IN2015DN03055A - - Google Patents

Info

Publication number
IN2015DN03055A
IN2015DN03055A IN3055DEN2015A IN2015DN03055A IN 2015DN03055 A IN2015DN03055 A IN 2015DN03055A IN 3055DEN2015 A IN3055DEN2015 A IN 3055DEN2015A IN 2015DN03055 A IN2015DN03055 A IN 2015DN03055A
Authority
IN
India
Prior art keywords
acrylic
diluent
bodying component
photoinitiators
crosslinkers
Prior art date
Application number
Other languages
English (en)
Inventor
Michael Zajaczkowski
Michael T Waterman
Kyle R Heimbach
Eric L Bartholomew
Brandon S Miller
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Publication of IN2015DN03055A publication Critical patent/IN2015DN03055A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/26Porous or cellular plastics
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/064Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/20Presence of organic materials
    • C09J2400/24Presence of a foam
    • C09J2400/243Presence of a foam in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00Presence of block copolymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
IN3055DEN2015 2012-10-09 2013-10-10 IN2015DN03055A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261711386P 2012-10-09 2012-10-09
PCT/US2013/064189 WO2014059057A1 (en) 2012-10-09 2013-10-10 Adhesives and related methods

Publications (1)

Publication Number Publication Date
IN2015DN03055A true IN2015DN03055A (pt) 2015-10-02

Family

ID=49447852

Family Applications (3)

Application Number Title Priority Date Filing Date
IN3074DEN2015 IN2015DN03074A (pt) 2012-10-09 2013-10-10
IN3071DEN2015 IN2015DN03071A (pt) 2012-10-09 2013-10-10
IN3055DEN2015 IN2015DN03055A (pt) 2012-10-09 2013-10-10

Family Applications Before (2)

Application Number Title Priority Date Filing Date
IN3074DEN2015 IN2015DN03074A (pt) 2012-10-09 2013-10-10
IN3071DEN2015 IN2015DN03071A (pt) 2012-10-09 2013-10-10

Country Status (10)

Country Link
US (15) US9725623B2 (pt)
EP (4) EP2906654B1 (pt)
KR (1) KR102295538B1 (pt)
CN (4) CN104854207A (pt)
AU (9) AU2013329250A1 (pt)
BR (4) BR112015007837B1 (pt)
CA (1) CA2887304A1 (pt)
IN (3) IN2015DN03074A (pt)
MX (2) MX2015004606A (pt)
WO (4) WO2014059056A1 (pt)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11685841B2 (en) 2012-10-09 2023-06-27 Avery Dennison Corporation Adhesives and related methods

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9574039B1 (en) * 2014-07-22 2017-02-21 Full Spectrum Laser Additive use in photopolymer resin for 3D printing to enhance the appearance of printed parts
CN104536210B (zh) * 2015-02-03 2017-09-29 京东方科技集团股份有限公司 一种配向膜印刷板的制备方法
EP3253837A1 (en) 2015-02-05 2017-12-13 Avery Dennison Corporation Label assemblies for adverse environments
US11141995B2 (en) 2015-12-28 2021-10-12 The Procter & Gamble Company Method and apparatus for applying a material onto articles with a pre-distorted transfer component
EP3397494A1 (en) 2015-12-28 2018-11-07 The Procter and Gamble Company Method and apparatus for applying a material onto articles using a transfer component that deflects on both sides
DE102016207540A1 (de) 2016-05-02 2017-11-02 Tesa Se Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat
DE102016207548A1 (de) 2016-05-02 2017-11-02 Tesa Se Härtbare Klebemasse und darauf basierende Reaktivklebebänder
ES2950434T3 (es) * 2016-09-16 2023-10-10 Int Flavors & Fragrances Inc Composiciones de microcápsula estabilizadas con agentes de control de la viscosidad
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers
WO2019003138A1 (en) 2017-06-30 2019-01-03 3M Innovative Properties Company PRINTABLE CURABLE MIXTURES AND CURED COMPOSITIONS
US10716715B2 (en) 2017-08-29 2020-07-21 Hill-Rom Services, Inc. RFID tag inlay for incontinence detection pad
JP6566324B2 (ja) * 2017-09-29 2019-08-28 サイデン化学株式会社 粘着シート
WO2019230677A1 (ja) * 2018-05-29 2019-12-05 日東電工株式会社 粘着剤組成物、粘着剤層及び粘着シート
JP2019206699A (ja) * 2018-05-29 2019-12-05 日東電工株式会社 粘着シート
EP3805332A4 (en) * 2018-05-29 2022-03-09 Nitto Denko Corporation ADHESIVE SHEET
JP7359570B2 (ja) * 2018-05-29 2023-10-11 日東電工株式会社 粘着剤組成物、粘着剤層及び粘着シート
EP3696110A1 (en) 2019-02-12 2020-08-19 The Procter & Gamble Company Apparatus for applying a material onto articles using a transfer component
KR102184587B1 (ko) * 2019-02-28 2020-12-01 주식회사 케이씨씨 접착제 조성물
DE102019208668A1 (de) * 2019-06-14 2020-12-17 Tesa Se Verklebungsverfahren mittels einer härtenden strukturellen Klebmasse
DE102019120049A1 (de) * 2019-07-24 2021-01-28 Bundesdruckerei Gmbh Verfahren und Schmelzklebstoff zur Herstellung eines aus mehreren Schichten bestehenden Wert- oder Sicherheitsdokumentes sowie Wert- oder Sicherheitsdokument
CN110527475B (zh) * 2019-09-26 2021-09-07 广东华南精细化工研究院有限公司 一种可喷涂抗下垂型硅烷改性聚醚密封胶及其制备方法
WO2021183350A1 (en) 2020-03-09 2021-09-16 The Procter & Gamble Company Method and apparatus for applying a material onto articles using a transfer component
CN111534269B (zh) * 2020-05-07 2022-04-12 苏州金枪新材料股份有限公司 一种用于液晶屏幕粘接的双组份柔韧性丙烯酸酯结构胶及其制备方法
CN111826093A (zh) * 2020-07-28 2020-10-27 中国石油化工股份有限公司 一种适用于油气集输管线修复的光固化材料及其制作方法
CA3206215A1 (en) * 2021-02-04 2022-08-11 Stephen Eric Howe Curable composition
CN114853969B (zh) * 2022-04-25 2023-11-24 广东深展实业有限公司 一种光热双重固化改性聚丙烯树脂及其制备方法
CN115044317B (zh) * 2022-06-29 2024-05-28 湖北祥源高新科技有限公司 一种双面自粘结聚氨酯泡棉的制备方法和产品

