CN100551179C - 显示器件及其制造方法 - Google Patents
显示器件及其制造方法 Download PDFInfo
- Publication number
- CN100551179C CN100551179C CNB2005101041442A CN200510104144A CN100551179C CN 100551179 C CN100551179 C CN 100551179C CN B2005101041442 A CNB2005101041442 A CN B2005101041442A CN 200510104144 A CN200510104144 A CN 200510104144A CN 100551179 C CN100551179 C CN 100551179C
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- Prior art keywords
- insulating barrier
- layer
- display device
- electrode layer
- film
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
- H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/125—Active-matrix OLED [AMOLED] displays including organic TFTs [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3031—Two-side emission, e.g. transparent OLEDs [TOLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80515—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP272628/04 | 2004-09-17 | ||
| JP2004272628 | 2004-09-17 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910170467XA Division CN101673758B (zh) | 2004-09-17 | 2005-09-15 | 显示器件及其制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1750719A CN1750719A (zh) | 2006-03-22 |
| CN100551179C true CN100551179C (zh) | 2009-10-14 |
Family
ID=36605931
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101041442A Expired - Fee Related CN100551179C (zh) | 2004-09-17 | 2005-09-15 | 显示器件及其制造方法 |
| CN200910170467XA Expired - Fee Related CN101673758B (zh) | 2004-09-17 | 2005-09-15 | 显示器件及其制造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910170467XA Expired - Fee Related CN101673758B (zh) | 2004-09-17 | 2005-09-15 | 显示器件及其制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US8350466B2 (enExample) |
| JP (15) | JP5244958B2 (enExample) |
| KR (2) | KR101256357B1 (enExample) |
| CN (2) | CN100551179C (enExample) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3989761B2 (ja) * | 2002-04-09 | 2007-10-10 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
| US8217396B2 (en) | 2004-07-30 | 2012-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising electrode layer contacting wiring in the connection region and extending to pixel region |
| US8350466B2 (en) * | 2004-09-17 | 2013-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| US7753751B2 (en) | 2004-09-29 | 2010-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating the display device |
| US8772783B2 (en) * | 2004-10-14 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR100685804B1 (ko) * | 2004-12-14 | 2007-02-22 | 삼성에스디아이 주식회사 | 유기전계발광소자 및 그의 제조방법 |
| KR100712111B1 (ko) * | 2004-12-14 | 2007-04-27 | 삼성에스디아이 주식회사 | 보조 전극 라인을 구비하는 유기전계발광소자 및 그의제조 방법 |
| US20060197088A1 (en) * | 2005-03-07 | 2006-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
| KR100730151B1 (ko) * | 2005-09-30 | 2007-06-19 | 삼성에스디아이 주식회사 | 평판 표시 장치 |
| TWI460851B (zh) | 2005-10-17 | 2014-11-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| JP4245032B2 (ja) * | 2006-10-03 | 2009-03-25 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| JP2008145840A (ja) * | 2006-12-12 | 2008-06-26 | Fujifilm Corp | 表示装置 |
| US7402469B1 (en) * | 2007-01-12 | 2008-07-22 | Applied Micro Circuits Corporation | System and method for selectivity etching an integrated circuit |
| US8409458B2 (en) * | 2007-03-02 | 2013-04-02 | Texas Instruments Incorporated | Process for reactive ion etching a layer of diamond like carbon |
| JP4380718B2 (ja) | 2007-03-15 | 2009-12-09 | ソニー株式会社 | 半導体装置の製造方法 |
| JP5185598B2 (ja) * | 2007-11-06 | 2013-04-17 | 株式会社ジャパンディスプレイイースト | 有機el表示装置およびその製造方法 |
| US7936122B2 (en) * | 2007-12-14 | 2011-05-03 | Canon Kabushiki Kaisha | Organic EL display apparatus |
