TW201344268A - 晶片組裝結構、晶片組裝方法及光纖耦合模組 - Google Patents

晶片組裝結構、晶片組裝方法及光纖耦合模組 Download PDF

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TW201344268A
TW201344268A TW101115017A TW101115017A TW201344268A TW 201344268 A TW201344268 A TW 201344268A TW 101115017 A TW101115017 A TW 101115017A TW 101115017 A TW101115017 A TW 101115017A TW 201344268 A TW201344268 A TW 201344268A
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wafer
hole
circuit board
fixing glue
connection pad
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TW101115017A
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Kai-Wen Wu
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Hon Hai Prec Ind Co Ltd
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Priority to TW101115017A priority Critical patent/TW201344268A/zh
Priority to US13/559,622 priority patent/US8890326B2/en
Publication of TW201344268A publication Critical patent/TW201344268A/zh

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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Abstract

一種晶片組裝結構，包括一個電路板以及一個位於所述電路板上之晶片。所述電路板上設置有一個連接墊。所述連接墊上設置有一個通孔，所述通孔對應與所述晶片之組裝位置。所述通孔內設置有固定膠，所述固定膠之厚度小於所述連接墊之厚度。所述晶片設置於所述通孔內並藉由所述固定膠與所述電路板固定相連。本發明還涉及一種晶片組裝方法以及一種具有所述晶片組裝結構之光纖耦合模組。

