金属结构如此获得，即金属结构不通过其他辅助材料而形成固定的连接。在此，这些金属结构能够具有纳米范围内的结构。相应地，这些金属结构能够例如具有介于10nm和10000nm之间、优选介于100nm和5000nm之间的范围。这些结构能够尤其地形成线，其中上述范围规定了各条线的长度。
此外，不同的模块组件能够相互组合。例如，下部模块组件能够在其面向上部模块组件的顶侧上具有金属柱，并且上部模块组件能够在其面向下部模块组件的底侧上具有金属结构，这些金属结构如此获得，即金属结构不通过其他辅助材料而形成固定的连接，其中下部模块组件的金属柱和上部模块组件的金属结构彼此相连。替选地，上部模块组件能够在其面向下部模块组件的底侧上具有金属柱，并且下部模块组件能够在其面向上部模块组件的顶侧上具有金属结构，这些金属结构如此获得，即金属结构不通过其他辅助材料而形成固定的连接，其中上部模块组件的金属柱和下部模块组件的金属结构彼此相连。
在模块的外表面上能够安排金属化物，该金属化物使得所述模块的电磁屏蔽成为可能并且/或用于所述模块的散热。金属化物此外能够构成天线结构。
在上部模块组件的背向下部模块组件的顶侧上安排有至少一个其他的模块组件，该模块组件具有材料，在该材料中嵌入有至少一个第三构件。通过这种方式能够相互堆叠几乎任意数量的模块组件。因此能够持续不断地提高在模块的第三维度中的集成度。此外，能够在每两个模块组件之间分别安排至少一个重新布线层，这两个模块组件通过该重新布线层彼此电接触。
内部嵌入有第一构件和第二构件的材料可以是预浸材料。其特点尤其在于良好的流动特性。这使得简单地形成层以及多个层的相互层压成为可能。
第一和/或第二构件可以是选自带集成的有源或无源电路的半导体芯片、无源构件、传感器、数字芯片或MEMS构件中的一个。除了实际的传感器元件，这样的传感器还能够具有用于评估测得的测量数据的逻辑以及存储元件。这种在可行的构件方面的多样性表明，该模块可以是用于组合各种各样的构件类型的技术平台。
上部模块组件能够在其背向下部模块组件的顶侧上具有重新布线层，该重新布线层具有金属化物，该金属化物构成天线结构以及无源元件，这些无源元件连接第二构件。因此，该金属化物同时用于多种目的。
本发明的另一观点涉及一种用于制造多种模块的方法。这些模块可以是上面所描述的模块。相应地，结合所述模块公开的所有结构性和功能性特征同样也可以适用于所述方法。结合所述方法公开的所有特征同样也可以适用于上面所描述的模块。
给出一种用于制造多种模块的方法，这些模块分别具有下部模块组件，该下部模块组件具有材料，在该材料中嵌入有至少一个第一构件，以及上部模块组件，该上部模块组件具有材料，在该材料中嵌入有至少一个第二构件，其中上部模块组件和下部模块组件相互堆叠，并且其中下部模块组件和上部模块组件彼此电接触并且机械相连。所述方法包括以下步骤：
-生产下部晶片或下部嵌板，在该晶片或嵌板中安排有采用复合体形式的多种下部模块组件，
-生产上部晶片或上部嵌板，在该晶片或嵌板中安排有采用复合体形式的多种上部模块组件，
-将下部晶片固定在上部晶片上或将下部嵌板固定在上部嵌板上，并且
-分离模块。
这些步骤优选按照此处规定的顺序进行。相应地，能够在模块以晶片复合体或嵌板复合体形式存在时执行多个步骤。在复合体中可在共同的工作步骤中同时加工多种模块。因此能够以这种方式大大简化制造过程。由于模块的分离在固定模块组件之后才依次进行，因此尤其能够避免模块组件的高耗费的单次操作。
下部晶片和上部晶片或下部嵌板和上部嵌板能够尤其借助共晶键合、热压键合、导电粘合、烧结或焊接彼此相连。尤其地，借助共晶键合实现的连接带来了许多优势，因为这种连接技术能够高精度地执行。
