IN2015DN03074A - - Google Patents

Info

Publication number
IN2015DN03074A
IN2015DN03074A IN3074DEN2015A IN2015DN03074A IN 2015DN03074 A IN2015DN03074 A IN 2015DN03074A IN 3074DEN2015 A IN3074DEN2015 A IN 3074DEN2015A IN 2015DN03074 A IN2015DN03074 A IN 2015DN03074A
Authority
IN
India
Prior art keywords
acrylic
diluent
bodying component
photoinitiators
crosslinkers
Prior art date
Application number
Inventor
Michael; Zajaczkowski
Michael T ; Waterman
Kyle R ; Heimbach
Eric L ; Bartholomew
Brandon S ; Miller
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Publication of IN2015DN03074A publication Critical patent/IN2015DN03074A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/26Porous or cellular plastics
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/064Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/20Presence of organic materials
    • C09J2400/24Presence of a foam
    • C09J2400/243Presence of a foam in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00Presence of block copolymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)

Abstract

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts , photoinitiators and stabilizers/ process aids. The bodying component can be acrylic or non -acrylic.
IN3074DEN2015 2012-10-09 2013-10-10 IN2015DN03074A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261711386P 2012-10-09 2012-10-09
PCT/US2013/064187 WO2014059055A1 (en) 2012-10-09 2013-10-10 Adhesives and related methods

Publications (1)

Publication Number Publication Date
IN2015DN03074A true IN2015DN03074A (en) 2015-10-02

Family

ID=49447852

Family Applications (3)

Application Number Title Priority Date Filing Date
IN3071DEN2015 IN2015DN03071A (en) 2012-10-09 2013-10-10
IN3055DEN2015 IN2015DN03055A (en) 2012-10-09 2013-10-10
IN3074DEN2015 IN2015DN03074A (en) 2012-10-09 2013-10-10

Family Applications Before (2)

Application Number Title Priority Date Filing Date
IN3071DEN2015 IN2015DN03071A (en) 2012-10-09 2013-10-10
IN3055DEN2015 IN2015DN03055A (en) 2012-10-09 2013-10-10

Country Status (10)

Country Link
US (15) US9714365B2 (en)
EP (4) EP2906651B1 (en)
KR (1) KR102295538B1 (en)
CN (4) CN112876996A (en)
AU (9) AU2013329253B2 (en)
BR (4) BR112015007832B1 (en)
CA (1) CA2887304A1 (en)
IN (3) IN2015DN03071A (en)
MX (2) MX2015004606A (en)
WO (4) WO2014059055A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11685841B2 (en) 2012-10-09 2023-06-27 Avery Dennison Corporation Adhesives and related methods

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9574039B1 (en) * 2014-07-22 2017-02-21 Full Spectrum Laser Additive use in photopolymer resin for 3D printing to enhance the appearance of printed parts
CN104536210B (en) * 2015-02-03 2017-09-29 京东方科技集团股份有限公司 A kind of preparation method of alignment film printing plate
MX2017010047A (en) * 2015-02-05 2017-12-18 Avery Dennison Corp Label assemblies for adverse environments.
CN108472972A (en) 2015-12-28 2018-08-31 宝洁公司 The method and apparatus on product is applied material to the transfering part of predistortion
CN108430786B (en) 2015-12-28 2021-06-15 宝洁公司 Method and apparatus for applying material to articles using transfer members deflected on both sides
DE102016207548A1 (en) * 2016-05-02 2017-11-02 Tesa Se Curable adhesive and reactive adhesive tapes based thereon
DE102016207540A1 (en) 2016-05-02 2017-11-02 Tesa Se Water-vapor-blocking adhesive with highly functionalized poly (meth) acrylate
ES2950434T3 (en) 2016-09-16 2023-10-10 Int Flavors & Fragrances Inc Microcapsule compositions stabilized with viscosity control agents
WO2018118767A1 (en) 2016-12-22 2018-06-28 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth) acrylate oligomers
CN111094493B (en) 2017-06-30 2022-11-04 3M创新有限公司 Printable curable mixtures and cured compositions
US10716715B2 (en) 2017-08-29 2020-07-21 Hill-Rom Services, Inc. RFID tag inlay for incontinence detection pad
JP6566324B2 (en) * 2017-09-29 2019-08-28 サイデン化学株式会社 Adhesive sheet
EP3805332A4 (en) * 2018-05-29 2022-03-09 Nitto Denko Corporation ADHESIVE SHEET
WO2019230677A1 (en) * 2018-05-29 2019-12-05 日東電工株式会社 Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet
JP2019206699A (en) * 2018-05-29 2019-12-05 日東電工株式会社 Adhesive sheet
JP7359570B2 (en) * 2018-05-29 2023-10-11 日東電工株式会社 Adhesive composition, adhesive layer and adhesive sheet
CN111546763B (en) 2019-02-12 2022-07-26 宝洁公司 Method and apparatus for applying material to articles using a transfer member
KR102184587B1 (en) * 2019-02-28 2020-12-01 주식회사 케이씨씨 Adhesive Composition
DE102019208668A1 (en) * 2019-06-14 2020-12-17 Tesa Se Bonding process using a hardening structural adhesive
TWI858080B (en) * 2019-07-12 2024-10-11 美商陶氏全球科技有限責任公司 Water-based compositions
DE102019120049B4 (en) * 2019-07-24 2025-07-31 Bundesdruckerei Gmbh Process and hot melt adhesive for producing a value or security document consisting of several layers and value or security document
CN110527475B (en) * 2019-09-26 2021-09-07 广东华南精细化工研究院有限公司 Sprayable anti-sagging silane modified polyether sealant and preparation method thereof
CN113214763B (en) 2020-01-21 2023-01-10 3M创新有限公司 Pressure-sensitive adhesive composition and pressure-sensitive tape
WO2021183350A1 (en) 2020-03-09 2021-09-16 The Procter & Gamble Company Method and apparatus for applying a material onto articles using a transfer component
CN111534269B (en) * 2020-05-07 2022-04-12 苏州金枪新材料股份有限公司 Two-component flexible acrylate structural adhesive for bonding liquid crystal screen and preparation method thereof
CN111826093A (en) * 2020-07-28 2020-10-27 中国石油化工股份有限公司 Photocuring material suitable for repairing oil-gas gathering and transportation pipeline and preparation method thereof
MX2023009162A (en) * 2021-02-04 2023-08-18 Sunstar Eng Americas Inc Curable composition.
CN114853969B (en) * 2022-04-25 2023-11-24 广东深展实业有限公司 Photo-thermal dual-curing modified polypropylene resin and preparation method thereof
CN115044317B (en) * 2022-06-29 2024-05-28 湖北祥源高新科技有限公司 Preparation method and product of double-sided self-adhesive polyurethane foam
WO2024205855A1 (en) * 2023-03-31 2024-10-03 Henkel Ag & Co. Kgaa Photo-curable acrylate adhesives for plastic bonding

