CN1103803C - 粘接剂、液晶装置、液晶装置的制造方法和电子装置 - Google Patents

粘接剂、液晶装置、液晶装置的制造方法和电子装置 Download PDF

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CN1103803C
CN1103803C CN98800198A CN98800198A CN1103803C CN 1103803 C CN1103803 C CN 1103803C CN 98800198 A CN98800198 A CN 98800198A CN 98800198 A CN98800198 A CN 98800198A CN 1103803 C CN1103803 C CN 1103803C
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adhesive linkage
substrate
caking agent
liquid
adhesives
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CN98800198A
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CN1217737A (zh
Inventor
内山宪治
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Japan Display West Inc
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Seiko Epson Corp
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
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    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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Abstract

本发明的目的在于，即使在与材料性质不同的两种被粘接物进行粘接的情况下也可分别提高与各被粘接物的粘接力的粘接剂，将配置在2个被粘接物间的粘接剂1的绝缘性粘接材料作成与一方被粘接物粘接的第1绝缘性粘接材料4和与另一方被粘接物粘接的第2绝缘性粘接材料5的2层结构。通过改变所添加的偶联剂的种类等，使各粘接剂4、5具有对应于粘接该粘接剂的被粘接物的粘接特性。由此，可分别提高各粘接剂4、5的与被粘接物的粘接力，与以往的使用一种绝缘性粘接材料的情况相比，可提高各向异性导电性粘接剂的与被粘接物的粘接力。

Description

粘接剂、液晶装置、液晶装置的制造方法和电子装置
[技术领域]
本发明涉及粘接剂，特别是涉及含有导电粒子的各向异性导电性粘接剂。再者，涉及在液晶屏与外部电路基板或半导体元件的连接中使用了各向异性导电性粘接剂的液晶装置及其制造方法。此外，涉及具备该液晶装置作为显示部的电子装置。
[背景技术]
如液晶屏的玻璃基板上设置的输入端子与TCP(带载体封装)的端子(也有在端子上形成了凸点的情况)的连接那样，在精细的间距的端子间的连接中使用了各向异性导电性粘接剂。
现有的各向异性导电性粘接剂由环氧树脂等热硬化性或热可塑性绝缘性粘接材料和在该粘接剂内配置的多个导电粒子构成。在此，由于将绝缘性粘接材料粘接到被粘接物、即玻璃基板和聚酰亚胺制的TCP上，故使用了通用性高的粘接剂以便能以预定的粘接力粘接到这些材料性质不同的被粘接物的任一个上。
