CN1717965A - 电子元件的安装方法 - Google Patents

电子元件的安装方法 Download PDF

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Publication number
CN1717965A
CN1717965A CNA2004800013595A CN200480001359A CN1717965A CN 1717965 A CN1717965 A CN 1717965A CN A2004800013595 A CNA2004800013595 A CN A2004800013595A CN 200480001359 A CN200480001359 A CN 200480001359A CN 1717965 A CN1717965 A CN 1717965A
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Prior art keywords
electronic component
base plate
conducting film
sheet
flexible base
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CN1717965B (zh
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小西美佐夫
波木秀次
篠崎润二
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Dexerials Corp
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Sony Chemicals Corp
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    • H05K13/04—Mounting of components, e.g. of leadless components
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    • H05K13/0469—Surface mounting by applying a glue or viscous material
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Abstract

一种在有配线电路的印刷基板(可挠性基板)上透过接着片—异方性导电膜安装电子元件的安装方法。在将前述异方性导电膜与前述可挠性基板之间空气加热的状态下，在前述可挠性基板安装前述电子元件的区域上贴上异方性导电膜。密封在异方性导电膜与可挠性基板之间的空气在冷却后体积会减少，因此能减少缝隙的发生与配线电路外露的问题。可以简化安装程序，并提升稳定性。

