DE602006007258D1 - Epoxidharz Halbleiterverkapselungszusammensetzung und Halbleitervorrichtung - Google Patents

Epoxidharz Halbleiterverkapselungszusammensetzung und Halbleitervorrichtung

Info

Publication number
DE602006007258D1
DE602006007258D1 DE200660007258 DE602006007258T DE602006007258D1 DE 602006007258 D1 DE602006007258 D1 DE 602006007258D1 DE 200660007258 DE200660007258 DE 200660007258 DE 602006007258 T DE602006007258 T DE 602006007258T DE 602006007258 D1 DE602006007258 D1 DE 602006007258D1
Authority
DE
Germany
Prior art keywords
epoxy resin
semiconductor
encapsulation composition
semiconductor device
semiconductor encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200660007258
Other languages
English (en)
Inventor
Shoichi Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602006007258D1 publication Critical patent/DE602006007258D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE200660007258 2005-03-24 2006-03-24 Epoxidharz Halbleiterverkapselungszusammensetzung und Halbleitervorrichtung Active DE602006007258D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005085799 2005-03-24

Publications (1)

Publication Number Publication Date
DE602006007258D1 true DE602006007258D1 (de) 2009-07-30

Family

ID=36648782

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660007258 Active DE602006007258D1 (de) 2005-03-24 2006-03-24 Epoxidharz Halbleiterverkapselungszusammensetzung und Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US20060216520A1 (de)
EP (1) EP1705199B1 (de)
JP (1) JP4793565B2 (de)
DE (1) DE602006007258D1 (de)

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EP1911579A1 (de) * 2006-10-04 2008-04-16 Shin-Etsu Chemical Co., Ltd. Epoxidharzzusammensetzung zur Einkapselung einer Halbleitervorrichtung und dünne Halbleitervorrichtung
JP4957220B2 (ja) 2006-12-04 2012-06-20 株式会社デンソー 電子パッケージ
US20090255438A1 (en) * 2008-04-15 2009-10-15 David Christopher Graham Thermally curable encapsulant composition for inkjet print cartridge
US7986050B2 (en) * 2008-07-28 2011-07-26 Nitto Denko Corporation Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
SG184504A1 (en) * 2010-04-08 2012-11-29 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminated sheet
US8657413B2 (en) 2011-01-18 2014-02-25 Funai Electric Co., Ltd. Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties
WO2012102336A1 (ja) * 2011-01-28 2012-08-02 住友ベークライト株式会社 封止用エポキシ樹脂組成物及び電子部品装置
JP6060541B2 (ja) * 2012-02-23 2017-01-18 日立化成株式会社 半導体封止用熱硬化性樹脂組成物およびそれを用いた半導体装置
JP2014028929A (ja) * 2012-06-28 2014-02-13 Nippon Shokubai Co Ltd 電子部品の製造方法
JP6322919B2 (ja) * 2012-07-25 2018-05-16 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
JP6111710B2 (ja) * 2013-02-04 2017-04-12 日立化成株式会社 硬化性樹脂組成物及び電子部品装置
JP6115225B2 (ja) * 2013-03-22 2017-04-19 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板及びプリント配線板
US10224258B2 (en) * 2013-03-22 2019-03-05 Applied Materials, Inc. Method of curing thermoplastics with microwave energy
JP6227954B2 (ja) * 2013-09-26 2017-11-08 株式会社日本触媒 硬化性樹脂組成物及びその用途
US10160856B2 (en) 2014-12-25 2018-12-25 Showa Denko K.K. Thermosetting resin composition
JP6950233B2 (ja) * 2017-03-28 2021-10-13 昭和電工マテリアルズ株式会社 ビルドアップフィルム接着用熱硬化性樹脂組成物、熱硬化性樹脂組成物、プリプレグ、積層体、積層板、多層プリント配線板及び半導体パッケージ
JP6319703B1 (ja) * 2017-07-11 2018-05-09 群栄化学工業株式会社 プロペニル基含有樹脂、樹脂組成物、樹脂ワニス、積層板の製造方法、熱硬化性成型材料および封止材
JP6988588B2 (ja) * 2018-03-08 2022-01-05 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP6597830B2 (ja) * 2018-04-11 2019-10-30 日立化成株式会社 トランスファ成形用樹脂組成物及び電子部品装置
JP6597829B2 (ja) * 2018-04-11 2019-10-30 日立化成株式会社 トランスファ成形用樹脂組成物及び電子部品装置
TWI804615B (zh) 2018-05-18 2023-06-11 日商信越化學工業股份有限公司 半導體密封用熱固性馬來醯亞胺樹脂組合物及半導體裝置
JP7087810B2 (ja) 2018-08-09 2022-06-21 信越化学工業株式会社 半導体封止用熱硬化性樹脂組成物及び半導体装置
JP7020341B2 (ja) 2018-08-10 2022-02-16 信越化学工業株式会社 半導体封止用熱硬化性樹脂組成物及び半導体装置
JP7024660B2 (ja) 2018-08-10 2022-02-24 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
WO2020070531A1 (ja) * 2018-10-05 2020-04-09 昭和電工株式会社 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体
JP6708242B2 (ja) * 2018-11-14 2020-06-10 日立化成株式会社 モールドアンダーフィル用樹脂組成物及び電子部品装置
JP7451058B2 (ja) 2021-03-23 2024-03-18 信越化学工業株式会社 熱硬化性シトラコンイミド樹脂組成物

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DE3701900A1 (de) * 1987-01-23 1988-08-04 Basf Ag Hitzehaertbare formmassen
DE3724055A1 (de) * 1987-07-21 1989-02-02 Basf Ag Bismaleinimid-harze
KR910008560B1 (ko) * 1988-02-15 1991-10-19 주식회사 럭키 반도체 봉지용 에폭시 수지 조성물
JPH0340459A (ja) * 1989-07-07 1991-02-21 Nitto Denko Corp 半導体装置
JPH03192114A (ja) * 1989-12-22 1991-08-22 Toshiba Corp マレイミド樹脂組成物及び樹脂封止形半導体装置
JP2570923B2 (ja) * 1991-06-07 1997-01-16 信越化学工業株式会社 熱硬化性樹脂組成物
DE4140472A1 (de) * 1991-12-09 1993-06-17 Beck & Co Ag Dr Drahtlacke sowie verfahren zu deren herstellung
TW260682B (de) * 1992-10-28 1995-10-21 Sumitomo Chemical Co
JPH08151430A (ja) * 1994-11-29 1996-06-11 Toagosei Co Ltd 封止用組成物
JP4051758B2 (ja) * 1998-01-13 2008-02-27 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP3295643B2 (ja) * 1998-03-19 2002-06-24 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JPH11310766A (ja) * 1998-04-28 1999-11-09 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
JP3824065B2 (ja) * 2001-11-06 2006-09-20 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3824066B2 (ja) * 2001-11-06 2006-09-20 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2003147053A (ja) * 2001-11-14 2003-05-21 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4569076B2 (ja) * 2002-06-05 2010-10-27 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
JP2004168848A (ja) * 2002-11-19 2004-06-17 Gun Ei Chem Ind Co Ltd エポキシ樹脂組成物

Also Published As

Publication number Publication date
EP1705199B1 (de) 2009-06-17
JP4793565B2 (ja) 2011-10-12
EP1705199A3 (de) 2007-05-09
US20060216520A1 (en) 2006-09-28
JP2006299246A (ja) 2006-11-02
EP1705199A2 (de) 2006-09-27

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