JP2009141008A - 半導体装置及びその製造方法、並びに、感光性接着フィルム - Google Patents
半導体装置及びその製造方法、並びに、感光性接着フィルム Download PDFInfo
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Abstract
【解決手段】本発明は、露光及び現像によってパターニングされた後に絶縁性及び被着体に対する接着性(再接着性)を有しアルカリ現像が可能な感光性接着剤を使用し、半導体素子8aと、半導体素子8aが搭載される支持部材6とを備える半導体装置を製造する方法に関する。すなわち、本発明に係る半導体装置の製造方法は、支持部材6の半導体搭載面6a上に上記性能を有する感光性接着剤層10を直接付設する工程と、半導体搭載面6a上の感光性接着剤層10を露光及び現像によってパターニングする工程と、パターニングされた感光性接着剤層(絶縁層)10aに半導体素子8aを直接接着する工程とを備える。
【選択図】図5
Description
Claims (9)
- 半導体素子と、当該半導体素子が搭載される支持部材とを備える半導体装置の製造方法であって、
露光及び現像によってパターニングされた後に絶縁性及び被着体に対する接着性を有しアルカリ現像が可能な感光性接着剤層を、前記支持部材の半導体搭載面上に直接付設する工程と、
前記半導体搭載面上の前記感光性接着剤層を露光及び現像によってパターニングする工程と、
パターニングされた前記感光性接着剤層に前記半導体素子を直接接着する工程と、
を備える方法。 - 前記感光性接着剤層が、アルカリ可溶性ポリマーと、放射線重合性化合物と、光重合開始剤とを含有する、請求項1に記載の方法。
- 前記アルカリ可溶性ポリマーがカルボキシル基又はフェノール性水酸基を有する、請求項2に記載の方法。
- 前記アルカリ可溶性ポリマーのガラス転移温度が150℃以下である、請求項2又は3に記載の方法。
- 前記アルカリ可溶性ポリマーがポリイミドである、請求項2〜4のいずれか一項に記載の方法。
- 前記感光性接着剤層が、熱硬化性樹脂を更に含有する、請求項1〜6のいずれか一項に記載の方法。
- 請求項1〜7のいずれか一項に記載の半導体装置の製造方法における前記感光性接着剤層として使用される感光性接着フィルム。
- 請求項8に記載の感光性接着フィルムによって、半導体素子と、当該半導体素子が搭載される支持部材とが接着されてなる半導体装置。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009242771A (ja) * | 2008-03-11 | 2009-10-22 | Hitachi Chem Co Ltd | 感光性接着剤組成物、接着シート、接着剤パターン、接着剤層付半導体ウェハ、並びに半導体装置及びその製造方法 |
JP2011042730A (ja) * | 2009-08-20 | 2011-03-03 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置 |
JP2011042729A (ja) * | 2009-08-20 | 2011-03-03 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006114757A (ja) * | 2004-10-15 | 2006-04-27 | Sumitomo Bakelite Co Ltd | 樹脂封止型半導体装置 |
WO2007004569A1 (ja) * | 2005-07-05 | 2007-01-11 | Hitachi Chemical Company, Ltd. | 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品 |
JP2007059815A (ja) * | 2005-08-26 | 2007-03-08 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
-
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- 2007-12-04 JP JP2007313794A patent/JP2009141008A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006114757A (ja) * | 2004-10-15 | 2006-04-27 | Sumitomo Bakelite Co Ltd | 樹脂封止型半導体装置 |
WO2007004569A1 (ja) * | 2005-07-05 | 2007-01-11 | Hitachi Chemical Company, Ltd. | 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品 |
JP2007059815A (ja) * | 2005-08-26 | 2007-03-08 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009242771A (ja) * | 2008-03-11 | 2009-10-22 | Hitachi Chem Co Ltd | 感光性接着剤組成物、接着シート、接着剤パターン、接着剤層付半導体ウェハ、並びに半導体装置及びその製造方法 |
JP2011042730A (ja) * | 2009-08-20 | 2011-03-03 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置 |
JP2011042729A (ja) * | 2009-08-20 | 2011-03-03 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置 |
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