CN104169386B - 压敏性粘合剂组合物 - Google Patents
压敏性粘合剂组合物 Download PDFInfo
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- CN104169386B CN104169386B CN201380014144.6A CN201380014144A CN104169386B CN 104169386 B CN104169386 B CN 104169386B CN 201380014144 A CN201380014144 A CN 201380014144A CN 104169386 B CN104169386 B CN 104169386B
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- adhesive compositions
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- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
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- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
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Abstract
本发明涉及一种压敏性粘合剂组合物、压敏性粘合剂膜和有机电子装置。所述示例性的压敏性粘合剂组合物能够提供压敏性粘合剂膜和有机电子装置的包封层,该包封层在高温度和高湿度条件下表现优异的水分阻隔性能、透明性、耐久性和可靠性,段差补偿性能和粘合力。
Description
技术领域
本申请涉及压敏性粘合剂组合物、压敏性粘合剂膜和有机电子装置。
背景技术
压敏性粘合剂膜可以用于保护对外部因素(如水分或氧)敏感的元件或装置。能够通过压敏性粘合剂膜保护的元件或装置可以包括,例如,有机电子装置、太阳能电池或二次电池(如锂二次电池)。具体地,在所述元件或装置中,有机电子装置易受到外部因素(如水分和氧)影响。
所述有机电子装置是包含功能性有机材料的装置。光伏装置、整流器、发射器或有机发光二极管(OLED)可以用作所述有机电子装置或所述有机电子装置中包括的有机电子元件。
有机电子装置通常会受到外部因素(如水分)的影响。例如,OLED通常包括存在于包含金属或金属氧化物的电极对之间的功能性有机材料层,并且有机材料层由于外部环境水分的影响而由电极的界面剥离,电阻值由于水分使电极氧化而提高,或者有机材料变质,因此导致诸如发射功能损耗或发光降低的问题。因此,为保护OLED不受外部环境因素(如水分)影响,使用一种包封结构,该包封结构通过用配备吸气剂或水分吸收剂的玻璃罐或金属罐覆盖形成于基板上的OLED并用粘合剂固定所得的OLED而形成。
发明内容
技术问题
本申请涉及提供一种压敏性粘合剂组合物、压敏性粘合剂膜和有机电子装置。
技术方案
本申请的一个方面提供一种压敏性粘合剂组合物,其包含粘合剂树脂、经有机改性剂改性的纳米粘土和溶剂。
可以使用压敏性粘合剂领域中所使用的压敏性粘合剂树脂作为粘合剂树脂。所述粘合剂树脂可以包括,例如,聚烯烃树脂、环氧树脂或丙烯酸类树脂。
在一个实施例中,粘合剂树脂可以为聚异丁烯树脂。所述聚异丁烯树脂是疏水性树脂,其通常具有比其它聚合物低的水分含量和低的水蒸气透过率(WVTR)。
所述聚异丁烯树脂可以为,例如,主链或侧链包含重复单元-[CH2-C(CH3)2]n-的树脂。在一个实施例中,所述聚异丁烯树脂可以为异丁烯的均聚物。此外,在另一个实施例中,所述聚异丁烯树脂可以为异丁烯和能够与其共聚的单体的共聚物。可以使用例如1-丁烯、2-丁烯、异戊二烯或丁二烯作为能够与异丁烯共聚的单体。
例如,用于压敏性粘合剂膜的粘合剂树脂可以具有低玻璃化转变温度。在一个实施例中,粘合剂树脂的玻璃化转变温度为-90至20℃或-90至-30℃。
粘合剂树脂可以具有足够的重均分子量以模制成膜的形式。在一个实施例中,可以模制成膜的重均分子量的范围可以为大约50,000至2,000,000、70,000至1,500,000或100,000至1,000,000。本发明所用术语“重均分子量”是指通过凝胶渗透色谱法(GPC)测定的相对于聚苯乙烯标准品的转换值。
