CA2887304A1 - Adhesives and related methods - Google Patents

Adhesives and related methods Download PDF

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Publication number
CA2887304A1
CA2887304A1 CA2887304A CA2887304A CA2887304A1 CA 2887304 A1 CA2887304 A1 CA 2887304A1 CA 2887304 A CA2887304 A CA 2887304A CA 2887304 A CA2887304 A CA 2887304A CA 2887304 A1 CA2887304 A1 CA 2887304A1
Authority
CA
Canada
Prior art keywords
cure
acrylate
acrylic
curative
irgacure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA2887304A
Other languages
English (en)
French (fr)
Inventor
Michael Zajaczkowski
Michael T. Waterman
Kyle R. Heimbach
Eric L. Bartholomew
Brandon S. Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avery Dennison Corp
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Publication of CA2887304A1 publication Critical patent/CA2887304A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
CA2887304A 2012-10-09 2013-10-10 Adhesives and related methods Abandoned CA2887304A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261711386P 2012-10-09 2012-10-09
US61/711,386 2012-10-09
PCT/US2013/064190 WO2014059058A1 (en) 2012-10-09 2013-10-10 Adhesives and related methods

Publications (1)

Publication Number Publication Date
CA2887304A1 true CA2887304A1 (en) 2014-04-17

Family

ID=49447852

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2887304A Abandoned CA2887304A1 (en) 2012-10-09 2013-10-10 Adhesives and related methods

Country Status (10)

Country Link
US (15) US9708509B2 (cg-RX-API-DMAC10.html)
EP (4) EP2906654B1 (cg-RX-API-DMAC10.html)
KR (1) KR102295538B1 (cg-RX-API-DMAC10.html)
CN (4) CN104854207A (cg-RX-API-DMAC10.html)
AU (9) AU2013329252B2 (cg-RX-API-DMAC10.html)
BR (4) BR112015007832B1 (cg-RX-API-DMAC10.html)
CA (1) CA2887304A1 (cg-RX-API-DMAC10.html)
IN (3) IN2015DN03074A (cg-RX-API-DMAC10.html)
MX (2) MX2015004606A (cg-RX-API-DMAC10.html)
WO (4) WO2014059055A1 (cg-RX-API-DMAC10.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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DE102016207540A1 (de) 2016-05-02 2017-11-02 Tesa Se Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat
DE102016207548A1 (de) * 2016-05-02 2017-11-02 Tesa Se Härtbare Klebemasse und darauf basierende Reaktivklebebänder
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JP7359570B2 (ja) * 2018-05-29 2023-10-11 日東電工株式会社 粘着剤組成物、粘着剤層及び粘着シート
WO2019230677A1 (ja) * 2018-05-29 2019-12-05 日東電工株式会社 粘着剤組成物、粘着剤層及び粘着シート
JP2019206699A (ja) * 2018-05-29 2019-12-05 日東電工株式会社 粘着シート
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KR102184587B1 (ko) * 2019-02-28 2020-12-01 주식회사 케이씨씨 접착제 조성물
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CN110527475B (zh) * 2019-09-26 2021-09-07 广东华南精细化工研究院有限公司 一种可喷涂抗下垂型硅烷改性聚醚密封胶及其制备方法
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CN115044317B (zh) * 2022-06-29 2024-05-28 湖北祥源高新科技有限公司 一种双面自粘结聚氨酯泡棉的制备方法和产品
KR20250169522A (ko) * 2023-03-31 2025-12-03 헨켈 아게 운트 코. 카게아아 플라스틱 접합용 광경화성 아크릴레이트 접착제

Family Cites Families (226)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408008A (en) 1966-12-02 1968-10-29 Eric H. Cocks Apparatus for applying hot melt adhesives
CH481197A (de) 1967-02-22 1969-11-15 Breveteam Sa Kleber zur unterseitigen Beschichtung von Bodenbelägen
US3639500A (en) 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
