BR112015007837A2 - adesivos e métodos relacionados - Google Patents

adesivos e métodos relacionados

Info

Publication number
BR112015007837A2
BR112015007837A2 BR112015007837A BR112015007837A BR112015007837A2 BR 112015007837 A2 BR112015007837 A2 BR 112015007837A2 BR 112015007837 A BR112015007837 A BR 112015007837A BR 112015007837 A BR112015007837 A BR 112015007837A BR 112015007837 A2 BR112015007837 A2 BR 112015007837A2
Authority
BR
Brazil
Prior art keywords
acrylic
diluent
additives
abstract
adhesives
Prior art date
Application number
BR112015007837A
Other languages
English (en)
Other versions
BR112015007837B1 (pt
Inventor
S Miller Brandon
L Bartholomew Eric
R Heimbach Kyle
T Waterman Michael
Zajaczkowski Michael
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Publication of BR112015007837A2 publication Critical patent/BR112015007837A2/pt
Publication of BR112015007837B1 publication Critical patent/BR112015007837B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer

Abstract

abstract cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/ process aids. the bodying component can be acrylic or non-acrylic. tradução do resumo resumo patente de invenção: "adesivos e métodos relacionados". composições de adesivo sensível a pressão adequadas para cura são descritas, as quais compreendem um ou mais de um componente de corporificação, um diluente estrutural, um diluente de radicais, assim como aditivos tais como reticuladores, catalisadores externos, fotoiniciadores e estabilizantes/aditivos de processamento. o componente de corporificação pode ser acrílico ou não acrílico.
BR112015007837-0A 2012-10-09 2013-10-10 Adesivo sensível à pressão para cura local e método de ligação BR112015007837B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261711386P 2012-10-09 2012-10-09
US61/711,386 2012-10-09
PCT/US2013/064188 WO2014059056A1 (en) 2012-10-09 2013-10-10 Adhesives and related methods

Publications (2)

Publication Number Publication Date
BR112015007837A2 true BR112015007837A2 (pt) 2017-07-04
BR112015007837B1 BR112015007837B1 (pt) 2021-10-05

Family

ID=49447852

Family Applications (4)

Application Number Title Priority Date Filing Date
BR112015007832-0A BR112015007832B1 (pt) 2012-10-09 2013-10-10 Líquido para cura local
BR112015007880-0A BR112015007880B1 (pt) 2012-10-09 2013-10-10 Adesivo para cura local
BR112015007833-8A BR112015007833B1 (pt) 2012-10-09 2013-10-10 Liquido e adesivo sensível a pressão para cura local e uso
BR112015007837-0A BR112015007837B1 (pt) 2012-10-09 2013-10-10 Adesivo sensível à pressão para cura local e método de ligação

Family Applications Before (3)

Application Number Title Priority Date Filing Date
BR112015007832-0A BR112015007832B1 (pt) 2012-10-09 2013-10-10 Líquido para cura local
BR112015007880-0A BR112015007880B1 (pt) 2012-10-09 2013-10-10 Adesivo para cura local
BR112015007833-8A BR112015007833B1 (pt) 2012-10-09 2013-10-10 Liquido e adesivo sensível a pressão para cura local e uso

Country Status (10)