此外,可以使用上述组分中的一种或至少两种作为粘合剂树脂。当使用至少两种树脂时,树脂的种类、重均分子量可以不同或二者均可以不同。
尽管粘合剂树脂为耐水性树脂,但仍难以完全阻挡来自外部环境的水分或水汽。因此,可以用纳米粘土与粘合剂树脂组合,从而使水分阻隔性能最大化。
纳米粘土可以作为例如水分阻隔剂而包含于所述压敏性粘合剂组合物中。本发明所用术语“水分阻隔剂”是指与外部渗入的水分不反应或反应性低并且可以阻挡或截断水分或水的流动的材料。
可以使用例如层状矿物质作为纳米粘土,以延长水分自外部环境流入的路径。在一个实施例中,层状矿物质的宽度为大约100至1000nm,层间的距离为大约1至5nm。这种纳米粘土的粒子间可以有聚集体,并且由于所述矿物质的机械性质和由特定溶剂的分散性导致的透明性,而一致地表现出在高温度和高湿度下的强化的耐久性及强化的水分阻隔性。
所述粘土为阳离子可以取代的矿物质,其可以用有机改性剂处理以用于与粘合剂树脂的相容性。在本说明书中,为方便起见,将“经有机改性剂改性的纳米粘土”称为“纳米粘土”。此处,矿物质可以用有机改性剂改性,并且可以使用本领域中已知的任何矿物质改性剂,而无限制。所述改性剂可以包括,例如,鎓离子(如含有偶氮基或过氧基的铵离子)、季铵离子或鏻离子。
在一个实施例中,为保持粘合剂树脂的优异的透明性,改性纳米粘土和溶剂可以适当组合。
在一个实施例中,在组合的改性纳米粘土中,可以使用层状硅酸盐作为纳米粘土。层状硅酸盐可以为,例如,蒙脱石、皂石、锂蒙脱石、蛭石、膨润土、绿坡缕石、海泡石、多水高岭土或它们的混合物。
此外,在组合的改性纳米粘土中,能够使纳米粘土改性的有机改性剂可以为,例如,具有二甲基苄基氢化牛脂基季铵离子、双(氢化牛脂基)二甲基季铵离子、甲基牛脂基双-2-羟乙基季铵离子、二甲基氢化牛脂基2-乙基己基季铵离子或二甲基脱氢牛脂基季铵离子的一种有机改性剂。
此类改性纳米粘土可以与特定溶剂组合,从而保持粘合剂树脂的优异的透明性。可以考虑例如折射率、挥发性或溶解性参数来选择溶剂。
例如,可以使用折射率为1.4以上的溶剂作为溶剂。可以使用折射率在上述范围内的溶剂,以保持所述粘合剂树脂的优异的透明性。此外,可以使用例如沸点为70至200℃或80至150℃的溶剂作为溶剂。此处,满足上述条件的溶剂可以为乙酸正丙酯、乙酸正丁酯、环己烷、甲基环己烷、苯、甲苯、乙苯、二甲苯和1,2,3-三甲基苯中的至少一种。
当改性纳米粘土与粘合剂树脂组合时,水分阻隔性得到强化。具体地,当上述组合的改性纳米粘土与溶剂组合时,可以提供具有优异的水分阻隔性和透明性的压敏性粘合剂组合物。
相对于100重量份的粘合剂树脂,可以以5至30重量份、5至25重量份、5至20重量份、10至30重量份、15至30重量份、10至25重量份或15至20重量份组合所述改性纳米粘土。在此范围内,压敏性粘合剂组合物的透明性和水分阻隔性可以最大化。在本说明书中,除非另外明确说明,否则单位“重量份”是指重量比。
压敏性粘合剂组合物可以为不可固化或可固化的压敏性粘合剂组合物。
不可固化的压敏性粘合剂组合物可以指不进行固化工艺便可以粘合的组合物。在一个实施例中,不可固化的压敏性粘合剂组合物不暴露于热和/或光便可以粘合,并因此适用于包封对热和/或光敏感的元件。此类不可固化的压敏性粘合剂组合物可以包含不具有可固化的官能团的粘合剂树脂,但本申请不限于此。还可以使用具有可固化的官能团的粘合剂树脂,只要所述组合物无须固化工艺便表现出粘合性即可。在一个实施例中,不具有可固化官能团的粘合剂树脂可以为异丁烯的均聚物;或异丁烯和正丁烯的共聚物。
可固化的压敏性粘合剂组合物可以指在粘合至粘合物之后可以被固化的组合物。可以使用可固化的压敏性粘合剂组合物来强化物理性质,例如可加工性、水分阻隔性和粘合性。此类可固化的压敏性粘合剂组合物可以通过控制固化条件而用来封装对热和/或光敏感的元件。在一个实施例中,可固化的压敏性粘合剂组合物可以包含具有可固化的官能团的粘合剂树脂。具有可固化的官能团的粘合剂树脂可以为上述异丁烯单体和诸如异戊二烯或丁二烯的单体的共聚物。此外,在另一个实施例中,可固化的压敏性粘合剂组合物还可以包含可固化组分。在此情况下,粘合剂树脂可以包含或不包含可固化的官能团。可固化组分可以为本领域已知的任何一种可固化组分,而无限制。可固化组分可以为,例如,多官能丙烯酸酯或环氧化合物。