DE2446438C2 (de) 1974-09-28 1985-04-11 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von Oxazolidingruppen enthaltenden Urethanen und ihre Verwendung
US4049483A (en) 1976-11-18 1977-09-20 Minnesota Mining And Manufacturing Company Pressure sensitive hot-melt adhesive system
US4135033A (en) 1977-02-16 1979-01-16 Lawton William R Heat-activated adhesive coating
US4143858A (en) 1977-08-29 1979-03-13 Eastman Kodak Company Substantially amorphous polyolefins useful as pressure-sensitive adhesives
US4185050A (en) 1978-12-26 1980-01-22 Celanese Corporation Pressure sensitive adhesive compositions comprising a mixture of terpolymers
BR8001021A (pt) 1979-02-26 1980-10-29 Du Pont Material resistente de pelicula seca, rolo ajustado, mascara de solda e processo para a modificacao seletiva de uma superficie
US4288527A (en) 1980-08-13 1981-09-08 W. R. Grace & Co. Dual UV/thermally curable acrylate compositions with pinacol
JPS618471Y2 (cg-RX-API-DMAC10.html) 1980-09-01 1986-03-15
JPS58152074A (ja) 1982-03-05 1983-09-09 Mitsui Toatsu Chem Inc 陶磁器質タイル用接着剤組成物
US4507429A (en) 1984-01-12 1985-03-26 Air Products And Chemicals, Inc. Pressure sensitive adhesives with improved shear resistance
JP2596923B2 (ja) 1985-02-05 1997-04-02 エーブリー インターナショナル コーポレイション 多層ラベル・ストックの製造方法
US5082922A (en) 1988-10-12 1992-01-21 The Valspar Corporation Modified-acrylate polymers and coating compositions made therefrom
US4914253A (en) 1988-11-04 1990-04-03 Exxon Chemical Patents Inc. Method for preparing polyethylene wax by gas phase polymerization
AU5549590A (en) 1989-05-11 1990-11-29 Landec Labs, Inc. Temperature-activated adhesive assemblies
EP0400703A1 (en) 1989-05-24 1990-12-05 Akzo Nobel N.V. Adhesive based on a thermoplastic polyester with an aluminium compound incorporated therein
US5194486A (en) 1989-06-09 1993-03-16 H & N Chemical Company Adhesive
US5264532A (en) 1989-08-14 1993-11-23 Avery Dennison Corporation Emulsion pressure-sensitive adhesives
US5024880A (en) 1990-01-03 1991-06-18 Minnesota Mining And Manufacturing Company Cellular pressure-sensitive adhesive membrane
DE4021659A1 (de) 1990-07-07 1992-01-09 Bayer Ag Bisoxazolane, im wesentlichen aus diesen bestehende oxazolangemische, ein verfahren zu deren herstellung und ihre verwendung als haerter fuer isocyanatgruppen aufweisende kunststoffvorlaeufer
CA2048232A1 (en) 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
US5264278A (en) 1991-03-20 1993-11-23 Minnesota Mining And Manufacturing Company Radiation-curable acrylate/silicone pressure-sensitive adhesive coated tapes adherable to paint coated substrates
CA2076278A1 (en) 1991-08-22 1993-02-23 Joseph T. Braun Curable silicone pressure sensitive adhesive tape
JP3035565B2 (ja) 1991-12-27 2000-04-24 株式会社半導体エネルギー研究所 薄膜太陽電池の作製方法
US5252694A (en) 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
US5348780A (en) 1992-08-28 1994-09-20 Moore Business Forms, Inc. Multipurpose label construction
EP0665782B1 (en) 1992-10-20 2000-03-22 Avery Dennison Corporation Pressure-sensitive structural adhesive
US5322731A (en) 1993-03-09 1994-06-21 Minnesota Mining And Manufacturing Company Adhesive beads
US7575653B2 (en) 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US5468652A (en) 1993-07-14 1995-11-21 Sandia Corporation Method of making a back contacted solar cell
