CN100587002C - 固化性树脂组合物、粘接性环氧树脂膏、粘接性环氧树脂薄片、导电连接膏、导电连接薄片和电子器件接合体 - Google Patents

固化性树脂组合物、粘接性环氧树脂膏、粘接性环氧树脂薄片、导电连接膏、导电连接薄片和电子器件接合体 Download PDF

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Publication number
CN100587002C
CN100587002C CN200380108393A CN200380108393A CN100587002C CN 100587002 C CN100587002 C CN 100587002C CN 200380108393 A CN200380108393 A CN 200380108393A CN 200380108393 A CN200380108393 A CN 200380108393A CN 100587002 C CN100587002 C CN 100587002C
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China
Prior art keywords
epoxy resin
adhesive
sheet
conductive
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CN200380108393A
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English (en)
Chinese (zh)
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CN1735660A (zh
Inventor
渡部功治
江南俊夫
竹部义之
铃木卓夫
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Epoxy Resins (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200380108393A 2003-01-07 2003-12-26 固化性树脂组合物、粘接性环氧树脂膏、粘接性环氧树脂薄片、导电连接膏、导电连接薄片和电子器件接合体 Expired - Lifetime CN100587002C (zh)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP001276/2003 2003-01-07
JP2003001276 2003-01-07
JP2003083588 2003-03-25
JP083588/2003 2003-03-25
JP2003177221 2003-06-20
JP177222/2003 2003-06-20
JP177221/2003 2003-06-20
JP2003177222 2003-06-20
JP2003338284 2003-09-29
JP338284/2003 2003-09-29
JP403703/2003 2003-12-02
JP2003403703A JP4238124B2 (ja) 2003-01-07 2003-12-02 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
PCT/JP2003/016906 WO2004060996A1 (ja) 2003-01-07 2003-12-26 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN 200710008000 Division CN101016402A (zh) 2003-01-07 2003-12-26 固化性树脂组合物、粘接性环氧树脂膏、粘接性环氧树脂薄片、导电连接膏、导电连接薄片和电子器件接合体

Publications (2)

Publication Number Publication Date
CN1735660A CN1735660A (zh) 2006-02-15
CN100587002C true CN100587002C (zh) 2010-02-03

Family

ID=32719682

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200380108393A Expired - Lifetime CN100587002C (zh) 2003-01-07 2003-12-26 固化性树脂组合物、粘接性环氧树脂膏、粘接性环氧树脂薄片、导电连接膏、导电连接薄片和电子器件接合体

Country Status (8)

Country Link
US (1) US7645514B2 (https=)
EP (1) EP1584657A4 (https=)
JP (1) JP4238124B2 (https=)
KR (2) KR100932045B1 (https=)
CN (1) CN100587002C (https=)
AU (1) AU2003296145A1 (https=)
TW (1) TW200417576A (https=)
WO (1) WO2004060996A1 (https=)

