JP4998635B2 - 接着剤組成物、回路接続材料及び回路部材の接続構造 - Google Patents
接着剤組成物、回路接続材料及び回路部材の接続構造 Download PDFInfo
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- JP4998635B2 JP4998635B2 JP2011082153A JP2011082153A JP4998635B2 JP 4998635 B2 JP4998635 B2 JP 4998635B2 JP 2011082153 A JP2011082153 A JP 2011082153A JP 2011082153 A JP2011082153 A JP 2011082153A JP 4998635 B2 JP4998635 B2 JP 4998635B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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Description
(GPC条件)
使用機器:日立L−6000型((株)日立製作所製、商品名)
検出器:L−3300RI((株)日立製作所製、商品名)
カラム:ゲルパックGL−R420+ゲルパックGL−R430+ゲルパックGL−R440(計3本)(日立化成工業(株)製、商品名)
溶離液:テトラヒドロフラン
測定温度:40℃
流量:1.75ml/min
[接着剤組成物の調製]
ラジカル重合性化合物として、ウレタンアクリレート(新中村化学工業社製、商品名「UA−5500T」)10質量部、ビス(アクリロキシエチル)イソシアヌレート(東亜合成社製、商品名「M−215」)25質量部、ジメチロールトリシクロデカンジアクリレート(共栄社化学社製、商品名「DCP−A」)10質量部及びモノ(2−メタクリロイルオキシエチル)アッシドフォスフェート(共栄社化学社製、商品名「P−2M」)1質量部、遊離ラジカル発生剤として2,5−ジメチル−2,5−ビス(2−エチルヘキサノイルパーオキシ)ヘキサンの50質量%炭化水素希釈溶液(日本油脂社製、商品名「パーヘキサ25O」)4質量部を準備した。また、ポリエステルウレタン樹脂(東洋紡績社製、商品名「UR8200」)をトルエン/メチルエチルケトン=50/50(質量比)の混合溶剤に溶解して得られた固形分40質量%のポリエステルウレタン樹脂溶液80質量部を準備した。上述のラジカル重合性化合物及び遊離ラジカル発生剤を、上記ポリエステルウレタン樹脂溶液に混合した後、均一に攪拌して接着剤成分を得た。
上述のようにして得られた接着シート(幅1.5mm、長さ3cm)を、接続部が面取りされたITOコートガラス基板(15Ω□)上に、基板と接着層が接触するように載置して積層体を得た。得られた積層体に対して、それらの積層方向に、加熱温度70℃、加圧圧力1MPaの条件で2秒間加熱及び加圧を施して、接着層を基板に貼り付けた。その後、PETフィルムを接着層から剥離した。
作製した直後の回路部材の接続構造について、FPCの隣り合う回路電極間の抵抗(初期接続抵抗)をマルチメータ(アドバンテスト社製、商品名「TR6845」)で測定した。抵抗値の測定は隣り合う回路電極間40点で行い、得られた抵抗値の相加平均値を求めた。その結果、接続構造の初期接続抵抗値は1.5Ωとなり、良好な接続特性を示した。
作製した直後の回路部材の接続構造について、FPCの90°剥離試験を、剥離速度50mm/分で行い、その時の最大荷重を測定して接着力とした。その結果、接着力は約1000N/mと、良好な接着特性を示した。
上述の回路部材の接続構造の作製において、PETフィルムを接着層から剥離した。その後、回路電極としての錫めっき銅回路(ライン幅25μm、ピッチ50μm、厚み8μm)100本がポリイミドフィルム上に形成されてなり、ライン間及びラインの一部を覆うように形成されたソルダーレジストを備えるフレキシブル回路板(FPC)を準備した。次に、接着層上に、基板の面取り部分とFPCのソルダーレジストが重なるように、FPCを載置した。続いて、それらに対して、加熱温度24℃、加圧圧力0.5MPaの条件で、1秒間積層方向に加熱及び加圧を施し、仮接続を行った。
導電粒子の平均粒径、導電粒子の配合量、絶縁粒子の平均粒径、及び/又は絶縁粒子の配合量を表1、2に示すように代えた以外は参考例1と同様にして、回路部材の接続構造を作製した。得られた回路部材の接続構造に対して、参考例1と同様にして、接続抵抗及び接着力の測定並びに短絡有無の評価を行った。結果を表1、2に示す。
ウレタンアクリレートの配合量を10質量部に代えて35質量部とし、ビス(アクリロキシエチル)イソシアヌレートの配合量を25質量部に変えて0質量部、すなわち配合しなかった以外は実施例10と同様にして、回路部材の接続構造を作製した。得られた回路部材の接続構造に対して、参考例1と同様にして、接続抵抗及び接着力の測定並びに短絡有無の評価を行った。結果を表2に示す。
ポリエステルウレタン樹脂に代えてフェノキシ樹脂(分子量45000)を用いた以外は実施例10と同様にして、回路部材の接続構造を作製した。得られた回路部材の接続構造に対して、参考例1と同様にして、接続抵抗及び接着力の測定並びに短絡有無の評価を行った。結果を表2に示す。
絶縁粒子をポリスチレン−ジビニルベンゼン共重合体からなるものに代えてシリコーン樹脂からなるものにした以外は参考例1と同様にして、回路部材の接続構造を作製した。なお、絶縁粒子の10%圧縮弾性率(K値)を測定したところ、30kgf/mm2であった。得られた回路部材の接続構造に対して、参考例1と同様にして、接続抵抗及び接着力の測定並びに短絡有無の評価を行った。結果を表2に示す。
絶縁粒子を用いない以外は参考例1と同様にして、回路部材の接続構造を作製した。得られた回路部材の接続構造に対して、参考例1と同様にして、接続抵抗及び接着力の測定並びに短絡有無の評価を行った。結果を表3に示す。