US5721289A (en) 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5645764A (en) 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5695837A (en) 1995-04-20 1997-12-09 Minnesota Mining And Manufacturing Company Tackified acrylic adhesives
US5905099A (en) * 1995-11-06 1999-05-18 Minnesota Mining And Manufacturing Company Heat-activatable adhesive composition
US5800724A (en) 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
ID17196A (id) 1996-03-14 1997-12-11 Dow Chemical Co Bahan-bahan perekat yang mengandung polimer-polimer olefin
EP0819746B1 (en) 1996-07-15 2004-05-06 Sekisui Kagaku Kogyo Kabushiki Kaisha Sheet form, curable pressure-sensitive adhesive
KR20000067940A (ko) 1996-07-22 2000-11-25 그래햄 이. 테일러 고온 용융 접착제
ZA977909B (en) 1996-09-04 1999-03-03 Dow Chemical Co Compositions comprising a substantially random interpolymer of at least one alpha-olefin and at least one vinylidene aromatic monomer or hindered aliphatic vinylidene monomer
US20020007910A1 (en) 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
JP3976350B2 (ja) 1997-03-14 2007-09-19 スリーエム カンパニー 反応性シラン官能性を有する要求に応じて硬化する、湿分硬化性組成物
US6011307A (en) 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
US6077527A (en) 1997-10-28 2000-06-20 National Starch And Chemical Investment Holding Corporation Enhancer tolerant pressure sensitive adhesives for transdermal drug delivery
US5951786A (en) 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
DE19800676A1 (de) 1998-01-10 1999-07-15 Henkel Kgaa Verwendung ausgewählter Klebstoffgemische für die Überlappungsverklebung von Rundumetiketten bei ihrem Auftrag auf Kunststoff-Flaschen
FI106470B (fi) 1998-03-09 2001-02-15 Neste Chemicals Oy Vaahdotettu hartsiliima ja sen käyttö puupohjaisten levyjen liimaamiseen
US6106982A (en) 1998-05-11 2000-08-22 Avery Dennison Corporation Imaged receptor laminate and process for making same
US6391415B1 (en) 1998-08-31 2002-05-21 Environmental Inks And Coatings Corporation Label system
US6362249B2 (en) 1998-09-04 2002-03-26 Dsm Desotech Inc. Radiation-curable coating compositions, coated optical fiber, radiation-curable matrix forming material and ribbon assembly
US6844391B1 (en) 1998-09-23 2005-01-18 Avery Dennison Corporation Adhesives with improved rivet properties and laminates using the same
US6228486B1 (en) 1998-10-06 2001-05-08 Avery Dennison Corporation Thermal transfer laminate
US6235850B1 (en) * 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
KR100634073B1 (ko) 1998-12-11 2006-10-16 헨켈 코만디트게젤샤프트 아우프 악티엔 고형물 함량이 높은 실릴 말단 중합체 분산액, 이의 제조방법 및 그의 용도
US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
US6503620B1 (en) 1999-10-29 2003-01-07 Avery Dennison Corporation Multilayer composite PSA constructions
US6664318B1 (en) 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
JP2001288438A (ja) * 2000-04-06 2001-10-16 Sekisui Chem Co Ltd 粘着剤組成物
WO2001092344A2 (en) 2000-06-01 2001-12-06 Kraton Polymers Research, B.V. Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US6376075B1 (en) 2000-06-17 2002-04-23 General Electric Company Article having reflecting coating and process for the manufacture
US6353037B1 (en) 2000-07-12 2002-03-05 3M Innovative Properties Company Foams containing functionalized metal oxide nanoparticles and methods of making same
US6841234B2 (en) 2000-08-04 2005-01-11 Scapa Tapes North America Inc. Heat-activated adhesive tape having an acrylic foam-like backing