Families Citing this family (139)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006022194A (ja) * 2004-07-07 2006-01-26 Sekisui Chem Co Ltd 硬化性樹脂フィルム、接着性エポキシ樹脂フィルム、非導電性フィルム及びダイアタッチフィルム
TW200613493A (en) * 2004-08-09 2006-05-01 Sumitomo Chemical Co Acrylic resin composition
US20060110600A1 (en) * 2004-11-19 2006-05-25 3M Innovative Properties Company Anisotropic conductive adhesive composition
EP1671670A1 (fr) * 2004-12-14 2006-06-21 STX Sprl Appareil pour l'electro-inhibition des muscles de la face
JP4947905B2 (ja) * 2005-02-04 2012-06-06 株式会社日本触媒 光半導体封止用樹脂組成物
US7999994B2 (en) 2005-02-23 2011-08-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US8310442B2 (en) 2005-02-23 2012-11-13 Pixtronix, Inc. Circuits for controlling display apparatus
US9229222B2 (en) * 2005-02-23 2016-01-05 Pixtronix, Inc. Alignment methods in fluid-filled MEMS displays
US8482496B2 (en) 2006-01-06 2013-07-09 Pixtronix, Inc. Circuits for controlling MEMS display apparatus on a transparent substrate
US9082353B2 (en) 2010-01-05 2015-07-14 Pixtronix, Inc. Circuits for controlling display apparatus
US8159428B2 (en) 2005-02-23 2012-04-17 Pixtronix, Inc. Display methods and apparatus
US9261694B2 (en) 2005-02-23 2016-02-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US8519945B2 (en) 2006-01-06 2013-08-27 Pixtronix, Inc. Circuits for controlling display apparatus
US20070205969A1 (en) 2005-02-23 2007-09-06 Pixtronix, Incorporated Direct-view MEMS display devices and methods for generating images thereon
US9158106B2 (en) 2005-02-23 2015-10-13 Pixtronix, Inc. Display methods and apparatus
EP1863038B1 (en) * 2005-03-23 2010-09-08 Murata Manufacturing Co., Ltd. Composite dielectric sheet, method for manufacturing same and multilayer electronic component
US20060289500A1 (en) * 2005-05-11 2006-12-28 Naohisa Okumura Semiconductor memory card comprising semiconductor memory chip
JP2007012378A (ja) * 2005-06-29 2007-01-18 Fujikura Kasei Co Ltd 導電性微粒子
JP2007016126A (ja) * 2005-07-07 2007-01-25 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び電子部品
JP2007056209A (ja) * 2005-08-26 2007-03-08 Sumitomo Electric Ind Ltd 回路接続用接着剤
JP2007091959A (ja) * 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP4970767B2 (ja) * 2005-10-26 2012-07-11 リンテック株式会社 導電接合シート用の絶縁シート、導電接合シート、導電接合シートの製造方法および電子複合部品の製造方法
US7722950B2 (en) * 2005-11-14 2010-05-25 World Properties, Inc. Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
EP1976354A4 (en) * 2006-01-20 2012-08-01 Fujitsu Ltd CHIP COMPONENT APPLICATION STRUCTURE, CHIP COMPONENT APPLICATION METHOD AND ELECTRONIC EQUIPMENT
US8526096B2 (en) 2006-02-23 2013-09-03 Pixtronix, Inc. Mechanical light modulators with stressed beams
EP2044163B1 (en) * 2006-07-24 2012-04-25 3M Innovative Properties Company Electrically conductive pressure sensitive adhesives
US20080029214A1 (en) * 2006-08-04 2008-02-07 Zephyros, Inc. Multiple or single stage cure adhesive material and method of use
US7732936B2 (en) * 2006-09-06 2010-06-08 Intel Corporation Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer
US20080152921A1 (en) * 2006-12-20 2008-06-26 3M Innovative Properties Company Thermally B-Stageable Composition for Rapid Electronic Device Assembly
