CA2506367A1 - Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder - Google Patents

Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder Download PDF

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Publication number
CA2506367A1
CA2506367A1 CA002506367A CA2506367A CA2506367A1 CA 2506367 A1 CA2506367 A1 CA 2506367A1 CA 002506367 A CA002506367 A CA 002506367A CA 2506367 A CA2506367 A CA 2506367A CA 2506367 A1 CA2506367 A1 CA 2506367A1
Authority
CA
Canada
Prior art keywords
copper powder
powder
flake copper
flake
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002506367A
Other languages
English (en)
French (fr)
Inventor
Takahiko Sakaue
Kunihiko Yasunari
Katsuhiko Yoshimaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2506367A1 publication Critical patent/CA2506367A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
CA002506367A 2002-11-22 2003-08-11 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder Abandoned CA2506367A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002338990A JP4145127B2 (ja) 2002-11-22 2002-11-22 フレーク銅粉及びそのフレーク銅粉の製造方法並びにそのフレーク銅粉を用いた導電性ペースト
JP2002-338990 2002-11-22
PCT/JP2003/010192 WO2004048017A1 (ja) 2002-11-22 2003-08-11 フレーク銅粉及びそのフレーク銅粉の製造方法並びにそのフレーク銅粉を用いた導電性ペースト

Publications (1)

Publication Number Publication Date
CA2506367A1 true CA2506367A1 (en) 2004-06-10

Family

ID=32375760

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002506367A Abandoned CA2506367A1 (en) 2002-11-22 2003-08-11 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder

Country Status (9)

