WO2009072492A1 - 感光性接着剤 - Google Patents

感光性接着剤 Download PDF

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Publication number
WO2009072492A1
WO2009072492A1 PCT/JP2008/071882 JP2008071882W WO2009072492A1 WO 2009072492 A1 WO2009072492 A1 WO 2009072492A1 JP 2008071882 W JP2008071882 W JP 2008071882W WO 2009072492 A1 WO2009072492 A1 WO 2009072492A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive adhesive
patterned
adhesive
exposure
development
Prior art date
Application number
PCT/JP2008/071882
Other languages
English (en)
French (fr)
Inventor
Takashi Masuko
Takashi Kawamori
Kazuyuki Mitsukura
Shigeki Katogi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009544676A priority Critical patent/JPWO2009072492A1/ja
Priority to CN200880119113.6A priority patent/CN101884104B/zh
Priority to US12/745,592 priority patent/US8258017B2/en
Priority to EP08856532A priority patent/EP2224483A1/en
Publication of WO2009072492A1 publication Critical patent/WO2009072492A1/ja
Priority to US13/551,816 priority patent/US8507323B2/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
    • C08G65/332—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
    • C08G65/3322—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof acyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/333—Polymers modified by chemical after-treatment with organic compounds containing nitrogen
    • C08G65/33303—Polymers modified by chemical after-treatment with organic compounds containing nitrogen containing amino group
    • C08G65/33306—Polymers modified by chemical after-treatment with organic compounds containing nitrogen containing amino group acyclic
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    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
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Abstract

　露光及び現像によってパターニングされた後に被着体に対する接着性を有し、アルカリ現像が可能な感光性接着剤であって、半導体チップ２０の回路面上に設けられた感光性接着剤１を露光及び現像によってパターニングする工程と、パターニングされた感光性接着剤１に他の半導体チップ２１を直接接着する工程と、を備える半導体装置１００の製造方法に用いるための、感光性接着剤。
PCT/JP2008/071882 2007-12-04 2008-12-02 感光性接着剤 WO2009072492A1 (ja)

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JP2009544676A JPWO2009072492A1 (ja) 2007-12-04 2008-12-02 感光性接着剤
CN200880119113.6A CN101884104B (zh) 2007-12-04 2008-12-02 感光性粘接剂
US12/745,592 US8258017B2 (en) 2007-12-04 2008-12-02 Photosensitive adhesive
EP08856532A EP2224483A1 (en) 2007-12-04 2008-12-02 Photosensitive adhesive
US13/551,816 US8507323B2 (en) 2007-12-04 2012-07-18 Method of producing semiconductor device with patterned photosensitive adhesive

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JP2007313886 2007-12-04
JP2007-313886 2007-12-04

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US12/745,592 A-371-Of-International US8258017B2 (en) 2007-12-04 2008-12-02 Photosensitive adhesive
US13/551,816 Division US8507323B2 (en) 2007-12-04 2012-07-18 Method of producing semiconductor device with patterned photosensitive adhesive

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JP (3) JPWO2009072492A1 (ja)
KR (1) KR20100074296A (ja)
CN (2) CN101884104B (ja)
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001942A1 (ja) * 2009-06-30 2011-01-06 日立化成工業株式会社 感光性接着剤、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP2011116968A (ja) * 2009-10-30 2011-06-16 Hitachi Chem Co Ltd 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。
CN102687256A (zh) * 2009-11-13 2012-09-19 日立化成工业株式会社 膜状粘接剂的制造方法、粘接片和半导体装置及其制造方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101068372B1 (ko) 2005-07-05 2011-09-28 히다치 가세고교 가부시끼가이샤 감광성 접착제, 및 이것을 이용하여 얻어지는 접착 필름, 접착 시트, 접착제층 부착 반도체 웨이퍼, 반도체장치 및 전자부품
US8074714B2 (en) * 2009-06-17 2011-12-13 Baker Hughes Incorporated System, method and apparatus for downhole orientation probe sensor
US9911683B2 (en) * 2010-04-19 2018-03-06 Nitto Denko Corporation Film for back surface of flip-chip semiconductor
KR20120082714A (ko) * 2011-01-14 2012-07-24 삼성엘이디 주식회사 발광소자용 접착필름 및 이를 이용한 발광다이오드 패키지 제조방법
DE102011085038A1 (de) * 2011-10-21 2013-04-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
EP2906654B1 (en) 2012-10-09 2020-04-08 Avery Dennison Corporation Adhesives and related methods
US9082681B2 (en) * 2013-03-29 2015-07-14 Stmicroelectronics Pte Ltd. Adhesive bonding technique for use with capacitive micro-sensors
US9618653B2 (en) 2013-03-29 2017-04-11 Stmicroelectronics Pte Ltd. Microelectronic environmental sensing module
US9176089B2 (en) 2013-03-29 2015-11-03 Stmicroelectronics Pte Ltd. Integrated multi-sensor module
US9000542B2 (en) 2013-05-31 2015-04-07 Stmicroelectronics Pte Ltd. Suspended membrane device
WO2015008330A1 (ja) * 2013-07-16 2015-01-22 日立化成株式会社 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP6270024B2 (ja) * 2013-10-04 2018-01-31 日立化成株式会社 感光性接着剤組成物、それを用いる半導体装置の製造方法、及び半導体装置
JP6314416B2 (ja) * 2013-10-17 2018-04-25 富士電機株式会社 半導体装置
US10254261B2 (en) 2016-07-18 2019-04-09 Stmicroelectronics Pte Ltd Integrated air quality sensor that detects multiple gas species
US10429330B2 (en) 2016-07-18 2019-10-01 Stmicroelectronics Pte Ltd Gas analyzer that detects gases, humidity, and temperature
KR102576813B1 (ko) * 2016-10-07 2023-09-11 삼성전자주식회사 터치스크린 디스플레이 및 이를 포함하는 전자 장치
US10557812B2 (en) 2016-12-01 2020-02-11 Stmicroelectronics Pte Ltd Gas sensors