Country Link
US (15) US9738817B2 (pt)
EP (4) EP2906654B1 (pt)
KR (1) KR102295538B1 (pt)
CN (4) CN108587528A (pt)
AU (9) AU2013329252B2 (pt)
BR (4) BR112015007832B1 (pt)
CA (1) CA2887304A1 (pt)
IN (3) IN2015DN03071A (pt)
MX (2) MX2015004606A (pt)
WO (4) WO2014059055A1 (pt)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2906654B1 (en) 2012-10-09 2020-04-08 Avery Dennison Corporation Adhesives and related methods
US9574039B1 (en) * 2014-07-22 2017-02-21 Full Spectrum Laser Additive use in photopolymer resin for 3D printing to enhance the appearance of printed parts
CN104536210B (zh) * 2015-02-03 2017-09-29 京东方科技集团股份有限公司 一种配向膜印刷板的制备方法
US11049421B2 (en) * 2015-02-05 2021-06-29 Avery Dennison Corporation Label assemblies for adverse environments
US10940685B2 (en) 2015-12-28 2021-03-09 The Procter & Gamble Company Method and apparatus for applying a material onto articles using a transfer component that deflects on both sides
WO2017116670A1 (en) 2015-12-28 2017-07-06 The Procter & Gamble Company Method and apparatus for applying a material onto articles with a pre-distorted transfer component
DE102016207548A1 (de) 2016-05-02 2017-11-02 Tesa Se Härtbare Klebemasse und darauf basierende Reaktivklebebänder
DE102016207540A1 (de) 2016-05-02 2017-11-02 Tesa Se Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat
ES2950434T3 (es) * 2016-09-16 2023-10-10 Int Flavors & Fragrances Inc Composiciones de microcápsula estabilizadas con agentes de control de la viscosidad
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers
KR102543277B1 (ko) 2017-06-30 2023-06-16 쓰리엠 이노베이티브 프로퍼티즈 캄파니 인쇄가능한 경화성 혼합물 및 경화된 조성물
EP3451235B1 (en) 2017-08-29 2021-06-02 Hill-Rom Services, Inc. Rfid tag inlay for incontinence detection pad
JP6566324B2 (ja) * 2017-09-29 2019-08-28 サイデン化学株式会社 粘着シート
JP7359570B2 (ja) * 2018-05-29 2023-10-11 日東電工株式会社 粘着剤組成物、粘着剤層及び粘着シート
EP3805332A4 (en) * 2018-05-29 2022-03-09 Nitto Denko Corporation ADHESIVE SHEET
JP2019206699A (ja) * 2018-05-29 2019-12-05 日東電工株式会社 粘着シート
WO2019230677A1 (ja) * 2018-05-29 2019-12-05 日東電工株式会社 粘着剤組成物、粘着剤層及び粘着シート
US20200254751A1 (en) 2019-02-12 2020-08-13 The Procter & Gamble Company Method and apparatus for applying a material onto articles using a transfer component
KR102184587B1 (ko) * 2019-02-28 2020-12-01 주식회사 케이씨씨 접착제 조성물
DE102019208668A1 (de) * 2019-06-14 2020-12-17 Tesa Se Verklebungsverfahren mittels einer härtenden strukturellen Klebmasse
DE102019120049A1 (de) * 2019-07-24 2021-01-28 Bundesdruckerei Gmbh Verfahren und Schmelzklebstoff zur Herstellung eines aus mehreren Schichten bestehenden Wert- oder Sicherheitsdokumentes sowie Wert- oder Sicherheitsdokument
CN110527475B (zh) * 2019-09-26 2021-09-07 广东华南精细化工研究院有限公司 一种可喷涂抗下垂型硅烷改性聚醚密封胶及其制备方法
US11752792B2 (en) 2020-03-09 2023-09-12 The Procter & Gamble Company Method and apparatus for applying a material onto articles using a transfer component
CN111534269B (zh) * 2020-05-07 2022-04-12 苏州金枪新材料股份有限公司 一种用于液晶屏幕粘接的双组份柔韧性丙烯酸酯结构胶及其制备方法
CN111826093A (zh) * 2020-07-28 2020-10-27 中国石油化工股份有限公司 一种适用于油气集输管线修复的光固化材料及其制作方法
JP2024508230A (ja) * 2021-02-04 2024-02-26 サンスター・エンジニアリング・アメリカズ・インコーポレイテッド 硬化性組成物
CN114853969B (zh) * 2022-04-25 2023-11-24 广东深展实业有限公司 一种光热双重固化改性聚丙烯树脂及其制备方法
CN115044317A (zh) * 2022-06-29 2022-09-13 湖北祥源高新科技有限公司 一种双面自粘结聚氨酯泡棉的制备方法和产品

