TWI357787B - - Google Patents

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Publication number
TWI357787B
TWI357787B TW093114560A TW93114560A TWI357787B TW I357787 B TWI357787 B TW I357787B TW 093114560 A TW093114560 A TW 093114560A TW 93114560 A TW93114560 A TW 93114560A TW I357787 B TWI357787 B TW I357787B
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TW
Taiwan
Prior art keywords
electronic component
conductive film
anisotropic conductive
mounting
substrate
Prior art date
Application number
TW093114560A
Other languages
English (en)
Other versions
TW200511912A (en
Inventor
Misao Konishi
Hidetsugu Namiki
Jyunji Shinozaki
Original Assignee
Sony Chem & Inf Device Corp
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Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200511912A publication Critical patent/TW200511912A/zh
Application granted granted Critical
Publication of TWI357787B publication Critical patent/TWI357787B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Description

1357787 九、發明說明： 【發明所屬之技術領域】 本發明係有關於-種電子元件 :種在裝有配線電路的印刷電路板上 電子元件的方法。 设耆片〔sheet)女裝 【先前技術】 一般的 COF (Chip on Film)安驴古哲 _ 可撓性基板13上貼上異方性導電：/ 1A圖所不，在 Φ工、 崎電膜14’此可撓性基板13是由愈 電^件的端子對應的配線電路u以及包圍電子元件安裝範圍 配線電路u的銲料保護層（_er resist) 12所構成。同時如第 圖所示’在異方性導電膜14上在置上安裝有有隆起部 卿）15的電子兀件16，以加熱方式壓著。如此即可得到如 第1C圖所示之電子元件安裝模組（m〇duie)。 仁疋在此COF安裝上’如第1B圖所示，由於配線電路11 與銲料保護層12等相凸，會使異方性導電膜14與可撓性基板 13之間殘留空氣。在此狀態下若安裝上電子元彳16，則安裝時 所施加的熱度與壓力會導致封閉在異方性導電膜14與可撓=基 板13之間的空氣膨脹’產生缝隙17，嚴重的話此縫隙破裂會破 壞到異方性導電膜14，造成配線電路外露部〗8產生，造成問題 發生。此間隙17與配線電路外露部18都會降低電子元件安裝模 組的穩定性。 ^、 因此，為了避免此類問題發生，因此有發明提案在可撓性基 板的厚度方向上設置一些孔，將封閉在内的空氣釋放出去（參照 例如專利文獻1 :特開平5-343844號公報等）。根據專利文獻i
TW17I8PA 5 1357787 所示’非可撓性電路基板與可撓性電路基板在透過異方性導電膜 ，著成為-體時’可在可撓性電路基板被接著部範_厚度方向 些孔。如此-來，在專利文獻1的連接方法中，如果進行加 了，即使殘留在非可撓性電路基板與可撓性電路基板之間的氣泡 (空虱）即使發生膨脹’也不會殘留在該範圍内而會透過可撓 性電路基㈣連接部範_通氣孔，㈣錢泡散去脫離。 但是在前述的專利文獻〗的方法中，須事先將可触基板穿 ^加卫’須增加—道卫程’造成安裝作業更為繁複。因此業界 y除了專敎獻1所記載的方法外，還能開發出其他技術解決 月1j述問題。 【發明内容】 有鐘於此’本發明的目的就是在提供—種―種電子元件的安 裝方法，不會使安裝作業更為繁複’而且能提升信賴信。 …根據本發明的目的，提出—種電子元件的安裝方法此方法 柄述如下。本發明之電子元件的安裝方法係在設有配線電路的印 刷基板上，透過接著片安裝電子元件的一種電子元件的安裝方 法，其特徵為在前述接著片與前述印刷基板之間的空氣在加熱的 狀態下，將前述接著片貼在前述印刷基板的前數電子元件的安裝 範圍上。 ~ 在如上的電子元件的安裝方法中，接著片貼在印刷基板的工 程二驟由於接著片與印刷機板之間有_層加熱了的空氣所以在 3片與印刷機板之間封有—層加熱了的空氣。被封住的空氣隨 =酿f冷卻體積也會減少，所以被封閉的空氣量在實質上會減 夕’當被封住的空氣遇到例如在電子元件壓著加熱而膨脹時，也