JP5000309B2 (ja) * 2007-01-10 2012-08-15 京セラケミカル株式会社 電子部品の実装方法および電子部品モジュールの製造方法
US9176318B2 (en) 2007-05-18 2015-11-03 Pixtronix, Inc. Methods for manufacturing fluid-filled MEMS displays
CN101641773B (zh) * 2007-04-10 2011-08-17 住友电木株式会社 用于半导体的粘合膜和使用该粘合膜的半导体器件
JP5029691B2 (ja) * 2007-06-13 2012-09-19 日立化成工業株式会社 回路接続用フィルム状接着剤
US20090014852A1 (en) * 2007-07-11 2009-01-15 Hsin-Hui Lee Flip-Chip Packaging with Stud Bumps
JP5336485B2 (ja) * 2007-08-02 2013-11-06 ダウ グローバル テクノロジーズ エルエルシー 熱硬化性ポリマーの性能を向上させるための両親媒性ブロックコポリマーおよび無機ナノフィラー
KR101497736B1 (ko) * 2007-08-28 2015-03-02 스미토모 베이클리트 컴퍼니 리미티드 다층 프린트 배선판용 절연 수지 조성물, 기재 부착 절연 수지 시트, 다층 프린트 배선판 및 반도체 장치
US9201299B2 (en) 2007-10-01 2015-12-01 San-Ei Kagaku Co., Ltd. Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same
DE102008045424B4 (de) * 2007-10-01 2018-03-22 San-Ei Kagaku Co. Ltd. Einen anorganischen Füllstoff und einen organischen Füllstoff enthaltende härtbare Kunstharzmischung und Verwendung derselben
JP5464314B2 (ja) * 2007-10-01 2014-04-09 山栄化学株式会社 無機フィラー及び有機フィラー含有硬化性樹脂組成物、並びにレジスト膜被覆プリント配線板及びその製造方法
CN102850982A (zh) 2007-10-05 2013-01-02 日立化成工业株式会社 粘接剂组合物和使用该组合物的电路连接膜，以及电路部件的连接方法和电路连接体
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
KR100924531B1 (ko) * 2007-12-31 2009-11-02 주식회사 효성 솔-젤법을 이용한 극미세 피치용 이방성 도전 필름의제조방법
KR101023843B1 (ko) * 2008-01-11 2011-03-22 주식회사 엘지화학 점착제 조성물, 상기를 포함하는 편광판 및 액정표시장치
JP2009170753A (ja) * 2008-01-18 2009-07-30 Panasonic Corp 多層プリント配線板とこれを用いた実装体
CN101959922B (zh) 2008-02-28 2013-08-07 积水化学工业株式会社 固化性环氧组合物、各向异性导电材料以及连接结构体
WO2009116618A1 (ja) * 2008-03-21 2009-09-24 積水化学工業株式会社 硬化性組成物、異方性導電材料及び接続構造体
JP5499448B2 (ja) * 2008-07-16 2014-05-21 デクセリアルズ株式会社 異方性導電接着剤
JP2010077305A (ja) * 2008-09-26 2010-04-08 Yokohama Rubber Co Ltd:The エポキシ樹脂組成物
JP5485523B2 (ja) * 2008-08-19 2014-05-07 積水化学工業株式会社 スクリーン印刷用接着剤
US8169679B2 (en) 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
US8482931B2 (en) * 2008-12-24 2013-07-09 Panasonic Corporation Package structure
CN101515486B (zh) * 2009-03-27 2011-08-17 彩虹集团公司 一种光热固化导电浆料的制造方法
TWI504655B (zh) * 2009-04-10 2015-10-21 Saint Gobain Performance Plast 含有彈性體微粒之聲阻尼組合物
WO2010118358A2 (en) * 2009-04-10 2010-10-14 Saint-Gobain Performance Plastics Corporation Acoustic damping compositions
JP2010260924A (ja) * 2009-04-30 2010-11-18 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
JP5792924B2 (ja) * 2009-04-30 2015-10-14 住友電気工業株式会社 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
CN102459395B (zh) * 2009-06-15 2015-01-28 味之素株式会社 树脂组合物和有机电解液电池
CA2766859A1 (en) 2009-07-08 2011-01-13 Henkel Ag & Co. Kgaa Electrically conductive adhesives
JP5635748B2 (ja) * 2009-08-26 2014-12-03 積水化学工業株式会社 半導体チップ接合用接着剤
JP5602743B2 (ja) * 2009-08-26 2014-10-08 積水化学工業株式会社 異方性導電材料、接続構造体及び接続構造体の製造方法
JP5526750B2 (ja) * 2009-12-09 2014-06-18 横浜ゴム株式会社 エポキシ樹脂組成物
JP2011132310A (ja) * 2009-12-22 2011-07-07 Nippon Zeon Co Ltd エポキシ基含有シクロペンタジエン系樹脂からなる硬化性樹脂組成物
WO2011087477A1 (en) * 2009-12-22 2011-07-21 Dow Global Technologies Llc Substantially solvent-free epoxy formulations
JP5130397B2 (ja) * 2010-01-21 2013-01-30 積水化学工業株式会社 熱硬化性樹脂組成物、先塗布型フリップチップ実装用接着剤、半導体装置の製造方法、及び、半導体装置
