CN1532919A - 电路装置及其制造方法 - Google Patents

电路装置及其制造方法 Download PDF

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Publication number
CN1532919A
CN1532919A CNA2004100300680A CN200410030068A CN1532919A CN 1532919 A CN1532919 A CN 1532919A CN A2004100300680 A CNA2004100300680 A CN A2004100300680A CN 200410030068 A CN200410030068 A CN 200410030068A CN 1532919 A CN1532919 A CN 1532919A
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electronic
circuit device
adhesive sheet
circuitry substrate
thermosetting resin
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CNA2004100300680A
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CN1532919B (zh
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v
塚原法人
西川和宏
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

一种电子电路装置及其制造方法，在一个面上具有连接端子的电子部件和电路衬底利用具有通孔的粘接片粘接，且利用通孔内的导电粘接剂连接电子部件的连接端子和在电路衬底上设置的电极焊盘，构成电子电路装置。电路衬底使用高分子树脂软片，通过在该衬底上安装LSI等电子部件得到小型、轻量、薄型化和低价格化的电子电路装置。

Description

电路装置及其制造方法
技术领域
本发明涉及安装电子部件的电路衬底的衬底材料使用高分子树脂板的电子电路装置及其制造方法
背景技术
近年来，对手机等电子设备中内装的电子电路装置的小型、轻量、薄型化的要求越来越高。因此，提出如下技术方案即将现有的大规模半导体集成电路(以下称LSI)等的电子部件高密度且薄型化地安装的技术。例如，特开2000-340607号公报等。
图5是显示现有的电子电路装置制造方法主要工序的剖面图。在现有的电子电路装置中，将电路衬底41的电极(未图示)和对应的LSI42的连接端子(未图示)介由焊锡补片43连接。
以下，参照图5说明现有的电子电路装置的制造方法。
首先，如图5A所示，在电路衬底41的电极上形成多个焊锡补片43。
其次，如图5B所示，在LSI42上粘接包括具有圆孔44的热塑性聚酰亚胺树脂的粘接片45。此时，粘接片45的圆孔44和在LSI42表面设置的连接端子被各自粘接在对应的位置。
其次，如图5C所示，在粘接片45的圆孔44中嵌入形成在电路衬底41上的焊锡补片43。而后，向电路衬底41和LSI42施加压力，并加热至焊锡补片43的熔融温度以上。而后，利用焊锡补片43的熔融连接LSI42的连接端子和电路衬底41的电极。与此同时，介由加热软化的粘接片45，粘接电路衬底41和LSI42构成电子电路装置。
但是，在现有的电子电路装置中，作为电连接材料使用熔点为20℃以上的焊锡，因此，不能将耐热温度低、具有通用性的廉价的高分子树脂板用作电路衬底的衬底材料。因此，要使用混合玻璃纤维的环氧树脂或陶瓷板等耐热温度高、且昂贵的衬底材料，因而电子电路装置的造价高。
另外，在加热粘接片，粘接LSI和电路衬底时，具有如下问题，粘接片中混入空气，或熔融的焊锡扩散到邻接的焊锡补片之间，绝缘电阻降低。由此，难于高成品率地制造高可靠性的电子电路装置。
发明内容
在本发明的电子电路装置中，介由具有通孔的粘接片粘接一个面上具有连接端子的电子部件和电路衬底，且利用通孔内的导电性粘接剂连接电子部件的连接端子和在电路衬底上设置的电极焊盘。
本发明电子电路装置的制造方法包括如下工序：A)将具有通孔的粘接片的通孔与在电路衬底表面设置的电极焊盘对位，而后，将粘接片粘接在电路衬底上的片粘接工序；B)向通孔内装入导电性粘接剂的导电性粘接剂装填工序；C)由通孔内的导电性粘接剂粘接电子部件一表面上设置的连接端子和电路衬底上设置的电极焊盘，并在粘接片上粘接电子部件的电子部件粘接工序。
附图说明