Family Cites Families (226)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408008A (en) 1966-12-02 1968-10-29 Eric H. Cocks Apparatus for applying hot melt adhesives
CH481197A (de) 1967-02-22 1969-11-15 Breveteam Sa Kleber zur unterseitigen Beschichtung von Bodenbelägen
US3639500A (en) 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
DE2446438C2 (de) 1974-09-28 1985-04-11 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von Oxazolidingruppen enthaltenden Urethanen und ihre Verwendung
US4049483A (en) 1976-11-18 1977-09-20 Minnesota Mining And Manufacturing Company Pressure sensitive hot-melt adhesive system
US4135033A (en) 1977-02-16 1979-01-16 Lawton William R Heat-activated adhesive coating
US4143858A (en) 1977-08-29 1979-03-13 Eastman Kodak Company Substantially amorphous polyolefins useful as pressure-sensitive adhesives
US4185050A (en) 1978-12-26 1980-01-22 Celanese Corporation Pressure sensitive adhesive compositions comprising a mixture of terpolymers
BR8001021A (pt) * 1979-02-26 1980-10-29 Du Pont Material resistente de pelicula seca, rolo ajustado, mascara de solda e processo para a modificacao seletiva de uma superficie
US4288527A (en) 1980-08-13 1981-09-08 W. R. Grace & Co. Dual UV/thermally curable acrylate compositions with pinacol
JPS618471Y2 (pt) 1980-09-01 1986-03-15
JPS58152074A (ja) 1982-03-05 1983-09-09 Mitsui Toatsu Chem Inc 陶磁器質タイル用接着剤組成物
US4507429A (en) 1984-01-12 1985-03-26 Air Products And Chemicals, Inc. Pressure sensitive adhesives with improved shear resistance
DE3650593T2 (de) 1985-02-05 1997-09-11 Avery International Corp Verbundfutter
US5082922A (en) 1988-10-12 1992-01-21 The Valspar Corporation Modified-acrylate polymers and coating compositions made therefrom
US4914253A (en) 1988-11-04 1990-04-03 Exxon Chemical Patents Inc. Method for preparing polyethylene wax by gas phase polymerization
ATE142557T1 (de) 1989-05-11 1996-09-15 Landec Corp Von der temperatur aktivierte bindemitteleinheiten
EP0400703A1 (en) 1989-05-24 1990-12-05 Akzo Nobel N.V. Adhesive based on a thermoplastic polyester with an aluminium compound incorporated therein
US5194486A (en) 1989-06-09 1993-03-16 H & N Chemical Company Adhesive
US5264532A (en) 1989-08-14 1993-11-23 Avery Dennison Corporation Emulsion pressure-sensitive adhesives
US5024880A (en) 1990-01-03 1991-06-18 Minnesota Mining And Manufacturing Company Cellular pressure-sensitive adhesive membrane
DE4021659A1 (de) 1990-07-07 1992-01-09 Bayer Ag Bisoxazolane, im wesentlichen aus diesen bestehende oxazolangemische, ein verfahren zu deren herstellung und ihre verwendung als haerter fuer isocyanatgruppen aufweisende kunststoffvorlaeufer
CA2048232A1 (en) 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
US5264278A (en) 1991-03-20 1993-11-23 Minnesota Mining And Manufacturing Company Radiation-curable acrylate/silicone pressure-sensitive adhesive coated tapes adherable to paint coated substrates
CA2076278A1 (en) 1991-08-22 1993-02-23 Joseph T. Braun Curable silicone pressure sensitive adhesive tape
JP3035565B2 (ja) 1991-12-27 2000-04-24 株式会社半導体エネルギー研究所 薄膜太陽電池の作製方法
US5252694A (en) 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
CA2077103C (en) 1992-08-28 2003-06-10 Moore U.S.A. Inc. Multipurpose label construction
WO1994008781A1 (en) 1992-10-20 1994-04-28 Avery Dennison Corporation Pressure-sensitive structural adhesive
US5322731A (en) 1993-03-09 1994-06-21 Minnesota Mining And Manufacturing Company Adhesive beads
US7575653B2 (en) 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US5468652A (en) 1993-07-14 1995-11-21 Sandia Corporation Method of making a back contacted solar cell
US5721289A (en) 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5645764A (en) 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5695837A (en) 1995-04-20 1997-12-09 Minnesota Mining And Manufacturing Company Tackified acrylic adhesives
US5905099A (en) * 1995-11-06 1999-05-18 Minnesota Mining And Manufacturing Company Heat-activatable adhesive composition
US5800724A (en) 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