Family Cites Families (226)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408008A (en) 1966-12-02 1968-10-29 Eric H. Cocks Apparatus for applying hot melt adhesives
CH481197A (de) 1967-02-22 1969-11-15 Breveteam Sa Kleber zur unterseitigen Beschichtung von Bodenbelägen
US3639500A (en) 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
DE2446438C2 (de) 1974-09-28 1985-04-11 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von Oxazolidingruppen enthaltenden Urethanen und ihre Verwendung
US4049483A (en) 1976-11-18 1977-09-20 Minnesota Mining And Manufacturing Company Pressure sensitive hot-melt adhesive system
US4135033A (en) 1977-02-16 1979-01-16 Lawton William R Heat-activated adhesive coating
US4143858A (en) 1977-08-29 1979-03-13 Eastman Kodak Company Substantially amorphous polyolefins useful as pressure-sensitive adhesives
US4185050A (en) 1978-12-26 1980-01-22 Celanese Corporation Pressure sensitive adhesive compositions comprising a mixture of terpolymers
BR8001021A (pt) * 1979-02-26 1980-10-29 Du Pont Material resistente de pelicula seca, rolo ajustado, mascara de solda e processo para a modificacao seletiva de uma superficie
US4288527A (en) 1980-08-13 1981-09-08 W. R. Grace & Co. Dual UV/thermally curable acrylate compositions with pinacol
JPS618471Y2 (pt) 1980-09-01 1986-03-15
JPS58152074A (ja) 1982-03-05 1983-09-09 Mitsui Toatsu Chem Inc 陶磁器質タイル用接着剤組成物
US4507429A (en) 1984-01-12 1985-03-26 Air Products And Chemicals, Inc. Pressure sensitive adhesives with improved shear resistance
DE3650593T2 (de) 1985-02-05 1997-09-11 Avery International Corp Verbundfutter
US5082922A (en) 1988-10-12 1992-01-21 The Valspar Corporation Modified-acrylate polymers and coating compositions made therefrom
US4914253A (en) 1988-11-04 1990-04-03 Exxon Chemical Patents Inc. Method for preparing polyethylene wax by gas phase polymerization
ATE142557T1 (de) 1989-05-11 1996-09-15 Landec Corp Von der temperatur aktivierte bindemitteleinheiten
EP0400703A1 (en) 1989-05-24 1990-12-05 Akzo Nobel N.V. Adhesive based on a thermoplastic polyester with an aluminium compound incorporated therein
US5194486A (en) 1989-06-09 1993-03-16 H & N Chemical Company Adhesive
US5264532A (en) 1989-08-14 1993-11-23 Avery Dennison Corporation Emulsion pressure-sensitive adhesives
US5024880A (en) 1990-01-03 1991-06-18 Minnesota Mining And Manufacturing Company Cellular pressure-sensitive adhesive membrane
DE4021659A1 (de) 1990-07-07 1992-01-09 Bayer Ag Bisoxazolane, im wesentlichen aus diesen bestehende oxazolangemische, ein verfahren zu deren herstellung und ihre verwendung als haerter fuer isocyanatgruppen aufweisende kunststoffvorlaeufer
CA2048232A1 (en) 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
US5264278A (en) 1991-03-20 1993-11-23 Minnesota Mining And Manufacturing Company Radiation-curable acrylate/silicone pressure-sensitive adhesive coated tapes adherable to paint coated substrates
CA2076278A1 (en) 1991-08-22 1993-02-23 Joseph T. Braun Curable silicone pressure sensitive adhesive tape
JP3035565B2 (ja) 1991-12-27 2000-04-24 株式会社半導体エネルギー研究所 薄膜太陽電池の作製方法
US5252694A (en) 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
US5348780A (en) 1992-08-28 1994-09-20 Moore Business Forms, Inc. Multipurpose label construction
WO1994008781A1 (en) 1992-10-20 1994-04-28 Avery Dennison Corporation Pressure-sensitive structural adhesive
US5322731A (en) 1993-03-09 1994-06-21 Minnesota Mining And Manufacturing Company Adhesive beads
US7575653B2 (en) 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US5468652A (en) 1993-07-14 1995-11-21 Sandia Corporation Method of making a back contacted solar cell
US5721289A (en) 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5645764A (en) 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5695837A (en) 1995-04-20 1997-12-09 Minnesota Mining And Manufacturing Company Tackified acrylic adhesives
US5905099A (en) * 1995-11-06 1999-05-18 Minnesota Mining And Manufacturing Company Heat-activatable adhesive composition
US5800724A (en) 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
ID17196A (id) 1996-03-14 1997-12-11 Dow Chemical Co Bahan-bahan perekat yang mengandung polimer-polimer olefin
EP1249479B1 (en) 1996-07-15 2004-02-18 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for joining members
ES2187797T3 (es) 1996-07-22 2003-06-16 Dow Chemical Co Adhesivos de fusion en caliente.
ZA977909B (en) 1996-09-04 1999-03-03 Dow Chemical Co Compositions comprising a substantially random interpolymer of at least one alpha-olefin and at least one vinylidene aromatic monomer or hindered aliphatic vinylidene monomer
US20020007910A1 (en) 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
EP0966503B2 (en) 1997-03-14 2008-01-09 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