但是，虽然具有通用性的粘接剂对于哪种材料性质的被粘接物也能得到一定水平的粘接力，但如果对一个被粘接物要求一定水平以上的粘接力，则存在与另一个被粘接物的粘接力下降、作为整体来说不能得到一定水平以上的粘接力的问题。
特别是在使用玻璃基板作为液晶屏、将该玻璃基板与外部电路基板即高分子基板连接起来的情况下，有时两者的粘接特性显著不同。因此，存在容易只在玻璃基板和高分子基板中的任一方中引起起因于粘接剥离的不良情况的趋势。
本发明的目的在于，即使在与材料性质不同的两种被粘接物进行粘接的情况下，也实现分别能提高与各被粘接物的粘接力的各向异性导电性粘接剂和实现不产生连接不良的液晶装置及其制造方法。
[发明的公开]
本发明的粘接剂是一种粘接第1被粘接物和由与所述第1被粘接物不同的材料构成的第2被粘接物的粘接剂，其特征在于，具备：具有对应于所述第1被粘接物的粘接特性的第1粘接层；以及具有对应于所述第2被粘接物的粘接特性的第2粘接层。
在使用本发明的粘接剂粘接第1被粘接物和第2被粘接物时，能使第1粘接层与第1被粘接物相接，使第2粘接层与第2被粘接物相接。通过这样做，由于能在分别对应于各被粘接物的粘接特性下与另一方的被粘接物粘接，故被粘接物相互间的粘接变得牢固。
此外，其特征在于：所述第1粘接层含有第1绝缘性粘接材料和多个导电粒子，所述第2粘接层含有第2绝缘性粘接材料。
在有必要在第1被粘接物与第2被粘接物之间进行导电性连接时，如本发明那样，在第1粘接层中掺入导电粒子即可。当然，在第2粘接层中掺入导电粒子也没有关系，但通常在第1被粘接物与第2被粘接物之间进行导电性连接时，使第1被粘接物与第2被粘接物互相挤压来进行粘接。因此，如果只在第1粘接层中掺入导电粒子，就可完成导电性连接。
如果只在第1粘接层中配置导电粒子，则由于容易管理导电粒子的数目及配置，故能容易地制造各向异性导电性粘接剂。在这种情况下，由于第2粘接层能够只用于与第2被粘接物的粘接即可，故与第1粘接层相比可将粘接层的厚度形成得较薄。
此外，即使在上述第1粘接层与上述第2粘接层之间设置含有绝缘性粘接材料和多个导电粒子的导电层也可在第1被粘接物与第2被粘接物之间进行导电性连接。
此时，由于配置导电粒子的导电层不与被粘接物直接接触，故没有必要与被粘接物相一致地来选定材料。因此，即使在将粘接剂粘接到哪一种的被粘接物上的情况下，也是根据这些被粘接物只设定第1及第2粘接层的粘接特性即可，由于能共同地利用导电层的绝缘性粘接材料，故在制造具有各种粘接特性的各向异性导电性粘接剂时可提高制造效率，可降低成本。
作为调整第1和第2粘接层的粘接特性的具体的方法，可考虑下述3种方法：
(1)使第1粘接层中的绝缘性粘接材料的主要成分与第2粘接层中的绝缘性粘接材料的主要成分不同；
(2)在第1粘接层和第2粘接层中添加不同的偶联剂；以及
(3)利用在第1粘接层和第2粘接层中不同的绝缘性粘接材料的主要成分和所添加的偶联剂等，但如果在第1粘接层和第2粘接层中使用相同的绝缘性粘接材料、然后在第1粘接层中添加对应于第1被粘接物的第1偶联剂、在第2粘接层中添加对应于第2被粘接物的第2偶联剂，则由于只改变偶联剂的种类就可使粘接剂的特性变化，故可减少所使用的绝缘性粘接材料的种类，可提高制造效率，也可降低成本。
本发明的液晶装置是下述的一种液晶装置，所述液晶装置具备液晶屏和电路基板，其中所述液晶屏在一对基板间封入了液晶并至少在一个所述基板上形成了电极端子，所述电路基板形成了电极端子并与所述一个基板连接，所述液晶装置的特征在于：由具有对应于所述一个基板和所述电路基板的任一个基板的粘接特性的第1粘接层和具有对应于另一个基板的粘接特性的第2粘接层的粘接剂将所述一个基板与所述电路基板连接起来。
