TWI379882B - - Google Patents

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Publication number
TWI379882B
TWI379882B TW100117777A TW100117777A TWI379882B TW I379882 B TWI379882 B TW I379882B TW 100117777 A TW100117777 A TW 100117777A TW 100117777 A TW100117777 A TW 100117777A TW I379882 B TWI379882 B TW I379882B
Authority
TW
Taiwan
Prior art keywords
circuit
particles
conductive particles
particle diameter
average particle
Prior art date
Application number
TW100117777A
Other languages
English (en)
Chinese (zh)
Other versions
TW201132736A (en
Inventor
Takashi Tatsuzawa
Kouji Kobayashi
Tohru Fujinawa
Naoki Fukushima
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201132736A publication Critical patent/TW201132736A/zh
Application granted granted Critical
Publication of TWI379882B publication Critical patent/TWI379882B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW100117777A 2005-12-26 2006-12-22 Adhesive composition, circuit connecting material and connecting structure of circuit member TW201132736A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005373042 2005-12-26
JP2006213230 2006-08-04

Publications (2)

Publication Number Publication Date
TW201132736A TW201132736A (en) 2011-10-01
TWI379882B true TWI379882B (https=) 2012-12-21

Family

ID=38217873

Family Applications (4)

Application Number Title Priority Date Filing Date
TW100117777A TW201132736A (en) 2005-12-26 2006-12-22 Adhesive composition, circuit connecting material and connecting structure of circuit member
TW099135570A TW201114878A (en) 2005-12-26 2006-12-22 Adhesive composition, circuit connecting material and connecting structure of circuit member
TW099135569A TW201114877A (en) 2005-12-26 2006-12-22 Adhesive composition, circuit connecting material and connecting structure of circuit member
TW095148545A TW200728430A (en) 2005-12-26 2006-12-22 Adhesive composition, circuit connecting material and connecting structure of a circuit member

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW099135570A TW201114878A (en) 2005-12-26 2006-12-22 Adhesive composition, circuit connecting material and connecting structure of circuit member
TW099135569A TW201114877A (en) 2005-12-26 2006-12-22 Adhesive composition, circuit connecting material and connecting structure of circuit member
TW095148545A TW200728430A (en) 2005-12-26 2006-12-22 Adhesive composition, circuit connecting material and connecting structure of a circuit member

Country Status (7)

Country Link
US (1) US20120085579A1 (https=)
EP (3) EP1967564A4 (https=)
JP (3) JPWO2007074652A1 (https=)
KR (3) KR20110036777A (https=)
CN (5) CN101346449B (https=)
TW (4) TW201132736A (https=)
WO (1) WO2007074652A1 (https=)

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US20100221533A1 (en) * 2007-10-15 2010-09-02 Hitachi Chemical Company, Ltd. Circuit connecting adhesive film and circuit connecting structure
WO2009057376A1 (ja) * 2007-10-29 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料、接続構造体及びその製造方法
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US8319339B2 (en) * 2009-07-10 2012-11-27 Stmicroelectronics (Tours) Sas Surface-mounted silicon chip
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US9412717B2 (en) * 2011-11-04 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for molded underfills in flip chip packaging
JP5972564B2 (ja) * 2011-12-14 2016-08-17 デクセリアルズ株式会社 接続方法、接続構造体、異方性導電フィルム及びその製造方法
JP5936882B2 (ja) * 2012-03-02 2016-06-22 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
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CN103294248B (zh) * 2012-08-17 2016-04-20 上海天马微电子有限公司 触控液晶显示装置的电连接结构
US20150181702A1 (en) * 2013-03-05 2015-06-25 Eastman Kodak Company Micro-wire connection pad
KR101568659B1 (ko) * 2013-03-29 2015-11-12 제일모직주식회사 도전성 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
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CN107251253B (zh) * 2015-02-24 2019-11-05 株式会社村田制作所 压电振动部件和涂布方法
GB2539684B (en) * 2015-06-24 2018-04-04 Dst Innovations Ltd Method of surface-mounting components
TWI690580B (zh) * 2015-09-16 2020-04-11 日商日立化成股份有限公司 接著劑組成物、異向導電性接著劑組成物、電路連接材料及連接體
JP6859077B2 (ja) * 2015-11-11 2021-04-14 積水化学工業株式会社 粒子材料、接続材料及び接続構造体
JP6652513B2 (ja) 2016-03-03 2020-02-26 信越化学工業株式会社 生体電極の製造方法
EP3428600B1 (en) * 2016-03-10 2023-05-24 Sekisui Chemical Co., Ltd. Adhesive for semiconductor sensor chip mounting, and semiconductor sensor
JP6549517B2 (ja) * 2016-05-09 2019-07-24 信越化学工業株式会社 生体電極及びその製造方法
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Also Published As

Publication number Publication date
CN102153964A (zh) 2011-08-17
JP4998635B2 (ja) 2012-08-15
TW200728430A (en) 2007-08-01
EP1967564A4 (en) 2010-08-04
CN102244042A (zh) 2011-11-16
TWI375709B (https=) 2012-11-01
EP2322585A1 (en) 2011-05-18
CN101346449A (zh) 2009-01-14
EP1967564A1 (en) 2008-09-10
JP2011179006A (ja) 2011-09-15
TW201114877A (en) 2011-05-01
KR20110036778A (ko) 2011-04-08
US20120085579A1 (en) 2012-04-12
KR20110036777A (ko) 2011-04-08
KR101140088B1 (ko) 2012-04-30
WO2007074652A1 (ja) 2007-07-05
JP2011179004A (ja) 2011-09-15
CN102161873A (zh) 2011-08-24
CN102161866A (zh) 2011-08-24
TW201132736A (en) 2011-10-01
TW201114878A (en) 2011-05-01
JPWO2007074652A1 (ja) 2009-06-04
KR101139984B1 (ko) 2012-05-02
CN101346449B (zh) 2011-06-15
EP2348087A1 (en) 2011-07-27
KR20080081353A (ko) 2008-09-09

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