US6497949B1 (en) 2000-08-11 2002-12-24 3M Innovative Properties Company Adhesive blends comprising hydrophilic and hydrophobic pressure sensitive adhesives
ATE344273T1 (de) 2000-09-18 2006-11-15 Applied Research Systems Verfahren zur herstellung von 21-hydroxy-6,19- oxidoprogesteron (21oh-6op)
US6756095B2 (en) 2001-01-10 2004-06-29 Avery Dennison Corporation Heat-sealable laminate
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP2002285106A (ja) 2001-03-27 2002-10-03 The Inctec Inc 活性エネルギー線硬化型感圧接着剤
US6686425B2 (en) 2001-06-08 2004-02-03 Adhesives Research, Inc. High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
US6602958B2 (en) 2001-07-10 2003-08-05 Ips Corporation Adhesives for bonding composites
US7247659B2 (en) * 2001-07-26 2007-07-24 Ciba Specialty Chemicals Corporation Photosensitive resin composition
US20030095388A1 (en) 2001-11-16 2003-05-22 Jinbao Jiao Method and apparatus for securing a circuit board to a rigid surface
US6866919B2 (en) 2002-02-21 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
US6613587B1 (en) * 2002-04-11 2003-09-02 Micron Technology, Inc. Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
RU2005104934A (ru) 2002-07-19 2005-09-10 Эвери Деннисон Копэрейшн (Us) Этикетка (варианты) и способ этикетирования
US6613857B1 (en) 2002-07-26 2003-09-02 Avery Dennison Corporation UV-crosslinked, pressure-sensitive adhesives
KR20050026087A (ko) 2002-07-31 2005-03-14 유씨비 소시에떼아노님 아크릴계 감압 접착제
AU2003265322A1 (en) 2002-07-31 2004-02-25 Nexicor Llc Induction bondable high-pressure laminate
US6653408B1 (en) 2002-11-21 2003-11-25 Kraton Polymers U.S. Llc Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US6887917B2 (en) 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
DE10322898A1 (de) 2003-05-21 2004-12-16 Tesa Ag Flammfeste und Hitze-aktivierbare Haftklebemassen
KR101177251B1 (ko) 2003-06-06 2012-08-24 히다치 가세고교 가부시끼가이샤 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체 장치의 제조방법
KR100749004B1 (ko) 2003-06-09 2007-08-13 미쓰이 가가쿠 가부시키가이샤 가교성 메타크릴 수지 조성물 및 투명 부재
US7170001B2 (en) 2003-06-26 2007-01-30 Advent Solar, Inc. Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias
US7691437B2 (en) 2003-10-31 2010-04-06 3M Innovative Properties Company Method for preparing a pressure-sensitive adhesive
US7270889B2 (en) 2003-11-04 2007-09-18 Kimberly-Clark Worldwide, Inc. Tackified amorphous-poly-alpha-olefin-bonded structures
JPWO2005042612A1 (ja) * 2003-11-04 2007-04-05 綜研化学株式会社 重合性組成物及び（メタ）アクリル系熱伝導性シート
US7144751B2 (en) 2004-02-05 2006-12-05 Advent Solar, Inc. Back-contact solar cells and methods for fabrication
US7157584B2 (en) * 2004-02-25 2007-01-02 Takeda Pharmaceutical Company Limited Benzimidazole derivative and use thereof
EA011898B1 (ru) 2004-03-09 2009-06-30 Спир Груп Холдингз Лимитед Этикетка для стеклянной бутылки и способ ее удаления
US7524911B2 (en) 2004-03-17 2009-04-28 Dow Global Technologies Inc. Adhesive and marking compositions made from interpolymers of ethylene/α-olefins
US7088248B2 (en) 2004-03-24 2006-08-08 Avery Dennison Corporation System and method for selectively reading RFID devices
WO2005103178A1 (en) 2004-03-29 2005-11-03 Avery Dennison Corporation Anaerobic pressure sensitive adhesive
US7645829B2 (en) * 2004-04-15 2010-01-12 Exxonmobil Chemical Patents Inc. Plasticized functionalized propylene copolymer adhesive composition