ID17196A (id) 1996-03-14 1997-12-11 Dow Chemical Co Bahan-bahan perekat yang mengandung polimer-polimer olefin
EP1249479B1 (en) 1996-07-15 2004-02-18 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for joining members
AU3665797A (en) 1996-07-22 1998-02-10 Dow Chemical Company, The Hot melt adhesives
ZA977909B (en) 1996-09-04 1999-03-03 Dow Chemical Co Compositions comprising a substantially random interpolymer of at least one alpha-olefin and at least one vinylidene aromatic monomer or hindered aliphatic vinylidene monomer
US20020007910A1 (en) 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
DE69815073T3 (de) 1997-03-14 2008-07-03 Minnesota Mining And Manufacturing Co., St. Paul Auf-anfrage-härtung von feuchtigkeithärtbaren zusammensetzungen mit reaktiven funktionellen silangruppen
US6011307A (en) 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
US6077527A (en) 1997-10-28 2000-06-20 National Starch And Chemical Investment Holding Corporation Enhancer tolerant pressure sensitive adhesives for transdermal drug delivery
US5951786A (en) 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
DE19800676A1 (de) 1998-01-10 1999-07-15 Henkel Kgaa Verwendung ausgewählter Klebstoffgemische für die Überlappungsverklebung von Rundumetiketten bei ihrem Auftrag auf Kunststoff-Flaschen
FI106470B (fi) 1998-03-09 2001-02-15 Neste Chemicals Oy Vaahdotettu hartsiliima ja sen käyttö puupohjaisten levyjen liimaamiseen
US6106982A (en) 1998-05-11 2000-08-22 Avery Dennison Corporation Imaged receptor laminate and process for making same
US6391415B1 (en) 1998-08-31 2002-05-21 Environmental Inks And Coatings Corporation Label system
US6362249B2 (en) * 1998-09-04 2002-03-26 Dsm Desotech Inc. Radiation-curable coating compositions, coated optical fiber, radiation-curable matrix forming material and ribbon assembly
US6844391B1 (en) 1998-09-23 2005-01-18 Avery Dennison Corporation Adhesives with improved rivet properties and laminates using the same
US6228486B1 (en) 1998-10-06 2001-05-08 Avery Dennison Corporation Thermal transfer laminate
CA2354532A1 (en) 1998-12-11 2000-06-22 Henkel Kommanditgesellschaft Auf Aktien Dispersions of silyl-terminated polymers with a high solids content, their production and their use
US6235850B1 (en) * 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
US6503620B1 (en) 1999-10-29 2003-01-07 Avery Dennison Corporation Multilayer composite PSA constructions
US6664318B1 (en) 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
JP2001288438A (ja) 2000-04-06 2001-10-16 Sekisui Chem Co Ltd 粘着剤組成物
EP1311559B1 (en) 2000-06-01 2006-08-02 Kraton Polymers Research B.V. Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US6376075B1 (en) 2000-06-17 2002-04-23 General Electric Company Article having reflecting coating and process for the manufacture
US6353037B1 (en) 2000-07-12 2002-03-05 3M Innovative Properties Company Foams containing functionalized metal oxide nanoparticles and methods of making same
US6841234B2 (en) 2000-08-04 2005-01-11 Scapa Tapes North America Inc. Heat-activated adhesive tape having an acrylic foam-like backing
US6497949B1 (en) 2000-08-11 2002-12-24 3M Innovative Properties Company Adhesive blends comprising hydrophilic and hydrophobic pressure sensitive adhesives
IL154776A0 (en) 2000-09-18 2003-10-31 Applied Research Systems Method for the preparation of 21-hydroxy-6, 19-oxidoprogesterone and derivatives thereof
US6756095B2 (en) 2001-01-10 2004-06-29 Avery Dennison Corporation Heat-sealable laminate
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP2002285106A (ja) * 2001-03-27 2002-10-03 The Inctec Inc 活性エネルギー線硬化型感圧接着剤
US6686425B2 (en) 2001-06-08 2004-02-03 Adhesives Research, Inc. High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
US6602958B2 (en) 2001-07-10 2003-08-05 Ips Corporation Adhesives for bonding composites
JP4312598B2 (ja) * 2001-07-26 2009-08-12 チバ ホールディング インコーポレーテッド 感光性樹脂組成物
US20030095388A1 (en) 2001-11-16 2003-05-22 Jinbao Jiao Method and apparatus for securing a circuit board to a rigid surface