此处,多官能丙烯酸酯可以为具有至少两个(甲基)丙烯酰基的任何化合物,而无限制。例如,多官能丙烯酸酯可以为双官能丙烯酸酯,例如,1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、新戊二醇己二酸二(甲基)丙烯酸酯、羟基新戊酸新戊二醇二(甲基)丙烯酸酯、二(甲基)丙烯酸二环戊基酯、经己内酯改性的二(甲基)丙烯酸二环戊烯酯、经环氧乙烷改性的二(甲基)丙烯酸酯、二(甲基)丙烯酰氧基乙基异氰脲酸酯、经烯丙基化的二(甲基)丙烯酸环己酯、三环癸烷二甲醇(甲基)丙烯酸酯、二羟甲基二环戊烷二(甲基)丙烯酸酯、经环氧乙烷改性的六氢肽酸二(甲基)丙烯酸酯、经新戊二醇改性的三甲基丙烷二(甲基)丙烯酸酯、金刚烷二(甲基)丙烯酸酯或9,9-双[4-2(-丙烯酰氧基乙氧基)苯基]氟;三官能丙烯酸酯,例如,三羟甲基丙烷三(甲基)丙烯酸酯、三(甲基)丙烯酸二季戊四醇酯、经丙酸改性的三(甲基)丙烯酸二季戊四醇酯、三(甲基)丙烯酸季戊四醇酯、经环氧丙烷改性的三羟甲基丙烷三(甲基)丙烯酸酯、三官能氨酯(甲基) 丙烯酸酯或三(甲基)丙烯酰氧基乙基异氰脲酸酯;四官能丙烯酸酯,例如,四(甲基)丙烯酸二甘油酯或四(甲基)丙烯酸季戊四醇酯;五官能丙烯酸酯,例如,经丙酸改性的五(甲基)丙烯酸二季戊四醇酯;或者六官能丙烯酸酯,例如,六(甲基)丙烯酸二季戊四醇酯、经己内酯改性的六(甲基)丙烯酸二季戊四醇酯或氨酯(甲基)丙烯酸酯(例如,异氰酸酯单体和三羟甲基丙烷三(甲基)丙烯酸酯的反应产物);或树枝状丙烯酸酯。
此外,多官能丙烯酸酯可以在分子中包含环状结构。多官能丙烯酸酯中包含的环状结构可以为碳环或杂环结构中的任意一种;或者单环或多环结构。具有环状结构的多官能丙烯酸酯可以为但不限于,六官能丙烯酸酯,例如,具有异氰脲酸酯结构的单体,例如三(甲基)丙烯酰氧基乙基异氰脲酸酯或异氰酸酯改性的氨酯三(甲基)丙烯酸酯(例如,通过异氰酸酯单体和三羟甲基丙烷三(甲基)丙烯酸酯等的反应获得的产物)。
此处,环氧化合物可以为例如环氧化的亚麻子油、环氧化的聚丁二烯、聚氧化异丁烯、α-氧化蒎烯、二氧化苧烯、3,4-环氧基环己基甲基-3,4-环氧基环己烷甲酸酯、三环癸烷二甲醇二环氧甘油醚、氢化双酚A二环氧甘油醚和1,2-双[(3-乙基-3-氧杂环丁基甲氧基)甲基]苯中的一种或至少两种。
相对于100重量份的粘合剂树脂,可固化组分的用量可以为0.2至10重量份。在此范围内,可以提供一种压敏性粘合剂组合物,该组合物能够提供一种具有高水分阻隔性,以及优异的机械性质和透明性的压敏性粘合剂膜。
可固化的压敏性粘合剂组合物还可以包含引发剂。根据示例性实施方案,引发剂可以为自由基引发剂或阳离子引发剂。
适当的自由基光敏引发剂可以为但不限于例如氨基酮,如2-甲基-l-[4-(甲硫基)苯基]-2-(4-吗啉基)-1-丙酮或2-苄基-2-(二甲基氨基)-l-[4-(4-吗琳基)苯基]-1-丁酮;苯偶姻醚,如苯偶姻甲醚或苯偶姻异丙醚;取代的苯偶姻醚,如茴香偶姻(anisoin)甲醚;取代的苯乙酮,如2,2-二乙氧基苯乙酮或2,2-二甲氧基-2-苯基苯乙酮;取代的a-乙酮醇,如2-甲基-2-羟基苯丙酮;芳族氧化膦,如双(2,4,6-三甲基苯甲酰基)苯基氧化膦;芳族磺酰氯,如2-萘-磺酰氯;光活性肟,如1-苯基-1,2丙二酮-2-(O-乙氧基羰基)肟;或它们的混合物。
适用的热自由基引发剂可以为但不限于,偶氮化合物,如2,2’-偶氮基-双(异丁腈)、2,2’-偶氮基-双(异丁酸)二甲酯、偶氮基-双(二苯基甲烷)或4,4-偶氮 基-双(4-氰基戊酸);过氧化物,如过氧化氢、过氧化苯甲酰、过氧化异丙苯、叔丁基过氧化物、过氧化环己酮、谷氨酸过氧化物、过氧化月桂酰或过氧化甲乙酮;氢过氧化物,如叔丁基氢过氧化物或异丙苯氢过氧化物;过氧酸,如过乙酸、过苯甲酸、过硫酸钾或过硫酸铵;过酸酯,如过碳酸二异丙酯;热氧化还原引发剂;或它们的混合物。
阳离子引发剂可以为本领域已知的引发剂。适用的阳离子光敏引发剂包括多种已知适用材料中的任意一种,例如鎓盐、特定的有机金属复合物或它们的混合物。适用的鎓盐包含结构式AX。此处,A选自有机阳离子(如选自二偶氮鎓、碘鎓和锍鎓阳离子;特别是二苯基碘鎓、三苯基锍鎓和苯硫基苯基二苯基锍鎓),X为阴离子(如有机磺酸盐或卤化的金属或准金属)。具体地,适用的鎓盐包括但不限于,芳基二偶氮鎓盐,二芳基碘鎓盐和三芳基锍鎓盐。适用的阳离子热引发剂包括咪唑的季铵盐或超酸(如SbF6的季铵盐),或它们的混合物。