Family Cites Families (226)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408008A (en) 1966-12-02 1968-10-29 Eric H. Cocks Apparatus for applying hot melt adhesives
CH481197A (en) 1967-02-22 1969-11-15 Breveteam Sa Adhesive for the underside coating of floor coverings
US3639500A (en) 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
DE2446438C2 (en) 1974-09-28 1985-04-11 Bayer Ag, 5090 Leverkusen Process for the preparation of urethanes containing oxazolidine groups and their use
US4049483A (en) 1976-11-18 1977-09-20 Minnesota Mining And Manufacturing Company Pressure sensitive hot-melt adhesive system
US4135033A (en) 1977-02-16 1979-01-16 Lawton William R Heat-activated adhesive coating
US4143858A (en) 1977-08-29 1979-03-13 Eastman Kodak Company Substantially amorphous polyolefins useful as pressure-sensitive adhesives
US4185050A (en) 1978-12-26 1980-01-22 Celanese Corporation Pressure sensitive adhesive compositions comprising a mixture of terpolymers
CA1154287A (en) 1979-02-26 1983-09-27 Joseph E. Gervay Dry-developing photosensitive dry film resist
US4288527A (en) 1980-08-13 1981-09-08 W. R. Grace & Co. Dual UV/thermally curable acrylate compositions with pinacol
JPS618471Y2 (en) 1980-09-01 1986-03-15
JPS58152074A (en) 1982-03-05 1983-09-09 Mitsui Toatsu Chem Inc Adhesive composition for ceramic tile
US4507429A (en) 1984-01-12 1985-03-26 Air Products And Chemicals, Inc. Pressure sensitive adhesives with improved shear resistance
EP0210261B1 (en) 1985-02-05 1991-06-26 Avery International Corporation Composite facestocks and liners
US5082922A (en) 1988-10-12 1992-01-21 The Valspar Corporation Modified-acrylate polymers and coating compositions made therefrom
US4914253A (en) 1988-11-04 1990-04-03 Exxon Chemical Patents Inc. Method for preparing polyethylene wax by gas phase polymerization
WO1990013420A1 (en) 1989-05-11 1990-11-15 Landec Labs, Inc. Temperature-activated adhesive assemblies
EP0400703A1 (en) 1989-05-24 1990-12-05 Akzo Nobel N.V. Adhesive based on a thermoplastic polyester with an aluminium compound incorporated therein
US5194486A (en) 1989-06-09 1993-03-16 H & N Chemical Company Adhesive
US5264532A (en) 1989-08-14 1993-11-23 Avery Dennison Corporation Emulsion pressure-sensitive adhesives
US5024880A (en) 1990-01-03 1991-06-18 Minnesota Mining And Manufacturing Company Cellular pressure-sensitive adhesive membrane
DE4021659A1 (en) 1990-07-07 1992-01-09 Bayer Ag BISOXAZOLANES, OXAZOLAN MIXTURES MOST OF THESE, A METHOD FOR THE PRODUCTION THEREOF AND THE USE THEREOF AS A HARDENER FOR PLASTIC PREPARATORS HAVING ISOCYANATE GROUPS
CA2048232A1 (en) 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
US5264278A (en) 1991-03-20 1993-11-23 Minnesota Mining And Manufacturing Company Radiation-curable acrylate/silicone pressure-sensitive adhesive coated tapes adherable to paint coated substrates
CA2076278A1 (en) 1991-08-22 1993-02-23 Joseph T. Braun Curable silicone pressure sensitive adhesive tape
JP3035565B2 (en) 1991-12-27 2000-04-24 株式会社半導体エネルギー研究所 Fabrication method of thin film solar cell
US5252694A (en) 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
CA2077103C (en) 1992-08-28 2003-06-10 Moore U.S.A. Inc. Multipurpose label construction
WO1994008781A1 (en) 1992-10-20 1994-04-28 Avery Dennison Corporation Pressure-sensitive structural adhesive
US5322731A (en) 1993-03-09 1994-06-21 Minnesota Mining And Manufacturing Company Adhesive beads
US7575653B2 (en) 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US5468652A (en) 1993-07-14 1995-11-21 Sandia Corporation Method of making a back contacted solar cell
US5721289A (en) 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5645764A (en) 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5695837A (en) 1995-04-20 1997-12-09 Minnesota Mining And Manufacturing Company Tackified acrylic adhesives
US5905099A (en) * 1995-11-06 1999-05-18 Minnesota Mining And Manufacturing Company Heat-activatable adhesive composition
US5800724A (en) 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
ID17196A (en) 1996-03-14 1997-12-11 Dow Chemical Co ADHESIVE INGREDIENTS THAT CONTAIN OLEFIN POLYMER
DE69728935T2 (en) 1996-07-15 2005-04-28 Sekisui Kagaku Kogyo K.K. A crosslinkable pressure-sensitive adhesive in the platform
BR9710552A (en) 1996-07-22 1999-08-17 Dow Chemical Co Hot melt adhesive packaging article for packaging and polymerization process
