JP2014500360A - 反応性導電性感圧接着テープ - Google Patents
反応性導電性感圧接着テープ Download PDFInfo
- Publication number
- JP2014500360A JP2014500360A JP2013541037A JP2013541037A JP2014500360A JP 2014500360 A JP2014500360 A JP 2014500360A JP 2013541037 A JP2013541037 A JP 2013541037A JP 2013541037 A JP2013541037 A JP 2013541037A JP 2014500360 A JP2014500360 A JP 2014500360A
- Authority
- JP
- Japan
- Prior art keywords
- reactive
- conductive
- pressure sensitive
- adhesive tape
- sensitive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
【選択図】図1
Description
本出願は、そのすべての内容が参照により本明細書に組み込まれる、2010年11月23日出願の米国特許出願第61/416,385号の優先権を主張するものである。
実施例1は、硬化性アクリルベースポリマーおよびラジカル硬化性架橋成分に基づく反応性導電性PSAの実施形態を例証する。感圧接着剤組成物を、表1に示すように配合し、ここで、部は重量部である。
実施例1 熱硬化前−非常に強いタック
実施例1 熱硬化後−僅かなタックからタックなし
0.5インチ×1.4ミル厚さのスズコーティング銅箔と実施例1において作製したテープ構築物の0.25インチ幅の条片とを重ね合わせることにより、オーバーラップ接点を作製した。光起電力モジュール用の典型的なEVA封入条件をモデル化するために、これらのサンプルを、25psiの下、150℃にて10分間硬化した。サンプルを室温まで冷却した。
実施例2は、ヒドロキシ官能性アクリルPSAポリマーベース樹脂およびブロックイソシアネート架橋成分から形成される反応性導電性PSAを例証する。ヒドロキシル官能性アクリルポリマー(27g、90重量部エチルヘキシルアクリレート、10重量部ヒドロキシエチルアクリレート、Mn 約250K、Mw 約550K)とブロックイソシアネート溶液Trixene BI−7982(4g、DMP−ブロックHDI三量体、バキセンデンケミカル(Baxenden Chemical)製)とを酢酸エチル(70g)中に溶解することにより、溶媒型導電性PSAを形成した。この溶液へ、公称35μmのAg−コーティングガラスビーズ(15g、ポッターズインダストリーズ(Potters Industries)製Conduct−O−Fil TP35−S12)を、メカニカルブレードミキサーを用いて攪拌しながらゆっくり添加した。
実施例2と同様に、実施例3は、ヒドロキシ官能性アクリルPSAポリマーベース樹脂およびブロックイソシアネート架橋成分から形成される反応性導電性PSAの別の実例である。ヒドロキシル官能性アクリルPSAベース樹脂(13.4gの酢酸エチル溶媒中8.9gのポリマー)、ジメチルピラゾール(DMP)−ヘキサメチレンジイソシアネート(HDI)三量体付加体のブロックイソシアネート硬化剤(1.1gのメチルエチルケトン溶媒中1.1gの付加体)、およびAg−コーティングガラスビーズ(2.1g)を、ボルテックスミキサーを用いて攪拌しながら混合することで、実施例2に記載のものと同様の硬化性導電性PSAを配合した。この接着剤を、ドローダウンバーを用いて剥離ライナー上にコーティングし、対流式オーブン中にて乾燥して、厚さ1.7ミルの乾燥接着剤フィルムを得た。このフィルムを、SnコーティングCu箔支持体へ、ラボローラー(lab roller)を用いて積層した。
実施例4は、アクリルポリマーPSAベース樹脂から、潜在的不溶性固体エポキシ架橋成分を用いて形成される反応性導電性PSAを用いた実施形態を例証するものである。10gのトリス(エポキシプロピル)イソシアヌレート粉末(TEPIC)(TCIアメリカから入手)および5gのジシアンジアミド固体粉末(DICY)(エアープロダクツ(Air Products)よりDicyanex 1400Bとして入手)を、アクリルポリマー合成においてモノマーフィード中に含有させたグリシジルメタクリレートを5重量%含む固体ポリマー85gを有するエポキシ官能性アクリル感圧接着剤の酢酸エチル溶液212.5g中に分散させることにより、溶媒型導電性PSAを形成する。この分散液へ、公称35μmのAg−コーティングガラスビーズ(30g、ポッターズインダストリーズ製Conduct−O−Fil TP35−S12)を、メカニカルブレードミキサーを用いて攪拌しながらゆっくり添加する。