TW1718PA 1357787 能減少發生縫隙或是配線電路外露的問題。 為讓本發明之上述目的、特徵、和優點能更明顯易懂，下文 特舉一較佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 以下參照圖面說明本發明之電子元件安裝方法。首先說明以 本發明方法製造之電子元件安裝模組。 請參照第2A以及2B圖’第2A圖為以本發明方法製造的 電子讀安裝模組-例中的概略平面圖，第2B圖為第Μ圖中 A-A’線的概略戴面圖。如第2B圖所示，以本發明方法製造之電 子凡件安裝模組在印刷基板，例如是可撓性基板i，上有多個配 線電路2與電子元件3的隆起部（bump)4透過接著片，例如是 異方性導電膜5,壓附接合，在可挽性基^上承載f子元件3, 構成所謂的COF ( Chip on film )的安裝方式。 、在可撓性基板1上，為了確保配線電路2彼此之間的絕緣 性办並且為了保護配線電路2，所以讓銲料保護層（solder re—) 6路出瓜與電子讀3的連接之部份配線電路2,但銲料保護層6 包，另-部份之配線電路2。此外，銲料保護層6在電子元件3 的安裝區域有一個包起來的開口部。 異方性導電膜5是含有分散的導電性粒子的 層薄膜狀，如異方性導電膠膜 :政 电吵联將之與電子兀件3、可撓性基板 1壓著在—域能確保電源連接效果。異方性導電膜5的外型尺 寸與輝料保護層6的内緣邊緣重疊，異方性導電膜5覆蓋住電子 兀安裝區域’並貼在鲜料保護層6之上。此外，接著片不 疋則述的異方性V電膜5，也可以是不含導電性粒子 接著劑片。 早4
TW1718PA 1357787 構成如上之電子元件安裝模組可以採用此類電子元件安跋 模組的任何一種元件皆可。 了撓性基板1可使用聚乙酿胺（Polyimide)等具有彈性之 絕緣基板。可撓性基板丨上的配線電路）是由銅等的導體構成， 對應於電子元件3的多個隆起部4。此外，印刷電路基板不只可 使用前述的可撓性基板丨，也可使用所謂的硬板等、可適用於所 有的配線基板。 電子元件3例如是半導體製成的IC晶片，表面有金屬等端 子構成隆起部4 * 構成異方性導電膜5的接著劑可使用各種熱硬化性樹脂、熱 可塑性樹脂、橡膠等。其中從連接後穩定度的角度來看，最好使 用熱硬化性樹脂。&硬化性書有環氧樹脂、美而寸皿樹脂、酚樹脂 (phenohc resin)、酸二烯丙酯樹脂（DiaUyi phthaiate ⑽⑷、 BT樹脂、聚酯樹脂、尿烷樹脂、苯氧樹脂（孙印〇町、聚 酿胺樹脂（Polyamide resin)或是聚乙醯胺（p〇lyamideresin)等 的合成樹脂以及含Hydroxil羥基（hydr〇xyi )、羧基（carb〇xyl )、 乙烯基（Vinyl)、胺基或環氧基等官能基之橡膠或人造橡膠等。 其中尤其以環氧樹脂等的各種特性為佳。環氧樹脂可使用雙苯基 (Bis Pheny。型環氧樹脂 '環氧酚醛樹脂或是分子内有2個以 上環氧乙炫（Oxirane)基的環氧化合物等。這類環氧樹脂最好採 用不純物離子、尤其是氣離子在5Gppm以下的高純度品。 此外’異方性導電膜5所使用的導電性粒子可使用如錦（犯）， 銀（Ag) ’銅（Cu)或是這類物質的合金等的金屬粉、將球狀樹 脂粒子表面以導電材料包覆的導電包覆粒子施加金屬電鍵之製 品'在表面加上絕緣性樹脂包膜之具有良好導電性的粒子等等， 以及各種過去之異方性導電性接著劑所使用的導電性粒子皆
TW1718PA 1357787 可。導電性粒子的直徑最好在0.2gm〜2〇/zm之間。 由以$上構成材料所形成的異方性導電膜5的融化黏度最好 在1.0xl05mPa· s'i.OxiVmpa · s的範圍内。異方性導電膜$的 融化黏度若太大則無法發揮充足的效果。 此外銲料保護層6可使用絕緣性保護材料等，或是使用一般 此類電子元件安裝模組所常用的銲料保護層皆可。 接著說明製造前述結構之電子元件安裝模組的電子元件安 裝方法。 明參照第3 A圖，其繪示為本發明之電子元件安装方法的工 程圖’為可撓性基板製作工程的概略截面圖。首先，將全面貼有 銅猪的可撓性基板㈣，準備與所搭載之電子元件隆起部（未顯 示圖中）相對應之多個配線電路2的可撓性基板丨。在此可撓性 基板U，形成與電子元件3的隆起部（未顯示圖中）電源相連 的配線電路2的-端’以及銲料保護層6，此銲料保護層6有一 個開口部露出電子元件3安裝區域的可撓性基板i之_部份，包 圍住電子元件安裝區域。這個部份是第3A圖的部份。 接著，如第3B圖中箭頭所示，將可撓性基板i加熱等會使 可撓性基板1上的空氣也加熱。在隔著加熱空氣的狀態下，將異 方性導電膜5貼在可撓性基板！的電子元件安裝區域上如第π 圖所不。此時空氣的溫度愈高，被封在裡.面的空氣量就會比實質 還多’如果異方性導電膜5的接著劑使賴硬化性樹脂時敎硬 化性樹脂的硬化溫度最好比異方性導電膜5的反應溫度還低。、具 體來說，空氣的溫度設在6(rc以上，且異方性導電膜5的反應溫 度範圍較佳的是介於90°C〜150°C之間。 其次，貼上異方性導電膜5的可撓性基板丨最好能經過一次 冷卻。將可撓性基板i冷卻可獲得如帛3D圖所示、軸閉在異