ZA977909B (en) 1996-09-04 1999-03-03 Dow Chemical Co Compositions comprising a substantially random interpolymer of at least one alpha-olefin and at least one vinylidene aromatic monomer or hindered aliphatic vinylidene monomer
US20020007910A1 (en) 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
WO1998040439A1 (en) 1997-03-14 1998-09-17 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
US6011307A (en) 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
US6077527A (en) 1997-10-28 2000-06-20 National Starch And Chemical Investment Holding Corporation Enhancer tolerant pressure sensitive adhesives for transdermal drug delivery
US5951786A (en) 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
DE19800676A1 (en) 1998-01-10 1999-07-15 Henkel Kgaa Use of selected adhesive mixtures for the overlap of all-round labels when applied to plastic bottles
FI106470B (en) 1998-03-09 2001-02-15 Neste Chemicals Oy Resin glue that has been foamed and its use in gluing boards with a wooden base
US6106982A (en) 1998-05-11 2000-08-22 Avery Dennison Corporation Imaged receptor laminate and process for making same
US6391415B1 (en) 1998-08-31 2002-05-21 Environmental Inks And Coatings Corporation Label system
US6362249B2 (en) * 1998-09-04 2002-03-26 Dsm Desotech Inc. Radiation-curable coating compositions, coated optical fiber, radiation-curable matrix forming material and ribbon assembly
US6844391B1 (en) 1998-09-23 2005-01-18 Avery Dennison Corporation Adhesives with improved rivet properties and laminates using the same
US6228486B1 (en) 1998-10-06 2001-05-08 Avery Dennison Corporation Thermal transfer laminate
US6235850B1 (en) * 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
BR9916097A (en) 1998-12-11 2001-09-04 Henkel Kgaa Dispersions of polymers finished in silyl with high solids content, their preparation and application
US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
US6503620B1 (en) 1999-10-29 2003-01-07 Avery Dennison Corporation Multilayer composite PSA constructions
US6664318B1 (en) 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
JP2001288438A (en) * 2000-04-06 2001-10-16 Sekisui Chem Co Ltd Pressure-sensitive adhesive composition
JP5057626B2 (en) 2000-06-01 2012-10-24 クレイトン・ポリマーズ・リサーチ・ベー・ベー Composition comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US6376075B1 (en) 2000-06-17 2002-04-23 General Electric Company Article having reflecting coating and process for the manufacture
US6353037B1 (en) 2000-07-12 2002-03-05 3M Innovative Properties Company Foams containing functionalized metal oxide nanoparticles and methods of making same
US6841234B2 (en) 2000-08-04 2005-01-11 Scapa Tapes North America Inc. Heat-activated adhesive tape having an acrylic foam-like backing
US6497949B1 (en) 2000-08-11 2002-12-24 3M Innovative Properties Company Adhesive blends comprising hydrophilic and hydrophobic pressure sensitive adhesives
IL154776A0 (en) 2000-09-18 2003-10-31 Applied Research Systems Method for the preparation of 21-hydroxy-6, 19-oxidoprogesterone and derivatives thereof
US6756095B2 (en) 2001-01-10 2004-06-29 Avery Dennison Corporation Heat-sealable laminate
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP2002285106A (en) * 2001-03-27 2002-10-03 The Inctec Inc Active energy ray-curable pressure-sensitive adhesive
US6686425B2 (en) 2001-06-08 2004-02-03 Adhesives Research, Inc. High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
US6602958B2 (en) 2001-07-10 2003-08-05 Ips Corporation Adhesives for bonding composites
US7247659B2 (en) * 2001-07-26 2007-07-24 Ciba Specialty Chemicals Corporation Photosensitive resin composition
US20030095388A1 (en) 2001-11-16 2003-05-22 Jinbao Jiao Method and apparatus for securing a circuit board to a rigid surface
US6866919B2 (en) 2002-02-21 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
US6613587B1 (en) * 2002-04-11 2003-09-02 Micron Technology, Inc. Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
AU2003256477A1 (en) 2002-07-19 2004-02-09 Avery Dennison Corporation Labeling method employing two-part curable adhesives
US6613857B1 (en) 2002-07-26 2003-09-02 Avery Dennison Corporation UV-crosslinked, pressure-sensitive adhesives
AU2003250919A1 (en) 2002-07-31 2004-02-23 Surface Specialties, S.A. Acrylic pressure sensitive adhesives
WO2004015019A1 (en) 2002-07-31 2004-02-19 Nexicor Llc Induction bondable high-pressure laminate