導電粒子の平均粒径、導電粒子の配合量、絶縁粒子の平均粒径、及び/又は絶縁粒子の配合量を表3に示すように代えた以外は参考例1と同様にして、回路部材の接続構造を作製した。得られた回路部材の接続構造に対して、参考例1と同様にして、接続抵抗及び接着力の測定並びに短絡有無の評価を行った。結果を表3に示す。
Claims (14)
- LCDパネル基板の主面上に第1の回路電極が形成されたLCDパネルと、
COF用フィルムの主面上に第2の回路電極及びレジストが形成されたCOFと、
前記LCDパネル基板の主面と前記COF用フィルムの主面との間に設けられ、前記第1の回路電極と前記第2の回路電極とを対向配置させた状態で電気的に接続する回路接続部材と、
を備え、
前記回路接続部材は、回路接続材料の硬化物であり、
前記回路接続材料は、接着剤成分と、導電粒子と、絶縁粒子と、を含有し、前記導電粒子の平均粒径Rcに対する前記絶縁粒子の平均粒径Riの比(Ri/Rc)が200〜300%である、接着剤組成物を含有し、
前記LCDパネル基板が、当該基板の接続部エッジに面取りが施されることにより設けられた面取り部を有し、
前記LCDパネル及び前記COFが、前記面取り部と前記レジストとが接するように配置されている、回路部材の接続構造。 - 前記回路接続材料は、前記接着剤成分100質量部に対して、前記絶縁粒子を1〜20質量部含有する、請求項1に記載の回路部材の接続構造。
- 前記回路接続材料は、前記接着剤成分100質量部に対して、前記絶縁粒子を5〜10質量部含有し、前記絶縁粒子が、絶縁性の樹脂を主成分として含有する粒子である、請求項1又は2に記載の回路部材の接続構造。
- 前記回路接続材料は、前記絶縁性の樹脂がシリコーン樹脂である、請求項3に記載の回路部材の接続構造。
- 前記回路接続材料は、前記導電粒子の平均粒径Rcが1〜20μmである、請求項1〜4のいずれか一項に記載の回路部材の接続構造。
- 前記回路接続材料は、前記導電粒子の平均粒径Rcが2〜10μmである、請求項5に記載の回路部材の接続構造。
- 前記回路接続材料は、前記絶縁粒子の平均粒径Riが1.2〜20μmである、請求項1〜6のいずれか一項に記載の回路部材の接続構造。
- 前記回路接続材料は、前記接着剤成分100体積部に対して、前記導電粒子を0.1〜30体積部含有する、請求項1〜7のいずれか一項に記載の回路部材の接続構造。
- 前記回路接続材料は、前記絶縁粒子の10%圧縮弾性率(K値)が、前記導電粒子のK値以下である、請求項1〜8のいずれか一項に記載の回路部材の接続構造。
- 前記回路接続材料は、前記導電粒子のK値が100〜1000kgf/mm 2 であり、前記絶縁粒子のK値が1〜1000kgf/mm 2 である、請求項9記載の回路部材の接続構造。
- 前記回路接続材料は、前記導電粒子100体積部に対して、前記絶縁粒子を50〜300体積部含有する、請求項1〜10のいずれか一項に記載の回路部材の接続構造。
- 前記回路接続材料は、フィルム状に形成されてなる、請求項1〜11のいずれか一項に記載の回路部材の接続構造。
- 請求項1〜12のいずれか一項に記載の回路部材の接続構造の製造方法であって、
前記LCDパネル、前記回路接続材料及び前記COFからなる積層体を積層方向に加熱及び加圧して前記回路接続材料を硬化させる、回路部材の接続構造の製造方法。 - 前記LCDパネル基板上に前記回路接続材料からなる接着層が設けられた前記LCDパネル及び前記COFからなる積層体を積層方向に加熱及び加圧して前記回路接続材料を硬化させる、請求項13に記載の回路部材の接続構造の製造方法。
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EP2211596A4 (en) * | 2007-10-02 | 2011-08-10 | Hitachi Chemical Co Ltd | CIRCUIT CONNECTION MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE |
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CN102161873A (zh) | 2011-08-24 |
TW201114877A (en) | 2011-05-01 |
KR20110036778A (ko) | 2011-04-08 |
KR101140088B1 (ko) | 2012-04-30 |
WO2007074652A1 (ja) | 2007-07-05 |
TW200728430A (en) | 2007-08-01 |
TWI375709B (ja) | 2012-11-01 |
EP2348087A1 (en) | 2011-07-27 |
KR20080081353A (ko) | 2008-09-09 |
CN102244042A (zh) | 2011-11-16 |
KR101139984B1 (ko) | 2012-05-02 |
TW201114878A (en) | 2011-05-01 |
TWI379882B (ja) | 2012-12-21 |
JP2011179006A (ja) | 2011-09-15 |
CN101346449B (zh) | 2011-06-15 |
EP1967564A1 (en) | 2008-09-10 |
TW201132736A (en) | 2011-10-01 |
JPWO2007074652A1 (ja) | 2009-06-04 |
KR20110036777A (ko) | 2011-04-08 |
CN102153964A (zh) | 2011-08-17 |
EP2322585A1 (en) | 2011-05-18 |
JP2011179004A (ja) | 2011-09-15 |
CN101346449A (zh) | 2009-01-14 |
CN102161866A (zh) | 2011-08-24 |
EP1967564A4 (en) | 2010-08-04 |
US20120085579A1 (en) | 2012-04-12 |
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