引发剂的比例无特别限制,可以根据目的而适当地选择。例如,相对于100重量份的粘合剂树脂,引发剂含量可以为0.01至20重量份,但本申请不限于此。当引发剂的比例过低时,不能引发适当的固化,或者当引发剂的比例过高时,由于在形成压敏性粘合剂层或包封层之后残留的引发剂可能导致物理性质劣化,因此,可以选择适当的比例。
压敏性粘合剂组合物还可以包含一种提供压敏粘合性的试剂。此处,可以使用例如通过氢化石油树脂而得到的氢化石油树脂作为提供压敏粘合性的试剂。所述氢化石油树脂可以部分或完全氢化,或者可以与另一种氢化石油树脂混合。此类提供压敏粘合性的试剂可以与粘合剂树脂具有良好的相容性,以及优异的水分阻隔性。氢化石油树脂可以为氢化萜烯类树脂、氢化酯类树脂或氢化二环戊二烯类树脂。提供压敏粘合性的试剂的重均分子量可以为大约200至5,000。提供压敏粘合性的试剂的含量可以视需要适当控制。例如,相对于100重量份的粘合剂树脂,提供压敏粘合性的试剂可以以5至100重量份包含于压敏性粘合剂组合物中。此外,考虑层压性能和段差(step difference)补偿性能,可以使用软化点为70至150℃的提供压敏粘合性的试剂。
除了上述组分以外,多种添加剂可以包含于压敏性粘合剂组合物中。作为添加剂,可以使用例如硅烷偶联剂、流平剂、分散剂、环氧树脂、紫外线 稳定剂、抗氧化剂、着色剂、增强剂、填料、起泡剂、表面活性剂或增塑剂。
可以使用本领域中已知的任何一种硅烷偶联剂,而无限制。例如,硅烷偶联剂可以为含有环氧基的硅烷偶联剂,例如3-环氧丙氧丙基三甲氧基硅烷、3-环氧丙氧丙基三乙氧基硅烷、3-环氧丙氧丙基甲基二乙氧基硅烷或2-(3,4-环氧基环己基)乙基三甲氧基硅烷;含氨基的硅烷偶联剂,例如3-氨基丙基三甲氧基硅烷、N-2-(氨基乙基)-3-氨基丙基甲基二甲氧基硅烷或3-三乙氧基甲硅烷基-N-(1,3-二甲基丁二烯)丙胺;含(甲基)丙烯酰基的硅烷偶联剂,例如3-丙烯酰氧基丙基三甲氧基硅烷或3-甲基丙烯酰氧基丙基三乙氧基硅烷;含(甲基)丙烯酰基的硅烷偶联剂,例如3-异氰酸酯丙基三乙氧基硅烷;或者含异氰酸酯基的硅烷偶联剂,例如3-异氰酸酯丙基三乙氧基硅烷。
当压敏性粘合剂组合物以膜的形式形成时,可以使用流平剂以使压敏性粘合剂树脂平面化。可以使用例如,硅流平剂、丙烯酰基流平剂或含氟的流平剂作为流平剂。
分散剂可以为本领域中任何一种已知的分散剂,而无限制。可以考虑纳米粘土和粘合剂树脂的种类而选择分散剂。在一个实施例中,分散剂可以为非离子表面活性剂。所述非离子表面活性剂可以为,例如,具有4至28个碳原子的饱和或不饱和脂肪酸,例如硬脂酸、棕榈酸、油酸或亚油酸;脂肪醇,例如鲸蜡醇、鲸蜡硬脂醇或油醇;或者葡糖苷,例如癸基葡糖苷、月桂基葡糖苷或辛基葡糖苷。分散剂的分散可以通过控制烷基的碳原子数和含量而控制。在一个实施例中,当使用上述分散剂时,相对于100重量份的改性纳米粘土,分散剂的用量可以为0.01至500重量份。在此范围内,在压敏性粘合剂组合物中,纳米粘土可以优异地分散于压敏性粘合剂树脂中,没有因分散剂在高温下挥发而引发的问题,并且可以保持优异的粘合强度。
在本申请的另一个实施方案中,提供了一种包含压敏性粘合剂组合物的压敏性粘合剂膜以及制造该压敏性粘合剂膜的方法。
在一个实施例中,压敏性粘合剂膜可以包括,例如,包含膜形式的压敏性粘合剂组合物的压敏性粘合剂层。
压敏性粘合剂膜可以具有优异的水分阻隔性。由于使用耐水性树脂作为基础树脂,因此压敏性粘合剂膜本身的水分含量很低,并且由于包含纳米粘土相对于外部水分具有很低的WVTR。在一个实施例中,压敏性粘合剂膜的 WVTR小于10克/平方米·天、7.5克/平方米·天、5克/平方米·天、4克/平方米·天或3.5克/平方米·天。针对压敏性粘合剂层在100°F和100%相对湿度下测量其厚度方向上的WVTR,该压敏性粘合剂层通过制备压敏性粘合剂组合物,涂覆该组合物至厚度为100μm,并干燥该经涂覆的组合物而形成。WVTR可以根据ASTM F1249测定。当WVTR降低时,可以表现更优异的水分阻隔性。然而,WVTR的下限可以为但不特别限于例如0克/平方米·天以上。
压敏性粘合剂膜还可以在可见光区具有优异的透光率。在一个实施例中,当改性纳米粘土和溶剂如上所述组合时,可以优异地保持粘合剂树脂的透明性。例如,通过制备与改性纳米粘土和溶剂的特定组合共混的压敏性粘合剂组合物,涂覆该组合物至厚度为50μm,并干燥经涂覆的组合物而形成的压敏性粘合剂层在可见光区的透光率可以为90%以上、92%以上、95%以上、97%以上或98%以上。