图1是示意性地显示本实施例的电子电路装置的结构的剖面图；
图2A是示意性地显示在本实施例的电子电路装置中、在电子部件的连接端子表面形成补片的结构的剖面图；
图2B是示意性地显示在本实施例的电子电路装置中、在电路衬底的电极焊盘侧设置、连接补片的结构的剖面图；
图3A、图3B、图3C是显示本实施例的电子电路装置的制造方法的工序剖面图；
图4A、图4B是显示本实施例的电子电路装置的制造方法的工序剖面图；
图5A、图5B、图5C是显示现有的电子电路装置的制造方法的主要工序的剖面图。
具体实施方式
以下，参照图1～图4说明本发明的实施例。另外，相同的结构使用相同的符号并省略详细说明。
图1是示意性地显示本发明实施例的电子电路装置结构的剖面图。在具有电路配线图案(未图示)的电路衬底11上，在对应电子部件15的连接端子16的位置设置电极焊盘12。在LSI等电子部件15的一表面形成具有至少由该表面突出的形状的连接端子16。在粘接片13上和各连接端子16对应的位置设置具有可嵌入连接端子16的形状的通孔14。将电子部件15的连接端子16和电路衬底11的电极焊盘12利用通孔14内填充的导电性粘接剂17粘接并电连接。另外，电路衬底11和电子部件15介由粘接片13粘接。这样，可实现可靠性高的连接。
电路衬底11的衬底材料，只要是包含玻璃纤维加入环氧树脂、陶瓷板等耐热性衬底或聚乙烯对苯二酸脂(PET)树酯、丙烯晴丁二烯苯乙烯(ABS)树脂、聚碳酸酯树脂或聚酰亚胺树脂等软片等的高分子树脂板等的可在常用的电路衬底中使用的材料都可以选用。特别优选使用由PET树脂、ABS树脂、聚碳酸酯树脂或聚酰亚胺树脂等构成的高分子树脂薄板。由于这些作为通用性塑料利用广泛，因而廉价，并且可将电路衬底11的板厚设定为50um～400um程度，对于电子电路装置的薄型化是有效的。
另外，作为粘接薄片13，可应用包括环氧树脂或丙烯酸树脂等热硬性树脂的粘接片或包括通常知道的热塑性树脂的热熔融片等。此时，粘接片13的厚度考虑电子电路装置的薄型化、电路衬底11和电子部件15的粘接强度或连接电阻等，最好为100um～800um。
导电性粘接剂17最好是将金(Au)、银(Ag)、铜(Cu)、镍(Ni)、钯(Pd)或Ag和Pd的合金等导电性物质微细化后的导电性粒子分散混合在粘结剂中构成的导电性膏。特别是包含聚酯树脂、环氧树脂、丙烯酸树脂、聚酰亚胺树脂或聚胺酯树脂等热硬性树脂的粘接剂在牢固粘接电路衬底1的电极焊盘12和电子部件15的连接端子16方面是理想的。
根据电路衬底11的衬底材料和电子部件15的形状或材料等，可选择粘接片13和导电性粘接剂17的最优化组合。此时，热硬性树脂的粘接片13和包含热硬性树脂粘结剂的导电性粘接剂17的组合最理想。这是因为该组合可应用于PFT树脂或ABS树脂等耐热性低的电路衬底，故可将电路衬底的选择范围增大。其中，最好为粘接片13的热硬性树脂的硬化开始温度比作为导电性粘接剂17使用的导电膏的热硬性树脂粘结剂的硬化开始温度更低的组合。利用该组合，可防止在热硬性树脂和热硬性树脂粘结剂加热硬化时粘接片13的挠曲。
另外，作为电子部件15，可采用LSI或电阻、电容器或线圈等片状部件等通常的电子部件。
如图2A、图2B所示，也可以采用在电子部件15的连接端子16和电路衬底11的电极焊盘12的至少任意一方形成向通孔14方向突出的补片20的结构。总之，将导电性粘接剂17和连接端子16或电极焊盘12的接触面积增大。利用该结构，可将连接端子16和电极焊盘12更牢固地粘接并使连接端子16和电极焊盘12之间的连接电阻降低。也可以是使连接端子16和电极焊盘12直接接触的结构。此时，连接端子16和电极焊盘12之间的连接电阻进一步降低。
图2A是示意性地显示在电子部件15的连接端子16表面形成补片20的结构的剖面图。在连接端子16表面利用例如柱式补片工艺以10um～100um左右的厚度形成由Au构成的补片20。由此，由于和导电性粘接剂17的接触面积扩大或与电路衬底11的电极焊盘12的间隔减小，故可大幅降低连接电阻。另外，补片20的形状要求至少比粘接片13上设置的通孔14的外形尺寸更小、比粘接片13的厚度更薄，其它没有要求。补片20的材料不仅可使用所述的Au，还可以使用Cu、Ni或焊锡等。另外，补片20不仅可利用柱式补片工艺形成，还可以利用镀敷法、蒸镀法或喷溅法等形成。
图2B是示意性地显示在电路衬底11的电极焊盘12侧设置、连接补片24的结构的剖面图。在电路衬底11的电极焊盘12上设置补片24，并介由导电性粘接剂17和电子部件15的连接端子16连接。补片24的形成方法或材料等和图2A相同。