US6866919B2 (en) 2002-02-21 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
US6613587B1 (en) * 2002-04-11 2003-09-02 Micron Technology, Inc. Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
RU2005104934A (ru) 2002-07-19 2005-09-10 Эвери Деннисон Копэрейшн (Us) Этикетка (варианты) и способ этикетирования
US6613857B1 (en) 2002-07-26 2003-09-02 Avery Dennison Corporation UV-crosslinked, pressure-sensitive adhesives
WO2004015019A1 (en) 2002-07-31 2004-02-19 Nexicor Llc Induction bondable high-pressure laminate
EP1527146B1 (en) 2002-07-31 2009-10-14 Cytec Surface Specialties, S.A. Acrylic pressure sensitive adhesives
US6653408B1 (en) 2002-11-21 2003-11-25 Kraton Polymers U.S. Llc Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US6887917B2 (en) 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
DE10322898A1 (de) 2003-05-21 2004-12-16 Tesa Ag Flammfeste und Hitze-aktivierbare Haftklebemassen
TWI318649B (en) 2003-06-06 2009-12-21 Hitachi Chemical Co Ltd Sticking sheep, connecting sheet unified with dicing tape,and fabricating method of semiconductor device
EP1632507A4 (en) 2003-06-09 2006-11-29 Mitsui Chemicals Inc NETWORK METHACRYL RESIN COMPRISING COMPOSITION AND TRANSPARENT ELEMENT
US7170001B2 (en) 2003-06-26 2007-01-30 Advent Solar, Inc. Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias
US7691437B2 (en) 2003-10-31 2010-04-06 3M Innovative Properties Company Method for preparing a pressure-sensitive adhesive
US7270889B2 (en) 2003-11-04 2007-09-18 Kimberly-Clark Worldwide, Inc. Tackified amorphous-poly-alpha-olefin-bonded structures
KR101009070B1 (ko) * 2003-11-04 2011-01-18 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 중합성 조성물 및 (메타)아크릴계 열전도성 시트
US7144751B2 (en) 2004-02-05 2006-12-05 Advent Solar, Inc. Back-contact solar cells and methods for fabrication
US7157584B2 (en) * 2004-02-25 2007-01-02 Takeda Pharmaceutical Company Limited Benzimidazole derivative and use thereof
EA011898B1 (ru) 2004-03-09 2009-06-30 Спир Груп Холдингз Лимитед Этикетка для стеклянной бутылки и способ ее удаления
US7524911B2 (en) 2004-03-17 2009-04-28 Dow Global Technologies Inc. Adhesive and marking compositions made from interpolymers of ethylene/α-olefins
US7088248B2 (en) 2004-03-24 2006-08-08 Avery Dennison Corporation System and method for selectively reading RFID devices
WO2005103178A1 (en) 2004-03-29 2005-11-03 Avery Dennison Corporation Anaerobic pressure sensitive adhesive
US7645829B2 (en) * 2004-04-15 2010-01-12 Exxonmobil Chemical Patents Inc. Plasticized functionalized propylene copolymer adhesive composition
US20050266237A1 (en) 2004-05-28 2005-12-01 Siddhartha Asthana Heat-activated sound and vibration damping sealant composition
EP1640388B1 (en) 2004-09-24 2015-02-25 Rohm and Haas Company Biomass based Michael addition composition
CA2548453C (en) 2004-10-22 2011-12-06 Kabushiki Kaisha Sato A method for applying a rfid tag carrying label on an object
US20080280111A1 (en) 2004-11-10 2008-11-13 Avery Dennison Corporation In-Mold Labels and Uses Thereof
US7212127B2 (en) 2004-12-20 2007-05-01 Avery Dennison Corp. RFID tag and label
US7786216B2 (en) 2005-03-17 2010-08-31 Dow Global Technologies Inc. Oil based blends of interpolymers of ethylene/α-olefins
JP5231986B2 (ja) 2005-03-17 2013-07-10 ダウ グローバル テクノロジーズ エルエルシー 官能化エチレン/α−オレフィン共重合体組成物
CA2601273A1 (en) 2005-03-17 2006-09-28 Dow Global Technologies Inc. Adhesive and marking compositions made from interpolymers of ethylene/alpha-olefins
US7756154B2 (en) 2005-03-22 2010-07-13 Netapp, Inc. Shared implementation for multiple system interfaces
TWI353360B (en) 2005-04-07 2011-12-01 Nippon Catalytic Chem Ind Production process of polyacrylic acid (salt) wate
US7298266B2 (en) 2005-05-09 2007-11-20 Avery Dennison RFID communication systems and methods
JP4634856B2 (ja) 2005-05-12 2011-02-16 利昌工業株式会社 白色プリプレグ、白色積層板、及び金属箔張り白色積層板
US8287949B2 (en) 2005-07-07 2012-10-16 Dow Global Technologies Inc. Aqueous dispersions
EP1904597B1 (en) * 2005-07-19 2012-08-22 Dow Corning Corporation Pressure sensitive adhesives and methods for their preparation