US6011307A (en) 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
US6077527A (en) 1997-10-28 2000-06-20 National Starch And Chemical Investment Holding Corporation Enhancer tolerant pressure sensitive adhesives for transdermal drug delivery
US5951786A (en) 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
DE19800676A1 (de) 1998-01-10 1999-07-15 Henkel Kgaa Verwendung ausgewählter Klebstoffgemische für die Überlappungsverklebung von Rundumetiketten bei ihrem Auftrag auf Kunststoff-Flaschen
FI106470B (fi) 1998-03-09 2001-02-15 Neste Chemicals Oy Vaahdotettu hartsiliima ja sen käyttö puupohjaisten levyjen liimaamiseen
US6106982A (en) 1998-05-11 2000-08-22 Avery Dennison Corporation Imaged receptor laminate and process for making same
US6391415B1 (en) 1998-08-31 2002-05-21 Environmental Inks And Coatings Corporation Label system
US6362249B2 (en) * 1998-09-04 2002-03-26 Dsm Desotech Inc. Radiation-curable coating compositions, coated optical fiber, radiation-curable matrix forming material and ribbon assembly
US6844391B1 (en) 1998-09-23 2005-01-18 Avery Dennison Corporation Adhesives with improved rivet properties and laminates using the same
US6228486B1 (en) 1998-10-06 2001-05-08 Avery Dennison Corporation Thermal transfer laminate
US6235850B1 (en) 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
ID30437A (id) 1998-12-11 2001-12-06 Henkel Kgaa Dispersi polimer berujung silil dengan kandungan padatan yang tinggi, pembuatan dan penggunaannya
US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
US6503620B1 (en) 1999-10-29 2003-01-07 Avery Dennison Corporation Multilayer composite PSA constructions
US6664318B1 (en) 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
JP2001288438A (ja) * 2000-04-06 2001-10-16 Sekisui Chem Co Ltd 粘着剤組成物
DE60121965T2 (de) 2000-06-01 2006-11-30 Kraton Polymers Research B.V. Funktionalisierte blockcopolymere enthaltende zusammensetzungen, die mit aluminiumacetylacetonaten vernetzt sind
US6376075B1 (en) 2000-06-17 2002-04-23 General Electric Company Article having reflecting coating and process for the manufacture
US6353037B1 (en) 2000-07-12 2002-03-05 3M Innovative Properties Company Foams containing functionalized metal oxide nanoparticles and methods of making same
US6841234B2 (en) 2000-08-04 2005-01-11 Scapa Tapes North America Inc. Heat-activated adhesive tape having an acrylic foam-like backing
US6497949B1 (en) 2000-08-11 2002-12-24 3M Innovative Properties Company Adhesive blends comprising hydrophilic and hydrophobic pressure sensitive adhesives
DE60124289T2 (de) 2000-09-18 2007-09-06 Applied Research Systems Ars Holding N.V. Verfahren zur herstellung von 21-hydroxy-6,19-oxidoprogesteron (21oh-6op)
US6756095B2 (en) 2001-01-10 2004-06-29 Avery Dennison Corporation Heat-sealable laminate
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP2002285106A (ja) * 2001-03-27 2002-10-03 The Inctec Inc 活性エネルギー線硬化型感圧接着剤
US6686425B2 (en) 2001-06-08 2004-02-03 Adhesives Research, Inc. High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
US6602958B2 (en) 2001-07-10 2003-08-05 Ips Corporation Adhesives for bonding composites
WO2003010602A1 (en) * 2001-07-26 2003-02-06 Ciba Specialty Chemicals Holding Inc. Photosensitive resin composition
US20030095388A1 (en) 2001-11-16 2003-05-22 Jinbao Jiao Method and apparatus for securing a circuit board to a rigid surface
US6866919B2 (en) 2002-02-21 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
US6613587B1 (en) * 2002-04-11 2003-09-02 Micron Technology, Inc. Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
AU2003256477A1 (en) 2002-07-19 2004-02-09 Avery Dennison Corporation Labeling method employing two-part curable adhesives
US6613857B1 (en) 2002-07-26 2003-09-02 Avery Dennison Corporation UV-crosslinked, pressure-sensitive adhesives
WO2004015019A1 (en) 2002-07-31 2004-02-19 Nexicor Llc Induction bondable high-pressure laminate
DE60329682D1 (de) 2002-07-31 2009-11-26 Cytec Surface Specialties Sa Acryldruckklebmittel
US6653408B1 (en) 2002-11-21 2003-11-25 Kraton Polymers U.S. Llc Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US6887917B2 (en) 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
DE10322898A1 (de) 2003-05-21 2004-12-16 Tesa Ag Flammfeste und Hitze-aktivierbare Haftklebemassen
JP5017861B2 (ja) 2003-06-06 2012-09-05 日立化成工業株式会社 接着シート、及びダイシングテープ一体型接着シート
EP1632507A4 (en) 2003-06-09 2006-11-29 Mitsui Chemicals Inc NETWORK METHACRYL RESIN COMPRISING COMPOSITION AND TRANSPARENT ELEMENT
US7170001B2 (en) 2003-06-26 2007-01-30 Advent Solar, Inc. Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias
US7691437B2 (en) 2003-10-31 2010-04-06 3M Innovative Properties Company Method for preparing a pressure-sensitive adhesive