所述压敏性粘合剂膜可以具有低雾度和优异的透光率。在一个实施例中,当改性纳米粘土和溶剂如上所述组合时,可以提供具有低雾度的压敏性粘合剂膜。例如,在与测定透光率的相同的条件下形成的压敏性粘合剂层的雾度小于3%、2.5%或2%。
压敏性粘合剂膜的压敏性粘合剂层在大约50℃和大约1Hz的频率下的储能模量可以为,例如104至107Pa、5xl04至107Pa、105至107Pa或1.4xl05至107Pa。在上述条件下,压敏性粘合剂膜可以具有优异的段差补偿性能和界面粘合性能。在一个实施例中,尽管压敏性粘合剂层粘合至其上形成有对外部环境敏感的元件的表面上,但是该压敏性粘合剂层仍可以适当地补偿元件和基板之间的段差,并且在具有段差的部分中具有优异的界面粘合性。
此外,在形成最终产物之后,所述压敏性粘合剂膜可以为有机组分挥发量低的膜。所述压敏性粘合剂膜在150℃下,1小时的有机组分挥发量可以为,例如,小于1000ppm。尽管具有上述挥发量范围的压敏性粘合剂层用于与可能被有机组分损坏的元件接触,但是仍可以在高温度和高湿度下优异地保持耐久性和可靠性,而不损坏元件。
除了上述优异的物理性质以外,所述压敏性粘合剂膜在高温度和/或高湿度下可以表现出优异的耐久性和可靠性。
可以根据用途、压敏性粘合剂膜的施用位置和压敏性粘合剂膜的结构而 适当地控制压敏性粘合剂层的厚度。例如,当压敏性粘合剂膜用于包封对外部环境敏感的元件的整个表面时,压敏性粘合剂层的厚度可以控制为大约5至100μm。
压敏性粘合剂膜还可以包括基膜。基膜21和基膜23可以存在于压敏性粘合剂层22的一个表面上,如图1所示,或者存在于压敏性粘合剂层22的两个表面上,如图2所示。
本领域已知的结构可以用作基膜,而无限制。例如,可以使用聚对苯二甲酸乙二醇酯膜、聚四氟乙烯膜、聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、氯乙烯共聚物膜、聚氨酯膜、乙烯-醋酸乙烯膜、乙烯-丙烯共聚物膜、乙烯-丙烯酸乙酯共聚物膜、乙烯-丙烯酸甲酯共聚物膜或聚酰胺膜。
根据需要,可以在基膜的一个或两个表面上进行适当的脱模处理。对基膜进行脱模处理的方法可以为本领域中使用的方法,而无限制。例如,可以使用基于醇酸、硅、氟、不饱和酯、聚烯烃或蜡的化合物,在基膜的一个或两个表面上进行脱模处理。
压敏性粘合剂膜还可以包括在压敏性粘合剂层的一个表面上的气体阻隔层。形成气体阻隔层的方法可以为本领域中已知的方法,而无限制。在一个实施例中,压敏性粘合剂层和在所述压敏性粘合剂层的一个表面上具有气体阻隔层的压敏性粘合剂膜可以用于实现柔性显示。
压敏性粘合剂膜可以由上述压敏性粘合剂组合物制备。
压敏性粘合剂组合物可以通过将分散液与包含粘合剂树脂的溶液混合而制备,所述分散液通过将经有机改性剂改性的纳米粘土分散于溶剂中而制得。
在一个实施例中,在此之前,可以包括任选地用有机改性剂处理纳米粘土以制备改性纳米粘土的操作。在此操作中,可以根据所用的纳米粘土和有机改性剂的种类选择适当的溶剂和反应条件。此外,可以根据有机改性剂的种类控制其比例,并且相对于100重量份的纳米粘土,有机改性剂的用量可以为10至100重量份。此操作中所用的纳米粘土和有机改性剂可以为,例如,对应于上述组合的组分。
分散液可以通过将如上所述制得的改性纳米粘土与溶剂混合而制备。此操作中所用的溶剂可以为,例如,对应于上述组合的溶剂。加入溶剂中的改性纳米粘土的含量可以考虑分散液的粘度和分散性而控制。在一个实施例中, 可以调节改性纳米粘土以使分散液的固体含量为1重量%至15重量%、1重量%至10重量%、3重量%至15重量%或3重量%至10重量%。在此范围内,可以提供在高温度和/或高湿度下具有耐久性和可靠性,以及适当的分散性和粘度的压敏性粘合剂组合物。在改性纳米粘土加入溶剂中之后,可以进行物理分散处理法以使粘土均匀地分散于溶剂中。可以使用例如,采用振荡器的方法、超声处理、超高压分散处理或珠磨法作为物理分散处理法。在一个实施例中,当改性纳米粘土具有层状结构时,其可以通过超声处理分散于溶剂中。因此,溶剂也可以有效地分散于改性纳米粘土的各个层之间。改性纳米粘土在溶剂中的分散可以进行5至200分钟。在此范围内,可以通过有效的制备方法制得改性纳米粘土适当地分散于其中的分散液。
在一个实施例中,包含改性纳米粘土的分散液在室温下的粘度可以为100cPs至1000cPs。粘度在此范围内的分散液可以不包含副产物,例如粘度在相同范围内的银胶,并且可以提供在高温度和高湿度下具有优异光学性质和耐久性的压敏性粘合剂膜。本发明所用术语“室温”是指自然状态下未升高或降低的温度,例如大约15℃至35℃,20℃至30℃或大约25℃。