Country Link
US (1) US20060137488A1 (zh)
JP (1) JP4145127B2 (zh)
KR (1) KR100613033B1 (zh)
CN (1) CN1292861C (zh)
AU (1) AU2003254924A1 (zh)
CA (1) CA2506367A1 (zh)
DE (1) DE10393768T5 (zh)
TW (1) TWI236393B (zh)
WO (1) WO2004048017A1 (zh)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4540945B2 (ja) * 2003-06-26 2010-09-08 住友大阪セメント株式会社 金属薄膜形成用塗料と金属薄膜及びその製造方法
JP4859362B2 (ja) * 2004-11-04 2012-01-25 三井金属鉱業株式会社 フレークニッケル粉及びその製造方法並びに導電性ペースト
JP4613362B2 (ja) * 2005-01-31 2011-01-19 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用金属粉および導電ペースト
JP5144022B2 (ja) * 2006-03-24 2013-02-13 三井金属鉱業株式会社 銅粉の製造方法及びその製造方法で得られた銅粉
US8926746B2 (en) 2006-04-05 2015-01-06 Nippon Sheet Glass Company, Limited Flaky particles and luster pigment, and cosmetic, coating composition, resin composition and ink composition each containing the same
JP5563732B2 (ja) * 2007-01-19 2014-07-30 日本光研工業株式会社 平滑薄片状粉体、高光輝性顔料及びそれらの製造方法
JP4922793B2 (ja) * 2007-03-09 2012-04-25 アルファーサイエンティフィック株式会社 混合導電粉及びその製造方法並びに導電ペースト及びその製造方法
CN100493781C (zh) * 2007-04-06 2009-06-03 深圳市危险废物处理站 一种片状镀银铜粉的制备方法
KR101399920B1 (ko) 2007-09-13 2014-05-28 헨켈 아게 운트 코. 카게아아 전기 전도성 조성물
US8295033B2 (en) * 2010-01-21 2012-10-23 George Van Straten Mobile electricity generator using solar, wind, and fuel-generated power
US8854794B2 (en) 2010-01-21 2014-10-07 George Van Straten Mobile electricity generator using solar panels
JP5820202B2 (ja) * 2010-09-30 2015-11-24 Ｄｏｗａエレクトロニクス株式会社 導電性ペースト用銅粉およびその製造方法
JP5563607B2 (ja) * 2012-01-20 2014-07-30 東洋アルミニウム株式会社 フレーク状導電フィラー
JP5794222B2 (ja) * 2012-02-03 2015-10-14 株式会社村田製作所 セラミック電子部品
JP5799948B2 (ja) * 2012-02-03 2015-10-28 株式会社村田製作所 セラミック電子部品及びその製造方法
US20150104625A1 (en) * 2012-04-27 2015-04-16 Taiyo Ink Mfg. Co., Ltd. Electroconductive composition
KR101565639B1 (ko) * 2013-02-20 2015-11-03 삼성전기주식회사 적층 세라믹 전자부품
JP6180769B2 (ja) * 2013-03-29 2017-08-16 トクセン工業株式会社 フレーク状の微小粒子
CN103273056B (zh) * 2013-05-27 2016-01-20 中国科学院过程工程研究所 一种片状铜粉及其制备方法
JP2015035581A (ja) * 2013-07-10 2015-02-19 株式会社村田製作所 セラミック電子部品およびその製造方法
JP2015034309A (ja) * 2013-08-07 2015-02-19 三井金属鉱業株式会社 複合銅粒子及びその製造方法
JP2015034310A (ja) * 2013-08-07 2015-02-19 三井金属鉱業株式会社 複合銅粒子及びその製造方法
CN103773984B (zh) * 2014-01-23 2015-10-14 上海交通大学 一种微纳米叠片制备超细晶合金的粉末冶金方法
CN105705276B (zh) * 2014-02-14 2018-01-19 三井金属矿业株式会社 铜粉
DE102014008756A1 (de) * 2014-06-12 2015-12-17 Pfisterer Kontaktsysteme Gmbh Vorrichtung zum Kontaktieren eines elektrischen Leiters sowie Anschluss- oder Verbindungseinrichtung mit einer solchen Vorrichtung
CN104117681B (zh) * 2014-07-31 2016-02-10 宁波广博纳米新材料股份有限公司 一种超细铜片的制备方法
JP5941588B2 (ja) * 2014-09-01 2016-06-29 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
JP6222189B2 (ja) * 2014-12-05 2017-11-01 Ｊｆｅスチール株式会社 粉末冶金用合金鋼粉および焼結体
US20170326639A1 (en) * 2015-02-06 2017-11-16 Tokusen Kogyo Co., Ltd. Electrically conductive fine particles
JP6060225B1 (ja) * 2015-07-27 2017-01-11 三井金属鉱業株式会社 銅粉及びその製造方法
MY189237A (en) * 2015-09-07 2022-01-31 Hitachi Chemical Co Ltd Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
KR20170029843A (ko) 2015-09-08 2017-03-16 창원대학교 산학협력단 밀링 공정을 통해 조절된 입자 형상을 가지는 금속분말의 제조방법
CN105405490A (zh) * 2015-12-23 2016-03-16 东洋油墨Sc控股株式会社 激光加工用导电性糊、导电性片材、信号布线的制造方法及电子设备
US10630100B2 (en) 2016-01-29 2020-04-21 George A. Van Straten Electricity generator having linearly deployed solar panels
CN106363165B (zh) * 2016-09-05 2019-02-15 国核电力规划设计研究院 一种片状铜颗粒及其制备方法、催化剂、电极
CN107414070A (zh) * 2017-08-10 2017-12-01 上海交通大学 一种均匀球形石墨烯/单晶铜复合粉末及其制备方法
WO2020035859A2 (en) * 2018-08-13 2020-02-20 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd. Thin copper flakes for conductive inks
CN110071050B (zh) * 2019-04-24 2021-09-24 深圳第三代半导体研究院 一种芯片互连结构及其制备方法
JP7036216B2 (ja) 2019-05-24 2022-03-15 Ｊｆｅスチール株式会社 鉄基合金焼結体及び粉末冶金用鉄基混合粉
JP7080950B2 (ja) * 2020-10-15 2022-06-06 トクセン工業株式会社 金属粉
EP4378902A1 (en) * 2021-07-27 2024-06-05 Nippon Sheet Glass Company, Limited Flaky particles and brilliant pigment
WO2023008118A1 (ja) * 2021-07-27 2023-02-02 日本板硝子株式会社 薄片状粒子および光輝性顔料
CN114888294B (zh) * 2022-05-14 2023-04-25 安徽纳洛米特新材料科技股份有限公司 一种工业化生产片状纳米镍粉的方法
WO2023223586A1 (ja) 2022-05-18 2023-11-23 三井金属鉱業株式会社 銅粉及びその製造方法
CN116021010A (zh) * 2023-02-01 2023-04-28 苏州星翰新材料科技有限公司 片状铜粉的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0456701A (ja) * 1990-06-26 1992-02-24 Fukuda Metal Foil & Powder Co Ltd 片状金属粉の製造方法
JPH04314802A (ja) * 1991-04-12 1992-11-06 Daido Steel Co Ltd フレーク粉の製造方法
JPH08325612A (ja) * 1995-05-30 1996-12-10 Mitsui Mining & Smelting Co Ltd 微細な鱗片状銅粉及びその製造方法
WO2004101201A1 (ja) * 1998-08-31 2004-11-25 Kenzo Hanawa 微小銅粉及びその製造方法
JP4136106B2 (ja) * 1998-08-31 2008-08-20 三井金属鉱業株式会社 扁平状微小銅粉及びその製造方法
CN1358593A (zh) * 2000-12-09 2002-07-17 甘肃雷诺换热设备有限公司 一种降低雾化铜粉松装密度的方法
JP4227373B2 (ja) * 2001-08-07 2009-02-18 三井金属鉱業株式会社 フレーク銅粉及びそのフレーク銅粉を用いた銅ペースト
JP4168116B2 (ja) * 2002-03-06 2008-10-22 Ｄｏｗａエレクトロニクス株式会社 箔片状銅粉およびこれを用いた導電ペースト

Also Published As

Publication number Publication date
TWI236393B (en) 2005-07-21
DE10393768T5 (de) 2005-10-20
CN1642680A (zh) 2005-07-20
KR100613033B1 (ko) 2006-08-16
KR20040086853A (ko) 2004-10-12
TW200408475A (en) 2004-06-01
WO2004048017A1 (ja) 2004-06-10
US20060137488A1 (en) 2006-06-29
CN1292861C (zh) 2007-01-03
JP4145127B2 (ja) 2008-09-03
JP2004169155A (ja) 2004-06-17
AU2003254924A1 (en) 2004-06-18

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