Description

电子元件的安装方法
技术领域
本发明是有关于一种电子元件的安装方法，且特别是有关于一种在装有配线电路的印刷电路板上，透过接着片(sheet)安装电子元件的方法。
背景技术
一般的COF(Chip on Film)安装方式如第1A图所示，在可挠性基板13上贴上异方性导电膜14，此可挠性基板13是由与电子元件的端子对应的配线电路11以及包围电子元件安装范围配线电路11的焊料保护层(solder resist)12所构成。同时如第1B图所示，在异方性导电膜14上在一定位置上安装有隆起部(bump)15的电子元件16，以加热方式压着。如此即可得到如第1C图所示的电子元件安装模块(module)。
但是在此COF安装上，如第1B图所示，由于配线电路11与焊料保护层12等的凹凸，会使异方性导电膜14与可挠性基板13之间残留空气。在此状态下若安装上电子元件16，则安装时所施加的热度与压力会导致封闭在异方性导电膜14与可挠性基板13之间的空气膨胀，产生缝隙17，严重的话此缝隙破裂会破坏到异方性导电膜14，造成配线电路外露部18产生，造成问题发生。此间隙17与配线电路外露部18都会降低电子元件安装模块的稳定性。
因此，为了避免此类问题发生，曾有发明提案在可挠性基板的厚度方向上设置一些孔，将封闭在内的空气释放出去(参照例如专利文献1：特开平5-343844号公报等)。根据专利文献1所示，非可挠性电路基板与可挠性电路基板在透过异方性导电膜接着成为一体时，可在可挠性电路基板被接着部范围朝厚度方向穿一些孔。如此一来，在专利文献1的连接方法中，如果进行加热，即使残留在非可挠性电路基板与可挠性电路基板之间的气泡(空气)发生膨胀，也不会残留在该范围内，而会透过可挠性电路基板被连接部范围的通气孔，轻易让气泡散去、脱离。
但是在前述的专利文献1的方法中，须事先将可挠性基板穿孔或加工，须增加一道工序，造成安装作业更为复杂。因此业界期待除了专利文献1所记载的方法外，还能开发出其它技术方案，解决前述问题。
发明内容
有鉴于此，本发明的目的就是在提供一种电子元件的安装方法，不会使安装作业更为复杂，而且能提升信赖性。
根据本发明的目的，提出一种电子元件的安装方法，此方法简述如下。本发明的电子组件的安装方法是在设有配线电路的印刷基板上，透过接着片安装电子元件的一种电子元件的安装方法，其特征为在前述接着片与前述印刷基板之间的空气在加热的状态下，将前述接着片贴在前述印刷基板的前述电子元件的安装范围上。
在如上的电子元件的安装方法中，接着片贴在印刷基板的工艺步骤由于接着片与印刷机板之间有一层加热了的空气，所以在接着片与印刷机板之间封有一层加热了的空气。被封住的空气随着温度冷却体积也会减少，所以被封闭的空气量在实质上会减少，当被封住的空气遇到例如在电子元件压着加热而膨胀时，也能减少发生缝隙或是配线电路外露的问题。
附图说明
为让本发明的上述目的、特征、和优点能更明显易懂，下文特举一较佳实施例，并配合所附图式，作详细说明如下：
图1A为现有的电子元件安装方法，是在贴上异方性导电膜工序时的截面图；
图1B为现有的电子元件安装方法，为电子元件安装工序的截面图；
图1C为现有的电子元件安装方法，为电子元件安装模块的概略平面图；
图2A为以本发明方法制造的电子元件安装模块一例中的概略平面图；
图2B为第2A图中A-A’线的概略截面图；
图3A为本发明的电子元件安装方法的工序示意图，为可挠性基板制作工序的概略截面图；
图3B为本发明的电子元件安装方法的工序示意图，为可挠性基板与异方性导电膜之间空气加热工序的概略截面图；
图3C为本发明的电子元件安装方法，为贴上异方性导电膜的工序概略截面图；
图3D为本发明的电子元件安装方法，为冷却可挠性基板的工序概略截面图；
图3E为本发明的电子元件安装方法，为电子元件安装工序的概略截面图；
图4为标示A～F中外观状态与缝隙比例的图表。
主要组件符号说明
1：可挠性基板                             5：异方性导电膜
2：配线电路                               6：焊料保护层
3：电子元件                               11：配线电路
4：隆起部                                 12：焊料保护层
13：可挠性基板                            16：电子元件
14：异方性导电膜                          17：间隙
15：隆起部                                18：配线电路外露部
具体实施方式
以下参照附图说明本发明的电子元件安装方法。首先说明以本发明方法制造的电子元件安装模块。