在生产下部晶片或下部嵌板时能够以板材成型的方法向材料的单侧嵌入第一构件，其中材料压制成薄膜。在生产上部晶片或上部嵌板时能够以板材成型的方法向材料的单侧嵌入第二构件，其中材料压制成薄膜。
在生产下部晶片或下部嵌板时能够在真空层压过程中向材料中嵌入第一构件，并且然后下部晶片或下部嵌板通过绝缘材料交联。在生产上部晶片或上部嵌板时能够在真空层压过程中向材料中嵌入第二构件，并且然后上部晶片或上部嵌板通过绝缘材料交联。该绝缘材料能够借助轧制、点胶技术、喷射或这些方法的组合被涂敷。
在将下部晶片或下部嵌板固定在上部晶片或上部嵌板上后，上部晶片或上部嵌板能够经受磨削过程，在该磨削过程中上部晶片或上部嵌板的厚度会降低。因此能够将部件上的材料量降至最低并且进一步降低模块的厚度。还能够使部件组成的系列变薄。
附图说明
下面参考附图详细描述本发明。
图1示出了下部模块组件的横截面。
图2示出了上部模块组件的横截面。
图3示出了模块的截面图，该模块通过堆叠图1中所示的下部模块组件和图2中所示的上部模块组件制造而成。
图4示出了在执行其他加工步骤后的图3中所示的模块。
图5示出了根据替代的实施方案的模块的截面图。
具体实施方式
图1示出了下部模块组件1，该模块组件能够与上部模块组件2结合形成一个模块。图1中示出了一个唯一的下部模块组件1。所述下部模块组件1能够与多个其他下部模块组件一起制造成晶片复合体或嵌板复合体。
该下部模块组件1具有材料3，在该材料中嵌入有第一构件4以及其他构件5。所述材料3可以例如是模塑材料、有机层压材料、尤其是基于环氧树脂或苯酚的有机层压材料或预浸材料。
例如第一构件4是通过SAW波工作的构件(SAW＝SurfaceAcousticWave，声表面波)。相应地，该构件是一种具有空腔的封装构件。下部模块组件1如此构造，即材料3中能够嵌入各种各样的构件4、5。该下部模块组件相应地是一种技术平台，该技术平台使得在模块中集成不同构件4、5成为可能。
其他构件5能够例如是传感器芯片，这些传感器芯片可以为模拟式或数字式。除了实际的传感器元件，这样的传感器芯片还能够具有用于评估测得的测量数据的逻辑以及存储元件。替选地或补充地，其他构件5可以是选自带集成的有源或无源电路的半导体芯片、无源构件、数字芯片或MEMS构件中的一个或多个。
在下部模块组件的顶侧6上此外安排有重新布线层7。重新布线层7具有金属层8。重新布线层7构造成多层，其中金属层8安排在多层之中。第一构件4具有多个触点9。这些触点与重新布线层7的金属层8相连。通过金属层8，第一构件4的触点9与安排在重新布线层7的顶侧上的触点10相连。因此能够以任意方式设置触点10的位置。尤其地，构件4、5的触点9能够以平面的安排重新布线到下部模块组件1的顶侧6上，从而能够大大增加触点中心距离。
图1中所示的下部模块组件1在其底侧11没有重新布线层。该重新布线层将在后续的方法步骤中生成。
安排在下部模块组件1的顶侧6上的重新布线层7与电镀通孔12电气相连，该电镀通孔延伸穿过下部模块组件1。
此外，下部模块组件1的顶侧6上安排有金属柱13。金属柱13能够例如由铜组成。金属柱13安排在重新布线层7的触点10上并且相应地与重新布线层7的金属层8电接触。金属柱13能够与上部模块组件2的底侧上相应的金属柱配合提供两个模块组件1、2彼此之间的电接触。
在下部模块组件1的顶侧6上此外安排有环14。该环由金属、例如铜制造而成。环14提供机械稳定性并且能够与相应的环相连、例如通过共晶键合相连，该环安排在上部模块组件2的底侧。
此外，下部模块组件1的顶侧6上还能够安排有其他金属结构15、例如由铜构成的金属结构，这些金属结构提供下部和上部模块组件1、2之间的机械连接的机械稳定性，并且这些金属结构未电气连接。
安排在顶侧6的边缘上的环14和安排在顶侧6的内部区域中的其他金属结构15提供下部模块组件1的机械加固并避免出现翘曲。