US6653408B1 (en) 2002-11-21 2003-11-25 Kraton Polymers U.S. Llc Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US6887917B2 (en) 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
DE10322898A1 (en) 2003-05-21 2004-12-16 Tesa Ag Flameproof and heat-activated PSAs
KR101177251B1 (en) 2003-06-06 2012-08-24 히다치 가세고교 가부시끼가이샤 Adhesive sheet, dicing tape integrated type, adhesive sheet, and semiconductor device producing method
TWI305542B (en) 2003-06-09 2009-01-21 Mitsui Chemicals Inc Crosslinkable methacrylic resin composition
US7170001B2 (en) 2003-06-26 2007-01-30 Advent Solar, Inc. Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias
US7691437B2 (en) 2003-10-31 2010-04-06 3M Innovative Properties Company Method for preparing a pressure-sensitive adhesive
US7270889B2 (en) 2003-11-04 2007-09-18 Kimberly-Clark Worldwide, Inc. Tackified amorphous-poly-alpha-olefin-bonded structures
WO2005042612A1 (en) * 2003-11-04 2005-05-12 Soken Chemical & Engineering Co., Ltd. Polymerizable composition and (meth)acrylic thermally conductive sheet
US7144751B2 (en) 2004-02-05 2006-12-05 Advent Solar, Inc. Back-contact solar cells and methods for fabrication
US7157584B2 (en) * 2004-02-25 2007-01-02 Takeda Pharmaceutical Company Limited Benzimidazole derivative and use thereof
EA011898B1 (en) 2004-03-09 2009-06-30 Спир Груп Холдингз Лимитед Label for glass containers and method for removing thereof
US7524911B2 (en) 2004-03-17 2009-04-28 Dow Global Technologies Inc. Adhesive and marking compositions made from interpolymers of ethylene/α-olefins
US7088248B2 (en) 2004-03-24 2006-08-08 Avery Dennison Corporation System and method for selectively reading RFID devices
WO2005103178A1 (en) 2004-03-29 2005-11-03 Avery Dennison Corporation Anaerobic pressure sensitive adhesive
US7645829B2 (en) * 2004-04-15 2010-01-12 Exxonmobil Chemical Patents Inc. Plasticized functionalized propylene copolymer adhesive composition
US20050266237A1 (en) 2004-05-28 2005-12-01 Siddhartha Asthana Heat-activated sound and vibration damping sealant composition
EP1640388B1 (en) 2004-09-24 2015-02-25 Rohm and Haas Company Biomass based Michael addition composition
JP4829242B2 (en) 2004-10-22 2011-12-07 株式会社サトー Labels and methods for applying labels to objects
US20080280111A1 (en) 2004-11-10 2008-11-13 Avery Dennison Corporation In-Mold Labels and Uses Thereof
US7212127B2 (en) 2004-12-20 2007-05-01 Avery Dennison Corp. RFID tag and label
CN101291964B (en) 2005-03-17 2011-07-27 陶氏环球技术有限责任公司 Adhesive and marking compositions made from ethylene/α-olefin interpolymers
US7786216B2 (en) 2005-03-17 2010-08-31 Dow Global Technologies Inc. Oil based blends of interpolymers of ethylene/α-olefins
AR055043A1 (en) 2005-03-17 2007-08-01 Dow Global Technologies Inc ETHYLENE INTERPOLIMERO COMPOSITIONS / (ALPHA) - FUNCTIONALIZED HOLE
US7756154B2 (en) 2005-03-22 2010-07-13 Netapp, Inc. Shared implementation for multiple system interfaces
TWI353360B (en) 2005-04-07 2011-12-01 Nippon Catalytic Chem Ind Production process of polyacrylic acid (salt) wate
US7298266B2 (en) 2005-05-09 2007-11-20 Avery Dennison RFID communication systems and methods
JP4634856B2 (en) 2005-05-12 2011-02-16 利昌工業株式会社 White prepreg, white laminate, and metal foil-clad white laminate
US8287949B2 (en) 2005-07-07 2012-10-16 Dow Global Technologies Inc. Aqueous dispersions
WO2007011538A2 (en) * 2005-07-19 2007-01-25 Dow Corning Corporation Pressure sensitive adhesives and methods for their preparation
JP4711777B2 (en) 2005-08-11 2011-06-29 日東電工株式会社 Adhesive sheet, manufacturing method thereof, and product processing method
US20100311920A1 (en) * 2005-08-26 2010-12-09 Cid Centro De Investigacion Y Desarrollo Tecnologico Sa De Cv Using Reactive Block Copolymers as Chain Extenders and Surface Modifiers
US20070088145A1 (en) 2005-10-19 2007-04-19 Mgaya Alexander P Adhesive useful for film laminating applications
US20070092733A1 (en) * 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
ES2557155T3 (en) 2005-12-01 2016-01-22 Henkel Ag & Co. Kgaa New material forming supramolecular structures, process and uses
CN101000899A (en) 2006-01-11 2007-07-18 南茂科技股份有限公司 Chip package structure
US20070231571A1 (en) 2006-04-04 2007-10-04 Richard Lane Pressure sensitive adhesive (PSA) laminates
US8785531B2 (en) 2006-07-06 2014-07-22 Dow Global Technologies Llc Dispersions of olefin block copolymers
CN101522318B (en) 2006-08-08 2013-11-06 环球产权公司 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