実施例2で作製された反応性導電性テープを、封入オーバーラップ接点を作ることで、基準となる非反応性荷電キャリアテープと比較した。0.5インチ幅×1.4ミル厚さのスズコーティング銅箔と実施例2において作製した反応性テープ構築物の0.25インチ幅の条片とを重ね合わせることにより、ガラス基材上に接点を作製した。ポリマー封入剤の層を接点上に配置し、続いて第二のガラスプレートを配置した。ソーラーセル封入プロセスをモデル化するために、この多層構造を、加圧下、150℃にて10分間熱ラミネートした。類似のオーバーラップ接点を、基準となる非反応性荷電キャリアテープを用いて構築した。サンプルを室温まで冷却した。オーバーラップ接点の抵抗を1、5、および10アンペアの電流で測定し(「上昇」データ)、続いて接点を10アンペアの電流にて60分間保持した。次に、電流を10から5、1アンペアへと段階的に低下させながら接点の抵抗を再度測定した(「降下」データ)。結果を以下の表4に示す。
実施例1の表1に表される接着剤製剤を、2ミル(0.002インチ)のシリコーン剥離ライナーに適用し、65℃にて5分間乾燥して、1.5ミル(0.0015インチ)厚さの接着剤層を剥離ライナー上に得た。第二の2ミル(0.002インチ)のシリコーン剥離ライナーを、露出した接着剤表面に積層した。
ソーラーパネル試験用のUL1703プロトコルに準拠する方法を用い、封入ラップ接点(lap joint)サンプルを−40℃から85℃のサイクル(「T−サイクル」)に掛けることによる促進試験を用いることで、実施例3に記載の硬化性導電性PSAを、典型的な非硬化性導電性PSAと比較した。
Claims (28)
- 反応性接着剤層であって:
硬化性感圧接着剤、および、
導電性充填剤、
を含む、反応性接着剤層;ならびに、
導電性基材であって、ここで、前記接着剤層は、前記導電性基材上に、それと接触して積層される、導電性基材、
を有し、
ここで、前記接着剤層の硬化プロファイルは、光起電力セル製造プロセスの硬化プロファイルに対応するように予め選択される、反応性導電性接着テープ。 - 前記硬化性感圧接着剤が、反応性ポリマーを含む、請求項1に記載の反応性導電性接着テープ。
- 前記硬化性感圧接着剤が、架橋成分をさらに含む、請求項2に記載の反応性導電性接着テープ。
- 前記反応性ポリマーが、エポキシ、カルボン酸、アミン、メルカプタン、アミド、イソシアネート、シアネートエステル、アリル、マレイミド、アクリレート、オキセタン、水素化シリコーン、アルコキシシラン、およびこれらの組み合わせから成る群より選択される1つ以上の官能基が組み込まれたアクリルコポリマーを含み、前記官能基は、前記ポリマーバックボーンへのペンダントとして、または前記ポリマーバックボーン内に存在する、請求項2に記載の反応性導電性接着テープ。
- 前記硬化性感圧接着剤が、非反応性ベースポリマーおよび架橋成分を含む、請求項1に記載の反応性導電性接着テープ。
- 前記非反応性ポリマーが、アクリルポリマーを含む、請求項5に記載の反応性導電性接着テープ。
- 前記硬化性感圧接着剤が、フェノール樹脂、脂肪族ポリエステル、芳香族ポリエステル、ポリエーテルポリオール、ポリエステルポリオール、アミン官能性アクリロニトリルブタジエンコポリマー、カルボン酸官能性アクリロニトリルブタジエンコポリマー、ポリウレタン、ポリアミド、ゴム化エポキシプレポリマー、またはヒドロキシル官能性アクリロニトリルブタジエンポリマーを含む、請求項1に記載の反応性導電性接着テープ。
- 前記接着剤の有機固形分の約0.1重量%から約70重量%で存在する架橋成分をさらに含む、請求項1に記載の反応性導電性接着テープ。
- 前記架橋成分が、前記接着剤の有機固形分の約0.5重量%から約20重量%で存在する、請求項8に記載の反応性導電性接着テープ。
- 前記架橋成分が、エポキシ、アクリレート、オキセタン、マレイミド、アルコール、メルカプタン、イソシアネート、シアネートエステル、アルコキシシラン、水素化ケイ素、アリル、またはベンゾキサジン官能基を有する、請求項8に記載の反応性導電性接着テープ。
- 前記架橋成分が、ウレタンアクリレート、エポキシ樹脂、またはブロックイソシアネートを含む、請求項8に記載の反応性導電性接着テープ。
