CN101346449B - 粘接剂组合物、电路连接材料以及电路构件的连接结构 - Google Patents

粘接剂组合物、电路连接材料以及电路构件的连接结构 Download PDF

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Publication number
CN101346449B
CN101346449B CN2006800490521A CN200680049052A CN101346449B CN 101346449 B CN101346449 B CN 101346449B CN 2006800490521 A CN2006800490521 A CN 2006800490521A CN 200680049052 A CN200680049052 A CN 200680049052A CN 101346449 B CN101346449 B CN 101346449B
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CN
China
Prior art keywords
circuit
connection
particles
conductive particles
adhesive
Prior art date
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Expired - Fee Related
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CN2006800490521A
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English (en)
Chinese (zh)
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CN101346449A (zh
Inventor
立泽贵
小林宏治
藤绳贡
福岛直树
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication of CN101346449A publication Critical patent/CN101346449A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN2006800490521A 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构 Expired - Fee Related CN101346449B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP373042/2005 2005-12-26
JP2005373042 2005-12-26
JP213230/2006 2006-08-04
JP2006213230 2006-08-04
PCT/JP2006/324929 WO2007074652A1 (ja) 2005-12-26 2006-12-14 接着剤組成物、回路接続材料及び回路部材の接続構造

Related Child Applications (4)

Application Number Title Priority Date Filing Date
CN2011100495458A Division CN102161873A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN2011101256810A Division CN102244042A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN201110049541XA Division CN102153964A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN2011100495265A Division CN102161866A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构

Publications (2)

Publication Number Publication Date
CN101346449A CN101346449A (zh) 2009-01-14
CN101346449B true CN101346449B (zh) 2011-06-15

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Family Applications (5)

Application Number Title Priority Date Filing Date
CN2006800490521A Expired - Fee Related CN101346449B (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN2011100495265A Pending CN102161866A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN2011101256810A Pending CN102244042A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN2011100495458A Pending CN102161873A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN201110049541XA Pending CN102153964A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构

Family Applications After (4)

Application Number Title Priority Date Filing Date
CN2011100495265A Pending CN102161866A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN2011101256810A Pending CN102244042A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN2011100495458A Pending CN102161873A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构
CN201110049541XA Pending CN102153964A (zh) 2005-12-26 2006-12-14 粘接剂组合物、电路连接材料以及电路构件的连接结构

Country Status (7)

Country Link
US (1) US20120085579A1 (https=)
EP (3) EP1967564A4 (https=)
JP (3) JPWO2007074652A1 (https=)
KR (3) KR20110036777A (https=)
CN (5) CN101346449B (https=)
TW (4) TW201132736A (https=)
WO (1) WO2007074652A1 (https=)

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JP6859077B2 (ja) * 2015-11-11 2021-04-14 積水化学工業株式会社 粒子材料、接続材料及び接続構造体
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Publication number Publication date
CN102153964A (zh) 2011-08-17
TWI379882B (https=) 2012-12-21
JP4998635B2 (ja) 2012-08-15
TW200728430A (en) 2007-08-01
EP1967564A4 (en) 2010-08-04
CN102244042A (zh) 2011-11-16
TWI375709B (https=) 2012-11-01
EP2322585A1 (en) 2011-05-18
CN101346449A (zh) 2009-01-14
EP1967564A1 (en) 2008-09-10
JP2011179006A (ja) 2011-09-15
TW201114877A (en) 2011-05-01
KR20110036778A (ko) 2011-04-08
US20120085579A1 (en) 2012-04-12
KR20110036777A (ko) 2011-04-08
KR101140088B1 (ko) 2012-04-30
WO2007074652A1 (ja) 2007-07-05
JP2011179004A (ja) 2011-09-15
CN102161873A (zh) 2011-08-24
CN102161866A (zh) 2011-08-24
TW201132736A (en) 2011-10-01
TW201114878A (en) 2011-05-01
JPWO2007074652A1 (ja) 2009-06-04
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