JP2008060151A (en) 2006-08-29 2008-03-13 Nitto Denko Corp Semiconductor wafer back surface processing method, substrate back surface processing method, and radiation curable adhesive sheet
US8074022B2 (en) 2006-09-28 2011-12-06 Virident Systems, Inc. Programmable heterogeneous memory controllers for main memory with different memory modules
US7776969B2 (en) 2006-12-04 2010-08-17 Bayer Materialscience Llc Allophanate-modified stabilizers and the polymer polyols prepared from these stabilizers
WO2008073669A1 (en) * 2006-12-07 2008-06-19 3M Innovative Properties Company Block copolymer blend adhesives with multiple tackifiers
TW200842174A (en) * 2006-12-27 2008-11-01 Cheil Ind Inc Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
KR100907982B1 (en) 2006-12-27 2009-07-16 제일모직주식회사 Dicing Die Bonding Film comprising the Adhesive Film for Semi-Conductor Packaging formed composition for Preparing Adhesive Film
WO2008093398A1 (en) 2007-01-30 2008-08-07 Asics Corporation Process for production of shoes and shoes
JP5089201B2 (en) 2007-03-12 2012-12-05 日東電工株式会社 Acrylic adhesive tape or sheet and method for producing the same
EP2139967B1 (en) 2007-03-21 2014-12-10 Avery Dennison Corporation Pressure sensitive adhesives
JP5419376B2 (en) 2007-04-20 2014-02-19 日東電工株式会社 Adhesive sheet adhesion to automobile coating surface
JP5038770B2 (en) 2007-05-01 2012-10-03 日東電工株式会社 Adhesive sheet adhesion method for vehicle paint film surface
JP5118880B2 (en) * 2007-05-08 2013-01-16 日東電工株式会社 Adhesive composition, and adhesive product and display using the same
US8334037B2 (en) * 2007-05-11 2012-12-18 3M Innovative Properties Company Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same
US8222339B2 (en) 2007-08-24 2012-07-17 Dow Global Technologies Llc Adhesives made from interpolymers of ethylene/alpha-olefins
KR100922684B1 (en) 2007-08-31 2009-10-19 제일모직주식회사 Photocuring composition for pressure-sensitive adhesive layer and dicing tape comprising the same
KR20100074144A (en) 2007-09-19 2010-07-01 헨켈 아게 운트 코. 카게아아 Highly damping expandable material and devices
US20090142506A1 (en) 2007-11-29 2009-06-04 Bayer Material Science Llc Ethylenically unsaturated polyisocyanate addition compounds based on lysine triisocyanate, their use in coating compositions and processes for their preparation
EP2224483A1 (en) * 2007-12-04 2010-09-01 Hitachi Chemical Company, Ltd. Photosensitive adhesive
US7786868B2 (en) 2007-12-11 2010-08-31 Avery Dennison Corporation RFID device with multiple passive operation modes
JP2009256607A (en) 2008-03-17 2009-11-05 Nitto Denko Corp Acrylic adhesive, acrylic adhesive layer, and acrylic adhesive tape or sheet
JP2011519989A (en) 2008-04-30 2011-07-14 テーザ・ソシエタス・ヨーロピア Adhesive tape
US8289165B2 (en) 2008-06-11 2012-10-16 Avery Dennison Corporation RFID device with conductive loop shield
TWI431087B (en) 2008-07-16 2014-03-21 Lg Chemical Ltd Pressure-sensitive adhesive composition, polarizer and liquid crystal display
EP2307516B1 (en) 2008-07-28 2012-09-05 Dow Corning Corporation Composite article
US8080177B2 (en) 2008-08-19 2011-12-20 The Boeing Company Low RF loss static dissipative adhesive
EP2319892A4 (en) * 2008-08-27 2012-01-18 Hitachi Chemical Co Ltd Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component
DE102008045802A1 (en) 2008-09-05 2010-03-11 Henkel Ag & Co. Kgaa Hot melt adhesive based on metallocene-catalyzed olefin-α-olefin copolymers
US8068028B2 (en) 2008-09-26 2011-11-29 Avery Dennison Corporation Encapsulated RFID device for flexible, non-planar or curvilinear surfaces
EP2334721A4 (en) 2008-09-30 2013-09-25 Henkel Corp Shear-and/or pressure-resistant microspheres
JP5803105B2 (en) 2008-12-26 2015-11-04 東洋紡株式会社 RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING THE SAME, ADHESIVE SHEET AND A PRINTED WIRING BOARD CONTAINING THE SAME AS ADHESIVE LAYER
AT12321U1 (en) 2009-01-09 2012-03-15 Austria Tech & System Tech MULTILAYER PCB LAYER ELEMENT WITH AT LEAST ONE LASER BEAM STOPPING ELEMENT AND METHOD FOR ATTACHING SUCH A LASER BEAM STOPPER IN A MULTILAYER PCB ELEMENT
US20100200063A1 (en) 2009-02-12 2010-08-12 Derek Djeu Thin film solar cell
JP5294931B2 (en) 2009-03-11 2013-09-18 日東電工株式会社 Acrylic adhesive sheet
EP2236534A1 (en) 2009-03-31 2010-10-06 Sika Technology AG Composition curable in two stages comprising a surface deactivated polyisocyanate
JP5404174B2 (en) 2009-05-14 2014-01-29 日東電工株式会社 Thermally peelable pressure sensitive adhesive tape or sheet