如上所述制备的分散液可以与包含粘合剂树脂的溶液混合,从而制备压敏性粘合剂组合物。在包含粘合剂树脂的溶液中,还可以包含上述提供压敏粘合性的试剂、可固化组分、引发剂或添加剂。在此操作中,相对于100重量份的粘合剂树脂,可以将分散液加入溶液中以使分散液的固体含量为5至30、5至25、5至20、10至30、15至30、10至25或15至20重量份。在此范围内,可以一致地表现出高水分阻隔性和透明性,可以在高温度和/或高湿度下不产生气泡,可以提供具有优异段差补偿性能的压敏性粘合剂组合物。所述压敏性粘合剂组合物可以用适当溶剂稀释以使固体含量为大约10重量%至40重量%,以保证可涂覆性。在一个实施例中,溶剂可以使用制备分散液所用的相同溶剂。此外,在另一个实施例中,可以考虑压敏性粘合剂组合物的可涂覆性或由压敏性粘合剂膜挥发的溶剂量而使用辅助溶剂。所述辅助溶剂可以为,例如,上述溶剂中的至少一种。
此处,通过涂覆操作,可以将所制备的压敏性粘合剂组合物制成压敏性粘合剂膜。例如,可以将压敏性粘合剂组合物涂覆在基膜上,从而形成膜状的压敏性粘合剂层。压敏性粘合剂组合物的涂覆可以通过常用方法进行。例 如,压敏性粘合剂组合物可以通过已知方法涂覆,例如刀涂、辊涂、喷涂、凹面涂覆、帘涂、逗号刮刀式涂覆(comma coating)或唇形涂覆(lip coating)。此外,在涂覆压敏性粘合剂组合物之后,干燥并去除溶剂,从而形成压敏性粘合剂层。此处,干燥条件无特别限制,例如,干燥可以在20至200℃下进行1至20分钟。
此外,在两个表面上包括基膜的压敏性粘合剂膜可以通过将另外的基膜紧压在其表面上存在基膜的压敏性粘合剂层的相反表面上而制备。此处,压敏性粘合剂层与基膜的压紧操作可以通过热辊层压或冲压工艺进行。此处,就连续工艺的可能性和效果而言,所述操作可以通过热辊层压法在大约10至100℃和大约0,1至10kgf/cm2下进行。
此外,可以通过在其表面上存在基膜的压敏性粘合剂层的相反表面上形成气体阻隔层而制备压敏性粘合剂膜。此处,在压敏性粘合剂层的一个表面上形成气体阻隔层的方法可以通过本领域已知的一般方法进行。在一个实施例中,可以使用具有水分阻隔性的多种材料形成气体阻隔层。可以使用例如,聚三氟乙烯或聚氯三氟乙烯(PCTFE)的含氟聚合物;聚酰亚胺;聚碳酸酯;聚对苯二甲酸乙二酯;脂环族聚烯烃;或乙烯-乙烯醇共聚物作为所述材料。在另一个实施例中,可以通过喷溅氧化硅、氮化硅、氧化铝或钻石样碳等材料形成无机薄膜的方法形成气体阻隔层。此外,气体阻隔层可以由聚合物层和无机薄膜的堆迭结构构成。
压敏性粘合剂膜可以在粘合剂领域中用于多种用途。在一个实施例中,压敏性粘合剂膜可以用以包封多种待保护的目标物体。具体地,所述膜可以有效地保护包括对外部组分(如水分和蒸气)敏感的元件的目标物体。作为施用压敏性粘合剂膜的目标物体的例子,可以使用有机电子装置,如光伏装置、整流器、发射器或有机发光二极管(OLED);太阳能电池;或二次电池,但本申请不限于此。本发明所用术语“元件”可以指电子装置的任何一个部件。
本申请的另一个方面提供有机电子装置。所述有机电子装置可以包括有机电子元件,以及通过用压敏性粘合剂层包封该元件的整个表面而形成的包封层。在本说明书中,压敏性粘合剂层和包封层实质上是指相同组分的术语,电子装置中包括的压敏性粘合剂层可以称为包封层。
在一个实施例中,如图3所示,有机电子装置可以包括下基板31、形成 于该下基板上的有机电子元件33、包封该元件的整个表面的包封层32、以及存在于包封层的一个表面上的上基板34。此外,在另一个实施例中,存在于包封层的一个表面上的上基板34可以由上述气体阻隔层代替。然而,本申请不限于此,并且所述电子装置可以变为本领域中使用的结构。
有机电子元件,例如OLED,可以用作可由所述膜保护的元件的代表性实例,但本申请不限于此。
在一个实施例中,包封层可以为上述压敏性粘合剂膜的压敏性粘合剂层。由于优异的段差补偿性能,因此上述压敏性粘合剂膜即使在具有高度差的表面(例如具有所述元件的基板)上也可以粘合,而无突起或气泡。因此,可以提供在包封层和元件或下基板之间具有优异的表面粘合强度的电子装置。
在一个实施例中,当包括压敏性粘合剂膜的压敏性粘合剂组合物为可固化的压敏性粘合剂组合物时,包封层可以在元件的整个表面被其包封之后固化。此处,可以考虑可固化压敏性粘合剂组合物中所包含的组分的种类,将固化条件控制在不损坏元件的范围内。