| CN101500351A (zh) * | 2008-01-30 | 2009-08-05 | 奇美电子股份有限公司 | 有机电致发光装置及其制造方法 |
| JP5505757B2 (ja) * | 2008-03-25 | 2014-05-28 | Nltテクノロジー株式会社 | 液晶表示装置の製造方法および液晶表示装置 |
| KR101308200B1 (ko) * | 2008-05-06 | 2013-09-13 | 엘지디스플레이 주식회사 | 플렉서블 유기발광 표시장치 및 그 제조 방법 |
| JP2011003522A (ja) | 2008-10-16 | 2011-01-06 | Semiconductor Energy Lab Co Ltd | フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法 |
| TWI607670B (zh) | 2009-01-08 | 2017-12-01 | 半導體能源研究所股份有限公司 | 發光裝置及電子裝置 |
| CN102498570B (zh) | 2009-09-04 | 2016-02-10 | 株式会社半导体能源研究所 | 发光装置及其制造方法 |
| WO2011145467A1 (en) * | 2010-05-21 | 2011-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101845480B1 (ko) * | 2010-06-25 | 2018-04-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| WO2012001734A1 (ja) * | 2010-06-29 | 2012-01-05 | パナソニック株式会社 | 有機発光素子、表示パネル、表示装置、および有機発光素子の製造方法 |
| JP5644341B2 (ja) * | 2010-10-04 | 2014-12-24 | ソニー株式会社 | 固体撮像素子、および、その製造方法、電子機器 |
| US8476622B2 (en) * | 2011-01-05 | 2013-07-02 | Electronics And Telecommunications Research Institute | Active matrix organic light emitting diode |
| KR101889748B1 (ko) * | 2011-01-10 | 2018-08-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
| CN104488016B (zh) | 2012-07-20 | 2018-08-10 | 株式会社半导体能源研究所 | 显示装置及具有该显示装置的电子设备 |
| US12302698B2 (en) | 2012-07-31 | 2025-05-13 | Jdi Design And Development G.K. | Display unit with moisture proof film outside of seal section and electronic apparatus with said display unit |
| JP6142151B2 (ja) * | 2012-07-31 | 2017-06-07 | 株式会社Joled | 表示装置および電子機器 |
| KR102000209B1 (ko) * | 2012-11-16 | 2019-07-16 | 삼성디스플레이 주식회사 | 표시장치 및 표시장치의 제조방법 |
| KR20140118011A (ko) * | 2013-03-27 | 2014-10-08 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조 방법 |
| US9269915B2 (en) * | 2013-09-18 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR102117109B1 (ko) * | 2013-10-22 | 2020-06-01 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102200294B1 (ko) * | 2014-01-22 | 2021-01-11 | 삼성디스플레이 주식회사 | 표시장치 및 그 제조방법 |
| KR20150137214A (ko) * | 2014-05-28 | 2015-12-09 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
| KR102199216B1 (ko) | 2014-06-09 | 2021-01-07 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 |
| KR102223676B1 (ko) | 2014-06-24 | 2021-03-08 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR102360783B1 (ko) | 2014-09-16 | 2022-02-10 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR102284756B1 (ko) | 2014-09-23 | 2021-08-03 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR102303242B1 (ko) | 2014-10-17 | 2021-09-17 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102391920B1 (ko) * | 2014-11-03 | 2022-04-28 | 엘지디스플레이 주식회사 | 유기발광 표시패널 및 그 제조 방법 |
| KR102557315B1 (ko) * | 2015-05-08 | 2023-07-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102430819B1 (ko) * | 2015-08-19 | 2022-08-10 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
| JP2017152231A (ja) * | 2016-02-25 | 2017-08-31 | 株式会社ジャパンディスプレイ | 表示装置、表示装置の製造方法 |
| KR102664048B1 (ko) * | 2016-08-30 | 2024-05-16 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102671040B1 (ko) * | 2016-10-10 | 2024-06-03 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| CN107316945B (zh) * | 2017-06-23 | 2019-06-07 | 京东方科技集团股份有限公司 | 一种oled显示面板和oled显示装置 |
| CN108010941B (zh) * | 2017-11-15 | 2020-08-11 | 纳晶科技股份有限公司 | 用于发光元件的封装结构及方法 |
| CN107946318B (zh) * | 2017-11-27 | 2021-01-12 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法、显示面板 |
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| US11502146B2 (en) * | 2018-03-28 | 2022-11-15 | Sharp Kabushiki Kaisha | Display device with frame region including metal layers across slit |
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