BR112012019383A2 (pt) 2010-02-02 2017-09-12 Pixtronix Inc Circuitos para controlar aparelho de exibição
WO2011097252A2 (en) 2010-02-02 2011-08-11 Pixtronix, Inc. Methods for manufacturing cold seal fluid-filled display apparatus
KR101162890B1 (ko) * 2010-03-17 2012-07-05 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전성 입자의 제조 방법, 이방성 도전 재료 및 접속 구조체
KR101567131B1 (ko) * 2010-03-19 2015-11-06 세키스이가가쿠 고교가부시키가이샤 경화성 조성물, 다이싱-다이본딩 테이프, 접속 구조체 및 점접착제층을 갖는 반도체 칩의 제조 방법
JP5619466B2 (ja) * 2010-04-13 2014-11-05 デクセリアルズ株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム
JP5654293B2 (ja) * 2010-09-03 2015-01-14 積水化学工業株式会社 半導体チップの実装方法及び半導体装置
KR101679657B1 (ko) * 2010-09-29 2016-11-25 삼성전자주식회사 유리섬유를 이용한 웨이퍼 레벨 몰드 형성방법 및 그 방법에 의한 웨이퍼 구조
CN102034721B (zh) * 2010-11-05 2013-07-10 南通富士通微电子股份有限公司 芯片封装方法
CN102034720B (zh) 2010-11-05 2013-05-15 南通富士通微电子股份有限公司 芯片封装方法
DE102011077757A1 (de) * 2010-11-24 2012-05-24 Robert Bosch Gmbh Verfahren zur Aushärtung eines elektrisch leitfähigen Klebstoffs und Kontaktstelle zwischen zwei Fügepartnern
KR101362868B1 (ko) * 2010-12-29 2014-02-14 제일모직주식회사 이중층 이방성 도전성 필름
JP5850621B2 (ja) * 2011-01-17 2016-02-03 積水化学工業株式会社 異方性導電ペースト、接続構造体及び接続構造体の製造方法
JP2012169263A (ja) * 2011-01-24 2012-09-06 Sekisui Chem Co Ltd 異方性導電材料、接続構造体の製造方法及び接続構造体
JP5438783B2 (ja) * 2011-02-01 2014-03-12 積水化学工業株式会社 異方性導電材料及び接続構造体
TWI608062B (zh) * 2011-05-31 2017-12-11 住友電木股份有限公司 樹脂組成物、使用它之半導體裝置及半導體裝置之製造方法
JP2011181525A (ja) * 2011-06-09 2011-09-15 Sony Chemical & Information Device Corp 異方性導電材料
TW201308354A (zh) * 2011-07-07 2013-02-16 Hitachi Chemical Co Ltd 電路連接材料及電路基板的連接構造體
WO2013027389A1 (ja) * 2011-08-22 2013-02-28 三井化学株式会社 シート状エポキシ樹脂組成物、及びこれを含む封止用シート
CN103828114B (zh) 2011-09-26 2018-03-09 住友化学株式会社 二次电池用粘合树脂组合物
JP2013149467A (ja) * 2012-01-19 2013-08-01 Sekisui Chem Co Ltd 異方性導電フィルム、接続構造体及び接続構造体の製造方法
JP2013149466A (ja) * 2012-01-19 2013-08-01 Sekisui Chem Co Ltd 異方性導電材料、接続構造体及び接続構造体の製造方法
JP2013175546A (ja) * 2012-02-24 2013-09-05 Dexerials Corp アンダーフィル材、及びそれを用いた半導体装置の製造方法
WO2013150907A1 (ja) * 2012-04-02 2013-10-10 株式会社スリーボンド 導電性組成物
TWI600701B (zh) * 2012-07-19 2017-10-01 長瀨化成股份有限公司 A semiconductor sealing epoxy resin composition and a method of manufacturing the semiconductor device
JP6316811B2 (ja) 2012-08-03 2018-04-25 エルジー・ケム・リミテッド 接着フィルム及びこれを利用した有機電子装置の封止製品
KR101365107B1 (ko) * 2012-09-21 2014-02-20 제일모직주식회사 이방성 도전 필름 및 이를 포함하는 반도체 장치
US9840058B2 (en) * 2012-10-31 2017-12-12 Dunlop Sports Co. Ltd. Fiber-reinforced epoxy resin material, prepreg and, tubular body made of fiber-reinforced epoxy resin material
KR101551758B1 (ko) * 2012-12-11 2015-09-09 제일모직주식회사 이방 도전성 필름용 조성물 및 이방 도전성 필름
US9134552B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus with narrow gap electrostatic actuators
JP6456027B2 (ja) * 2013-03-27 2019-01-23 日東電工株式会社 封止シート、封止シートの製造方法及び電子部品パッケージの製造方法
JP6131087B2 (ja) * 2013-04-04 2017-05-17 協立化学産業株式会社 電池のタブリード封止用液状組成物及び電池の製造方法
US20140299268A1 (en) * 2013-04-09 2014-10-09 The Boeing Company Thermally Curable Bonding Film Adhesive with Uniform Thickness
CN104250525B (zh) * 2013-06-25 2016-04-20 第一毛织株式会社 各向异性导电膜、图像显示器及半导体装置
KR101676527B1 (ko) * 2013-06-25 2016-11-16 제일모직주식회사 이방성 도전 필름, 이를 포함하는 영상 표시 장치 및 반도체 장치