在所述有机电子装置中,包封层可以表现优异的水分阻隔性和光学特性,并与下基板一起有效地固定和支撑上基板。此外,无论有机电子装置为顶发射型或底发射型,通过使用有机改性剂和溶剂的特定组合对纳米粘土改性并使该改性纳米粘土均匀地分散于树脂中,可以形成具有优异的透明性和稳定性的包封层。
所述有机电子装置可以以本领域已知的常规构造提供,不同的是,包封层用上述膜形成。例如,可以使用本领域常用的玻璃、金属或聚合物膜作为下和上基板。此外,有机电子元件可以包括,例如,一对电极和形成于该电极对之间的有机材料层。此处,电极对的任一电极可以为透明电极。此外,有机材料层可以包括,例如,电洞传输层、发射层和电子传输层。
有益效果
示例性的压敏性粘合剂组合物能够提供压敏性粘合剂膜和有机电子装置的包封层,其在高温度和高湿度下表现出优异的水分阻隔性、透明性、耐久性和可靠性,以及段差补偿性能和粘合强度。
附图说明
图1和图2示出了示例性压敏性粘合剂膜的示意图;
图3示出了示例性有机电子装置的横截面的示意图;
标号说明
21、23:基膜
22:压敏性粘合剂
31:基板
32:包封层
33:有机电子元件
34:基板或气体阻隔层
具体实施方式
下文中,将参考实施例和对比实施例,进一步详细说明压敏性粘合剂组合物,但所述组合物的范围不限于以下实施例。
下文中,实施例和对比实施例中所示物理性质通过以下方法评估。
1、透明性的评估
制备压敏性粘合剂膜,使得实施例或对比实施例的压敏性粘合剂组合物形成的压敏性粘合剂层的厚度为大约50μm。所制备的压敏性粘合剂膜的压敏性粘合剂层被转移至玻璃。之后,使用雾度计(NDH-5000),根据JIS K7105法,基于玻璃测定透光率和雾度。
2、水分阻隔性的评估
制备压敏性粘合剂膜,使得实施例或对比实施例的压敏性粘合剂组合物形成的压敏性粘合剂层的厚度为大约100μm。然后,将该压敏性粘合剂层与多孔膜进行层压并剥除基膜,从而制得样品。之后,在样品处于100°F和100%的相对湿度下的同时,测定样品在厚度方向的WVTR。WVTR根据ASTM F1249规定测定。
3、储能模量的评估
制备压敏性粘合剂膜,使得实施例或对比实施例的压敏性粘合剂组合物形成的压敏性粘合剂层的厚度为大约500μm,并且在基膜存在于压敏性粘合剂层的两个表面上的结构中形成基膜。通过将所制备的压敏性粘合剂膜切成直径大约8mm的圆形而制得样品。之后,通过温度扫描法,在1Hz的频率和 50℃下测定样品的储能模量。
4、高温度和高湿度下的耐久性和可靠性
制备压敏性粘合剂膜,使得实施例或对比实施例的压敏性粘合剂组合物形成的压敏性粘合剂层的厚度为大约50μm。通过将制备的压敏性粘合剂膜的压敏性粘合剂层粘合于玻璃上而制得样品。之后,在将样品置于85℃和85%的相对湿度下的恒温和恒湿室中的同时,观察压敏性粘合剂层中是否有产生气泡、浊度改变和/或界面突起的情况发生。
5、粘合剂强度的评估
制备压敏性粘合剂膜,使得实施例或对比实施例的压敏性粘合剂组合物形成的压敏性粘合剂层的厚度为大约50μm。将制备的压敏性粘合剂层与未脱模的PET基膜层压,然后将其切成1英寸宽度和20cm长度。随后,通过剥除压敏性粘合剂膜的未脱模的基膜而制得样品,并将压敏性粘合剂层转移至玻璃。之后,使用纹理分析仪测定样品的180度粘合强度。
实施例1
(1)压敏性粘合剂组合物的制备
将5重量%的用双(氢化牛脂基)二甲基季铵离子改性的纳米粘土(商品名:Cloisite93A,生产商:Southern Clay Products)加入二甲苯中,并使用叶轮混合。此外,所获得的混合物用超声波发生器分散大约1小时,从而制得分散液。
将聚异丁烯树脂(重均分子量:1,000,000)加入二甲苯中,使得固体含量为10重量%。随后,相对于60重量份的聚异丁烯树脂,将40重量份氢化的萜烯树脂(软化点:100℃)加入上述二甲苯中并混合,从而制得包含粘合剂树脂的溶液。
将制备的分散液加入包含粘合剂树脂的溶液中,使得相对于100重量份的溶液,改性纳米粘土的固体含量为10重量份。随后,所获得的溶液用二甲苯稀释并混合,使得最终组合物的固体含量为10重量%,从而制得压敏性粘合剂组合物。
(2)压敏性粘合剂膜的制备
使用刮棒涂布机将制备的压敏性粘合剂组合物涂覆在脱模PET基膜上。随后,将经涂覆的压敏性粘合剂组合物的层在大约120℃的烘箱中干燥大约30分钟,制得压敏性粘合剂膜。
对比实施例1