图2示出了上部模块组件2。图2中示出了一个唯一的上部模块组件2。所述上部模块组件2能够与多个其他上部模块组件2一起制造成晶片复合体或嵌板复合体。
为此，上部模块组件2设计成与下部模块组件1组合成一个模块。上部模块组件2具有与下部模块组件1类似的结构。该上部模块组件2也具有材料3，在该材料中嵌入有第二构件16以及其他构件5。材料3能够例如是上述也用于下部模块组件1的材料中的一种。材料3可以与下部模块组件1的材料3一样或不一样。
上部模块组件2同样形成了一个平台用以集成不同构件16、5。第二构件16和其他构件5能够例如是选自模拟或数字芯片、无源组件或传感器芯片中的一个或多个。
图2中所示的上部模块组件2没有重新布线层7。在替选的实施方式中，上部模块组件2在其底侧17和/或在其顶侧18上具有一层或多层的重新布线层7。
上部模块组件2的底侧17上安排有金属柱13，这些金属柱能够与下部模块组件1的顶侧6上的金属柱13相连，以使两个模块组件1、2相互电接触。金属柱13例如由铜组成并且在其面向下部模块组件1的一侧具有含锡的涂层19。下部模块组件1的金属柱13和上部模块组件2的金属柱13通过共晶键合相连，其中铜和锡的组合形成连接。
替选地，能够用导电的粘合材料替代锡涂覆在金属柱13上。在这种情况下，金属柱13能够与下部模块组件1的相应金属柱粘接在一起。
上部模块组件2在其底侧17此外具有环14，该环构造成用于与下部模块组件1的环14相连。此外，上部模块组件2的底侧17具有其他金属结构15，这些金属结构有助于提高模块的机械稳定性。正如已结合下部模块组件1所讨论的那样，环14和其他金属结构15提供机械加固并且避免上部模块组件2出现翘曲。环14和其他金属结构15也涂覆有锡，以实现通过共晶键合相连。替选地，这些元件能够例如涂覆有胶粘剂。作为通过共晶键合相连的替选，其他连接工艺也是可行的，例如银烧结工艺或焊接。
图3示出了在来自图1的下部模块组件1已与来自图2的上部模块组件2固定后的模块。在此，具有多个下部模块组件1的晶片或嵌板固定在具有相应数量的上部模块组件2的晶片或嵌板上。
两个模块组件1、2已通过共晶键合彼此相连。该步骤已在两个模块组件1、2分别与多个其他模块组件1、2结合成晶片复合体或嵌板复合体期间执行。共晶键合时，环14、金属柱13和其他金属结构15彼此相连。金属柱13提供两个模块组件1、2彼此之间的电接触。环14以及其他金属结构15彼此机械相连并且提高模块的机械稳定性，从而避免模块出现翘曲。
在两个模块组件1、2之间此外已安排有电绝缘的底部填充层20。底部填充层20能够由传统材料或各向异性的导电胶组成。该底部填充层没有空气囊或空心点。底部填充层20因用于模块组件1、2的电气和机械连接的结构而中断。环14、其他金属结构15和金属柱13尤其属于上述结构。
底部填充层20负责使上部模块组件2的底侧17和下部模块组件1的顶侧6分别具有无梯级的同一表面。两个模块组件1、2的连接能够通过底部填充层20进行密封。
此外，材料3被下部模块组件1的底侧11截断，以使电镀通孔12的朝下的端部暴露出来。然后在下部模块组件1的底侧11上涂有接触层21。该接触层使得模块与电路板或类似部件进行触点接通成为可能。
材料3被下部模块组件1的底侧11截断这一过程在下部模块组件1与上部模块组件2相连后才进行，因为模块此后具有了更高的机械稳定性，使得模块在截断材料时折断的危险足够低。
图4示出了在执行制造方法的其他步骤后的图3中所示的模块。
在图3中以晶片复合体或嵌板复合体形式存在的模块现在已分离，例如通过锯切工艺。因此产生模块在图4中示出的倾斜的侧面。
此外，材料3已被上部模块组件2的顶侧18截断。尤其地，上部模块组件2通过磨削过程变薄。在此，构件5、16上方的材料3的厚度降低。此外插入有凹槽，这些凹槽用于电镀通孔。
