JP2013033972A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP2013033972A JP2013033972A JP2012196277A JP2012196277A JP2013033972A JP 2013033972 A JP2013033972 A JP 2013033972A JP 2012196277 A JP2012196277 A JP 2012196277A JP 2012196277 A JP2012196277 A JP 2012196277A JP 2013033972 A JP2013033972 A JP 2013033972A
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- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
- C08G65/332—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
- C08G65/3322—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof acyclic
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Abstract
【解決手段】露光及び現像によってパターニングされた後に被着体に対する接着性を有し、アルカリ現像が可能な感光性接着剤であって、半導体チップ20の回路面上に設けられた感光性接着剤1を露光及び現像によってパターニングする工程と、パターニングされた感光性接着剤1に他の半導体チップ21を直接接着する工程と、を備える半導体装置100の製造方法に用いるための、感光性接着剤。
【選択図】図5
Description
Claims (20)
- 半導体チップの回路面上に設けられた感光性接着剤を露光及び現像によってパターニングする工程と、
パターニングされた前記感光性接着剤に他の半導体チップを直接接着する工程と、を備え、
前記感光性接着剤が、露光及び現像によってパターニングされた後に被着体に対する接着性を有する、半導体装置の製造方法。 - 前記感光性接着剤が、アルカリ現像が可能である、請求項1に記載の半導体装置の製造方法。
- パターニングされた前記感光性接着剤がバッファーコート膜である、請求項1又は2に記載の半導体装置の製造方法。
- 前記感光性接着剤がアルカリ可溶性ポリマーと、放射線重合性化合物と、光重合開始剤と、を含有する、請求項1〜3のいずれか一項に記載の半導体装置の製造方法。
- 前記アルカリ可溶性ポリマーがカルボキシル基又はフェノール性水酸基を有する、請求項4に記載の半導体装置の製造方法。
- 前記アルカリ可溶性ポリマーのガラス転移温度が150℃以下である、請求項4又は5に記載の半導体装置の製造方法。
- 前記アルカリ可溶性ポリマーがポリイミドである、請求項4〜6のいずれか一項に記載の半導体装置の製造方法。
- 前記感光性接着剤が熱硬化性樹脂を更に含有する、請求項4〜8のいずれか一項に記載の半導体装置の製造方法。
- 前記感光性接着剤がフィルム状である、請求項1〜9のいずれか一項に記載の半導体装置の製造方法。
- 半導体チップの回路面上に設けられた感光性接着剤を露光及び現像によってパターニングする工程と、パターニングされた前記感光性接着剤に他の半導体チップを直接接着する工程と、を備える半導体装置の製造方法により得られ、
前記感光性接着剤が、露光及び現像によってパターニングされた後に被着体に対する接着性を有する、半導体装置。 - 前記感光性接着剤が、アルカリ現像が可能である、請求項11に記載の半導体装置。
- パターニングされた前記感光性接着剤がバッファーコート膜である、請求項11又は12に記載の半導体装置。
- 前記感光性接着剤がアルカリ可溶性ポリマーと、放射線重合性化合物と、光重合開始剤と、を含有する、請求項11〜13のいずれか一項に記載の半導体装置。
- 前記アルカリ可溶性ポリマーがカルボキシル基又はフェノール性水酸基を有する、請求項14に記載の半導体装置。
- 前記アルカリ可溶性ポリマーのガラス転移温度が150℃以下である、請求項14又は15に記載の半導体装置。
- 前記アルカリ可溶性ポリマーがポリイミドである、請求項14〜16のいずれか一項に記載の半導体装置。
- 前記感光性接着剤が熱硬化性樹脂を更に含有する、請求項14〜18のいずれか一項に記載の半導体装置。
- 前記感光性接着剤がフィルム状である、請求項11〜19のいずれか一項に記載の半導体装置。
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- 2008-12-02 EP EP08856532A patent/EP2224483A1/en not_active Withdrawn
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JP2006114757A (ja) * | 2004-10-15 | 2006-04-27 | Sumitomo Bakelite Co Ltd | 樹脂封止型半導体装置 |
WO2007004345A1 (ja) * | 2005-06-30 | 2007-01-11 | Toray Industries, Inc. | 感光性樹脂組成物および接着改良剤 |
WO2007004569A1 (ja) * | 2005-07-05 | 2007-01-11 | Hitachi Chemical Company, Ltd. | 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015072409A (ja) * | 2013-10-04 | 2015-04-16 | 日立化成株式会社 | 感光性接着剤組成物、それを用いる半導体装置の製造方法、及び半導体装置 |
JP2015079874A (ja) * | 2013-10-17 | 2015-04-23 | 富士電機株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
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EP2224483A1 (en) | 2010-09-01 |
US20120282547A1 (en) | 2012-11-08 |
CN102915932A (zh) | 2013-02-06 |
CN101884104A (zh) | 2010-11-10 |
JP2014220509A (ja) | 2014-11-20 |
US20110045639A1 (en) | 2011-02-24 |
JPWO2009072492A1 (ja) | 2011-04-21 |
TW200938606A (en) | 2009-09-16 |
WO2009072492A1 (ja) | 2009-06-11 |
JP5758362B2 (ja) | 2015-08-05 |
US8258017B2 (en) | 2012-09-04 |
KR20100074296A (ko) | 2010-07-01 |
CN101884104B (zh) | 2014-05-28 |
US8507323B2 (en) | 2013-08-13 |
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