RU2550383C2 (ru) * 2013-08-06 2015-05-10 Федеральное государственное унитарное предприятие "Научно-производственный центр автоматики и приборостроения имени академика Н.А. Пилюгина" (ФГУП "НПЦАП") Склеивающая прокладка сфг
JP6408759B2 (ja) * 2013-11-08 2018-10-17 デクセリアルズ株式会社 接着剤組成物、及びフィルム巻装体
CN103555245B (zh) * 2013-11-18 2015-01-14 湖南固特邦土木技术发展有限公司 一种铰缝修复加固用环氧胶粘剂及其应用
KR102427652B1 (ko) 2015-03-30 2022-08-01 세팔리 테크놀로지 에스피알엘 삼차 신경의 경피 전기 자극을 위한 장치
TWI688971B (zh) * 2015-03-30 2020-03-21 日商則武股份有限公司 加熱硬化型導電性糊
JP6624545B2 (ja) 2015-03-31 2019-12-25 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、金属張積層板、絶縁シート、プリント配線板、プリント配線板の製造方法及びパッケージ基板
RS61789B1 (sr) 2015-09-30 2021-06-30 Univ Jichi Medical Viskoelastična kompozicija
CN108028477A (zh) 2015-10-07 2018-05-11 迪睿合株式会社 各向异性导电膜和连接结构体
KR20180121875A (ko) * 2016-03-17 2018-11-09 도레이 카부시키가이샤 감광성 도전 페이스트 및 도전 패턴이 있는 기판의 제조 방법
JP6672953B2 (ja) * 2016-03-29 2020-03-25 味の素株式会社 樹脂シート
CN105702170A (zh) 2016-04-05 2016-06-22 京东方科技集团股份有限公司 胶材、柔性模组、显示设备及柔性模组的制作方法
EP3448923B1 (en) 2016-04-25 2021-03-17 3M Innovative Properties Company Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles
JP2018035286A (ja) * 2016-09-01 2018-03-08 パナソニックＩｐマネジメント株式会社 導電性樹脂組成物及びそれを用いた電子回路部材
JP6452659B2 (ja) * 2016-09-28 2019-01-16 株式会社タムラ製作所 熱硬化性フラックス組成物および電子基板の製造方法
JP6530734B2 (ja) * 2016-09-28 2019-06-12 株式会社タムラ製作所 熱硬化性フラックス組成物および電子基板の製造方法
JP6894221B2 (ja) * 2016-12-02 2021-06-30 ククド ケミカル カンパニー リミテッド 異方性導電フィルム、これを含む積層フィルム、およびこれらの製造方法
WO2018125209A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Improving mechanical and thermal reliability in varying form factors
TWI778041B (zh) * 2017-03-31 2022-09-21 日商日鐵化學材料股份有限公司 纖維強化複合材料用環氧樹脂組成物、纖維強化複合材料及成形體
DE202018001803U1 (de) 2017-05-19 2018-06-27 Cefaly Technology Sprl Externe Trigeminusnervenstimulation für die Akutbehandlung von Migräneattacken
KR102097800B1 (ko) * 2017-06-21 2020-04-06 삼성에스디아이 주식회사 정제 상의 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 장치
WO2019131353A1 (ja) * 2017-12-25 2019-07-04 ペルノックス株式会社 熱硬化性組成物及びペースト
US10739712B2 (en) * 2018-03-22 2020-08-11 Canon Kabushiki Kaisha Fixing member, fixing device, and electrophotographic image forming apparatus
CN108682475A (zh) * 2018-03-22 2018-10-19 衢州顺络电子有限公司 导电浆料及导电干膜制备方法
US11697753B2 (en) 2018-06-14 2023-07-11 3M Innovative Properties Company Method of treating a surface, surface-modified abrasive particles, and resin-bond abrasive articles
US11168237B2 (en) 2018-06-14 2021-11-09 3M Innovative Properties Company Adhesion promoters for curable compositions
TWI853851B (zh) 2018-11-15 2024-09-01 中國商深圳華大智造科技有限公司 微流體裝置與其製備方法
CA3123036A1 (en) 2018-12-20 2020-06-25 Stijn COERTJENS Adhesive with high filler content
JP7327416B2 (ja) * 2019-01-28 2023-08-16 株式会社レゾナック 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
KR102287235B1 (ko) * 2019-10-30 2021-08-06 에스케이씨솔믹스 주식회사 가교도가 조절된 연마패드 및 이의 제조방법
EP3838981A1 (de) * 2019-12-18 2021-06-23 Hilti Aktiengesellschaft Reaktivharzkomponente, diese enthaltendes reaktivharzsystem und deren verwendung
CN111234753B (zh) * 2020-04-03 2022-02-25 世晨材料技术(上海)有限公司 一种具有高玻璃化转变温度的胶粘剂组合物及其应用