在上部模块组件2的顶侧18上涂有金属化物22、23、24。金属化物22构成天线结构。金属化物23用于冷却模块。金属化物24用于防止静电放电。此外设置有热通孔25，该热通孔应用于将模块产生的热量导出至顶侧18。
第二构件16在变薄时已暴露出来，从而其顶侧未被材料3所覆盖。相反地，在第二构件16的顶侧现在安排有金属化物23，该金属化物用于冷却第二构件16。
图5示出了根据替选的实施方案的模块。图5中示出的模块与之前示出的模块的不同之处在于，在上部模块组件2的顶侧18上安排有重新布线层7并且在上部模块组件2中设置有电镀通孔12，这些电镀通孔与安排在上部模块组件2的顶侧18上的重新布线层7以安排在底侧17上的触点进行触点连接。电镀通孔12为嵌入式Z线。
安排在上部模块组件2的顶侧18上的重新布线层7构成天线结构。
在图5中示出的模块中，上部模块组件2未变薄。
参考标号列表
1下部模块组件
2上部模块组件
3材料
4第一构件
5另一构件
6下部模块组件的顶侧
7重新布线层
8金属层
9第一构件的触点
10重新布线层的触点
11下部模块组件的底侧
12电镀通孔
13金属柱
14环
15金属结构
16第二构件
17上部模块组件的底侧
18上部模块组件的顶侧
19涂层
20底部填充层
21接触层
22金属化物
23金属化物
24金属化物
25热通孔

Claims (15)

1.一种模块，所述模块具有：
下部模块组件以及上部模块组件，所述下部模块组件具有材料，在所述材料中嵌入有至少一个第一构件(4)，所述上部模块组件具有材料(3)，在所述材料中嵌入有至少一个第二构件(16)，
其中所述上部模块组件和所述下部模块组件相互堆叠，其中所述下部模块组件和所述上部模块组件彼此电接触并且机械相连，
其中所述第一构件(4)和所述第二构件(16)为通过声波工作的滤波器，
其中所述上部模块组件和所述下部模块组件中的至少一个模块组件在面向另一个模块组件的一侧具有第一重新布线层，所述第一重新布线层具有金属层(8)，所述上部模块组件和所述下部模块组件通过所述金属层彼此电接触；
其中所述上部模块组件在其背向所述下部模块组件的顶侧(18)上具有第二重新布线层，所述第二重新布线层具有金属化物，所述金属化物构成天线结构以及无源元件，所述无源元件连接至所述第二构件。
2.根据权利要求1所述的模块，
其中所述模块组件(1，2)中的至少一个在其底侧(11，17)上和其与所述底侧相对而置的顶侧(6，18)上分别具有重新布线层(7)，其中所述重新布线层(7)与电镀通孔(12)相连，所述电镀通孔延伸穿过所述模块组件(1，2)。
3.根据权利要求1或2所述的模块，
其中所述下部模块组件在其面向所述上部模块组件的顶侧(6)上具有金属柱(13)，
其中所述上部模块组件在其面向所述下部模块组件的底侧(17)上具有金属柱(13)，
其中所述下部模块组件的所述金属柱(13)和所述上部模块组件的所述金属柱(13)相连。
4.根据权利要求1或2所述的模块，
其中所述下部模块组件在其面向所述上部模块组件的顶侧(6)上具有金属结构，
其中所述上部模块组件在其面向所述下部模块组件的底侧(17)上具有金属结构，
其中所述下部模块组件的金属结构和所述上部模块组件的金属结构彼此相连，并且所述金属结构如此获得，即所述金属结构不通过其他辅助材料而形成固定的连接。
5.根据权利要求4所述的模块，
其中所述金属结构具有纳米范围内的结构。
6.根据权利要求1或2所述的模块，
其中所述下部模块组件在其面向所述上部模块组件的顶侧(6)上具有金属柱(13)，并且
其中所述上部模块组件在其面向所述下部模块组件的底侧(17)上具有金属结构，所述金属结构如此获得，即所述金属结构不通过其他辅助材料而形成固定的连接，