US20050266237A1 (en) 2004-05-28 2005-12-01 Siddhartha Asthana Heat-activated sound and vibration damping sealant composition
EP1640388B1 (en) 2004-09-24 2015-02-25 Rohm and Haas Company Biomass based Michael addition composition
AU2005299092B2 (en) 2004-10-22 2010-02-18 Sato, Kabushiki Kaisha A method for applying a RFID tag carrying label on an object
RU2461074C2 (ru) 2004-11-10 2012-09-10 Эвери Деннисон Копэрейшн Пленка для изготовления вплавляемой этикетки, способ повышения ее технологичности, способ этикетирования изделий и этикетированное изделие (варианты)
US7212127B2 (en) 2004-12-20 2007-05-01 Avery Dennison Corp. RFID tag and label
EP1858945B1 (en) 2005-03-17 2019-04-24 Dow Global Technologies LLC Adhesive and marking compositions made from interpolymers of ethylene/alpha-olefins
JP5231986B2 (ja) 2005-03-17 2013-07-10 ダウ グローバル テクノロジーズ エルエルシー 官能化エチレン／α−オレフィン共重合体組成物
US7786216B2 (en) 2005-03-17 2010-08-31 Dow Global Technologies Inc. Oil based blends of interpolymers of ethylene/α-olefins
US7756154B2 (en) 2005-03-22 2010-07-13 Netapp, Inc. Shared implementation for multiple system interfaces
TWI344469B (en) 2005-04-07 2011-07-01 Nippon Catalytic Chem Ind Polyacrylic acid (salt) water-absorbent resin, production process thereof, and acrylic acid used in polymerization for production of water-absorbent resin
US7298266B2 (en) 2005-05-09 2007-11-20 Avery Dennison RFID communication systems and methods
JP4634856B2 (ja) 2005-05-12 2011-02-16 利昌工業株式会社 白色プリプレグ、白色積層板、及び金属箔張り白色積層板
US8287949B2 (en) 2005-07-07 2012-10-16 Dow Global Technologies Inc. Aqueous dispersions
US8298367B2 (en) 2005-07-19 2012-10-30 Dow Corning Corporation Pressure sensitive adhesives and methods for their preparation
JP4711777B2 (ja) 2005-08-11 2011-06-29 日東電工株式会社 粘着シートとその製造方法、及び、製品の加工方法
US20100311920A1 (en) * 2005-08-26 2010-12-09 Cid Centro De Investigacion Y Desarrollo Tecnologico Sa De Cv Using Reactive Block Copolymers as Chain Extenders and Surface Modifiers
US20070088145A1 (en) 2005-10-19 2007-04-19 Mgaya Alexander P Adhesive useful for film laminating applications
US20070092733A1 (en) 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
ES2557155T3 (es) 2005-12-01 2016-01-22 Henkel Ag & Co. Kgaa Nuevo material formador de estructuras supramoleculares, proceso y usos
CN101000899A (zh) 2006-01-11 2007-07-18 南茂科技股份有限公司 晶片封装结构
US20070231571A1 (en) 2006-04-04 2007-10-04 Richard Lane Pressure sensitive adhesive (PSA) laminates
US8785531B2 (en) 2006-07-06 2014-07-22 Dow Global Technologies Llc Dispersions of olefin block copolymers
CN101522318B (zh) 2006-08-08 2013-11-06 环球产权公司 粘合性提高的电路材料、其制造方法和由其制成的制品
JP2008060151A (ja) 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
US8074022B2 (en) 2006-09-28 2011-12-06 Virident Systems, Inc. Programmable heterogeneous memory controllers for main memory with different memory modules
US7776969B2 (en) 2006-12-04 2010-08-17 Bayer Materialscience Llc Allophanate-modified stabilizers and the polymer polyols prepared from these stabilizers
US9458359B2 (en) * 2006-12-07 2016-10-04 3M Innovative Properties Company Block copolymer blend adhesives with multiple tackifiers
TW200842174A (en) 2006-12-27 2008-11-01 Cheil Ind Inc Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
KR100907982B1 (ko) * 2006-12-27 2009-07-16 제일모직주식회사 점착필름 형성용 조성물에 의한 반도체 패키지용 점착필름을 포함하는 다이싱 다이본드 필름