US20230078492A1 (en) * 2020-05-08 2023-03-16 Lintec Corporation Wiring sheet
WO2022123498A1 (en) 2020-12-10 2022-06-16 3M Innovative Properties Company Crosslinked polymer particles and related compositions and processes
WO2022158527A1 (ja) * 2021-01-20 2022-07-28 積水化学工業株式会社 非導電性フラックス、接続構造体及び接続構造体の製造方法
JP2022151816A (ja) * 2021-03-26 2022-10-07 デクセリアルズ株式会社 接続フィルム、及び接続構造体の製造方法
KR20230115323A (ko) * 2021-03-26 2023-08-02 데쿠세리아루즈 가부시키가이샤 접속 필름 및 접속 구조체의 제조 방법
CN113376217A (zh) * 2021-06-24 2021-09-10 哈尔滨理工大学 一种用于固化与测量环氧基复合材料电导率的模具及方法
TW202444786A (zh) 2023-03-09 2024-11-16 日商拓自達電線股份有限公司 導電性組成物
CN116970131B (zh) * 2023-09-11 2024-12-13 广州境好新材料有限公司 一种超低酸值醇酸树脂水分散体及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000248052A (ja) * 1999-03-04 2000-09-12 Nippon Kayaku Co Ltd 透明薄膜用樹脂組成物及びその硬化物
JP2002241584A (ja) * 2001-02-16 2002-08-28 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及び半導体装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59230068A (ja) * 1983-06-14 1984-12-24 Asahi Chem Ind Co Ltd 新規な粉体塗料用エポキシ樹脂組成物
US4940740A (en) 1989-04-21 1990-07-10 Basf Aktiengesellschaft Single phase toughened heat-curable resin systems exhibiting high strength after impact
JP2541367Y2 (ja) 1990-03-12 1997-07-16 ホシザキ電機株式会社 ラック受渡し装置
JPH04332722A (ja) * 1991-05-07 1992-11-19 Toagosei Chem Ind Co Ltd エポキシ樹脂組成物
JP3114162B2 (ja) 1991-07-14 2000-12-04 ソニーケミカル株式会社 電気的接続方法
US5392951A (en) * 1993-05-20 1995-02-28 Lionville Systems, Inc. Drawer operating system
JP3655646B2 (ja) * 1993-05-24 2005-06-02 日産自動車株式会社 エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物
IL109921A (en) 1993-06-24 1997-09-30 Quickturn Design Systems Method and apparatus for configuring memory circuits
DE69621722T2 (de) 1995-03-14 2003-01-30 Nagase Chemtex Corp., Osaka Organopolysiloxan-derivate
KR100290993B1 (ko) * 1995-06-13 2001-08-07 이사오 우치가사키 반도체장치,반도체탑재용배선기판및반도체장치의제조방법
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
US6328844B1 (en) 1996-07-15 2001-12-11 Hitachi Chemical Company, Ltd. Filmy adhesive for connecting circuits and circuit board
US6309502B1 (en) * 1997-08-19 2001-10-30 3M Innovative Properties Company Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods
GB9718469D0 (en) 1997-09-02 1997-11-05 Ciba Geigy Ag Epoxy resin compositions
DE60025720T2 (de) * 1999-06-18 2006-11-09 Hitachi Chemical Co., Ltd. Klebstoff, klebstoffgegenstand, schaltungssubstrat für halbleitermontage mit einem klebstoff und eine halbleiteranordnung die diesen enthält
JP2001323246A (ja) 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
TWI245791B (en) * 2000-03-31 2005-12-21 Hitachi Chemical Co Ltd Adhesive films, and semiconductor devices using the same
JP3711842B2 (ja) * 2000-06-01 2005-11-02 ソニーケミカル株式会社 異方性導電接続材料及び接続構造体
JP2002060467A (ja) * 2000-08-15 2002-02-26 Jsr Corp 熱硬化性樹脂組成物およびその硬化物
JP2002313143A (ja) 2001-04-18 2002-10-25 Sekisui Chem Co Ltd 微粒子配置導電接続フィルム、微粒子配置導電接続フィルムの製造方法及び導電接続構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000248052A (ja) * 1999-03-04 2000-09-12 Nippon Kayaku Co Ltd 透明薄膜用樹脂組成物及びその硬化物
JP2002241584A (ja) * 2001-02-16 2002-08-28 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及び半導体装置

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