请参照第2A以及2B图，第2A图为以本发明方法制造的电子元件安装模块一例中的概略平面图，第2B图为第2A图中A-A’线的概略截面图。如第2B图所示，以本发明方法制造的电子元件安装模块在印刷基板，例如是可挠性基板1，上有多个配线电路2与电子元件3的隆起部(bump)4透过接着片，例如是异方性导电膜5，压附接合，在可挠性基板1上承载电子元件3，构成所谓的COF(Chip on film)的安装方式。
在可挠性基板1上，为了确保配线电路2彼此之间的绝缘性，并且为了保护配线电路2，所以让焊料保护层(solder resist)6露出欲与电子元件3的连接之部份配线电路2，但焊料保护层6包住另一部份的配线电路2。此外，焊料保护层6在电子元件3的安装区域有一个包起来的开口部。
异方性导电膜5是含有分散的导电性粒子的接着剂形成一层薄膜状，如异方性导电胶膜，将之与电子元件3、可挠性基板1压着在一起就能确保电源连接效果。异方性导电膜5的外型尺寸与焊料保护层6的内缘边缘重叠，异方性导电膜5覆盖住电子元件3的安装区域，并贴在焊料保护层6之上。此外，接着片不一定是前述的异方性导电膜5，也可以是不含导电性粒子的单纯接着剂片。
构成如上的电子元件安装模块可以采用此类电子元件安装模块的任何一种组件。
可挠性基板1可使用聚酰亚胺(Polyimide)等具有弹性的绝缘基板。可挠性基板1上的配线电路2是由同等的导体构成，对应于电子元件3的多个隆起部4。此外，印刷电路基板不仅可使用前述的可挠性基板1，也可使用所谓的硬板等、可适用于所有的配线基板。
电子元件3例如是半导体制成的IC芯片，表面有金属等端子构成隆起部4。
构成异方性导电膜5的接着剂可使用各种热硬化性树脂、热可塑性树脂、橡胶等。其中从连接后稳定度的角度来看，最好使用热硬化性树脂。热硬化性树脂有环氧树脂、密胺树脂、酚醛树脂(phenolic resin)、邻苯二甲酸二烯丙基酯树脂、粘胶丝马来酰亚胺三嗪(三氮杂苯)树脂、聚酯树脂、尿烷树脂、苯氧基树脂(Phenoxy resin)、聚酰胺树脂(Polyamide resin)或是聚酰亚胺树脂(Polyimide resin)等的合成树脂以及含Hydroxil羟基(hydroxyl)、羧基(carboxyl)、乙烯基(Vinyl)、胺基或环氧基等官能基的橡胶或人造橡胶等。其中尤其以环氧树脂等的各种特性为佳。环氧树脂可使用双苯基(Bis Phenyl)型环氧树脂、环氧酚醛树脂或是分子内有2个以上环氧乙烷(Oxirane)基的环氧化合物等。这类环氧树脂最好采用杂质离子、尤其是氯离子含量在50ppm以下的高纯度产品。
此外，异方性导电膜5所使用的导电性粒子可使用如镍(Ni)，银(Ag)，铜(Cu)或是这类物质的合金等的金属粉、将球状树脂粒子表面以导电材料包覆的导电包覆粒子施加金属电镀的制品、在表面加上绝缘性树脂包膜的具有良好导电性的粒子等等，以及各种过去的异方性导电性接着剂所使用的导电性粒子皆可。导电性粒子的直径最好在0.2μm～20μm之间。
由以上构成材料所形成的异方性导电膜5的融化粘度最好在1.0×105mPa·s～1.0×107mPa·s的范围内。异方性导电膜5的融化粘度若太大，则无法发挥充足的效果。
此外焊料保护层6可使用绝缘性保护材料等，或是使用一般此类电子元件安装模块所常用的焊料保护层皆可。
接着说明制造前述结构的电子元件安装模块的电子元件安装方法。
请参照第3A图，其绘示为本发明的电子元件安装方法的工序示意图，为可挠性基板制作工序的概略截面图。首先，将全面贴有铜箔的可挠性基板蚀刻，准备与所搭载的电子元件隆起部(未显示图中)相对应的多个配线电路2的可挠性基板1。在此可挠性基板1上，形成与电子元件3的隆起部(未显示图中)电源相连的配线电路2的一端，以及焊料保护层6，此焊料保护层6有一个开口部露出电子元件3安装区域的可挠性基板1的一部份，包围住电子元件安装区域。这个部份是第3A图的部份。
接着，如第3B图中箭头所示，将可挠性基板1加热等会使可挠性基板1上的空气也加热。在隔着加热空气的状态下，将异方性导电膜5贴在可挠性基板1的电子元件安装区域上，如第3C图所示。此时空气的温度愈高，被封在里面的空气量就会比实质还多，如果异方性导电膜5的接着剂使用热硬化性树脂时，热硬化性树脂的硬化温度最好比异方性导电膜5的反应温度还低。具体来说，空气的温度设在60℃以上，且异方性导电膜5的反应温度范围较佳的是介于90℃～150℃之间。
其次，贴上异方性导电膜5的可挠性基板1最好能经过一次冷却。将可挠性基板1冷却可获得如第3D图所示、让封闭在异方性导电膜5下的空气体积减少，确实抑制缝隙发生的效果。
然后要将电子元件3配置在一定的位置上，以使电子元件3的隆起部4形成面配置在异方性导电膜5侧，同时加热压着放上去的电子元件3。如此一来，透过异方性导电膜5的导电性粒子电子元件3的隆起部4与配线电路2的电源就能相连，完成如第3E图所示的电子元件安装模块。