JPWO2005042612A1 (ja) * 2003-11-04 2007-04-05 綜研化学株式会社 重合性組成物及び（メタ）アクリル系熱伝導性シート
US7270889B2 (en) 2003-11-04 2007-09-18 Kimberly-Clark Worldwide, Inc. Tackified amorphous-poly-alpha-olefin-bonded structures
US7144751B2 (en) 2004-02-05 2006-12-05 Advent Solar, Inc. Back-contact solar cells and methods for fabrication
US7157584B2 (en) * 2004-02-25 2007-01-02 Takeda Pharmaceutical Company Limited Benzimidazole derivative and use thereof
EA011898B1 (ru) 2004-03-09 2009-06-30 Спир Груп Холдингз Лимитед Этикетка для стеклянной бутылки и способ ее удаления
US7524911B2 (en) 2004-03-17 2009-04-28 Dow Global Technologies Inc. Adhesive and marking compositions made from interpolymers of ethylene/α-olefins
US7088248B2 (en) 2004-03-24 2006-08-08 Avery Dennison Corporation System and method for selectively reading RFID devices
US20050215655A1 (en) * 2004-03-29 2005-09-29 Bilodeau Wayne L Anaerobic pressure sensitive adhesive
US7645829B2 (en) * 2004-04-15 2010-01-12 Exxonmobil Chemical Patents Inc. Plasticized functionalized propylene copolymer adhesive composition
US20050266237A1 (en) 2004-05-28 2005-12-01 Siddhartha Asthana Heat-activated sound and vibration damping sealant composition
EP1640388B1 (en) 2004-09-24 2015-02-25 Rohm and Haas Company Biomass based Michael addition composition
KR20070049105A (ko) 2004-10-22 2007-05-10 가부시키가이샤 사토 Ｒｆｉｄ 태그를 갖춘 라벨을 물품 상에 부착하는 방법
EP1829017B1 (en) 2004-11-10 2012-02-08 Avery Dennison Corporation In-mold labels and uses thereof
US7212127B2 (en) 2004-12-20 2007-05-01 Avery Dennison Corp. RFID tag and label
EP1858937B1 (en) 2005-03-17 2019-09-25 Dow Global Technologies LLC Functionalized ethylene/(alpha) -olefin interpolymer compositions
JP5231987B2 (ja) 2005-03-17 2013-07-10 ダウ グローバル テクノロジーズ エルエルシー エチレン／α−オレフィン共重合体から製造される接着剤およびマーキング用組成物
US7786216B2 (en) 2005-03-17 2010-08-31 Dow Global Technologies Inc. Oil based blends of interpolymers of ethylene/α-olefins
US7756154B2 (en) 2005-03-22 2010-07-13 Netapp, Inc. Shared implementation for multiple system interfaces
TWI353360B (en) 2005-04-07 2011-12-01 Nippon Catalytic Chem Ind Production process of polyacrylic acid (salt) wate
US7298266B2 (en) 2005-05-09 2007-11-20 Avery Dennison RFID communication systems and methods
JP4634856B2 (ja) 2005-05-12 2011-02-16 利昌工業株式会社 白色プリプレグ、白色積層板、及び金属箔張り白色積層板
US8287949B2 (en) 2005-07-07 2012-10-16 Dow Global Technologies Inc. Aqueous dispersions
WO2007011538A2 (en) * 2005-07-19 2007-01-25 Dow Corning Corporation Pressure sensitive adhesives and methods for their preparation
JP4711777B2 (ja) 2005-08-11 2011-06-29 日東電工株式会社 粘着シートとその製造方法、及び、製品の加工方法
US20100311920A1 (en) * 2005-08-26 2010-12-09 Cid Centro De Investigacion Y Desarrollo Tecnologico Sa De Cv Using Reactive Block Copolymers as Chain Extenders and Surface Modifiers
US20070088145A1 (en) 2005-10-19 2007-04-19 Mgaya Alexander P Adhesive useful for film laminating applications
US20070092733A1 (en) 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
EP1792925B1 (en) 2005-12-01 2015-10-07 Henkel AG & Co. KGaA Novel material forming supramolecular structures, process and uses
CN101000899A (zh) 2006-01-11 2007-07-18 南茂科技股份有限公司 晶片封装结构
US20070231571A1 (en) 2006-04-04 2007-10-04 Richard Lane Pressure sensitive adhesive (PSA) laminates
US8785531B2 (en) 2006-07-06 2014-07-22 Dow Global Technologies Llc Dispersions of olefin block copolymers
CN101522318B (zh) 2006-08-08 2013-11-06 环球产权公司 粘合性提高的电路材料、其制造方法和由其制成的制品
JP2008060151A (ja) 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
US8074022B2 (en) 2006-09-28 2011-12-06 Virident Systems, Inc. Programmable heterogeneous memory controllers for main memory with different memory modules
US7776969B2 (en) 2006-12-04 2010-08-17 Bayer Materialscience Llc Allophanate-modified stabilizers and the polymer polyols prepared from these stabilizers
KR101596049B1 (ko) * 2006-12-07 2016-02-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 다수의 점착성 부여제를 포함하는 블록 공중합체 블렌드 접착제
KR100907982B1 (ko) * 2006-12-27 2009-07-16 제일모직주식회사 점착필름 형성용 조성물에 의한 반도체 패키지용 점착필름을 포함하는 다이싱 다이본드 필름
TW200842174A (en) 2006-12-27 2008-11-01 Cheil Ind Inc Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
WO2008093398A1 (ja) 2007-01-30 2008-08-07 Asics Corporation シューズの製造方法、及びシューズ
JP5089201B2 (ja) 2007-03-12 2012-12-05 日東電工株式会社 アクリル系粘着テープ又はシート、およびその製造方法
CN101641418B (zh) 2007-03-21 2012-09-05 艾利丹尼森公司 压敏粘合剂
JP5419376B2 (ja) 2007-04-20 2014-02-19 日東電工株式会社 粘着シートの自動車塗膜面への接着方法
JP5038770B2 (ja) 2007-05-01 2012-10-03 日東電工株式会社 車両用塗膜面に対する粘着シートの接着方法
JP5118880B2 (ja) * 2007-05-08 2013-01-16 日東電工株式会社 粘着剤組成物及びそれを用いた粘着製品、ディスプレイ
US8334037B2 (en) * 2007-05-11 2012-12-18 3M Innovative Properties Company Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same
WO2009029476A1 (en) 2007-08-24 2009-03-05 Dow Global Technologies Inc. ADHESIVES MADE FROM INTERPOLYMERS OF ETHYLENE/α-OLEFINS