JP2011026551A (en) * 2009-05-21 2011-02-10 Kaneka Corp Ultraviolet-curing type pressure-sensitive adhesive composition
KR20120029421A (en) 2009-06-11 2012-03-26 헨켈 코포레이션 Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds
US8593256B2 (en) 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
BR112012001614B1 (en) 2009-07-24 2019-11-26 Bostik, Inc. THERMAL FOLDING ADHESIVE BASED ON OLEFINE BLOCK COPOLYMERS
US8242185B2 (en) 2009-08-03 2012-08-14 Morgan Adhesives Company Adhesive compositions for easy application and improved durability
KR20120055583A (en) * 2009-08-04 2012-05-31 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Non-halogenated polyisobutylene - thermoplastic elastomer blend pressure sensitive adhesive
CN102498183A (en) 2009-09-16 2012-06-13 日东电工株式会社 acrylic adhesive tape
ES2453978T3 (en) 2009-09-24 2014-04-09 Avery Dennison Corporation Acrylic compositions to adhere to substrates with low surface energy
JP2011096988A (en) 2009-11-02 2011-05-12 Keiwa Inc Adhesive sheet for protecting back of solar cell module, and solar cell module using the same
EP2513220B1 (en) 2009-12-16 2013-11-06 Avery Dennison Corporation Photovoltaic backsheet
US20120276380A1 (en) * 2009-12-18 2012-11-01 Steffen Traser Pressure sensitive adhesives for low surface energy substrates
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
CN102792218B (en) 2010-03-09 2016-02-03 3M创新有限公司 For bonding the thermal activation optically clear adhesive of display panel
WO2011119393A2 (en) 2010-03-26 2011-09-29 3M Innovative Properties Company Method of sterilization of wound dressings
JP2011231319A (en) 2010-04-09 2011-11-17 Nitto Denko Corp Pressure-sensitive adhesive composition and acrylic pressure-sensitive adhesive tape
JP5749052B2 (en) 2010-04-12 2015-07-15 日東電工株式会社 Method for producing cured multilayer sheet and cured multilayer sheet
WO2011142964A1 (en) 2010-05-11 2011-11-17 3M Innovative Properties Company Curable composition, pressure-sensitive adhesive, method of making the same, and adhesive articles
WO2011159727A1 (en) 2010-06-14 2011-12-22 Avery Dennison Corporation Method, system and apparatus for making short run radio frequency identification tags and labels
JP5432853B2 (en) 2010-07-30 2014-03-05 日東電工株式会社 Dicing tape-integrated film for semiconductor back surface, manufacturing method thereof, and manufacturing method of semiconductor device
WO2012024217A1 (en) 2010-08-18 2012-02-23 3M Innovative Properties Company Optical assemblies including stress-relieving optical adhesives and methods of making same
MX2013002214A (en) 2010-08-26 2013-05-09 Henkel Corp ADHESIVE POLY-ALFA-OLEFINA AMPERFA OF LOW APPLICATION TEMPERATURE.
WO2012026118A1 (en) 2010-08-27 2012-03-01 日東電工株式会社 Acrylic adhesive composition, acrylic adhesive layer, and acrylic adhesive tape
DE102010035889B4 (en) 2010-08-30 2021-11-11 Bundesdruckerei Gmbh Value and / or security document and process for its production
KR101494984B1 (en) 2010-09-17 2015-02-23 쇼와 덴코 가부시키가이샤 Light-curing composition for use in transparent pressure-sensitive adhesive sheet
JP6144868B2 (en) 2010-11-18 2017-06-07 日東電工株式会社 Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, and flip chip semiconductor back film manufacturing method
MY169514A (en) 2010-11-23 2019-04-19 Adhesives Res Inc Reactive conductive pressure-sensitive adhesive tape
CN103548093B (en) 2010-11-23 2016-08-10 西屋电气有限责任公司 Full-spectrum LOCA evaluation model and analysis method
JP2014503640A (en) 2010-12-13 2014-02-13 スリーエム イノベイティブ プロパティズ カンパニー Pressure sensitive adhesive for low surface energy substrates
WO2012088384A1 (en) 2010-12-22 2012-06-28 Bostik Inc. Olefin block copolymer based packaging adhesive
JP5689336B2 (en) 2011-03-03 2015-03-25 日東電工株式会社 Heat release type adhesive sheet
JP2012193317A (en) 2011-03-17 2012-10-11 Nitto Denko Corp Pressure-sensitive adhesive tape for temporary fixing of electronic part
CA2830645C (en) 2011-03-24 2018-09-04 Henkel Corporation Stretch film lamination adhesive
WO2012139120A1 (en) 2011-04-08 2012-10-11 Bostik, Inc. Polyolefin based hot melt adhesive containing a solid plasticizer
JP2012229375A (en) 2011-04-27 2012-11-22 Nitto Denko Corp Pressure-sensitive adhesive sheet
US9000659B2 (en) * 2011-05-09 2015-04-07 Kenneth S. Chin Lamp socket
CN103534323B (en) * 2011-05-10 2016-05-04 迪睿合电子材料有限公司 Double-faced adhesive tape and manufacture method thereof