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1124257A (ja) 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性ポリイミド前駆体組成物及びそれを用いたパターン製造法
JP2000290501A (ja) 1999-04-05 2000-10-17 Nitto Denko Corp 感光性ポリイミド樹脂前駆体及び接着剤
JP2001329233A (ja) 2000-03-15 2001-11-27 Shin Etsu Chem Co Ltd フィルム状電子部品用接着剤及び電子部品
JP2004022996A (ja) * 2002-06-19 2004-01-22 Mitsui Chemicals Inc 半導体チップの積層方法
WO2007004569A1 (ja) * 2005-07-05 2007-01-11 Hitachi Chemical Company, Ltd. 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05282706A (ja) 1991-08-01 1993-10-29 Canon Inc 光記録媒体とその製造方法及び光記録媒体用基板
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
JPH1027827A (ja) 1996-07-10 1998-01-27 Toshiba Corp 半導体装置の製造方法
JP3999840B2 (ja) 1997-04-16 2007-10-31 日東電工株式会社 封止用樹脂シート
JP4390028B2 (ja) * 2000-10-04 2009-12-24 日産化学工業株式会社 ポジ型感光性ポリイミド樹脂組成物
JPWO2004070826A1 (ja) 2003-02-06 2006-06-01 富士通株式会社 電極間接続構造体の形成方法および電極間接続構造体
US7250310B1 (en) * 2004-06-21 2007-07-31 National Semiconductor Corporation Process for forming and analyzing stacked die
JP4428189B2 (ja) 2004-10-15 2010-03-10 住友ベークライト株式会社 樹脂封止型半導体装置
KR100687069B1 (ko) * 2005-01-07 2007-02-27 삼성전자주식회사 보호판이 부착된 이미지 센서 칩과 그의 제조 방법
JP5087923B2 (ja) * 2005-06-30 2012-12-05 東レ株式会社 感光性樹脂組成物およびパターンの形成方法
KR100621438B1 (ko) * 2005-08-31 2006-09-08 삼성전자주식회사 감광성 폴리머를 이용한 적층 칩 패키지 및 그의 제조 방법
JP2007192936A (ja) * 2006-01-17 2007-08-02 Asahi Kasei Electronics Co Ltd ポジ型感光性樹脂組成物
JP5157229B2 (ja) * 2006-04-11 2013-03-06 日立化成株式会社 接着シート
JP2007294767A (ja) * 2006-04-26 2007-11-08 Renesas Technology Corp 半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1124257A (ja) 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性ポリイミド前駆体組成物及びそれを用いたパターン製造法
JP2000290501A (ja) 1999-04-05 2000-10-17 Nitto Denko Corp 感光性ポリイミド樹脂前駆体及び接着剤
JP2001329233A (ja) 2000-03-15 2001-11-27 Shin Etsu Chem Co Ltd フィルム状電子部品用接着剤及び電子部品
JP2004022996A (ja) * 2002-06-19 2004-01-22 Mitsui Chemicals Inc 半導体チップの積層方法
WO2007004569A1 (ja) * 2005-07-05 2007-01-11 Hitachi Chemical Company, Ltd. 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001942A1 (ja) * 2009-06-30 2011-01-06 日立化成工業株式会社 感光性接着剤、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
CN102471664A (zh) * 2009-06-30 2012-05-23 日立化成工业株式会社 感光性粘接剂、以及使用该粘接剂的膜状粘接剂、粘接片、粘接剂图形、带有粘接剂层的半导体晶片和半导体装置
JP5549671B2 (ja) * 2009-06-30 2014-07-16 日立化成株式会社 感光性接着剤、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP2011116968A (ja) * 2009-10-30 2011-06-16 Hitachi Chem Co Ltd 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。
US9309446B2 (en) 2009-10-30 2016-04-12 Hitachi Chemical Company, Ltd. Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device
CN102687256A (zh) * 2009-11-13 2012-09-19 日立化成工业株式会社 膜状粘接剂的制造方法、粘接片和半导体装置及其制造方法

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JP2013033972A (ja) 2013-02-14
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US8507323B2 (en) 2013-08-13
JPWO2009072492A1 (ja) 2011-04-21
US20110045639A1 (en) 2011-02-24
US8258017B2 (en) 2012-09-04
TW200938606A (en) 2009-09-16
JP5758362B2 (ja) 2015-08-05
CN101884104A (zh) 2010-11-10
EP2224483A1 (en) 2010-09-01
US20120282547A1 (en) 2012-11-08
CN102915932A (zh) 2013-02-06
KR20100074296A (ko) 2010-07-01

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