根据本发明的液晶装置，在液晶屏用基板(主要是玻璃基板)与电路基板(主要是高分子基板)的连接中使用具有多个粘接层的粘接剂，其中所述多个粘接层具有对应于各自的基板的粘接特性。其结果，双方的基板的粘接力变得均匀且牢固，液晶装置的连接可靠性提高。
此外，其特征在于：在所述一个基板上形成的所述电极端子和在所述电路基板上形成的所述电极端子中，电极端子的厚度不同，所述第1粘接层含有第1绝缘性粘接材料和多个导电粒子，与所述一个基板和所述电路基板中的具有所述厚度薄的电极端子的基板连接，所述第2粘接层含有第2绝缘性粘接材料，与所述一个基板和所述电路基板中的具有所述厚度厚的电极端子的基板连接。
一般来说，通过压接进行液晶屏基板与外部电路基板的连接。在该压接时，由于电极端子的缘故，粘接剂被压出，然后流出。当然，被电极端子的厚度厚的电极端子压出的粘接剂的量比被电极端子的厚度薄的电极端子压出的粘接剂的量多。为了在液晶屏基板与外部电路基板之间进行可靠的导电性连接，最好不使导电粒子流出。
在本发明中，由于掺入了导电粒子的第1层与形成了厚度薄的电极端子的基板相接，故可防止压接时的导电粒子的流出。
一般来说，在液晶屏基板上形成的电极端子大多是透明导电膜(ITO)，在电路基板上形成的电极端子大多是金属膜，在这种情况下，第1粘接层最好与液晶屏基板连接，第2粘接层最好与所述电路基板连接。之所以如此，是因为通常ITO比金属膜形成得薄。
此外，所述液晶装置是下述的一种液晶装置，所述液晶装置具备液晶屏和电路基板，其中所述液晶屏在一对基板间封入了液晶并至少在一个所述基板上形成了电极端子，所述电路基板形成了电极端子并与所述一个基板连接，所述液晶装置的特征在于：由具有对应于所述一个基板和所述电路基板的任一个基板的粘接特性的第1粘接层、具有对应于另一个基板的粘接特性的第2粘接层以及配置在所述第1粘接层和所述第2粘接层之间并含有绝缘性粘接材料和多个导电粒子的导电层的粘接剂将所述电路基板与所述一个基板连接起来。
按照本发明的液晶装置，在液晶屏用基板(主要是玻璃基板)与外部电路基板(主要是高分子基板)的连接中使用具有多个粘接层和配置在第1粘接层和第2粘接层之间并包含导电粒子的导电层的粘接剂，其中所述多个粘接层具有对应于各自的基板的粘接特性。其结果，双方的基板的粘接力变得均匀且牢固，液晶装置的连接可靠性提高。
此外，所述液晶装置是下述的一种液晶装置，所述液晶装置在一对基板间封入了液晶并至少在一个所述基板上安装了半导体元件，所述液晶装置的特征在于：由具备具有对应于所述一个基板或半导体元件中的一方的粘接特性的第1粘接层以及具有对应于所述一个基板或所述半导体元件中的另一方的粘接特性的第2粘接层的粘接剂将所述半导体元件与所述一个基板连接起来。
按照本发明，在直接将半导体元件安装到液晶屏基板上的所谓COG(玻璃上的芯片)方式的液晶装置中，可使液晶屏基板与半导体元件的连接变得牢固。
本发明的电子装置的特征在于：具备上述的液晶装置作为显示部，而且，具备容纳所述显示部的框体。
所谓本发明的电子装置，例如是携带电话、手表、笔记本电脑等，由于在液晶装置与外部电路或半导体元件的连接中使用了本发明的粘接剂，故可提高液晶屏与外部电路或半导体元件的粘接力，可降低液晶装置或电子装置的不合格品的发生率，也可降低制造成本。
本发明的液晶装置的制造方法是下述的一种液晶装置的制造方法，所述液晶装置用粘接剂来连接液晶屏和电路基板，其中所述液晶屏在一对基板间封入了液晶并至少在一个所述基板上形成了第1电极端子，所述电路基板形成了第2电极端子并与所述一个基板连接，所述液晶装置的制造方法的特征在于，具有下述工序：在所述一个基板和所述电路基板之间配置具有对应于所述一个基板和所述电路基板中的任一个基板的粘接特性的第1粘接层、具有对应于另一个基板的粘接特性的第2粘接层的粘接剂的工序；以及通过压接对所述一个基板和所述电路基板进行连接的工序。