其中所述下部模块组件的所述金属柱(13)和所述上部模块组件的所述金属结构相连，或
其中所述上部模块组件在其面向所述下部模块组件的底侧(17)上具有金属柱(13)，并且
其中所述下部模块组件在其面向所述上部模块组件的顶侧(6)上具有金属结构，所述金属结构如此获得，即所述金属结构不通过其他辅助材料而形成固定的连接，
其中所述上部模块组件的所述金属柱(13)与所述下部模块组件的所述金属结构相连。
7.根据权利要求1或2所述的模块，
其中在所述模块的外表面上安排有金属化物(23，24)，所述金属化物实现所述模块的电磁屏蔽并且/或者用于所述模块的散热。
8.根据权利要求1或2所述的模块，其中在所述模块的外表面上安排有金属化物(22)，所述金属化物形成天线结构。
9.根据权利要求1或2所述的模块，
其中在背向所述下部模块组件的所述上部模块组件的顶侧(18)上安排有至少一个其他的模块组件，所述模块组件具有材料(3)，在所述材料中嵌入有至少一个第三构件。
10.根据权利要求1或2所述的模块，
其中内部嵌入有所述第一构件和所述第二构件(4，16)的材料(3)为预浸材料或模塑材料。
11.一种用于制造多种模块的方法，所述模块分别具有下部模块组件以及上部模块组件，所述下部模块组件具有材料(3)，在所述材料中嵌入有至少一个第一构件(4)，所述上部模块组件具有材料(3)，在所述材料中嵌入有至少一个第二构件(16)，
其中所述上部模块组件和所述下部模块组件相互堆叠，并且其中所述下部模块组件和所述上部模块组件彼此电接触并且机械相连，
所述方法具有以下步骤：
-生产下部晶片或下部嵌板，在所述晶片或嵌板中安排有采用复合体形式的多种下部模块组件(1，2)，
-生产上部晶片或上部嵌板，在所述晶片或嵌板中安排有采用复合体形式的多种上部模块组件(1，2)，
-将所述下部晶片固定在所述上部晶片上或将所述下部嵌板固定在所述上部嵌板上，并且
-分离模块，
其中所述第一构件(4)和所述第二构件(16)为通过声波工作的滤波器，
其中所述上部模块组件和所述下部模块组件中的至少一个模块组件在面向另一个模块组件的一侧具有第一重新布线层，所述第一重新布线层具有金属层(8)，所述上部模块组件和所述下部模块组件通过所述金属层彼此电接触
其中所述上部模块组件在其背向所述下部模块组件的顶侧(18)上具有第二重新布线层，所述重新布线层具有金属化物，所述金属化物构成天线结构以及无源元件，所述无源元件连接至所述第二构件。
12.根据权利要求11所述的方法，
其中所述下部晶片和所述上部晶片或所述下部嵌板和所述上部嵌板借助共晶键合、热压键合、导电粘合、烧结或焊接彼此相连。
13.根据权利要求11或12之一所述的方法，其中在生产所述下部晶片或所述下部嵌板时以板材成型的方法向所述材料(3)的单侧嵌入第一构件，其中所述材料(3)压制成薄膜，
并且/或者
其中在生产所述上部晶片或所述上部嵌板时以板材成型的方法向所述材料(3)的单侧嵌入第二构件，其中所述材料(3)压制成薄膜。
14.根据权利要求11或12之一所述的方法，其中在生产所述下部晶片或所述下部嵌板时在真空层压过程中向所述材料(3)中嵌入所述第一构件，并且然后所述下部晶片或下部嵌板通过绝缘材料交联，
并且/或者
其中在生产所述上部晶片或所述上部嵌板时在真空层压过程中向所述材料(3)中嵌入所述第二构件，并且然后所述上部晶片或上部嵌板通过绝缘材料交联。
15.根据权利要求11或12所述的方法，
其中在将所述下部晶片或下部嵌板固定在所述上部晶片或上部嵌板上后，所述上部晶片或所述上部嵌板会经受磨削过程，在所述磨削过程中所述上部晶片或所述上部嵌板的厚度会降低。
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