EP2545798B1 (en) 2011-07-13 2018-02-21 3M Innovative Properties Company Sanitary product system
US20130017389A1 (en) * 2011-07-15 2013-01-17 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet
EP2551102B1 (en) 2011-07-29 2014-12-03 3M Innovative Properties Company Self-stick foam adhesive
EP2581423A1 (en) 2011-10-14 2013-04-17 3M Innovative Properties Company Primerless multilayer adhesive film for bonding glass substrates
WO2013069907A1 (en) 2011-11-08 2013-05-16 주식회사 엘지화학 Adhesive composition for an antistatic protective film, and production method therefor
DE102011088170A1 (en) 2011-12-09 2013-06-13 Bayer Materialscience Aktiengesellschaft Reactive pressure-sensitive adhesives
JP6494284B2 (en) 2011-12-22 2019-04-03 スリーエム イノベイティブ プロパティズ カンパニー Olefin block copolymer based pressure sensitive adhesive
DE102012200854A1 (en) 2012-01-20 2013-07-25 Tesa Se Crosslinking accelerator system for polyacrylates
WO2013115851A1 (en) 2012-02-03 2013-08-08 Avery Dennison Corporation Laser patterning of photovoltaic backsheet
EP2810999B1 (en) 2012-03-12 2019-09-11 LG Chem, Ltd. Pressure-sensitive adhesive composition
JP5900091B2 (en) 2012-03-27 2016-04-06 大日本印刷株式会社 Decorative sheet and decorative plate having the same
CA2869108A1 (en) 2012-03-30 2013-10-03 Bioformix Inc. Methods for activating polymerizable compositions, polymerizable systems, and products formed thereby
JP6226951B2 (en) 2012-03-30 2017-11-08 ダウ グローバル テクノロジーズ エルエルシー Polyolefin adhesive composition
CN102634286B (en) 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 Method for preparing photo-thermal dual curable type anisotropic conductive film
KR20150027067A (en) 2012-05-29 2015-03-11 닛토덴코 가부시키가이샤 Adhesive, and transparent substrate using same
DE102012209116A1 (en) 2012-05-30 2013-12-05 Tesa Se Heat sealable tape
DE102013209827A1 (en) 2012-06-21 2013-12-24 Tesa Se Heat resistant tape
JP5961055B2 (en) 2012-07-05 2016-08-02 日東電工株式会社 Sealing resin sheet, electronic component package manufacturing method, and electronic component package
CN104411790B (en) 2012-07-05 2019-10-18 三键精密化学有限公司 Sheet-shaped adhesive and organic EL panel using the sheet-shaped adhesive
KR102058512B1 (en) 2012-07-26 2019-12-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Heat de-bondable optical articles
WO2014018312A1 (en) 2012-07-26 2014-01-30 3M Innovative Properties Company Heat de-bondable adhesive articles
MX2015004606A (en) * 2012-10-09 2017-04-04 Avery Dennison Corp Adhesives and related methods.
US20140162082A1 (en) 2012-12-07 2014-06-12 H.B. Fuller Company Composition, an article and a method for the bonding of non-woven substrates
US9023954B1 (en) 2012-12-26 2015-05-05 The United States Of America As Represented By The Secretary Of The Navy Side-chain and end-group modified poly-p-phenylene oligomers
ES2676694T3 (en) 2013-01-24 2018-07-24 Basf Se Pressure sensitive reactive adhesive products
CA2899313C (en) 2013-01-24 2021-02-02 Henkel Ltd. Foamable hot melt adhesive compositions and use thereof
WO2014138166A2 (en) 2013-03-05 2014-09-12 Avery Dennison Corporation Differential dual functional foam tapes
CR20190518A (en) 2013-03-06 2020-01-10 Incyte Corp Processes and intermediates for making a jak inhibitor
TWI622625B (en) 2013-03-28 2018-05-01 道康寧公司 Organosiloxane compositions and coatings, manufactured articles, methods and uses
CN103275656B (en) 2013-05-29 2015-07-08 北京化工大学 Reactive pressure-sensitive adhesive having performance of structural adhesive after being cured, and preparation method thereof
BR112016006260A2 (en) 2013-09-23 2017-08-01 Lubrizol Advanced Mat Inc adhesive system and adhesive article
US9982171B2 (en) 2013-09-25 2018-05-29 Bostik, Inc. Hot melt adhesive with functionalized metallocene catalyzed polyolefins
CN111484803A (en) 2013-10-10 2020-08-04 艾利丹尼森公司 Adhesives and related methods
US20170128615A1 (en) 2014-06-18 2017-05-11 Avery Dennison Corporation Transposable Pressure Sensitive Adhesives, Articles, and Related Methods
JP6514771B2 (en) 2014-09-29 2019-05-15 アベリー・デニソン・コーポレイションAvery Dennison Corporation Tire tracking RFID label
MX2017010047A (en) 2015-02-05 2017-12-18 Avery Dennison Corp Label assemblies for adverse environments.
WO2018118767A1 (en) 2016-12-22 2018-06-28 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth) acrylate oligomers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11685841B2 (en) 2012-10-09 2023-06-27 Avery Dennison Corporation Adhesives and related methods

