JP4793565B2 - 半導体封止用エポキシ樹脂組成物及び半導体装置 - Google Patents

半導体封止用エポキシ樹脂組成物及び半導体装置 Download PDF

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Publication number
JP4793565B2
JP4793565B2 JP2006076522A JP2006076522A JP4793565B2 JP 4793565 B2 JP4793565 B2 JP 4793565B2 JP 2006076522 A JP2006076522 A JP 2006076522A JP 2006076522 A JP2006076522 A JP 2006076522A JP 4793565 B2 JP4793565 B2 JP 4793565B2
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Prior art keywords
epoxy resin
component
resin composition
phenol
semiconductor
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JP2006076522A
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English (en)
Japanese (ja)
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JP2006299246A (ja
Inventor
将一 長田
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2006076522A 2005-03-24 2006-03-20 半導体封止用エポキシ樹脂組成物及び半導体装置 Active JP4793565B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006076522A JP4793565B2 (ja) 2005-03-24 2006-03-20 半導体封止用エポキシ樹脂組成物及び半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005085799 2005-03-24
JP2005085799 2005-03-24
JP2006076522A JP4793565B2 (ja) 2005-03-24 2006-03-20 半導体封止用エポキシ樹脂組成物及び半導体装置

Publications (2)

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JP2006299246A JP2006299246A (ja) 2006-11-02
JP4793565B2 true JP4793565B2 (ja) 2011-10-12

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Country Link
US (1) US20060216520A1 (de)
EP (1) EP1705199B1 (de)
JP (1) JP4793565B2 (de)
DE (1) DE602006007258D1 (de)

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CN110240885A (zh) * 2018-03-08 2019-09-17 味之素株式会社 树脂组合物、片状层叠材料、印刷布线板及半导体装置

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EP1911579A1 (de) * 2006-10-04 2008-04-16 Shin-Etsu Chemical Co., Ltd. Epoxidharzzusammensetzung zur Einkapselung einer Halbleitervorrichtung und dünne Halbleitervorrichtung
JP4957220B2 (ja) 2006-12-04 2012-06-20 株式会社デンソー 電子パッケージ
US20090255438A1 (en) * 2008-04-15 2009-10-15 David Christopher Graham Thermally curable encapsulant composition for inkjet print cartridge
US7986050B2 (en) * 2008-07-28 2011-07-26 Nitto Denko Corporation Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
EP2557121B1 (de) * 2010-04-08 2020-03-04 Mitsubishi Gas Chemical Company, Inc. Harzzusammensetzung, prepreg und laminat
US8657413B2 (en) 2011-01-18 2014-02-25 Funai Electric Co., Ltd. Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties
SG191755A1 (en) * 2011-01-28 2013-08-30 Sumitomo Bakelite Co Epoxy resin composition for sealing, and electronic component device
JP6060541B2 (ja) * 2012-02-23 2017-01-18 日立化成株式会社 半導体封止用熱硬化性樹脂組成物およびそれを用いた半導体装置
JP2014028929A (ja) * 2012-06-28 2014-02-13 Nippon Shokubai Co Ltd 電子部品の製造方法
JP6322919B2 (ja) * 2012-07-25 2018-05-16 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
JP6111710B2 (ja) * 2013-02-04 2017-04-12 日立化成株式会社 硬化性樹脂組成物及び電子部品装置
JP6115225B2 (ja) * 2013-03-22 2017-04-19 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板及びプリント配線板
US10224258B2 (en) * 2013-03-22 2019-03-05 Applied Materials, Inc. Method of curing thermoplastics with microwave energy
JP6227954B2 (ja) * 2013-09-26 2017-11-08 株式会社日本触媒 硬化性樹脂組成物及びその用途
EP3239199B1 (de) * 2014-12-25 2019-09-25 Showa Denko K.K. Wärmehärtbare harzzusammensetzung
JP6950233B2 (ja) * 2017-03-28 2021-10-13 昭和電工マテリアルズ株式会社 ビルドアップフィルム接着用熱硬化性樹脂組成物、熱硬化性樹脂組成物、プリプレグ、積層体、積層板、多層プリント配線板及び半導体パッケージ
JP6319703B1 (ja) * 2017-07-11 2018-05-09 群栄化学工業株式会社 プロペニル基含有樹脂、樹脂組成物、樹脂ワニス、積層板の製造方法、熱硬化性成型材料および封止材
JP6597829B2 (ja) * 2018-04-11 2019-10-30 日立化成株式会社 トランスファ成形用樹脂組成物及び電子部品装置
JP6597830B2 (ja) * 2018-04-11 2019-10-30 日立化成株式会社 トランスファ成形用樹脂組成物及び電子部品装置
TWI804615B (zh) 2018-05-18 2023-06-11 日商信越化學工業股份有限公司 半導體密封用熱固性馬來醯亞胺樹脂組合物及半導體裝置
JP7087810B2 (ja) 2018-08-09 2022-06-21 信越化学工業株式会社 半導体封止用熱硬化性樹脂組成物及び半導体装置
JP7020341B2 (ja) 2018-08-10 2022-02-16 信越化学工業株式会社 半導体封止用熱硬化性樹脂組成物及び半導体装置
JP7024660B2 (ja) 2018-08-10 2022-02-24 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
WO2020070531A1 (ja) * 2018-10-05 2020-04-09 昭和電工株式会社 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体
JP6708242B2 (ja) * 2018-11-14 2020-06-10 日立化成株式会社 モールドアンダーフィル用樹脂組成物及び電子部品装置
JP7451058B2 (ja) 2021-03-23 2024-03-18 信越化学工業株式会社 熱硬化性シトラコンイミド樹脂組成物

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110240885A (zh) * 2018-03-08 2019-09-17 味之素株式会社 树脂组合物、片状层叠材料、印刷布线板及半导体装置
JP2019156909A (ja) * 2018-03-08 2019-09-19 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置

Also Published As

Publication number Publication date
EP1705199A3 (de) 2007-05-09
EP1705199B1 (de) 2009-06-17
DE602006007258D1 (de) 2009-07-30
US20060216520A1 (en) 2006-09-28
JP2006299246A (ja) 2006-11-02
EP1705199A2 (de) 2006-09-27

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