如上所述，通过在电路衬底11的电极焊盘12及电子部件15的连接端子16的至少任意一方上形成补片20、24，可将导电性粘接剂17的涂敷量减少。即使填充在通孔14的导电性粘接剂17的涂敷量有偏差，由于接触面积大也不易产生连接电阻的偏差。
在本发明实施例中，电子部件15的连接端子16未必由其表面突出。例如，在电子部件15的连接端子16以自表面凹陷的状态形成时，可利用在连接端子16上形成补片和电路衬底11的电极焊盘12连接。
以下说明本发明实施例的电子电路装置的制造方法。
图3和图4是显示本发明实施例的电子电路装置制造方法的工序剖面图。
首先，如图3A所示，在电路衬底11上形成必要的电路配线图案(未图示)。可以在该电路衬底11上予先利用焊锡焊接等安装电阻、电容或半导体元件等，也可以仅形成电路配线图案。然后，在安装电子部件15的电路衬底11的规定位置形成电极焊盘12。再在包含环氧树脂或丙烯酸树脂等热硬性树脂的粘接片13上，在电路衬底11的对应电极焊盘12的位置设置通孔14。
其次，如图3B所示，使粘接片13的通孔14和电路衬底11的电极焊盘12的位置对准，而后将粘接片13粘贴在电路衬底11上(该工序被称为片粘接工序)。
其次，如图3C所示，向粘接片13的通孔14内填充导电性粘接剂17(该工序被称为导电性粘接剂填充工序)。导电性粘接剂17利用例如网印法、喷墨法、绘图法或转印法等各种方法涂敷到通孔14内。此时，最好考虑嵌入粘接片13的通孔14内的连接端子16或补片20、24的大小，供给导电性粘接剂17，以使其至少比粘接片13上设置的通孔14的高度低。
其次，如图4A所示，在使粘贴了粘接片13的电路衬底11的电极焊盘12和电子部件15的连接端子16的位置对准后，将电子部件15压装到粘接片13上。由此，电路衬底11和电子部件15介由粘接片13相互粘接。然后，介由通孔14内的导电性粘接剂17将连接端子16和电极焊盘12机械性粘接，同时使其电连接(该工序被称为电子部件粘接工序)。例如，在使用包括热硬性树脂的粘接片13时，也可以压装并加热电子部件15，即使在压装后加热，也可可靠地粘接电路部件11和电子部件15。
利用上述制造方法可得到图4B所示的将电子部件15安装到电路衬底11上的电子电路装置。
利用本实施例，由于利用导电性粘接剂17连接电子部件15的连接端子16和电路衬底11的电极焊盘12，且利用粘接片13粘接电子部件15和电路衬底11，因此，即使使用片状电路衬底11也可以实现可靠性高的连接。
另外，本发明不限于所述制造方法，也可以是如下制造方法，在预先向粘接片13的通孔14内供给导电性粘接剂17后，使其与电路衬底11的电极焊盘12的位置对位，粘接粘接片13的方法。
实施例
以下，详细说明电子部件15使用LSI、电路衬底11使用高分子设置片衬底的电子电路装置。
下述显示作为电路衬底11、电子部件15及导电性粘接剂17使用的材料。
电路衬底11使用在两面形成电路配线图案的厚度为100um的聚乙烯对苯二酸酯(PET)的薄片。电子部件15使用在连接端子16表面形成直径约0.2mm的半球状补片20的LSI。此时，补片20的排列间隔为0.4mm。粘接片13使用厚度为0.6mm、硬化温度为80℃的热硬性热熔片(ヘンケルジャパン公司制的(マクロメルト6301))。导电性粘接剂17使用Ag膏。该Ag膏的粘结剂使用硬化温度为110℃的热硬性环氧树脂。
参照图3和图4具体地说明电子电路装置的制造方法。首先，使用常用的网印法在PET薄片上印刷电路配线图案(未图示)及电极焊盘12，形成图3A的电路衬底11。
其次，利用图3B说明的方法在电路衬底11的电极焊盘12的位置对位，在电路衬底11上粘接形成了直径0.3mm的通孔14的粘接片13。粘接条件为温度为80℃，加热时间为15秒。
其次，如图3C所示，利用网印法向粘接片13的各通孔14内供给0.035mm3～0.040mm3左右的导电性粘接剂17。而后，使电子部件15的连接端子16和电路衬底11的电极焊盘12的位置对位，将电子部件15粘贴到粘接片13上。进一步由温度110℃、时间30分的加热条件硬化导电性粘接剂17。由此，电子部件15介由粘接片13被牢固地粘接在电路衬底11上。同时，连接端子16和电极焊盘12也利用导电性粘接剂17机械连接并电连接。此时的电极焊盘12和连接端子16之间的导通电阻值大约为20mΩ。另外，作为电子部件15的LSI和作为电路衬底11的PET薄片具有足够的粘接强度。通过最优化组合粘接片13和导电性粘接剂17，可实现PET薄片的挠曲在实用上几乎没有问题的电子电路装置。
通过所述的制造方法，可实现电路衬底使用廉价地、具有可挠性且可在低温下制造的高分子树脂板的电子电路装置。另外，利用向通孔内提供了导电性粘接剂的粘接片，可得到电路衬底和电子部件的粘接强度强且连接阻抗低的高可靠性电子电路装置。