JP4711777B2 (ja) 2005-08-11 2011-06-29 日東電工株式会社 粘着シートとその製造方法、及び、製品の加工方法
US20100311920A1 (en) * 2005-08-26 2010-12-09 Cid Centro De Investigacion Y Desarrollo Tecnologico Sa De Cv Using Reactive Block Copolymers as Chain Extenders and Surface Modifiers
US20070088145A1 (en) 2005-10-19 2007-04-19 Mgaya Alexander P Adhesive useful for film laminating applications
US20070092733A1 (en) 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
EP1792925B1 (en) 2005-12-01 2015-10-07 Henkel AG & Co. KGaA Novel material forming supramolecular structures, process and uses
CN101000899A (zh) 2006-01-11 2007-07-18 南茂科技股份有限公司 晶片封装结构
US20070231571A1 (en) 2006-04-04 2007-10-04 Richard Lane Pressure sensitive adhesive (PSA) laminates
US8785531B2 (en) 2006-07-06 2014-07-22 Dow Global Technologies Llc Dispersions of olefin block copolymers
DE112007001861B4 (de) 2006-08-08 2022-08-11 World Properties, Inc. Schaltungsmaterial mit verbesserter Bindung, Verfahren zu dessen Herstellung und mehrschichtige Schaltung
JP2008060151A (ja) 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
US8074022B2 (en) 2006-09-28 2011-12-06 Virident Systems, Inc. Programmable heterogeneous memory controllers for main memory with different memory modules
US7776969B2 (en) 2006-12-04 2010-08-17 Bayer Materialscience Llc Allophanate-modified stabilizers and the polymer polyols prepared from these stabilizers
WO2008073669A1 (en) * 2006-12-07 2008-06-19 3M Innovative Properties Company Block copolymer blend adhesives with multiple tackifiers
KR100907982B1 (ko) * 2006-12-27 2009-07-16 제일모직주식회사 점착필름 형성용 조성물에 의한 반도체 패키지용 점착필름을 포함하는 다이싱 다이본드 필름
TW200842174A (en) * 2006-12-27 2008-11-01 Cheil Ind Inc Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
WO2008093398A1 (ja) 2007-01-30 2008-08-07 Asics Corporation シューズの製造方法、及びシューズ
JP5089201B2 (ja) 2007-03-12 2012-12-05 日東電工株式会社 アクリル系粘着テープ又はシート、およびその製造方法
US10100233B2 (en) 2007-03-21 2018-10-16 Avery Dennison Corporation Pressure sensitive adhesives
JP5419376B2 (ja) 2007-04-20 2014-02-19 日東電工株式会社 粘着シートの自動車塗膜面への接着方法
JP5038770B2 (ja) 2007-05-01 2012-10-03 日東電工株式会社 車両用塗膜面に対する粘着シートの接着方法
JP5118880B2 (ja) * 2007-05-08 2013-01-16 日東電工株式会社 粘着剤組成物及びそれを用いた粘着製品、ディスプレイ
US8334037B2 (en) * 2007-05-11 2012-12-18 3M Innovative Properties Company Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same
US8222339B2 (en) 2007-08-24 2012-07-17 Dow Global Technologies Llc Adhesives made from interpolymers of ethylene/alpha-olefins
KR100922684B1 (ko) * 2007-08-31 2009-10-19 제일모직주식회사 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프
CA2699932A1 (en) 2007-09-19 2009-03-26 Delphine Leclerc Highly damping expandable material and devices
US20090142506A1 (en) 2007-11-29 2009-06-04 Bayer Material Science Llc Ethylenically unsaturated polyisocyanate addition compounds based on lysine triisocyanate, their use in coating compositions and processes for their preparation
CN101884104B (zh) * 2007-12-04 2014-05-28 日立化成株式会社 感光性粘接剂
US7786868B2 (en) 2007-12-11 2010-08-31 Avery Dennison Corporation RFID device with multiple passive operation modes
JP2009256607A (ja) 2008-03-17 2009-11-05 Nitto Denko Corp アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート
WO2009133175A1 (de) 2008-04-30 2009-11-05 Tesa Se Klebeband
US8289165B2 (en) 2008-06-11 2012-10-16 Avery Dennison Corporation RFID device with conductive loop shield
US20110122343A1 (en) 2008-07-16 2011-05-26 Min Soo Park Pressure-sensitive adhesive composition, polarization plate, and liquid crystal display
WO2010014545A1 (en) * 2008-07-28 2010-02-04 Dow Corning Corporation Composite article
US8080177B2 (en) 2008-08-19 2011-12-20 The Boeing Company Low RF loss static dissipative adhesive
EP2319892A4 (en) * 2008-08-27 2012-01-18 Hitachi Chemical Co Ltd PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
DE102008045802A1 (de) 2008-09-05 2010-03-11 Henkel Ag & Co. Kgaa Schmelzklebstoff auf Basis von Metallocene-katalysierten Olefin-α-Olefin Copolymeren
US8068028B2 (en) 2008-09-26 2011-11-29 Avery Dennison Corporation Encapsulated RFID device for flexible, non-planar or curvilinear surfaces