KR100922684B1 (ko) * 2007-08-31 2009-10-19 제일모직주식회사 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프
DE602007012372D1 (de) 2007-09-19 2011-03-17 Henkel Ag & Co Kgaa Hochdämpfendes, expandierbares material und vorrichtungen
US20090142506A1 (en) 2007-11-29 2009-06-04 Bayer Material Science Llc Ethylenically unsaturated polyisocyanate addition compounds based on lysine triisocyanate, their use in coating compositions and processes for their preparation
KR20100074296A (ko) * 2007-12-04 2010-07-01 히다치 가세고교 가부시끼가이샤 감광성 접착제
US7786868B2 (en) 2007-12-11 2010-08-31 Avery Dennison Corporation RFID device with multiple passive operation modes
JP2009256607A (ja) 2008-03-17 2009-11-05 Nitto Denko Corp アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート
WO2009133175A1 (de) 2008-04-30 2009-11-05 Tesa Se Klebeband
US8289165B2 (en) 2008-06-11 2012-10-16 Avery Dennison Corporation RFID device with conductive loop shield
CN102099432B (zh) 2008-07-16 2014-04-30 Lg化学株式会社 压敏粘合剂组合物、偏振片和液晶显示器
KR101665534B1 (ko) * 2008-07-28 2016-10-13 다우 코닝 코포레이션 복합 물품
US8080177B2 (en) 2008-08-19 2011-12-20 The Boeing Company Low RF loss static dissipative adhesive
BRPI0917383A2 (pt) * 2008-08-27 2015-11-17 Hitachi Chemical Co Ltd composicao adesiva fotossensivel, adesivo em pelicula fotossensevel, padrao adesivo, wafer semicondutor com adesivo, dispositivo semicondutor e componente eletronico
DE102008045802A1 (de) 2008-09-05 2010-03-11 Henkel Ag & Co. Kgaa Schmelzklebstoff auf Basis von Metallocene-katalysierten Olefin-α-Olefin Copolymeren
US8068028B2 (en) 2008-09-26 2011-11-29 Avery Dennison Corporation Encapsulated RFID device for flexible, non-planar or curvilinear surfaces
WO2010039623A2 (en) 2008-09-30 2010-04-08 Henkel Corporation Shear-and/or pressure-resistant microspheres
JP5803105B2 (ja) 2008-12-26 2015-11-04 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板
AT12321U1 (de) 2009-01-09 2012-03-15 Austria Tech & System Tech Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
US20100200063A1 (en) 2009-02-12 2010-08-12 Derek Djeu Thin film solar cell
JP5294931B2 (ja) 2009-03-11 2013-09-18 日東電工株式会社 アクリル系粘着シート
EP2236534A1 (de) 2009-03-31 2010-10-06 Sika Technology AG Zweistufig aushärtende Zusammensetzung enthaltend ein oberflächendesaktiviertes Polyisocyanat
JP5404174B2 (ja) 2009-05-14 2014-01-29 日東電工株式会社 熱剥離性感圧接着テープ又はシート
JP2011026551A (ja) * 2009-05-21 2011-02-10 Kaneka Corp 紫外線硬化型粘接着剤組成物
BRPI1010733A2 (pt) 2009-06-11 2016-03-15 Henkel Corp composição adesiva de fusão a quente termicamente reversível contendo compostos de dieno e dienófilo multifuncionais.
US8593256B2 (en) 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
JP5909445B2 (ja) 2009-07-24 2016-04-26 ボスティック，インコーポレイテッド オレフィンブロックコポリマーをベースとするホットメルト接着剤
US8242185B2 (en) 2009-08-03 2012-08-14 Morgan Adhesives Company Adhesive compositions for easy application and improved durability
WO2011017298A1 (en) 2009-08-04 2011-02-10 3M Innovative Properties Company Non-halogentaed polyisobutylene -thermoplastic elastomer blend pressure sensitive adhesives
CN102498183A (zh) 2009-09-16 2012-06-13 日东电工株式会社 丙烯酸类粘合带
WO2011038202A1 (en) 2009-09-24 2011-03-31 Avery Dennison Corporation Acrylic compositions for adhering to low surface energy subtrates
JP2011096988A (ja) 2009-11-02 2011-05-12 Keiwa Inc 太陽電池モジュール裏面保護用粘着シート及びこれを用いた太陽電池モジュール
WO2011084438A1 (en) 2009-12-16 2011-07-14 Avery Dennison Corporation Photovoltaic backsheet
US20120276380A1 (en) * 2009-12-18 2012-11-01 Steffen Traser Pressure sensitive adhesives for low surface energy substrates
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
KR101816330B1 (ko) 2010-03-09 2018-01-08 쓰리엠 이노베이티브 프로퍼티즈 컴파니 디스플레이 패널을 접합하기 위한 열 활성화 광학 투명 접착제
US9439809B2 (en) 2010-03-26 2016-09-13 3M Innovative Properties Company Method of sterilization of wound dressings
JP2011231319A (ja) 2010-04-09 2011-11-17 Nitto Denko Corp 粘着性組成物およびアクリル系粘着テープ
JP5749052B2 (ja) 2010-04-12 2015-07-15 日東電工株式会社 硬化多層シートの製造方法及び硬化多層シート
US9074087B2 (en) 2010-05-11 2015-07-07 3M Innovative Properties Company Curable composition, pressure-sensitive adhesive, method of making the same, and adhesive articles
ES2646830T3 (es) 2010-06-14 2017-12-18 Avery Dennison Corporation Método de fabricación de estructuras conductoras
JP5432853B2 (ja) 2010-07-30 2014-03-05 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
US20130136874A1 (en) 2010-08-18 2013-05-30 3M Innovative Properties Company Optical assemblies including stress-relieving optical adhesives and methods of making same
BR112013004339B1 (pt) 2010-08-26 2020-03-10 Henkel IP & Holding GmbH Adesivo fundido a quente de poli-alfa-olefina amorfa e artigo compreendendo o mesmo