在将异方性导电膜5贴附在可挠性基板1上的工序中，虽然无法避免可挠性基板1的凹凸形状造成其间有空气封入，但是在本发明当中，由于事先将存在异方性导电膜5与可挠性基板1之间的空气加热，因此被密封在里面的空气会变成膨胀的状态。换言之，事先将被密封在异方性导电膜5与可挠性基板1之间的空气进行实质上的减量。所以即使在电子元件的压着工序中再度加热，也能降低密封空气膨胀造成缝隙或是破坏异方性导电膜的问题发生。因此，采用本发明就能避免因为封闭空气造成缝隙发生、配线外露等问题，而能制造出稳定性极高的电子元件安装模块。此外，也不须在可挠性基板1上做穿设通气孔的工序，因此能以极为简单的方法即制造出稳定性极高的电子元件安装模块。
具体实施方式
以下根据实验结果说明适用本发明的具体实施例。
<实施例1>
在本实施例当中，异方性导电膜采用相对流动性较低的材料(ACF-1：高粘度)，中度流动性的材料(ACF-2：中粘度)以及高流动性材料(ACF-3：低粘度)制作电子元件安装模块。
首先准备有配线电路的可挠性基板，形成一个焊料保护层包围住IC芯片的安装区域。然后加热基板，让可挠性基板上的空气加热到40℃，然后贴上异方性导电膜同时要包住焊料保护层的开口部。此处所用的异方性导电膜为以德国Harch公司制粘度计RS150测定融化粘度(100℃)为2.5×107mPa·s的ACF-1。然后在异方性导电膜上的一定位置排列好IC芯片，经过加热、加压将IC芯片安装到可挠性基板上，成为电子元件安装模块。
另外以德国Harch公司制粘度计RS150测定融化粘度(100℃)为1.1×107mPa·s的ACF-2，其余以相同步骤制作了与前述相同的电子元件安装模块。
此外，再以德国Harch公司制粘度计RS150测定融化粘度(100℃)为4.0×106mPa·s的ACF-3以相同步骤制作了与前述相同的电子元件安装模块。
<实施例2>
在将可挠性基板上的空气加热至60℃的状态下，贴上异方性导电膜并包住焊料保护层的开口部，其余步骤与实施例1同样地制作3种使用异方性导电膜的电子元件安装模块。
<实施例3>
在将可挠性基板上的空气加热至80℃的状态下，贴上异方性导电膜并包住焊料保护层的开口部，其余步骤与实施例1同样地制作3种使用异方性导电膜的电子元件安装模块。
<实施例4>
在将可挠性基板上的空气加热至120℃的状态下，贴上异方性导电膜并包住焊料保护层的开口部，其余步骤与实施例1同样地制作3种使用异方性导电膜的电子元件安装模块。
<比较例>
在比较例中，除了采用与前述各实施例相同的异方性导电膜外，除贴上异方性导电膜的工序中未透过可挠性基板将空气加热外，其余皆与前述实施例相同地制作电子元件安装模块。此外，在比较例中位于可挠性基板与异方性导电膜之间的空气温度为室温25℃。
针对以上所制作出的各电子元件安装模块，从可挠性基板侧观察IC芯片的安装区域评量其缝隙的发生状态。评量结果如表1所示。在表1中各标示A～F的评量基准如第4图所示。换言之，当缝隙的发生比例在5％以下时为A，10％为B，20％为C，40％为D，60％为E，80％以上为F。
表1
  项目   比较例1   实施例1   实施例2   实施例3   实施例4
  加热温度   25℃   40℃   60℃   80℃   120℃
  ACF-1   F   F   E   D   B
  ACF-2   E   E   D   C   B
  ACF-3   C   B   A   A   A
从表1中可清楚看出，在贴上异方性导电膜的工序中，有将空气加热的各实施例和未将空气加热的比较例相较之下，缝隙发生的问题获得改善。特别在空气加热温度在60℃以上的实施例2～实施例4中，采用异方性导电膜ACF-3时，缝隙发生比例达到5％以下，其它异方性导电膜ACF-2，AFC-1也都明显获得改善。
由以上结果显示，不论异方性导电膜的粘度如何，在贴上异方性导电膜工序中将空气加热，能减低封闭在异方性导电膜与可挠性基板间的空气量，可明显减少缝隙发生的问题。
本发明上述实施例所揭露的电子元件安装方法，在贴上接着片工序中将空气加热，就能实际减少封闭于接着片与印刷基板间的空气量，所以就能避免缝隙发生与配线电路露出等的问题，制造出具有优秀稳定性的电子元件安装模块。

Claims (6)

1.一种电子元件安装方法，是在具有一配线电路的一印刷基板上透过一接着片安装该电子元件的方法，其特征在于：在加热封闭于该接着片与该印刷基板间空气的状态下，在该印刷基板之一电子元件安装区域上贴上该接着片。
2.根据权利要求1所述的电子元件安装方法，其特征在于：加热该印刷基板，用以加热该接着片与该印刷基板之间的空气。
3.根据权利要求2所述的电子元件安装方法，其特征在于：冷却贴有该接着片的该印刷基板之后，在该接着片上压着该电子元件。
4.根据权利要求1所述的电子元件安装方法，其特征在于：该加热温度的范围在60℃以上，该接着片的反应温度以下。
5.根据权利要求1、2、3或4所述的任一种电子元件安装方法，其特征在于：该接着片是一异方性导电膜。
6.根据权利要求1、2、3或4所述的任一种电子元件安装方法，其特征在于：该印刷基板是一可挠性基板。
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