按照本发明的液晶装置的制造方法，在液晶屏用基板(主要是玻璃基板)与外部电路基板(主要是高分子基板)的连接中使用具有多个粘接层的粘接剂，其中所述多个粘接层具有对应于各自的基板的粘接特性。其结果，双方的基板的粘接力变得均匀且牢固。
此外，其特征在于：所述第1粘接层含有第1绝缘性粘接材料和多个导电粒子，所述第2粘接层含有第2绝缘性粘接材料。
此外，本发明的液晶装置的制造方法是下述的一种液晶装置的制造方法，所述液晶装置在一对基板间封入了液晶的液晶屏的至少一个所述基板上安装半导体元件，所述液晶装置的制造方法的特征在于，具有下述工序：在所述一个基板和所述半导体元件之间配置具有对应于所述一个基板或半导体元件中的一方的粘接特性的第1粘接层、具有对应于另一方的粘接特性的第2粘接层的粘接剂的工序；以及通过压接对所述一个基板和所述半导体元件进行连接的工序。
按照本发明的液晶装置的制造方法，在直接将半导体元件安装到液晶屏基板上的所谓COG(玻璃上的芯片)方式的液晶装置中，可使液晶屏基板与半导体元件的连接变得牢固。
[附图的简单说明]
图1是示出在本发明的第1实施形态中使用的粘接剂的剖面的图。
图2是示出第1实施形态中的液晶屏基板与TCP基板的连接部分的剖面的图。
图3是本发明的液晶装置的斜视图。
图4是本发明的携带电话的斜视图。
图5是示出本发明的笔记本电脑的斜视图。
图6是示出在本发明的第2实施形态中的粘接剂的剖面的图。
图7是示出本发明的第2实施形态中的液晶屏基板与半导体元件的连接部分的剖面的图。
[用于实施发明的最佳形态]
以下参照附图中示出的本发明的实施形态，更详细地进行说明。
(第1实施形态)
在图1中示出了本发明的第1实施形态的粘接剂1。粘接剂1具有配置了多个导电粒子3的第1粘接层4和在该第1粘接层4上层叠的第2粘接层5。
导电粒子3可以是焊锡粒子、Ni、Au、Ag、Cu、Pb、Sn等的单独的金属粒子或多种金属的混合物、合金、电镀金属等的复合金属粒子，也可以是在塑料粒子(聚苯乙烯系列、聚碳酸酯系列、丙烯酸系列、丁二烯苯系列树脂)上电镀了Ni、Au、Cu、Fe等的单独或多种金属的粒子或碳粒子等。
此外，在第1粘接层4和第2粘接层5中，使用了与粘接各粘接层4、5的被粘接物的粘接力高的绝缘性粘接材料作为主要成分。
例如，如图2中所示，在将粘接剂1配置在设置在液晶屏的玻璃基板11上的电极端子12与TCP13的电极端子14之间的情况下，第1粘接层4将与玻璃基板11和由ITO等构成的端子12的粘接力高的绝缘性粘接材料作为主要成分，第2粘接层5将与聚酰亚胺制的TCP13和在铜的表面上电镀了锡的电极端子14的粘接力高的绝缘性粘接材料作为主要成分来使用。
再有，将第1粘接层4粘接到玻璃基板11和电极端子12上，但因为粘接面积更大的是与玻璃基板11的粘接，故也可将与玻璃基板11的粘接力更大的绝缘性粘接材料作为主要成分来使用。
第2粘接层5也同样，也可将与TCP13(聚酰亚胺制)的粘接力更大的绝缘性粘接材料作为主要成分来使用。
作为各粘接层4、5的主要成分而使用的绝缘性粘接材料具体地说，是苯乙烯丁二烯苯乙烯(SBS)系列、环氧系列、丙烯酸系列、聚酯系列、尿烷系列等的单独或多种混合物或化合物等。此时，作为各粘接层4、5的主要成分，也可使用不同种类的绝缘性粘接材料，但在本实施形态中使用相同种类的绝缘性粘接材料，通过改变所添加的偶联剂的种类来改变粘接特性。
作为粘接层4中使用的具体的偶联剂，可举出二甲基二甲氧基硅烷、γ-氨丙基三乙氧基硅烷等，但只要是包含多个甲氧基或乙氧基作为官能基的偶联剂，就可提高与玻璃的粘接强度。
此外，作为粘接层5中使用的具体的偶联剂，可举出N-β(氨乙基)γ-氨丙基三甲氧基硅烷、γ甘油基丙基三甲氧基硅烷等，但只要是包含多个氨基、环氧基作为官能基的偶联剂，就可提高与聚酰亚胺的粘接强度。