EP2610319A4 (en) 2010-08-27 2015-12-02 Nitto Denko Corp ACRYLIC ADHESIVE COMPOSITION, ACRYLIC ADHESIVE LAYER, AND ACRYLIC ADHESIVE TAPE
DE102010035889B4 (de) 2010-08-30 2021-11-11 Bundesdruckerei Gmbh Wert- und/oder Sicherheitsdokument und Verfahren zu dessen Herstellung
CN103108930B (zh) 2010-09-17 2014-08-20 昭和电工株式会社 光固化性透明粘合片用组合物
JP6144868B2 (ja) 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
US9735299B2 (en) 2010-11-23 2017-08-15 Adhesives Research, Inc. Reactive conductive pressure-sensitive adhesive tape
WO2012071483A2 (en) 2010-11-23 2012-05-31 Westinghouse Electric Company Llc Full spectrum loca evaluation model and analysis methodology
CN103261349B (zh) 2010-12-13 2017-12-26 3M创新有限公司 用于低表面能基材的压敏粘合剂
WO2012088384A1 (en) 2010-12-22 2012-06-28 Bostik Inc. Olefin block copolymer based packaging adhesive
JP5689336B2 (ja) 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート
JP2012193317A (ja) 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
CN103476888B (zh) 2011-03-24 2015-08-26 汉高知识产权控股有限责任公司 拉伸膜层合粘合剂
ES2553653T3 (es) 2011-04-08 2015-12-10 Bostik, Inc. Adhesivo fusible en caliente a base de poliolefina que contiene un plastificante sólido
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
US9000659B2 (en) 2011-05-09 2015-04-07 Kenneth S. Chin Lamp socket
EP2708585B1 (en) * 2011-05-10 2018-01-03 Dexerials Corporation Method for producing a double-sided adhesive tape
PL2545798T3 (pl) 2011-07-13 2018-07-31 3M Innovative Properties Company System wyrobów higienicznych
EP2546053B1 (en) * 2011-07-15 2013-12-11 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet
EP2551102B1 (en) 2011-07-29 2014-12-03 3M Innovative Properties Company Self-stick foam adhesive
EP2581423A1 (en) 2011-10-14 2013-04-17 3M Innovative Properties Company Primerless multilayer adhesive film for bonding glass substrates
CN103814095B (zh) 2011-11-08 2016-08-17 Lg化学株式会社 用于具有抗静电性的保护膜的压敏粘合剂组合物及其制备方法
DE102011088170A1 (de) 2011-12-09 2013-06-13 Bayer Materialscience Aktiengesellschaft Reaktive Haftklebstoffe
KR102162852B1 (ko) 2011-12-22 2020-10-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 올레핀 블록 공중합체계 감압 접착제
DE102012200854A1 (de) 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
WO2013115851A1 (en) 2012-02-03 2013-08-08 Avery Dennison Corporation Laser patterning of photovoltaic backsheet
JP5938514B2 (ja) 2012-03-12 2016-06-22 エルジー・ケム・リミテッド 粘着剤組成物
JP5900091B2 (ja) 2012-03-27 2016-04-06 大日本印刷株式会社 化粧シート及びそれを有する化粧板
JP6188252B2 (ja) 2012-03-30 2017-08-30 シラス・インコーポレイテッド 重合性組成物の活性化方法、重合系およびこれにより形成される製品
CN110655886A (zh) 2012-03-30 2020-01-07 陶氏环球技术有限责任公司 聚烯烃粘合剂组合物
CN102634286B (zh) 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
CN104350121A (zh) 2012-05-29 2015-02-11 日东电工株式会社 粘合剂和使用所述粘合剂的透明基板
DE102012209116A1 (de) 2012-05-30 2013-12-05 Tesa Se Heißsiegelbares Klebeband
DE102013209827A1 (de) 2012-06-21 2013-12-24 Tesa Se Hitzebeständiges Klebeband
TWI585181B (zh) 2012-07-05 2017-06-01 Three Bond Fine Chemical Co Ltd A sheet-type adhesive and an organic EL panel using the same
JP5961055B2 (ja) 2012-07-05 2016-08-02 日東電工株式会社 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ
US10471681B2 (en) 2012-07-26 2019-11-12 3M Innovative Properties Company Heat de-bondable adhesive articles
CN104823080B (zh) 2012-07-26 2017-06-16 3M创新有限公司 可热脱粘的光学制品
EP2906654B1 (en) 2012-10-09 2020-04-08 Avery Dennison Corporation Adhesives and related methods
US20140162082A1 (en) 2012-12-07 2014-06-12 H.B. Fuller Company Composition, an article and a method for the bonding of non-woven substrates
US9023954B1 (en) 2012-12-26 2015-05-05 The United States Of America As Represented By The Secretary Of The Navy Side-chain and end-group modified poly-p-phenylene oligomers
CN105308140B (zh) 2013-01-24 2019-11-05 汉高有限公司 可发泡热熔粘合剂组合物及其用途
EP2759578B1 (de) 2013-01-24 2018-05-02 Basf Se Reaktive Haftklebstoffprodukte
CA2904584A1 (en) 2013-03-05 2014-09-12 Avery Dennison Corporation Differential dual functional foam tapes
CN105189509B (zh) 2013-03-06 2017-12-19 因赛特公司 用于制备jak抑制剂的方法及中间体
TWI622625B (zh) 2013-03-28 2018-05-01 道康寧公司 有機矽氧烷組成物與塗佈、製造物件、方法及用途
CN103275656B (zh) 2013-05-29 2015-07-08 北京化工大学 固化后具有结构胶性能的反应型压敏胶黏剂及其制备方法
KR102285194B1 (ko) 2013-09-23 2021-08-02 루브리졸 어드밴스드 머티어리얼스, 인코포레이티드 조합된 핫-멜트 접착제 및 감압 접착제 시스템 및 이로부터 제조된 복합 물질
CN105658754B (zh) 2013-09-25 2019-01-04 波士胶公司 具有官能化的金属茂催化的聚烯烃的热熔性粘合剂
CN111484803A (zh) 2013-10-10 2020-08-04 艾利丹尼森公司 胶黏剂和相关方法
EP3158020A1 (en) 2014-06-18 2017-04-26 Avery Dennison Corporation Transposable pressure sensitive adhesives, articles, and related methods
EP3201841A1 (en) 2014-09-29 2017-08-09 Avery Dennison Corporation Tire tracking rfid label
US11049421B2 (en) 2015-02-05 2021-06-29 Avery Dennison Corporation Label assemblies for adverse environments
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers

Also Published As

Publication number Publication date
MX2016004653A (es) 2016-08-05
US20170275501A1 (en) 2017-09-28
WO2014059058A1 (en) 2014-04-17
BR112015007837B1 (pt) 2021-10-05
EP2906653A1 (en) 2015-08-19
US20200024490A1 (en) 2020-01-23
CN112876996A (zh) 2021-06-01
EP2906652B1 (en) 2020-03-11
EP2906653B1 (en) 2022-06-15
US20180305584A1 (en) 2018-10-25
US10040978B2 (en) 2018-08-07
BR112015007880A2 (pt) 2017-07-04
US20150275058A1 (en) 2015-10-01
US9725623B2 (en) 2017-08-08
IN2015DN03071A (pt) 2015-10-02
AU2019201055A1 (en) 2019-03-07
US10035930B2 (en) 2018-07-31
AU2013329252B2 (en) 2017-05-18
US20150267090A1 (en) 2015-09-24
US10533117B2 (en) 2020-01-14
BR112015007833B1 (pt) 2021-10-05
EP2906654A1 (en) 2015-08-19
US20180305591A1 (en) 2018-10-25
US20160257858A1 (en) 2016-09-08
AU2013329252A1 (en) 2015-04-30
US20170275504A1 (en) 2017-09-28
US9708509B2 (en) 2017-07-18
BR112015007880B1 (pt) 2021-10-05
US11292942B2 (en) 2022-04-05
KR102295538B1 (ko) 2021-08-27
AU2017201997B2 (en) 2018-11-08
US20210253910A1 (en) 2021-08-19
US10040974B2 (en) 2018-08-07
US9714365B2 (en) 2017-07-25
WO2014059055A1 (en) 2014-04-17
IN2015DN03074A (pt) 2015-10-02
BR112015007832B1 (pt) 2021-10-05
US20180305585A1 (en) 2018-10-25
AU2019201055B2 (en) 2020-07-30
AU2017201999B2 (en) 2019-01-17
US10597560B2 (en) 2020-03-24
CN104854207A8 (zh) 2018-07-20
AU2013329253A1 (en) 2015-04-30
IN2015DN03055A (pt) 2015-10-02
MX2015004606A (es) 2017-04-04
KR20160070174A (ko) 2016-06-17
BR112015007833A8 (pt) 2019-08-27
WO2014059056A1 (en) 2014-04-17
US20170275502A1 (en) 2017-09-28
WO2014059058A8 (en) 2014-07-10
WO2014059057A1 (en) 2014-04-17
AU2020244387A1 (en) 2020-11-05
BR112015007833A2 (pt) 2017-07-04
CN104854207A (zh) 2015-08-19
EP2906651A1 (en) 2015-08-19
CN105793376A (zh) 2016-07-20
AU2022291497A1 (en) 2023-02-02
EP2906651B1 (en) 2021-09-15
US10457838B2 (en) 2019-10-29
AU2017201997A1 (en) 2017-04-13
US9738817B2 (en) 2017-08-22
US11008483B2 (en) 2021-05-18
EP2906652A1 (en) 2015-08-19
EP2906654B1 (en) 2020-04-08
US20150252227A1 (en) 2015-09-10
BR112015007832A2 (pt) 2017-07-04
US20170275503A1 (en) 2017-09-28
US10040973B2 (en) 2018-08-07
US20180305583A1 (en) 2018-10-25
US20150275057A1 (en) 2015-10-01
CN108587528A (zh) 2018-09-28
AU2013329251A1 (en) 2015-04-30
AU2013329253B2 (en) 2017-02-23
CA2887304A1 (en) 2014-04-17
AU2017201999A1 (en) 2017-04-13
AU2020244387B2 (en) 2022-11-03
US11685841B2 (en) 2023-06-27
CN105793376B (zh) 2020-10-23
AU2013329250A1 (en) 2015-04-30

Similar Documents

Publication Publication Date Title
BR112015007833A2 (pt) adesivos e métodos relacionados
EP4257596A3 (en) Coumarin compounds and their uses as fluorescent labels
AR090465A1 (es) Formas solidas de un profarmaco de nucleotidos de tiofosforamidato
BR112014017021A8 (pt) inibidores de irak e usos dos mesmos
BR112018004965A2 (pt) domínios de superfamìlia de imunoglobulina variante ajustàvel
BR112016023851A2 (pt) ?composição de revestimento de duas partes e método para revestir uma superfície?
BR112018006034A2 (pt) compostos bicíclicos como inibidores de atx
CL2016002072A1 (es) 2-amino-3,5,5-trifluoro-3,4,5,6-tetrahidropiridinas como inhibidores de bace1 para el tratamiento de la enfermedad de alzheimer
BR112014013308A2 (pt) polímero superabsorvente com reticulador
PH12017501371A1 (en) Pressure-sensitive adhesives for transdermal drug delivery
BR112014005581A2 (pt) compostos inibidores de enzima
NZ748769A (en) Nitroxyl donors with improved therapeutic index
TR201901348T4 (tr) Metap-2 inhibitörleri olarak pirolidinon türevleri.
UY34420A (es) ?métodos de tratamiento del virus de la hepatitis c con que de gs-7977 y ribavirina, composiciones y usos"
BR112017008481A2 (pt) composto antimicótico
EA201692028A1 (ru) Применение замещенных оксотетрагидрохинолинилсульфонамидов или их солей для повышения стрессоустойчивости растений
CR20130610A (es) Método de tratamiento de la fiebre dengue
BR112017010185A2 (pt) composições de cuidados pessoais contendo polímeros catiônicos
CR20150041A (es) Azaheterociclos como inhibidores de bir2 y/o bir3
BR112014014572A2 (pt) composição bioativa
BRPI0910663A2 (pt) micropartículas poliméricas inter-reticuladas
BR112017005741A2 (pt) cetiminas de poliaminas benziladas como agentes de cura
BR112016029905A2 (pt) adesivos transponíveis sensíveis à pressão, artigos e métodos relacionados
MX2019003175A (es) Aminas ciclicas de 6 miembros o lactamas sustituidas con urea y fenilo.
EA201892620A1 (ru) Композиция полимера для применения в качестве адгезива

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06I Publication of requirement cancelled [chapter 6.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 6.6.1 NA RPI NO 2462 DE 13/03/2018 POR TER SIDO INDEVIDA.

B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 10/10/2013, OBSERVADAS AS CONDICOES LEGAIS.

B25G Requested change of headquarter approved

Owner name: AVERY DENNISON CORPORATION (US)