WO2008093398A1 (ja) 2007-01-30 2008-08-07 Asics Corporation シューズの製造方法、及びシューズ
JP5089201B2 (ja) 2007-03-12 2012-12-05 日東電工株式会社 アクリル系粘着テープ又はシート、およびその製造方法
WO2008116033A2 (en) 2007-03-21 2008-09-25 Avery Dennison Corporation Pressure sensitive adhesives
JP5419376B2 (ja) 2007-04-20 2014-02-19 日東電工株式会社 粘着シートの自動車塗膜面への接着方法
JP5038770B2 (ja) 2007-05-01 2012-10-03 日東電工株式会社 車両用塗膜面に対する粘着シートの接着方法
JP5118880B2 (ja) * 2007-05-08 2013-01-16 日東電工株式会社 粘着剤組成物及びそれを用いた粘着製品、ディスプレイ
US8334037B2 (en) * 2007-05-11 2012-12-18 3M Innovative Properties Company Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same
BRPI0815310B1 (pt) 2007-08-24 2019-05-14 Dow Global Technologies Inc. Composição adesiva, artigo e método de aplicação de uma composição adesiva
KR100922684B1 (ko) * 2007-08-31 2009-10-19 제일모직주식회사 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프
KR20100074144A (ko) 2007-09-19 2010-07-01 헨켈 아게 운트 코. 카게아아 고도 완화 팽창가능 재료 및 장치
US20090142506A1 (en) 2007-11-29 2009-06-04 Bayer Material Science Llc Ethylenically unsaturated polyisocyanate addition compounds based on lysine triisocyanate, their use in coating compositions and processes for their preparation
KR20100074296A (ko) * 2007-12-04 2010-07-01 히다치 가세고교 가부시끼가이샤 감광성 접착제
US7786868B2 (en) 2007-12-11 2010-08-31 Avery Dennison Corporation RFID device with multiple passive operation modes
JP2009256607A (ja) 2008-03-17 2009-11-05 Nitto Denko Corp アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート
ES2518417T3 (es) 2008-04-30 2014-11-05 Tesa Se Cinta adhesiva
US8289165B2 (en) 2008-06-11 2012-10-16 Avery Dennison Corporation RFID device with conductive loop shield
US20110122343A1 (en) 2008-07-16 2011-05-26 Min Soo Park Pressure-sensitive adhesive composition, polarization plate, and liquid crystal display
CN102137908B (zh) * 2008-07-28 2013-10-30 陶氏康宁公司 复合制品
US8080177B2 (en) 2008-08-19 2011-12-20 The Boeing Company Low RF loss static dissipative adhesive
KR20110016987A (ko) * 2008-08-27 2011-02-18 히다치 가세고교 가부시끼가이샤 감광성 접착제 조성물, 필름상 감광성 접착제, 접착제 패턴, 접착제 부착 반도체 웨이퍼, 반도체 장치, 및 전자 부품
DE102008045802A1 (de) 2008-09-05 2010-03-11 Henkel Ag & Co. Kgaa Schmelzklebstoff auf Basis von Metallocene-katalysierten Olefin-α-Olefin Copolymeren
US8068028B2 (en) 2008-09-26 2011-11-29 Avery Dennison Corporation Encapsulated RFID device for flexible, non-planar or curvilinear surfaces
WO2010039623A2 (en) 2008-09-30 2010-04-08 Henkel Corporation Shear-and/or pressure-resistant microspheres
CN102264855B (zh) 2008-12-26 2014-03-12 东洋纺织株式会社 粘合剂用树脂组合物、含有它的粘合剂、粘合片以及将粘合片作为粘合层含有的印制线路板
AT12321U1 (de) 2009-01-09 2012-03-15 Austria Tech & System Tech Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
US20100200063A1 (en) 2009-02-12 2010-08-12 Derek Djeu Thin film solar cell
JP5294931B2 (ja) 2009-03-11 2013-09-18 日東電工株式会社 アクリル系粘着シート
EP2236534A1 (de) 2009-03-31 2010-10-06 Sika Technology AG Zweistufig aushärtende Zusammensetzung enthaltend ein oberflächendesaktiviertes Polyisocyanat
JP5404174B2 (ja) 2009-05-14 2014-01-29 日東電工株式会社 熱剥離性感圧接着テープ又はシート
JP2011026551A (ja) * 2009-05-21 2011-02-10 Kaneka Corp 紫外線硬化型粘接着剤組成物
CN102803416B (zh) 2009-06-11 2016-01-20 汉高知识产权控股有限责任公司 含有多官能二烯和亲二烯体化合物的热可逆热熔性粘合剂
US8593256B2 (en) 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
JP5909445B2 (ja) 2009-07-24 2016-04-26 ボスティック，インコーポレイテッド オレフィンブロックコポリマーをベースとするホットメルト接着剤