通过例如在制造用基板或剥离纸上层叠掺合了导电粒子3的第1粘接层4，并在其上层叠第2粘接层5等，来制造这样的结构的粘接剂1。
如图2中所示，将以这种方式构成的粘接剂1配置在液晶屏的玻璃基板11与TCP13之间。然后，通过热压接等将各电极端子12、14压入到粘接剂1一侧，使导电粒子3介入各电极端子12、14间而使这些端子间导通，同时用各粘接层4、5来粘接玻璃基板11和TCP13。
通过这样的顺序，如图3中所示，构成由粘接剂1来粘接的液晶屏10与安装了液晶驱动IC15的TCP13的液晶装置100。
将该液晶装置100组装在各种电子装置的框体内加以利用。例如，组装在图4中示出的携带电话200的框体201内，或组装在图5中示出的笔记本电脑300的框体301内加以利用。
在这样的第1实施形态中，具有下述的效果。
①由于层叠第1和第2两种粘接剂4、5来构成粘接剂1，故能将粘接到玻璃基板11及电极端子12上的第1粘接层4作成与这些玻璃基板11等的粘接力高的种类的粘接层，能将粘接到TCP13及端子14上的第2粘接层5用与这些TCP13等的粘接力高的种类的粘接层来构成。因此，与以往那样用一种粘接层来粘接玻璃基板11、TCP13的情况相比，可提高与各被粘接物11、13的粘接力，可作成在粘接特性方面优良的粘接剂1。
②由于导电粒子3只包含在第1粘接层4中，故与在各粘接层4、5两者中配置导电粒子3的情况相比，能容易管理导电粒子3的数目及配置，能容易地制造。
③由于不在第2粘接层5中配置导电粒子3，故与第1粘接剂4相比，可将膜厚形成得较薄，故可减少粘接层5的使用量，也可降低成本。
④在改变各粘接层4、5的粘接特性时，由于改变所添加的偶联剂的种类而不改变绝缘性粘接材料的种类，故能以低成本且容易地设定各粘接层4、5的粘接特性。
(第2实施形态)
其次，参照图6、7说明本发明的第2实施形态。再有，在本实施形态中，与上述第1实施形态相同或同样的构成部分附以相同的符号，省略或简化其说明。
第2实施形态的粘接剂1(各向异性导电性粘接剂)具有配置了多个导电粒子3的导电层7、在该导电层7下层叠的第1粘接层4和在导电层7上层叠的第2粘接层5。
在此，导电层7由容易掺合导电粒子3的粘接剂构成，此外，将其形成得较薄，以使导电粒子3在膜厚方向上成为一列(一层)。如果导电粒子是一层，则在粘接时在端子间移动的导电粒子的量也变少，可进一步减少端子间短路的可能性。
此外，第1和第2粘接层4、5与上述第1实施形态中的粘接层4、5相同，用与粘接各粘接层4、5的被粘接物的粘接力高的粘接层来构成。
例如，如图7中所示，在将粘接剂1配置在设置在液晶屏的玻璃基板11上的电极端子12与IC21的端子(凸点)22之间的情况下，第1粘接层4使用与玻璃基板11和由ITO等构成的电极端子12的粘接力高的粘接层，第2粘接层5使用与由陶瓷等构成的IC21的封装和电镀了金的端子22的粘接力高的粘接层。
再有，在本实施形态中，也因为第1粘接层4与玻璃基板11的粘接面积大，故也可使用与玻璃基板11的粘接力更大的粘接层，第2粘接层5也可使用与粘接面积大的IC21的粘接力更大的粘接层。再有，在各粘接层4、5和导电层7中作为主要成分使用的绝缘性粘接材料，与上述第1实施形态相同，通过改变所添加的偶联剂的种类来使粘接特性变化。
例如通过在制造用基板或剥离纸上层叠第1粘接层4，再在其上依次层叠掺合了导电粒子3的导电层7和第2粘接层5等来制造这样的结构的粘接剂1。
如图7中所示，将以这种方式构成的粘接剂1配置在液晶屏的玻璃基板11和IC21之间。然后，通过热压接等将各电极端子12、22压入到粘接剂1一侧，使导电粒子3介入各电极端子12、22间而使这些端子间导通，同时用各粘接层4、5来粘接玻璃基板11和IC21。此外，为了将信号输入到IC21中，将柔性基板连接到与IC21的输入端子连接的电极端子12上，但在该柔性基板与玻璃基板上的电极端子12的连接中，最好使用在第1实施形态中示出的粘接剂。