以实施例1说明的方式制备压敏性粘合剂组合物和压敏性粘合剂膜,不同的是,使用未改性的纳米粘土代替用双(氢化牛脂基)二甲基季铵离子改性的纳米粘土。
对比实施例2
以实施例1说明的方式制备压敏性粘合剂组合物和压敏性粘合剂膜,不同的是,分散液中使用甲乙酮(MEK)代替二甲苯。
对比实施例3
以实施例1说明的方式制备压敏性粘合剂组合物和压敏性粘合剂膜,不同的是,使用改性的硅石(疏水性热解法二氧化硅,R972,Evonik)代替用双(氢化牛脂基)二甲基季铵离子改性的纳米粘土。
对比实施例4
以实施例1说明的方式制备压敏性粘合剂组合物和压敏性粘合剂膜,不同的是,未使用分散液。
[表1]
Claims (15)
1.一种压敏性粘合剂膜,所述压敏性粘合剂膜在可见光区的透光率为90%以上,雾度小于3%,且所述压敏性粘合剂膜包含压敏性粘合剂组合物,所述压敏性粘合剂组合物包含:
粘合剂树脂,所述粘合剂树脂为聚异丁烯树脂;
经有机改性剂改性的纳米粘土,其中,相对于100重量份的所述粘合剂树脂,包含5至30重量份的所述经有机改性剂改性的纳米粘土。
2.根据权利要求1所述的压敏性粘合剂膜,其中,所述纳米粘土为层状硅酸盐。
3.根据权利要求1所述的压敏性粘合剂膜,其中,所述有机改性剂包括二甲基苄基氢化牛脂基季铵离子、双(氢化牛脂基)二甲基季铵离子、甲基牛脂基双-2-羟乙基季铵离子、二甲基氢化牛脂基2-乙基己基季铵离子或二甲基脱氢牛脂基季铵离子。
4.根据权利要求1所述的压敏性粘合剂膜,其中,所述压敏性粘合剂组合物还包含折射率为1.4以上的溶剂。
5.根据权利要求4所述的压敏性粘合剂膜,其中,所述溶剂包括乙酸正丙酯、乙酸正丁酯、环己烷、甲基环己烷、苯、甲苯、乙苯、二甲苯或1,2,3-三甲基苯。
6.根据权利要求1所述的压敏性粘合剂膜,所述压敏性粘合剂组合物还包含多官能丙烯酸酯或环氧化合物。
7.根据权利要求6所述的压敏性粘合剂膜,所述压敏性粘合剂组合物还包含引发剂。
8.根据权利要求1所述的压敏性粘合剂膜,其在150℃下,1小时的有机组分挥发量小于1000ppm。
9.一种权利要求1所述的压敏性粘合剂膜的制备方法,包括:
通过将经有机改性剂改性的纳米粘土和溶剂的分散液与含有粘合剂树脂的溶液混合,制备压敏性粘合剂组合物;以及
在基膜上涂覆所述压敏性粘合剂组合物。
10.根据权利要求9所述的方法,还包括:
在制备所述压敏性粘合剂组合物之前,用所述有机改性剂处理所述纳米粘土制备经有机改性剂改性的纳米粘土。
11.根据权利要求9所述的方法,其中,所述压敏性粘合剂组合物的制备包括将所述经有机改性剂改性的纳米粘土加入所述溶剂中,使得所述分散液的固体含量为1重量%至15重量%。
12.根据权利要求9所述的方法,其中,所述压敏性粘合剂组合物的制备包括通过物理分散方法,将所述经有机改性剂改性的纳米粘土与所述溶剂混合。
13.根据权利要求9所述的方法,其中,所述压敏性粘合剂组合物的制备包括在分散后,将所述经有机改性剂改性的纳米粘土与所述溶剂混合,使得室温下的粘度为100至1000cPs。
14.根据权利要求9所述的方法,其中,所述压敏性粘合剂组合物的制备包括将所述分散液加入含有粘合剂树脂的溶液中,使得相对于100重量份所述的粘合剂树脂,所述分散液的固体含量为5至30重量份。
15.一种有机电子装置,包括:
具有有机电子元件的基板,和
权利要求1所述的压敏性粘合剂膜,所述权利要求1的压敏性粘合剂膜包封所述有机电子元件的整个表面。
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TWI488930B (zh) | 2015-06-21 |
KR101478429B1 (ko) | 2014-12-31 |
EP2810999A4 (en) | 2015-11-04 |
US20140377554A1 (en) | 2014-12-25 |
JP2015515513A (ja) | 2015-05-28 |
WO2013137621A1 (ko) | 2013-09-19 |
JP5938514B2 (ja) | 2016-06-22 |
EP2810999A1 (en) | 2014-12-10 |
CN104169386A (zh) | 2014-11-26 |
EP2810999B1 (en) | 2019-09-11 |
KR20130105445A (ko) | 2013-09-25 |
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