EP2334721A4 (en) 2008-09-30 2013-09-25 Henkel Corp SHEAR AND / OR PRESSURE-RELATED MICROBALLS
CN102264855B (zh) 2008-12-26 2014-03-12 东洋纺织株式会社 粘合剂用树脂组合物、含有它的粘合剂、粘合片以及将粘合片作为粘合层含有的印制线路板
AT12321U1 (de) 2009-01-09 2012-03-15 Austria Tech & System Tech Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
US20100200063A1 (en) 2009-02-12 2010-08-12 Derek Djeu Thin film solar cell
JP5294931B2 (ja) 2009-03-11 2013-09-18 日東電工株式会社 アクリル系粘着シート
EP2236534A1 (de) 2009-03-31 2010-10-06 Sika Technology AG Zweistufig aushärtende Zusammensetzung enthaltend ein oberflächendesaktiviertes Polyisocyanat
JP5404174B2 (ja) 2009-05-14 2014-01-29 日東電工株式会社 熱剥離性感圧接着テープ又はシート
JP2011026551A (ja) * 2009-05-21 2011-02-10 Kaneka Corp 紫外線硬化型粘接着剤組成物
ES2539184T3 (es) 2009-06-11 2015-06-26 Henkel IP & Holding GmbH Composición adhesiva termofusible térmicamente reversible que contiene compuestos de dieno y dienófilos multifuncionales
US8593256B2 (en) 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
US8921474B2 (en) 2009-07-24 2014-12-30 Bostik, Inc. Hot melt adhesive based on olefin block copolymers
US8242185B2 (en) 2009-08-03 2012-08-14 Morgan Adhesives Company Adhesive compositions for easy application and improved durability
CN102471656A (zh) * 2009-08-04 2012-05-23 3M创新有限公司 非卤化聚异丁烯热塑性弹性体共混物压敏粘合剂
CN102498183A (zh) 2009-09-16 2012-06-13 日东电工株式会社 丙烯酸类粘合带
PL2480617T3 (pl) 2009-09-24 2014-08-29 Avery Dennison Corp Kompozycje akrylowe do przywierania do podłoży o niskiej energii powierzchniowej
JP2011096988A (ja) 2009-11-02 2011-05-12 Keiwa Inc 太陽電池モジュール裏面保護用粘着シート及びこれを用いた太陽電池モジュール
US20120240973A1 (en) 2009-12-16 2012-09-27 Avery Dennison Corporation Photovoltaic Backsheet
JP2013514445A (ja) * 2009-12-18 2013-04-25 スリーエム イノベイティブ プロパティズ カンパニー 低表面エネルギー基材用感圧性接着剤
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
WO2011112447A2 (en) 2010-03-09 2011-09-15 3M Innovative Properties Company Heat activated optically clear adhesive for bonding display panels
WO2011119393A2 (en) 2010-03-26 2011-09-29 3M Innovative Properties Company Method of sterilization of wound dressings
JP2011231319A (ja) 2010-04-09 2011-11-17 Nitto Denko Corp 粘着性組成物およびアクリル系粘着テープ
JP5749052B2 (ja) 2010-04-12 2015-07-15 日東電工株式会社 硬化多層シートの製造方法及び硬化多層シート
US9074087B2 (en) 2010-05-11 2015-07-07 3M Innovative Properties Company Curable composition, pressure-sensitive adhesive, method of making the same, and adhesive articles
ES2735236T3 (es) 2010-06-14 2019-12-17 Avery Dennison Corp Método y aparato de fabricar etiquetas y marbetes de identificación por radiofrecuencia en tiradas cortas
JP5432853B2 (ja) 2010-07-30 2014-03-05 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
US20130136874A1 (en) 2010-08-18 2013-05-30 3M Innovative Properties Company Optical assemblies including stress-relieving optical adhesives and methods of making same
CA2807966C (en) 2010-08-26 2019-10-29 Henkel Corporation Low application temperature amorphous poly-.alpha.-olefin adhesive
CN103097483B (zh) 2010-08-27 2016-03-09 日东电工株式会社 丙烯酸类粘合剂组合物、丙烯酸类粘合剂层以及丙烯酸类粘合带
DE102010035889B4 (de) 2010-08-30 2021-11-11 Bundesdruckerei Gmbh Wert- und/oder Sicherheitsdokument und Verfahren zu dessen Herstellung
KR101494984B1 (ko) * 2010-09-17 2015-02-23 쇼와 덴코 가부시키가이샤 광경화성 투명 점착 시트용 조성물
JP6144868B2 (ja) 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
WO2012071483A2 (en) 2010-11-23 2012-05-31 Westinghouse Electric Company Llc Full spectrum loca evaluation model and analysis methodology
WO2012071484A2 (en) 2010-11-23 2012-05-31 Adhesives Research, Inc. Reactive conductive pressure-sensitive adhesive tape
US20130273362A1 (en) 2010-12-13 2013-10-17 3M Innovative Properties Company Pressure sensitive adhesives for low surface energy substrates
US20120165455A1 (en) 2010-12-22 2012-06-28 Bostik, Inc. OBC Based Packaging Adhesive
JP5689336B2 (ja) 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート
JP2012193317A (ja) 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
ES2689109T3 (es) 2011-03-24 2018-11-08 Henkel IP & Holding GmbH Adhesivo de laminación de película estirable
