CN104854207A8 - 胶黏剂和相关方法 - Google Patents
胶黏剂和相关方法 Download PDFInfo
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- CN104854207A8 CN104854207A8 CN201380063122.9A CN201380063122A CN104854207A8 CN 104854207 A8 CN104854207 A8 CN 104854207A8 CN 201380063122 A CN201380063122 A CN 201380063122A CN 104854207 A8 CN104854207 A8 CN 104854207A8
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- adhesive
- correlation technique
- acrylic acid
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- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
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- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
- C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
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- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
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- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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Abstract
描述了一种适当固化的压敏胶黏剂组合物,其包括一种或多种稠化组分、结构稀释剂、自由基稀释剂,以及添加剂,比如交联剂、外部催化剂、光敏引发剂和稳定剂/加工助剂。稠化组分可以是丙烯酸或非丙烯酸。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011471678.XA CN112876996A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
CN201810460293.XA CN108587528A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261711386P | 2012-10-09 | 2012-10-09 | |
US61/711,386 | 2012-10-09 | ||
PCT/US2013/064190 WO2014059058A1 (en) | 2012-10-09 | 2013-10-10 | Adhesives and related methods |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011471678.XA Division CN112876996A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
CN201810460293.XA Division CN108587528A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104854207A CN104854207A (zh) | 2015-08-19 |
CN104854207A8 true CN104854207A8 (zh) | 2018-07-20 |
Family
ID=49447852
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380063122.9A Pending CN104854207A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
CN201810460293.XA Pending CN108587528A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
CN202011471678.XA Pending CN112876996A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
CN201480066751.1A Active CN105793376B (zh) | 2012-10-09 | 2014-03-05 | 黏合剂制品和相关方法 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810460293.XA Pending CN108587528A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
CN202011471678.XA Pending CN112876996A (zh) | 2012-10-09 | 2013-10-10 | 胶黏剂和相关方法 |
CN201480066751.1A Active CN105793376B (zh) | 2012-10-09 | 2014-03-05 | 黏合剂制品和相关方法 |
Country Status (10)
Country | Link |
---|---|
US (15) | US9714365B2 (zh) |
EP (4) | EP2906652B1 (zh) |
KR (1) | KR102295538B1 (zh) |
CN (4) | CN104854207A (zh) |
AU (9) | AU2013329252B2 (zh) |
BR (4) | BR112015007832B1 (zh) |
CA (1) | CA2887304A1 (zh) |
IN (3) | IN2015DN03074A (zh) |
MX (2) | MX2015004606A (zh) |
WO (4) | WO2014059055A1 (zh) |
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BR112015007832B1 (pt) | 2012-10-09 | 2021-10-05 | Avery Dennison Corporation | Líquido para cura local |
US9574039B1 (en) * | 2014-07-22 | 2017-02-21 | Full Spectrum Laser | Additive use in photopolymer resin for 3D printing to enhance the appearance of printed parts |
CN104536210B (zh) * | 2015-02-03 | 2017-09-29 | 京东方科技集团股份有限公司 | 一种配向膜印刷板的制备方法 |
JP6537620B2 (ja) * | 2015-02-05 | 2019-07-03 | アベリー・デニソン・コーポレイションAvery Dennison Corporation | 苛酷な環境のためのラベルアセンブリー |
EP3397494A1 (en) | 2015-12-28 | 2018-11-07 | The Procter and Gamble Company | Method and apparatus for applying a material onto articles using a transfer component that deflects on both sides |
EP3397495A1 (en) | 2015-12-28 | 2018-11-07 | The Procter and Gamble Company | Method and apparatus for applying a material onto articles with a pre-distorted transfer component |
DE102016207540A1 (de) | 2016-05-02 | 2017-11-02 | Tesa Se | Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat |
DE102016207548A1 (de) * | 2016-05-02 | 2017-11-02 | Tesa Se | Härtbare Klebemasse und darauf basierende Reaktivklebebänder |
EP4209264A1 (en) * | 2016-09-16 | 2023-07-12 | International Flavors & Fragrances Inc. | Microcapsule compositions stabilized with viscosity control agents |
US10526511B2 (en) | 2016-12-22 | 2020-01-07 | Avery Dennison Corporation | Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers |
TWI786141B (zh) | 2017-06-30 | 2022-12-11 | 美商3M新設資產公司 | 可印刷可固化混合物及經固化組成物 |
US10716715B2 (en) | 2017-08-29 | 2020-07-21 | Hill-Rom Services, Inc. | RFID tag inlay for incontinence detection pad |
JP6566324B2 (ja) * | 2017-09-29 | 2019-08-28 | サイデン化学株式会社 | 粘着シート |
JP2019206699A (ja) * | 2018-05-29 | 2019-12-05 | 日東電工株式会社 | 粘着シート |
WO2019230677A1 (ja) * | 2018-05-29 | 2019-12-05 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
JP7359570B2 (ja) * | 2018-05-29 | 2023-10-11 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
EP3805332A4 (en) * | 2018-05-29 | 2022-03-09 | Nitto Denko Corporation | ADHESIVE SHEET |
CN111546762B (zh) | 2019-02-12 | 2022-04-19 | 宝洁公司 | 使用传送部件将材料施加到制品上的方法和设备 |
KR102184587B1 (ko) * | 2019-02-28 | 2020-12-01 | 주식회사 케이씨씨 | 접착제 조성물 |
DE102019208668A1 (de) * | 2019-06-14 | 2020-12-17 | Tesa Se | Verklebungsverfahren mittels einer härtenden strukturellen Klebmasse |
DE102019120049A1 (de) * | 2019-07-24 | 2021-01-28 | Bundesdruckerei Gmbh | Verfahren und Schmelzklebstoff zur Herstellung eines aus mehreren Schichten bestehenden Wert- oder Sicherheitsdokumentes sowie Wert- oder Sicherheitsdokument |
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