Description

晶片組裝結構、晶片組裝方法及光纖耦合模組
本發明涉及一種晶片組裝結構、晶片組裝方法以及具有該晶片組裝結構之光纖耦合模組。
光纖耦合模組中一般包括電路板以及設置於所述電路板上之光電二極體晶片、雷射二極體晶片、驅動晶片、耦合透鏡。所述光電二極體晶片以及所述雷射二極體晶片分別與所述驅動晶片電連接。所述耦合透鏡蓋設與所述光電二極體、所述雷射二極體晶片以及所述驅動晶片上方。
所述光電二極體晶片、雷射二極體晶片以及驅動晶片與所述電路板上之組裝方式為：在所述電路板之晶片組裝位置形成一個連接墊；在所述連接墊上塗敷一層液態固定膠；將晶片置於所述液態固定膠上；固化所述液態固定膠，使所述晶片固定於所述電路板上。然，由於晶片（尤其是所述光電二極體晶片以及所述雷射二極體晶片）尺寸較小，所述晶片置於所述液態固定膠上後，容易因所述液態固定膠之流動的產生固定位置之變化影響晶片組裝之精度。另外，上述晶片組裝方式容易產生溢膠之問題。
所述光電二極體以及所述雷射二極體通常以打線方式與所述驅動晶片相電連，由於打線結構需要形成一定高度的弧形結構，而同時上述晶片組裝方式組裝完成後之晶片組裝結構本身具有較厚的厚度，因此，使得所述弧形結構本身具備較高高度，而所述弧形結構過高則有可能撞到後續組裝之耦合透鏡，造成所述光纖耦合模組品質下降。
有鑒於此，有必要提供一種具有高組裝精度之晶片組裝結構、晶片組裝方法以及具有該晶片組裝結構之光纖耦合模組。
一種晶片組裝結構，包括一個電路板以及一個位於所述電路板上之晶片。所述電路板上設置有一個連接墊。所述連接墊上設置有一個通孔，所述通孔對應與所述晶片之組裝位置。所述通孔內設置固定膠，所述固定膠之厚度小於所述連接墊之厚度。所述晶片設置於所述通孔內並藉由所述固定膠與所述電路板固定相連。
一種晶片組方法，包括如下步驟：
提供一個晶片；
提供一個電路板；
提供一個連接墊，所述連接墊上具有一個用於容置所述晶片之通孔；
將所述連接墊設置於所述電路板上，使所述通孔對應於所述晶片之組裝位置；
在所述通孔內設置固定膠，並且使所述固定膠之厚度小於所述連接墊之厚度；
將所述晶片設置於所述通孔內，使所述晶片藉由所述固定膠與所述電路板固定相連。
一種光纖耦合模組，包括一個電路板以及一個位於所述電路板上之晶片。所述電路板上設置有一個連接墊。所述連接墊上設置有一個通孔，所述通孔對應與所述晶片之組裝位置。所述通孔內設置固定膠，所述固定膠之厚度小於所述連接墊之厚度。所述晶片設置於所述通孔內並藉由所述固定膠與所述電路板固定相連。
相較先前技術，所述之晶片組裝結構、晶片組裝方法以及具有該晶片組裝結構之光纖耦合模組藉由在所述連接墊上開設所述通孔，將所述晶片透過所述通孔固定於所述電路板上，因此可以降低所述晶片組裝結構之厚度。同時由於所述晶片設置於所述連接墊之通孔內，所述連接墊可以防止所述晶片在固定過程中出現滑移，起到精確定位所述晶片之作用。另外，在以膠合方式固定晶片時，由於固定膠設置於所述通孔內，因此可以防止晶片固定時產生溢膠現象。
下面將結合附圖對本發明作一具體介紹。
請參閱圖1及圖2，本發明實施方式之晶片組裝結構100包括一個電路板10以及一個位於所述電路板10上之晶片20。所述晶片組裝結構100可用於光纖耦合模組（圖未示）中，所述晶片20可以為光纖耦合模組中之光電二極體鏡晶片、雷射二極體晶片或者驅動晶片。
所述電路板10用於承載所述晶片20並且對所述晶片20提供訊號傳輸之路徑。所述電路板10上設置有一個連接墊11。所述連接墊11具有一個通孔111，所述通孔111對應於所述晶片20於所述電路板10上之組裝位置，並且所述通孔111之形狀以及尺寸分別與所述晶片20相對應，換言之，所述通孔111用於容置晶片20。較佳地，所述連接墊11之材料為金屬，本實施方式中，所述連接墊11之材料為銅。
所述晶片20收容於所述通孔111內且與所述電路板10藉由固定膠30相固接。所述固定膠30之厚度小於所述連接墊之厚度。所述固定膠30可以為熱固化膠或者所述紫外光固化膠，本實施方式中，所述固定膠30為熱固化膠。所述晶片20之接地端（圖未示）可以與所述連接墊11相連，由於所述連接墊11圍繞所述晶片20，因此所述晶片20之接地端能夠採用較短的導線實現與連接墊12相連。
上述實施方式中，僅描述了一個晶片20於所述電路板10上之組裝方式，可以理解，所述電路板10還可以以類似方式組裝有其他晶片，例如，如果所述晶片組裝結構100用於光纖耦合模組，所述電路板10可以同時組裝有光電二極體晶片、雷射二極體晶片以及驅動晶片。
所述之晶片組裝結構100藉由在所述連接墊11上設置所述通孔111，將所述晶片20透過所述通孔111固定於所述電路板10上，因此可以降低所述晶片組裝結構100之厚度。同時由於所述晶片20設置於所述連接墊11之通孔111內，所述連接墊11可以防止所述晶片20在固定過程中出現滑移，起到精確定位所述晶片20之作用。另外，在晶片20固定時，由於固定膠30設置於所述通孔111內，因此可以防止晶片20固定時產生溢膠現象。
請參閱圖3，本發明之晶片組裝方法包括如下步驟：
提供一個晶片；
提供一個電路板；
提供一個連接墊，所述連接墊上具有一個用於容置所述晶片之通孔；
將所述連接墊設置於所述電路板上，使所述通孔對應於所述晶片之組裝位置；
在所述通孔內設置固定膠，並且使所述固定膠之厚度小於所述連接墊之厚度；
將所述晶片設置於所述通孔內，使所述晶片藉由所述固定膠與所述電路板固定相連。
本實施方式中，所述晶片與所述電路板之間藉由膠合方式固定相連，因此在將所述晶片設置於所述孔通內之前，首先將固定膠設置於所述通孔內，所述固定膠之厚度小於所述連接墊之厚度，待所述晶片置於所述通孔內之後，固化所述固定膠。所述固定膠可以為熱固化膠或者紫外光固化膠。
同樣，上述晶片組裝方法中，僅描述了一個晶片於所述電路板上之組裝方法，可以理解，所述電路板還可以以類似方式組裝有其他晶片，例如，如果所述晶片組裝結構用於光纖耦合模組，則所述光纖耦合模組之光電二極體晶片、雷射二極體晶片以及驅動晶片可採用同樣方法組裝於所述電路板上。
所述之晶片組裝方法藉由在所述連接墊上開設所述通孔，將所述晶片透過所述通孔固定於所述電路板上，因此可以降低所述晶片組裝結構之厚度。同時由於所述晶片設置於所述連接墊之通孔內，所述連接墊可以防止所述晶片在固定過程中出現滑移，起到精確定位所述晶片之作用。另外，在以膠合方式固定晶片時，由於固定膠設置於所述通孔內，因此可以防止晶片固定時產生溢膠現象。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100．．．晶片組裝結構
10．．．電路板
11．．．連接墊
111．．．通孔
20．．．晶片
30．．．固定膠
圖1係本發明之晶片組裝結構之示意圖。
圖2係圖1之晶片組裝結構沿II-II之剖視圖。
圖3係本發明晶片組裝方法之流程圖。
100．．．晶片組裝結構
10．．．電路板
11．．．連接墊
111．．．通孔
20．．．晶片
30．．．固定膠