WO2012139120A1 (en) 2011-04-08 2012-10-11 Bostik, Inc. Polyolefin based hot melt adhesive containing a solid plasticizer
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
US9000659B2 (en) * 2011-05-09 2015-04-07 Kenneth S. Chin Lamp socket
CN103534323B (zh) * 2011-05-10 2016-05-04 迪睿合电子材料有限公司 双面粘合带及其制造方法
PL2545798T3 (pl) 2011-07-13 2018-07-31 3M Innovative Properties Company System wyrobów higienicznych
US20130017389A1 (en) * 2011-07-15 2013-01-17 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet
EP2551102B1 (en) 2011-07-29 2014-12-03 3M Innovative Properties Company Self-stick foam adhesive
EP2581423A1 (en) 2011-10-14 2013-04-17 3M Innovative Properties Company Primerless multilayer adhesive film for bonding glass substrates
KR101367177B1 (ko) 2011-11-08 2014-02-27 주식회사 엘지화학 대전방지성 보호필름용 점착제 조성물 및 이의 제조방법
DE102011088170A1 (de) 2011-12-09 2013-06-13 Bayer Materialscience Aktiengesellschaft Reaktive Haftklebstoffe
EP2794795B1 (en) 2011-12-22 2018-05-30 3M Innovative Properties Company Olefin block copolymer based pressure sensitive adhesives
DE102012200854A1 (de) 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
EP2810539B1 (en) 2012-02-03 2018-03-28 Avery Dennison Corporation Laser patterning of photovoltaic backsheet
TWI488930B (zh) 2012-03-12 2015-06-21 Lg Chemical Ltd 壓感性黏著組成物
JP5900091B2 (ja) 2012-03-27 2016-04-06 大日本印刷株式会社 化粧シート及びそれを有する化粧板
CA2869108A1 (en) 2012-03-30 2013-10-03 Bioformix Inc. Methods for activating polymerizable compositions, polymerizable systems, and products formed thereby
EP2831190B1 (en) 2012-03-30 2016-12-14 Dow Global Technologies LLC Polyolefin adhesive composition
CN102634286B (zh) 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
KR20150027067A (ko) 2012-05-29 2015-03-11 닛토덴코 가부시키가이샤 접착제 및 그것을 사용한 투명 기판
DE102012209116A1 (de) 2012-05-30 2013-12-05 Tesa Se Heißsiegelbares Klebeband
DE102013209827A1 (de) 2012-06-21 2013-12-24 Tesa Se Hitzebeständiges Klebeband
JP5961055B2 (ja) 2012-07-05 2016-08-02 日東電工株式会社 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ
KR102055869B1 (ko) 2012-07-05 2019-12-13 쓰리본드 화인 케미칼 가부시키가이샤 시트형상 접착제 및 이 시트형상 접착제를 사용한 유기 el 패널
EP2877547A4 (en) 2012-07-26 2016-01-27 3M Innovative Properties Co HEAT-SOAKING ADHESIVE ARTICLES
EP2877883B1 (en) 2012-07-26 2017-08-23 3M Innovative Properties Company Heat de-bondable optical articles
EP2906654B1 (en) 2012-10-09 2020-04-08 Avery Dennison Corporation Adhesives and related methods
US20140162082A1 (en) 2012-12-07 2014-06-12 H.B. Fuller Company Composition, an article and a method for the bonding of non-woven substrates
US9023954B1 (en) 2012-12-26 2015-05-05 The United States Of America As Represented By The Secretary Of The Navy Side-chain and end-group modified poly-p-phenylene oligomers
EP2759578B1 (de) 2013-01-24 2018-05-02 Basf Se Reaktive Haftklebstoffprodukte
BR112015017383A2 (pt) 2013-01-24 2017-07-11 Henkel Ag & Co Kgaa composições de adesivo de fusão a quente espumável e uso das mesmas
KR20150126658A (ko) 2013-03-05 2015-11-12 애버리 데니슨 코포레이션 차별적인 듀얼 기능 폼 테이프들
AU2014225938B2 (en) 2013-03-06 2018-07-19 Incyte Holdings Corporation Processes and intermediates for making a JAK inhibitor
CN105229056B (zh) 2013-03-28 2017-11-28 道康宁公司 有机硅氧烷组合物和涂层、制成品、方法及用途
CN103275656B (zh) 2013-05-29 2015-07-08 北京化工大学 固化后具有结构胶性能的反应型压敏胶黏剂及其制备方法
CA2924202A1 (en) 2013-09-23 2015-03-26 Lubrizol Advanced Materials, Inc. A combined hot-melt adhesive and pressure sensitive adhesive system and composite materials made from the same
CN105658754B (zh) 2013-09-25 2019-01-04 波士胶公司 具有官能化的金属茂催化的聚烯烃的热熔性粘合剂
CN111484803A (zh) 2013-10-10 2020-08-04 艾利丹尼森公司 胶黏剂和相关方法
BR112016029905A2 (pt) 2014-06-18 2017-08-22 Avery Dennison Corp adesivos transponíveis sensíveis à pressão, artigos e métodos relacionados
US10152672B2 (en) 2014-09-29 2018-12-11 Avery Dennison Corporation Tire tracking RFID label
EP3253837A1 (en) 2015-02-05 2017-12-13 Avery Dennison Corporation Label assemblies for adverse environments
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11685841B2 (en) 2012-10-09 2023-06-27 Avery Dennison Corporation Adhesives and related methods