TW1718PA 9 I357787 方性導電膜5下之空氣體積減少，確 .然後要將電子元件3配置在一定貫的^縫卜隙發生的效果。 的隆起部4形成面配置在展方阽道帝 置上，以使電子7〇.件3 , i广成面配置在異方性導電膜5側同時加熱 去的電子元件3。如此一來，透過展太从，曾 …、 電子元件3的隆起部4與配線電路2的電==導電性粒子 3E圖所示之電子元件安裝模組。的電^能相連，完成如第 在將異綠導電膜5貼附在可撓性基板】上的卫程中雖铁 :避免可撓性基板i的凹凸形狀造成其間有空氣封入 在 :當中’由於事先將存在異方性導電膜5與可撓性基板i Ϊ ::::熱，因此被密封在裡面的空氣會變成膨脹的狀態。換 質=T性導電膜5與可挽性基板1之間的空 即使在電子元件的壓著工程中再度加 …此降低㈣空氣膨脹造成縫隙或是破壞異方 題發生。因此’採用本發明就能避免因為封閉空氣造成縫= 生配線外露等問題，而能製造出穩定性極高的電子元件安裝模 組。此外在可撓性基板i上料設通氣孔的卫程因此 能以極為簡料方法即製造出穩定性極高的電子元件安裝模紐。 實施例 以下根據實驗結果說明適用本發明之具體實施例。 <實施例1 > 在本實施例當中，異方性導電膜採用相對流動性較低之材料 (ACF-1 :高黏度），中度流動性 CF_2 : 高流動性材料UCR低黏度）製作電子元件安裝 以及 百先準備有配線電路的可撓性基板，形成一個銲料保護層包 圍住1C晶片的安裝區域。然後加熱基板，讓可撓性基板上的空
TWJ718PA 1357787 乳加熱到4GC，㈣貼上異方性導電膜同時要包住銲料保護層的 開口部。此處所用之異方性導電膜為以德國Harch公司製黏度計 Rsi5〇測定融化黏度（刚。c )為2 5xi〇7mpa · s的acf i。然後 在異方性導電膜上的位置排列好IC晶片，經過加熱、加壓 將1C晶片安裝到可撓性基板上，成為電子元件安裝模組。 。另外以德國Harch公司製黏度計RS150測定融化黏度（100 C )為1.1x10 mPa . s❼ACF2，其餘以相同步驟製作了與前述 相同的電子元件安裝模組。 此外，再以德國Harch公司製黏度計RS150敎融化黏度 (1〇〇。0為4.0XH)Vpa· s的ACF_3以相同步驟製作了與前述 相同的電子元件安裝模組。 <實施例2 > 在將可撓性基板上的空氣加熱至6〇。。的狀態下貼上異方 性導電膜ϋ包住銲料保護層的開口部，其餘步驟與實施例！同樣 地製作3種使用異方性導電_電子元件安裝額。 <實施例3 > 在將可撓性基板上的空氣加熱至8〇。匸的狀態下貼上異方 !·生導電膜並包住&料保護層的開口部，其餘步驟與實施例i同樣 地製作3種使用異方性導電膜的電子元件安裝模組。 <實施例4 > 在將可撓性基板上的空氣加熱至12〇。匸的狀態下貼上異方 2電膜並包住銲料保護層的開口部，其餘步驟與實施例1同樣 地製作3種使用異方性導電祺的電子元件安裝模組。 <比較例> 外’ 在比較例令，除了採用 除貼上異方性導電膜的 與前述各實施例相同的異方性導電膜 工程中未透過可撓性基板將空氣加熱
TWI718PA

Claims (1)

  1. f。。年）月？日修(<)止替換胃 100年2月8曰修正替換頁 、申請專利範圍： 基板二:種1子，件安裝方法，係在具有-配線電路的-印刷 ㈣安裝該電子元件的方法，該電子元件安裝方 印刷=熱封閉於該接著片與該印刷基板間线的狀態下，在該 P刷基板之-電子元件安裝區域上貼上該接著片。 徵在於 如申明專利範圍帛1項所述之電子元件安裝方法，其特 氣 加熱該印刷基板’用以加熱該接著片與該印刷基板之間 的空 徵在於 3.如申請專利範圍第2項所述之電子元件安裝 方法，其特 冷部貼有该接著片的該印刷基板之後，在該接著片上壓著該 電子元件。 4.如申請專利範圍第1項所述之電子元件安裝方法，其特 徵在於： 該加熱溫度係不小於60°C且不大於150°C。 或4項所述之電子元件安裝 5.如申請專利範圍第i、2 方法’其特徵在於： 該接著片係一異方性導電膜 6.如申請專利範圍第1、2、3或4項所述之電子元件安裝 1357787 100年2月8日修正替換頁 方法 (q〇年lee dlfs./pL替換頁 徵在於: 該印刷基板係一可撓性基板。
    17
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