在这样的第2实施形态中，也具有与上述①～④相同的效果。
即，①由于将第1粘接层4、第2粘接层5和导电层7这样的三层层叠在一起来构成粘接剂1，故能将粘接到玻璃基板11及电极端子12上的第1粘接层4作成与这些玻璃基板11等的粘接力高的种类的粘接层，能将粘接到IC21及电极端子22上的第2粘接层5用与这些IC21等的粘接力高的种类的粘接层来构成。因此，与以往那样用一种粘接层来粘接玻璃基板11、IC21的情况相比，可提高与各被粘接物的粘接力，可作成在粘接特性方面优良的粘接剂1。
②由于只在导电层7中包含导电粒子3，故与将导电粒子3配置在粘接层4、5和导电层7中的情况相比，容易管理导电粒子3的数目及配置，能容易进行制造。
③由于第1、第2粘接层4、5中不配置导电粒子3，故与导电层7相比，其膜厚可形成得较薄，可减少绝缘性粘接材料的使用量，也可降低成本。
④通过所添加的偶联剂的种类来使各粘接层4、5的粘接特性变化，故能以低成本且容易地设定各粘接层4、5的粘接特性。
⑤再者，按照第2实施形态，由于包含导电粒子3的导电层7配置在粘接剂1的中间，不直接与被粘接物接触，故没有必要与被粘接物11、21相一致地来选定材料。因此，即使在将粘接剂1粘接到哪一种被粘接物上的情况下，根据这些被粘接物设定第1粘接层4和第2粘接层5即可，由于能共同地利用导电层7，故在制造具有各种粘接特性的粘接剂1时可提高制造效率，也可降低成本。
⑥由于将导电粒子3配置成在粘接剂1的膜厚方向上成为一列(一层)，故通过控制各电极端子12、22的连接面的面积和在每单位面积上的导电粒子3的散布数目，可容易地管理介入到各电极端子12、22间的导电粒子3的数目，能以高精度来调整、设定介入到各电极端子12、22间的导电粒子3的数目、即导通性能。
再有，本发明不限于上述的各实施形态，在能达到本发明的目的的范围内的变形、改良等，都包含在本发明中。
例如，在上述各实施形态中，导电粒子3只包含在第1实施形态中的第1粘接层或第2实施形态中的导电层7中，但即使采用下述结构，也能在粘接强度方面得到与第1或第2实施形态同样的效果，这些结构是：在其它的层中、例如在第1实施形态中的第2粘接层5或第2实施形态中的第2粘接层5中也包含导电粒子3，或者，在第1实施形态中的第1粘接层4或第2实施形态中的导电层7中不包含导电粒子3，只在其它的层中、例如在第1实施形态中的第2粘接层5或第2实施形态中的第2粘接层5中包含导电粒子3。
此外，导电粒子3可以如图1中所示那样均匀地配置在膜厚较厚的粘接剂层中，也可以如图6中所示那样配置在膜厚较薄的粘接剂层中，使其在膜厚方向上成为约1～2列。
再者，作为粘接剂1，也可以具有4层以上的层叠结构。在这种情况下，除了粘接到玻璃基板11及TCP13、IC21的粘接剂之外，另外设置粘接到各电极端子12、14、22上的粘接层，能利用适合于被粘接物12、14、22的各自的粘接层，可进一步提高粘接剂与被粘接物的粘接力。
此外，也可以将第2实施形态的3层结构的粘接剂1用于第1实施形态的液晶屏用玻璃基板11的电极端子12与TCP13的电极端子14的导通连接，相反，也可以将第1实施形态的2层结构的粘接剂1用于第2实施形态的玻璃基板11与IC21的粘接。
再者，本发明的粘接剂不限于液晶屏用的部件的粘接，可广泛地用于各种电气部件相互间的导通。此外，为了设定各粘接层4、5和导电层7的粘接特性，不限于添加偶联剂的情况，也可通过改变绝缘性粘接材料的主要成分的种类本身来进行设定，也可适当地加入其它的添加物来进行设定。
总之，根据所使用的被粘接物的种类适当地设定粘接剂1的粘接层4、5和导电层7及导电粒子3的材料(绝缘性粘接材料的主要成分的种类及所添加的偶联剂的种类)、大小(膜厚及粒子直径)等即可。因而，作为使用了本发明的粘接剂1的电子装置，不限于携带电话200及笔记本电脑300那样的具备液晶装置100作为显示部的装置，也可适用于不具备液晶装置的各种电子装置。