Claims (9)

  1. 一種晶片組裝結構，包括一個電路板以及一個位於所述電路板上之晶片，所述電路板上設置有一個連接墊，其改進在於：所述連接墊上設置有一個通孔，所述通孔對應與所述晶片之組裝位置，所述通孔內設置有固定膠，所述固定膠之厚度小於所述連接墊之厚度，所述晶片設置於所述通孔內並藉由所述固定膠與所述電路板固定相連。
  2. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述通孔之形狀以及尺寸分別與所述晶片之形狀及尺寸相對應。
  3. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述連接墊之材料為金屬。
  4. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述連接墊之材料為銅。
  5. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述固定膠為熱固化膠或者所述紫外光固化膠。
  6. 一種晶片組裝方法，包括如下步驟：
    提供一個晶片；
    提供一個電路板；
    提供一個連接墊，所述連接墊上具有一個用於容置所述晶片之通孔；
    將所述連接墊設置於所述電路板上，使所述通孔對應於所述晶片之組裝位置；
    在所述通孔內設置固定膠，並且使所述固定膠之厚度小於所述連接墊之厚度；
    將所述晶片設置於所述通孔內，使所述晶片藉由所述固定膠與所述電路板固定相連。
  7. 如申請專利範圍第6項所述之晶片組裝方法，其中，所述通孔之形狀及尺寸分別對應於所述晶片之形狀及尺寸。
  8. 如申請專利範圍第6項所述之晶片組裝方法，其中，所述固定膠為熱固化膠或者所述紫外光固化膠。
  9. 一種光纖耦合模組，包括一個電路板以及一個位於所述電路板上之晶片，所述電路板上設置有一個連接墊，其改進在於：所述連接墊上設置有一個通孔，所述通孔對應與所述晶片之組裝位置，所述通孔內設置有固定膠，所述固定膠之厚度小於所述連接墊之厚度，所述晶片設置於所述通孔內並藉由所述固定膠與所述電路板固定相連。
TW101115017A 2012-04-27 2012-04-27 晶片組裝結構、晶片組裝方法及光纖耦合模組 TW201344268A (zh)

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