US8242185B2 (en) 2009-08-03 2012-08-14 Morgan Adhesives Company Adhesive compositions for easy application and improved durability
WO2011017298A1 (en) * 2009-08-04 2011-02-10 3M Innovative Properties Company Non-halogentaed polyisobutylene -thermoplastic elastomer blend pressure sensitive adhesives
CN102498183A (zh) 2009-09-16 2012-06-13 日东电工株式会社 丙烯酸类粘合带
ES2453978T3 (es) 2009-09-24 2014-04-09 Avery Dennison Corporation Composiciones acrílicas para adherirse a sustratos con baja energía superficial
JP2011096988A (ja) 2009-11-02 2011-05-12 Keiwa Inc 太陽電池モジュール裏面保護用粘着シート及びこれを用いた太陽電池モジュール
WO2011084438A1 (en) 2009-12-16 2011-07-14 Avery Dennison Corporation Photovoltaic backsheet
KR20120115320A (ko) * 2009-12-18 2012-10-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 저 표면 에너지 기재를 위한 감압 접착제
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
WO2011112447A2 (en) 2010-03-09 2011-09-15 3M Innovative Properties Company Heat activated optically clear adhesive for bonding display panels
CN102834121A (zh) 2010-03-26 2012-12-19 3M创新有限公司 消毒伤口敷料的方法
JP2011231319A (ja) 2010-04-09 2011-11-17 Nitto Denko Corp 粘着性組成物およびアクリル系粘着テープ
JP5749052B2 (ja) 2010-04-12 2015-07-15 日東電工株式会社 硬化多層シートの製造方法及び硬化多層シート
KR20130102464A (ko) 2010-05-11 2013-09-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경화성 조성물, 감압 접착제, 그의 제조 방법, 및 접착 용품
BR122020013215B8 (pt) 2010-06-14 2023-01-24 Avery Dennison Corp Substrato tendo uma estrutura condutora
JP5432853B2 (ja) 2010-07-30 2014-03-05 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
US20130136874A1 (en) 2010-08-18 2013-05-30 3M Innovative Properties Company Optical assemblies including stress-relieving optical adhesives and methods of making same
JP5919273B2 (ja) 2010-08-26 2016-05-18 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 低塗布温度の非晶質ポリ−α−オレフィン接着剤
EP2610319A4 (en) 2010-08-27 2015-12-02 Nitto Denko Corp ACRYLIC ADHESIVE COMPOSITION, ACRYLIC ADHESIVE LAYER, AND ACRYLIC ADHESIVE TAPE
DE102010035889B4 (de) 2010-08-30 2021-11-11 Bundesdruckerei Gmbh Wert- und/oder Sicherheitsdokument und Verfahren zu dessen Herstellung
KR101494984B1 (ko) * 2010-09-17 2015-02-23 쇼와 덴코 가부시키가이샤 광경화성 투명 점착 시트용 조성물
JP6144868B2 (ja) 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
CN103548093B (zh) 2010-11-23 2016-08-10 西屋电气有限责任公司 全谱的loca评价模型及分析方法
MY169514A (en) 2010-11-23 2019-04-19 Adhesives Res Inc Reactive conductive pressure-sensitive adhesive tape
KR20140031849A (ko) 2010-12-13 2014-03-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 저 표면 에너지 기재용 감압 접착제
US20120165455A1 (en) 2010-12-22 2012-06-28 Bostik, Inc. OBC Based Packaging Adhesive
JP5689336B2 (ja) 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート
JP2012193317A (ja) 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
EP2688967B1 (en) 2011-03-24 2018-08-15 Henkel IP & Holding GmbH Stretch film lamination adhesive
CN103562332B (zh) 2011-04-08 2017-08-04 波士胶公司 含有固体增塑剂的基于聚烯烃的热熔粘合剂
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
US9000659B2 (en) 2011-05-09 2015-04-07 Kenneth S. Chin Lamp socket
JP5966581B2 (ja) * 2011-05-10 2016-08-10 デクセリアルズ株式会社 両面粘着テープ及びその製造方法
PL2545798T3 (pl) 2011-07-13 2018-07-31 3M Innovative Properties Company System wyrobów higienicznych
EP2546053B1 (en) * 2011-07-15 2013-12-11 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet
EP2551102B1 (en) 2011-07-29 2014-12-03 3M Innovative Properties Company Self-stick foam adhesive