Claims (12)

1.一种用于粘接粘接特性相异的第一被粘接物和第2被粘接物的粘接剂，其特征在于：
所述粘接剂具有第1粘接层和第2粘接层；
所述第1粘接层和所述第2粘接层分别被粘接到所述第1被粘接物和所述第2被粘接物；
所述第1粘接层和所述第2粘接层显示出各不相同的粘接特性。
2.如权利要求1中所述的粘接剂，其特征在于：
所述第1粘接层含有第1绝缘性粘接材料和导电粒子；
所述第2粘接层含有第2绝缘性粘接材料。
3.如权利要求1中所述的粘接剂，其特征在于：
所述粘接剂具有第1粘接层和第2粘接层和夹在它们之间的导电层，所述导电层含有绝缘性粘接材料和导电粒子。
4.一种用于粘接粘接特性相异的第1被粘接物和第2被粘接物的粘接剂，其特征在于：
所述粘接剂具有第1粘接层和第2粘接层；
所述第1粘接层和所述第2粘接层分别被粘接到所述第1被粘接物和所述第2被粘接物；
所述第1粘接层和所述第2粘接层分别含有第1偶联剂和第2偶联剂；
所述第1偶联剂和所述第2偶联剂是各不相同的偶联剂。
5.一种液晶装置，具有相对向配置的第1基板和第2基板，及夹于它们之间的液晶层，其特征在于：
所述第1基板和第2基板中的一块上具有通过粘接剂粘接的电路基板；
所述粘接剂具有由第1粘接层和第2粘接层重叠而成的结构；
所述第1粘接层和所述第2粘接层显示出各不相同的粘接特性。
6.如权利要求5中所述的液晶装置，其特征在于：
还具有在所述第1基板和第2基板中的一块基板上形成的第1电极端子，和在所述电路基板上形成的第2电极端子；
所述电路基板和所述一块基板有不同的厚度；
所述第1粘接层含有导电粒子，而且与所述第1电极端子和所述第2电极端子中的一个连接，所述第2粘接层与所述第1电极和所述第2电极中的另一个连接。
7.如权利要求6中所述的液晶装置，其特征在于：
所述第1电极端子和所述第2电极端子分别含有透明导电膜和金属膜，所述第1粘接层与所述第1电极端子，所述第2粘接层与所述第2电极端子分别连接。
8.一种液晶装置，具有相对向配置的第1基板和第2基板，及夹于它们之间的液晶层，其特征在于：
所述第1基板和第2基板中的一块上具有通过粘接剂粘接的半导体元件；
所述粘接剂具有由第1粘接层和第2粘接层重叠而成的结构；
所述第1粘接层和所述第2粘接层显示出各不相同的粘接特性。
9.一种具有显示部和容纳该显示部的框体的电子机器，其特征在于：
所述显示部包括有液晶装置；和
使用权利要求5中记载的液晶装置作为所述液晶装置。
10.一种具有相对向配置的第1基板和第2基板，及夹于它们之间的液晶装置的制造方法，其特征在于，该方法具有下列工序：
在所述第1基板和第2基板中的一块和所述电路基板之间配置粘接剂的工序，和
将所述第1基板和第2基板中的一块与所述电路基板连接的工序；
粘接剂具有由有各不相同的粘接特性的第1粘接层和第2粘接层重叠而成的结构。
11.如权利要求10中所述的液晶装置的制造方法，其特征在于：
所述第1粘接层含有第1绝缘性粘接材料和导电粒子；
所述第2粘接层含有第2绝缘性粘接材料；
所述第1绝缘性粘接材料和所述第2绝缘性粘接材料是各不相同的粘接材料。
12.一种具有相对向配置的第1基板和第2基板，以及半导体元件的液晶装置的制造方法，其特征在于，该方法包括下列工序：
在所述第1基板和第2基板中的一块和所述半导体元件之间配置粘接剂的工序，和
将所述第1基板和第2基板中的一块与所述半导体元件连接的工序；
所述粘接剂具有由有各不相同的粘接特性的第1粘接层和第2粘接层重叠而成的结构。
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