Also Published As

Publication number Publication date
AU2020244387B2 (en) 2022-11-03
WO2014059057A1 (en) 2014-04-17
BR112015007833B1 (pt) 2021-10-05
WO2014059058A1 (en) 2014-04-17
CN105793376B (zh) 2020-10-23
EP2906653A1 (en) 2015-08-19
US20150252227A1 (en) 2015-09-10
AU2017201997B2 (en) 2018-11-08
EP2906651B1 (en) 2021-09-15
US20170275501A1 (en) 2017-09-28
IN2015DN03074A (pt) 2015-10-02
CA2887304A1 (en) 2014-04-17
US11008483B2 (en) 2021-05-18
US20170275504A1 (en) 2017-09-28
US20170275503A1 (en) 2017-09-28
BR112015007833A2 (pt) 2017-07-04
US9738817B2 (en) 2017-08-22
EP2906653B1 (en) 2022-06-15
MX2015004606A (es) 2017-04-04
AU2013329252A1 (en) 2015-04-30
US10040973B2 (en) 2018-08-07
AU2013329253A1 (en) 2015-04-30
CN108587528A (zh) 2018-09-28
WO2014059056A1 (en) 2014-04-17
US10040978B2 (en) 2018-08-07
US20150275058A1 (en) 2015-10-01
US10533117B2 (en) 2020-01-14
EP2906652A1 (en) 2015-08-19
EP2906654B1 (en) 2020-04-08
BR112015007880A2 (pt) 2017-07-04
AU2020244387A1 (en) 2020-11-05
WO2014059058A8 (en) 2014-07-10
BR112015007880B1 (pt) 2021-10-05
US20180305583A1 (en) 2018-10-25
AU2022291497A1 (en) 2023-02-02
US20180305584A1 (en) 2018-10-25
IN2015DN03071A (pt) 2015-10-02
US10597560B2 (en) 2020-03-24
AU2017201999A1 (en) 2017-04-13
US20210253910A1 (en) 2021-08-19
AU2017201997A1 (en) 2017-04-13
KR20160070174A (ko) 2016-06-17
CN104854207A (zh) 2015-08-19
US20170275502A1 (en) 2017-09-28
US10035930B2 (en) 2018-07-31
CN112876996A (zh) 2021-06-01
US20150267090A1 (en) 2015-09-24
US11685841B2 (en) 2023-06-27
US20180305591A1 (en) 2018-10-25
US11292942B2 (en) 2022-04-05
EP2906652B1 (en) 2020-03-11
AU2013329252B2 (en) 2017-05-18
CN105793376A (zh) 2016-07-20
EP2906654A1 (en) 2015-08-19
AU2017201999B2 (en) 2019-01-17
US9708509B2 (en) 2017-07-18
BR112015007832A2 (pt) 2017-07-04
AU2019201055A1 (en) 2019-03-07
US20200024490A1 (en) 2020-01-23
AU2013329250A1 (en) 2015-04-30
EP2906651A1 (en) 2015-08-19
BR112015007837A2 (pt) 2017-07-04
US9714365B2 (en) 2017-07-25
BR112015007837B1 (pt) 2021-10-05
US20160257858A1 (en) 2016-09-08
US20150275057A1 (en) 2015-10-01
WO2014059055A1 (en) 2014-04-17
US9725623B2 (en) 2017-08-08
BR112015007832B1 (pt) 2021-10-05
US10457838B2 (en) 2019-10-29
US10040974B2 (en) 2018-08-07
AU2013329251A1 (en) 2015-04-30
KR102295538B1 (ko) 2021-08-27
BR112015007833A8 (pt) 2019-08-27
US20180305585A1 (en) 2018-10-25
CN104854207A8 (zh) 2018-07-20
AU2013329253B2 (en) 2017-02-23
MX2016004653A (es) 2016-08-05
AU2019201055B2 (en) 2020-07-30

Similar Documents

Publication Publication Date Title
IN2015DN03071A (pt)
MX2018014214A (es) Sistema de adhesivo curable de cianoacrilato en dos partes.
IN2015DN03795A (pt)
PH12015502401A1 (en) Compositions and methods for enhancing microbial stability
AU2015208932A8 (en) (2S)-N-[(1S)-1-cyano-2-phenylethyl]-1,4-oxazepane-2-carboxamides as dipeptidyl peptidase I inhibitors
AU2014375265A1 (en) Novel pyrazolyl-heteroarylamides as pesticides
MX350804B (es) Tablón de madera y proceso para su producción.
MY177183A (en) Water-dispersed pressure-sensitive adhesive composition and pressure-sensitive adhesive
EP3697820A4 (en) PROCESSES AND COMPOSITIONS RELATING TO GENETICALLY MODIFIED REGULATORY T-LYMPHOCYTES
PH12015501083B1 (en) Novel pyridine derivatives
AU2015287674B2 (en) Topical antiviral compositions and methods of using the same
MY179412A (en) Pyridine-2-amides useful as cb2 agonists
MY182328A (en) Pyridine-2-amides useful as cb2 agonists
MX2017002633A (es) Composicion polimerica para capa de elemento de capa.
MX2017005219A (es) Composiciones de curado anaerobio que tienen esteres vinilicos novolac.
MY168166A (en) Polymer and Composition Including Same, and Adhesive Composition
PH12015501933A1 (en) Novel pyridine derivatives
MY172773A (en) Use of polyesters with inherent flame retardancy in adhesives and sealants
PH12016501865A1 (en) Pyridine-2-amides useful as cb2 agonists
MX2017014000A (es) Adhesivos acrilicos en emulsion.
GB2548277A (en) Antibiofilm compositions
MX2017003344A (es) Composicion de polimero para capa de un elemento de capa.
MX2014013745A (es) Uso de seaprose para eliminar la pelicula biologica bacteriana.
GB2527719A (en) Absorbent article with elastically elongatable panel
MX2016003892A (es) Uso de dihidrooxindolilsulfonamidas sustituidas, o sus sales, para aumentar la tolerancia de plantas al estres.