- 前記テープが、前記接着剤が未硬化状態である場合に、少なくとも2.7N/cmの剥離強度を有する、請求項1に記載の反応性導電性接着テープ。
- 前記テープが、前記接着剤が未硬化状態である場合に、少なくとも4.3N/cmの剥離強度を有する、請求項12に記載の反応性導電性接着テープ。
- 前記導電性充填剤が、前記反応性接着剤層の固形分の約0.1重量%から約90重量%で存在する、請求項1に記載の反応性導電性接着テープ。
- 前記導電性充填剤が、銀、金、ニッケル、銅、カーボンブラック、カーボンファイバー、金属化カーボンファイバー、金属コーティングガラスビーズ、金属コーティングガラスフレーク/ファイバー、金属コーティングニッケル粒子、およびこれらの組み合わせから成る群より選択される、請求項14に記載の反応性導電性接着テープ。
- 前記導電性基材が、スズコーティング銅箔、アルミニウム箔、銅箔、金属化プラスチック、または導電性スクリムである、請求項1に記載の反応性導電性接着テープ。
- 光起電力セルを構築する方法であって:
請求項1に記載の反応性導電性接着テープを、電気的相互接続として光起電力セルに適用すること、および、
前記反応性導電性接着テープの接着剤層を、前記光起電力セルの製造の過程で硬化すること、
を含む、光起電力セルを構築する方法。 - 前記接着剤層を硬化する前記工程が、光起電力セルの硬化と同時に行われる、請求項17に記載の方法。
- 前記硬化する工程が、約150℃から約170℃の温度にて、約10から約15分間の間行われる、請求項18に記載の方法。
- 前記反応性導電性接着テープの前記硬化性感圧接着剤が、エポキシおよびカルボン酸官能化アクリルポリマー、疎水性脂肪族ウレタンアクリレートオリゴマー、およびウレタンアクリレートオリゴマーを含む、請求項17に記載の方法。
- 前記反応性導電性接着テープの前記硬化性感圧接着剤が、ヒドロキシル官能性アクリルポリマーおよびブロックイソシアネートを含む、請求項17に記載の方法。
- 前記光起電力セルが、結晶Si、多結晶Si、無機薄膜、または有機光起電力セルである、請求項17に記載の方法。
- 硬化性感圧接着剤および導電性充填剤を含む反応性導電性感圧接着剤組成物であって、ここで、前記接着剤組成物は、未硬化の状態で少なくとも約2.7N/cmの剥離強度、および未硬化の状態で約−50℃から約−10℃の範囲のガラス転移点を有する、反応性導電性感圧接着剤組成物。
- 硬化された状態で約0℃未満のガラス転移点を有する、請求項23に記載の反応性導電性感圧接着剤組成物。
- 前記接着剤組成物が、ラジカル硬化機構、ヒドロキシル−ブロックイソシアネート硬化機構、エポキシ−潜在アミン硬化機構、または不溶性エポキシ−アミン硬化機構によって硬化可能であるように製剤される、請求項23に記載の反応性導電性感圧接着剤組成物。
- 前記接着剤組成物が、反応性ポリマーを含む、請求項23に記載の反応性導電性感圧接着剤組成物。
- 前記接着剤組成物が、非反応性ポリマーおよび架橋成分を含む、請求項23に記載の反応性導電性感圧接着剤組成物。
- 約10から約15分間の範囲の時間にて約150℃から約170℃の範囲という硬化プロファイルを有する、請求項23に記載の反応性導電性感圧接着剤組成物。
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PCT/US2011/061988 WO2012071484A2 (en) | 2010-11-23 | 2011-11-23 | Reactive conductive pressure-sensitive adhesive tape |
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EP (1) | EP2643418A2 (ja) |
JP (1) | JP2014500360A (ja) |
KR (1) | KR20130129222A (ja) |
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CN103314066A (zh) | 2013-09-18 |
US20130233485A1 (en) | 2013-09-12 |
KR20130129222A (ko) | 2013-11-27 |
MY169514A (en) | 2019-04-19 |
WO2012071484A2 (en) | 2012-05-31 |
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