Also Published As

Publication number Publication date
BR112015007832A2 (en) 2017-07-04
CN104854207A8 (en) 2018-07-20
BR112015007837B1 (en) 2021-10-05
AU2017201997A1 (en) 2017-04-13
WO2014059058A1 (en) 2014-04-17
US10040978B2 (en) 2018-08-07
BR112015007837A2 (en) 2017-07-04
WO2014059057A1 (en) 2014-04-17
EP2906651A1 (en) 2015-08-19
AU2020244387A1 (en) 2020-11-05
US10040973B2 (en) 2018-08-07
AU2013329251A1 (en) 2015-04-30
CN105793376B (en) 2020-10-23
CA2887304A1 (en) 2014-04-17
EP2906653A1 (en) 2015-08-19
US10040974B2 (en) 2018-08-07
US20180305584A1 (en) 2018-10-25
US20160257858A1 (en) 2016-09-08
EP2906651B1 (en) 2021-09-15
US20180305585A1 (en) 2018-10-25
BR112015007833A8 (en) 2019-08-27
AU2013329253B2 (en) 2017-02-23
US20150252227A1 (en) 2015-09-10
AU2013329253A1 (en) 2015-04-30
EP2906654A1 (en) 2015-08-19
BR112015007832B1 (en) 2021-10-05
EP2906652A1 (en) 2015-08-19
EP2906654B1 (en) 2020-04-08
WO2014059058A8 (en) 2014-07-10
AU2019201055A1 (en) 2019-03-07
AU2017201999A1 (en) 2017-04-13
AU2022291497B2 (en) 2024-12-12
CN108587528A (en) 2018-09-28
US20150267090A1 (en) 2015-09-24
CN112876996A (en) 2021-06-01
US20180305591A1 (en) 2018-10-25
US10035930B2 (en) 2018-07-31
US20200024490A1 (en) 2020-01-23
US9725623B2 (en) 2017-08-08
BR112015007833B1 (en) 2021-10-05
AU2017201997B2 (en) 2018-11-08
US20150275057A1 (en) 2015-10-01
US9738817B2 (en) 2017-08-22
US20170275504A1 (en) 2017-09-28
US20150275058A1 (en) 2015-10-01
US20210253910A1 (en) 2021-08-19
US9714365B2 (en) 2017-07-25
KR102295538B1 (en) 2021-08-27
IN2015DN03071A (en) 2015-10-02
WO2014059056A1 (en) 2014-04-17
US11008483B2 (en) 2021-05-18
MX2016004653A (en) 2016-08-05
US10597560B2 (en) 2020-03-24
IN2015DN03055A (en) 2015-10-02
US10457838B2 (en) 2019-10-29
BR112015007833A2 (en) 2017-07-04
AU2013329250A1 (en) 2015-04-30
US20180305583A1 (en) 2018-10-25
EP2906653B1 (en) 2022-06-15
AU2013329252B2 (en) 2017-05-18
AU2022291497A1 (en) 2023-02-02
AU2020244387B2 (en) 2022-11-03
AU2019201055B2 (en) 2020-07-30
BR112015007880B1 (en) 2021-10-05
AU2017201999B2 (en) 2019-01-17
AU2013329252A1 (en) 2015-04-30
KR20160070174A (en) 2016-06-17
WO2014059055A1 (en) 2014-04-17
MX2015004606A (en) 2017-04-04
CN104854207A (en) 2015-08-19
CN105793376A (en) 2016-07-20
BR112015007880A2 (en) 2017-07-04
US20170275503A1 (en) 2017-09-28
US20170275502A1 (en) 2017-09-28
US20170275501A1 (en) 2017-09-28
US10533117B2 (en) 2020-01-14
US11292942B2 (en) 2022-04-05
EP2906652B1 (en) 2020-03-11
US9708509B2 (en) 2017-07-18
US11685841B2 (en) 2023-06-27

Similar Documents

Publication Publication Date Title
IN2015DN03055A (en)
EP3697820A4 (en) Methods and compositions relating to engineered regulatory t cells
IN2015DN03795A (en)
MX350804B (en) Wood board and process for its production.
PH12015502401A1 (en) Compositions and methods for enhancing microbial stability
AU2014375265A1 (en) Novel pyrazolyl-heteroarylamides as pesticides
MY177183A (en) Water-dispersed pressure-sensitive adhesive composition and pressure-sensitive adhesive
MY179412A (en) Pyridine-2-amides useful as cb2 agonists
AU2015287674B2 (en) Topical antiviral compositions and methods of using the same
MX2015010747A (en) Elastic attachment adhesive and use thereof.
PH12015501083B1 (en) Novel pyridine derivatives
IN2014DN06104A (en)
MY182328A (en) Pyridine-2-amides useful as cb2 agonists
MX2017005219A (en) Anaerobic curable compositions having novolac vinyl esters.
PH12015501933B1 (en) Novel pyridine derivatives
MY179975A (en) Use of a 2-octyl acrylate polymer as a binding agent in a coating composition
MX2017014000A (en) Acrylic emulsion adhesives.
MY168166A (en) Polymer and Composition Including Same, and Adhesive Composition
PH12016501865A1 (en) Pyridine-2-amides useful as cb2 agonists
GB2527719A (en) Absorbent article with elastically elongatable panel
MY172773A (en) Use of polyesters with inherent flame retardancy in adhesives and sealants
NZ701623A (en) Use of protease to remove bacterial biofilm
GB2548277A (en) Antibiofilm compositions
MX363458B (en) Novel tetrazolone derivatives.
PH12018501585B1 (en) Novel pyrrolidine derivatives