Claims (10)

1、一种电子电路装置，其包括：电子部件，其一个面上具有连接端子；电路衬底；粘接片，其具有通孔；导电性粘接剂，其被设置在所述通孔内，其中，介由所述粘接片粘接所述电子部件和所述电路衬底，且利用所述通孔内的导电性粘接剂连接所述电子部件的所述连接端子和在所述电路衬底上设置的电极焊盘。
2、如权利要求1所述的电子电路装置，其中，所述连接端子和所述电极焊盘的至少一者向所述通孔方向突出。
3、如权利要求1所述的电子电路装置，其中，所述电路衬底的衬底材料是高分子树脂板。
4、如权利要求3所述的电子电路装置，其中，所述高分子树脂板，是自聚乙烯对苯二酸脂、丙烯晴丁二烯苯乙烯、聚碳酸酯及聚酰亚胺的组中选择的任意一种。
5、如权利要求1所述的电子电路装置，其中，所述导电性粘接剂是以导电性粒子和热硬性树脂粘结剂为主成分的导电性膏。
6、如权利要求1所述的电子电路装置，其中，所述粘接片是热硬性树脂或热塑性树脂。
7、如权利要求1所述的电子电路装置，其中，所述导电性粘接剂的主要成分是导电性粒子和热硬性树脂粘结剂，且所述粘接片包括热硬性树脂，所述热硬性树脂的硬化开始温度比所述导电性粘接剂的热硬性树脂粘结剂的硬化开始温度低。
8、一种电子电路装置的制造方法，其包括如下工序：使具有通孔的粘接片的所述通孔与在电路衬底表面设置的电极焊盘对位，在所述电路衬底上粘接所述粘接片；向所述通孔内充填导电性粘接剂；利用所述通孔内的所述导电性粘接剂粘接在电子部件的一个表面设置的连接端子和在所述电路衬底上设置的所述电极焊盘，并在所述粘接片上粘接所述电子部件。
9、如权利要求8所述的电子电路装置，其中，所述粘接片是热硬性树脂或热塑性树脂。
10、如权利要求8所述的电子电路装置的制造方法，所述导电性粘接剂的主要成分是导电性粒子和热硬性树脂粘结剂，且所述粘接片包括热硬性树脂，所述热硬性树脂的硬化开始温度比所述导电性粘接剂的热硬性树脂粘结剂的硬化开始温度低。
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