EP2581423A1 (en) 2011-10-14 2013-04-17 3M Innovative Properties Company Primerless multilayer adhesive film for bonding glass substrates
WO2013069907A1 (ko) 2011-11-08 2013-05-16 주식회사 엘지화학 대전방지성 보호필름용 점착제 조성물 및 이의 제조방법
DE102011088170A1 (de) 2011-12-09 2013-06-13 Bayer Materialscience Aktiengesellschaft Reaktive Haftklebstoffe
IN2014CN04668A (cg-RX-API-DMAC10.html) 2011-12-22 2015-09-18 3M Innovative Properties Co
DE102012200854A1 (de) 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
EP2810539B1 (en) 2012-02-03 2018-03-28 Avery Dennison Corporation Laser patterning of photovoltaic backsheet
CN104169386B (zh) 2012-03-12 2016-10-26 Lg化学株式会社 压敏性粘合剂组合物
JP5900091B2 (ja) 2012-03-27 2016-04-06 大日本印刷株式会社 化粧シート及びそれを有する化粧板
JP6188252B2 (ja) 2012-03-30 2017-08-30 シラス・インコーポレイテッド 重合性組成物の活性化方法、重合系およびこれにより形成される製品
JP6226951B2 (ja) 2012-03-30 2017-11-08 ダウ グローバル テクノロジーズ エルエルシー ポリオレフィン接着剤組成物
CN102634286B (zh) 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
EP2857474A4 (en) 2012-05-29 2016-02-17 Nitto Denko Corp ADHESIVE AND TRANSPARENT SUBSTRATE THEREWITH
DE102012209116A1 (de) 2012-05-30 2013-12-05 Tesa Se Heißsiegelbares Klebeband
DE102013209827A1 (de) 2012-06-21 2013-12-24 Tesa Se Hitzebeständiges Klebeband
JP5961055B2 (ja) 2012-07-05 2016-08-02 日東電工株式会社 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ
KR102055869B1 (ko) 2012-07-05 2019-12-13 쓰리본드 화인 케미칼 가부시키가이샤 시트형상 접착제 및 이 시트형상 접착제를 사용한 유기 el 패널
EP2877547A4 (en) 2012-07-26 2016-01-27 3M Innovative Properties Co HEAT-RESOLVABLE ADHESIVES
US9827739B2 (en) 2012-07-26 2017-11-28 3M Innovative Properties Company Heat de-bondable optical articles
US9708509B2 (en) * 2012-10-09 2017-07-18 Avery Dennison Corporation Adhesives and related methods
US20140162082A1 (en) 2012-12-07 2014-06-12 H.B. Fuller Company Composition, an article and a method for the bonding of non-woven substrates
US9023954B1 (en) 2012-12-26 2015-05-05 The United States Of America As Represented By The Secretary Of The Navy Side-chain and end-group modified poly-p-phenylene oligomers
WO2014116395A1 (en) 2013-01-24 2014-07-31 Henkel Ltd. Foamable hot melt adhesive compositions and use thereof
EP2759578B1 (de) 2013-01-24 2018-05-02 Basf Se Reaktive Haftklebstoffprodukte
CN105518093A (zh) 2013-03-05 2016-04-20 艾利丹尼森公司 不同的双功能泡沫带
DK2964650T3 (en) 2013-03-06 2019-02-11 Incyte Holdings Corp PROCEDURES AND INTERMEDIATES FOR THE MANUFACTURE OF A JAK INHIBITOR
TWI622625B (zh) 2013-03-28 2018-05-01 道康寧公司 有機矽氧烷組成物與塗佈、製造物件、方法及用途
CN103275656B (zh) 2013-05-29 2015-07-08 北京化工大学 固化后具有结构胶性能的反应型压敏胶黏剂及其制备方法
BR112016006260A2 (pt) 2013-09-23 2017-08-01 Lubrizol Advanced Mat Inc sistema de adesivo, e, artigo adesivo
BR112016006114A2 (pt) 2013-09-25 2020-05-19 Bostik, Inc. composição adesiva termofundida
CN111484803A (zh) 2013-10-10 2020-08-04 艾利丹尼森公司 胶黏剂和相关方法
WO2015195854A1 (en) 2014-06-18 2015-12-23 Avery Dennison Corporation Transposable pressure sensitive adhesives, articles, and related methods
KR102603422B1 (ko) 2014-09-29 2023-11-17 애버리 데니슨 코포레이션 타이어 트래킹 rfid 라벨
JP6537620B2 (ja) 2015-02-05 2019-07-03 アベリー・デニソン・コーポレイションＡｖｅｒｙ Ｄｅｎｎｉｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ 苛酷な環境のためのラベルアセンブリー
WO2018118767A1 (en) 2016-12-22 2018-06-28 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth) acrylate oligomers

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