BRPI0917383A2 - composicao adesiva fotossensivel, adesivo em pelicula fotossensevel, padrao adesivo, wafer semicondutor com adesivo, dispositivo semicondutor e componente eletronico - Google Patents

composicao adesiva fotossensivel, adesivo em pelicula fotossensevel, padrao adesivo, wafer semicondutor com adesivo, dispositivo semicondutor e componente eletronico

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Publication number
BRPI0917383A2
BRPI0917383A2 BRPI0917383A BRPI0917383A BRPI0917383A2 BR PI0917383 A2 BRPI0917383 A2 BR PI0917383A2 BR PI0917383 A BRPI0917383 A BR PI0917383A BR PI0917383 A BRPI0917383 A BR PI0917383A BR PI0917383 A2 BRPI0917383 A2 BR PI0917383A2
Authority
BR
Brazil
Prior art keywords
adhesive
photosensitive
electronic component
standard
semiconductor device
Prior art date
Application number
BRPI0917383A
Other languages
English (en)
Inventor
Kazuyuki Mitsukura
Shigeki Katogi
Takashi Kawamori
Takashi Masuko
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of BRPI0917383A2 publication Critical patent/BRPI0917383A2/pt

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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
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    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
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    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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  • Chemical & Material Sciences (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Materials For Photolithography (AREA)
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  • Photosensitive Polymer And Photoresist Processing (AREA)
BRPI0917383A 2008-08-27 2009-08-26 composicao adesiva fotossensivel, adesivo em pelicula fotossensevel, padrao adesivo, wafer semicondutor com adesivo, dispositivo semicondutor e componente eletronico BRPI0917383A2 (pt)

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WO2007004569A1 (ja) * 2005-07-05 2007-01-11 Hitachi Chemical Company, Ltd. 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品
JP5732815B2 (ja) 2009-10-30 2015-06-10 日立化成株式会社 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。
JP6221204B2 (ja) * 2011-03-28 2017-11-01 日立化成株式会社 感光性樹脂組成物、感光性フィルム、パターン形成方法、中空構造の形成方法、及び電子部品
EP2906654B1 (en) 2012-10-09 2020-04-08 Avery Dennison Corporation Adhesives and related methods
JP6436081B2 (ja) * 2013-07-16 2018-12-12 日立化成株式会社 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP6234870B2 (ja) * 2014-04-01 2017-11-22 エア・ウォーター株式会社 ポリアミドイミド樹脂および当該ポリアミドイミド樹脂の製造方法
EP3253837A1 (en) 2015-02-05 2017-12-13 Avery Dennison Corporation Label assemblies for adverse environments
JP6490459B2 (ja) * 2015-03-13 2019-03-27 古河電気工業株式会社 ウェハ固定テープ、半導体ウェハの処理方法および半導体チップ
KR102445235B1 (ko) * 2015-03-27 2022-09-20 도레이 카부시키가이샤 감광성 수지 조성물, 감광성 시트, 반도체 장치 및 반도체 장치의 제조 방법
JP2018084626A (ja) * 2016-11-22 2018-05-31 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers
US10727195B2 (en) * 2017-09-15 2020-07-28 Technetics Group Llc Bond materials with enhanced plasma resistant characteristics and associated methods
CN109976096B (zh) * 2017-12-27 2022-01-25 太阳油墨（苏州）有限公司 固化性树脂组合物、干膜、固化物、及印刷电路板
CN116789590B (zh) * 2023-06-25 2024-02-02 波米科技有限公司 一种含哌啶基团的二胺化合物及其制备方法和应用
CN117210141B (zh) * 2023-11-07 2024-01-26 明士(北京)新材料开发有限公司 一种耐显影的光敏胶膜及其制备与应用

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196564A (ja) * 1987-02-10 1988-08-15 Agency Of Ind Science & Technol イミドオリゴマ−の製造方法
JPH01179935A (ja) * 1988-01-11 1989-07-18 Hitachi Chem Co Ltd 感光性樹脂組成物
JPH0352930A (ja) * 1989-07-21 1991-03-07 Kanegafuchi Chem Ind Co Ltd ポリイミド重合体
US5493002A (en) * 1994-07-06 1996-02-20 Virginia Tech Intellectual Properties, Inc. Aryl ethynyl phthalic anhydrides and polymers with terminal or pendant amines prepared with aryl ethynyl phthalic anhydrides
CN1103803C (zh) * 1997-02-27 2003-03-26 精工爱普生株式会社 粘接剂、液晶装置、液晶装置的制造方法和电子装置
JPH1124257A (ja) 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性ポリイミド前駆体組成物及びそれを用いたパターン製造法
JP2000290501A (ja) 1999-04-05 2000-10-17 Nitto Denko Corp 感光性ポリイミド樹脂前駆体及び接着剤
JP4748292B2 (ja) 2000-03-15 2011-08-17 信越化学工業株式会社 フィルム状電子部品用接着剤及び電子部品
JP2001270943A (ja) * 2000-03-24 2001-10-02 Mitsui Chemicals Inc ポリイミドの製造方法
JP4867073B2 (ja) * 2001-03-08 2012-02-01 住友ベークライト株式会社 絶縁接着剤
JP3719234B2 (ja) * 2001-08-06 2005-11-24 日立化成工業株式会社 半導体用接着フィルム、およびこれを用いた半導体用接着フィルム付きリードフレームならびに半導体装置
JP3943883B2 (ja) * 2001-10-02 2007-07-11 新日鐵化学株式会社 絶縁用樹脂組成物及びこれを用いた積層体
JP2006286852A (ja) * 2005-03-31 2006-10-19 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
WO2007004569A1 (ja) * 2005-07-05 2007-01-11 Hitachi Chemical Company, Ltd. 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品
JP2008003582A (ja) * 2006-05-22 2008-01-10 Osaka Prefecture Univ 感光性樹脂組成物及びそれを用いた回路基板
JP5338033B2 (ja) * 2006-05-31 2013-11-13 東レ株式会社 耐熱性樹脂組成物およびそれを用いた金属樹脂複合体ならびに電子部品
JP5157255B2 (ja) * 2006-09-05 2013-03-06 日立化成株式会社 感光性接着剤組成物、及びそれを用いた接着フィルム、接着シート、接着剤パターン、並びに半導体装置
JP2008156603A (ja) * 2006-12-01 2008-07-10 Toray Ind Inc 熱硬化性樹脂組成物
JP5217408B2 (ja) * 2007-03-19 2013-06-19 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法
JP5093229B2 (ja) * 2007-04-04 2012-12-12 日立化成工業株式会社 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法
KR101184527B1 (ko) * 2007-06-06 2012-09-19 히다치 가세고교 가부시끼가이샤 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴의 형성방법, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법
JP5458538B2 (ja) * 2007-12-12 2014-04-02 日立化成株式会社 半導体装置及びその製造方法
KR101184467B1 (ko) * 2008-01-16 2012-09-19 히다치 가세고교 가부시끼가이샤 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법
JP5663826B2 (ja) * 2008-02-26 2015-02-04 日立化成株式会社 接着シート、接着剤層付半導体ウェハ、並びに半導体装置及びその製造方法

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WO2010024295A1 (ja) 2010-03-04
JPWO2010024295A1 (ja) 2012-01-26
EP2319892A4 (en) 2012-01-18
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CN102131882B (zh) 2013-10-30
EP2319892A1 (en) 2011-05-11

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