BRPI0609127B1 - método para operação de uma fonte de arco elétrico pulsada - Google Patents
método para operação de uma fonte de arco elétrico pulsada Download PDFInfo
- Publication number
- BRPI0609127B1 BRPI0609127B1 BRPI0609127A BRPI0609127A BRPI0609127B1 BR PI0609127 B1 BRPI0609127 B1 BR PI0609127B1 BR PI0609127 A BRPI0609127 A BR PI0609127A BR PI0609127 A BRPI0609127 A BR PI0609127A BR PI0609127 B1 BRPI0609127 B1 BR PI0609127B1
- Authority
- BR
- Brazil
- Prior art keywords
- current
- pulsed
- target
- petition
- electric arc
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 93
- 238000010891 electric arc Methods 0.000 title claims abstract description 36
- 238000000576 coating method Methods 0.000 claims abstract description 49
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- 238000010892 electric spark Methods 0.000 claims abstract 3
- 239000007789 gas Substances 0.000 claims description 47
- 230000008569 process Effects 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 20
- 229910052760 oxygen Inorganic materials 0.000 claims description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 18
- 239000001301 oxygen Substances 0.000 claims description 18
- 239000013077 target material Substances 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 14
- 239000011261 inert gas Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- 239000012298 atmosphere Substances 0.000 claims description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 230000010287 polarization Effects 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 230000001360 synchronised effect Effects 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- -1 TaSi Inorganic materials 0.000 claims description 5
- 230000000737 periodic effect Effects 0.000 claims description 5
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 4
- RHBRWKIPYGZNMP-UHFFFAOYSA-N [O--].[O--].[O--].[Al+3].[Cr+3] Chemical compound [O--].[O--].[O--].[Al+3].[Cr+3] RHBRWKIPYGZNMP-UHFFFAOYSA-N 0.000 claims description 4
- YAIQCYZCSGLAAN-UHFFFAOYSA-N [Si+4].[O-2].[Al+3] Chemical compound [Si+4].[O-2].[Al+3] YAIQCYZCSGLAAN-UHFFFAOYSA-N 0.000 claims description 4
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 claims description 4
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 4
- 229910052723 transition metal Inorganic materials 0.000 claims description 4
- 150000003624 transition metals Chemical class 0.000 claims description 4
- 229910019974 CrSi Inorganic materials 0.000 claims description 3
- 229910008484 TiSi Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- 101100293276 Caenorhabditis elegans cra-1 gene Proteins 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 claims description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 239000011630 iodine Substances 0.000 claims description 2
- 229910052740 iodine Inorganic materials 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- LIZIAPBBPRPPLV-UHFFFAOYSA-N niobium silicon Chemical compound [Si].[Nb] LIZIAPBBPRPPLV-UHFFFAOYSA-N 0.000 claims description 2
- HEHINIICWNIGNO-UHFFFAOYSA-N oxosilicon;titanium Chemical compound [Ti].[Si]=O HEHINIICWNIGNO-UHFFFAOYSA-N 0.000 claims description 2
- 229910021332 silicide Inorganic materials 0.000 claims description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- HWEYZGSCHQNNEH-UHFFFAOYSA-N silicon tantalum Chemical compound [Si].[Ta] HWEYZGSCHQNNEH-UHFFFAOYSA-N 0.000 claims description 2
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 claims description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims 1
- QQHSIRTYSFLSRM-UHFFFAOYSA-N alumanylidynechromium Chemical compound [Al].[Cr] QQHSIRTYSFLSRM-UHFFFAOYSA-N 0.000 claims 1
- 230000003247 decreasing effect Effects 0.000 claims 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 50
- 239000000758 substrate Substances 0.000 description 25
- 239000002346 layers by function Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 238000009489 vacuum treatment Methods 0.000 description 5
- 238000007792 addition Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 2
- SJKRCWUQJZIWQB-UHFFFAOYSA-N azane;chromium Chemical compound N.[Cr] SJKRCWUQJZIWQB-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000010349 pulsation Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019912 CrN Inorganic materials 0.000 description 1
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910008482 TiSiN Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- AAYFQAPISKPSSI-UHFFFAOYSA-N [N].C#C Chemical group [N].C#C AAYFQAPISKPSSI-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- QRRWWGNBSQSBAM-UHFFFAOYSA-N alumane;chromium Chemical compound [AlH3].[Cr] QRRWWGNBSQSBAM-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000006115 industrial coating Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- QRXWMOHMRWLFEY-UHFFFAOYSA-N isoniazide Chemical compound NNC(=O)C1=CC=NC=C1 QRXWMOHMRWLFEY-UHFFFAOYSA-N 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- WDCKRYQAVLUEDJ-UHFFFAOYSA-N methyl(oxo)silicon Chemical compound C[Si]=O WDCKRYQAVLUEDJ-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
- F01D5/00—Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
- F01D5/12—Blades
- F01D5/28—Selecting particular materials; Particular measures relating thereto; Measures against erosion or corrosion
- F01D5/288—Protective coatings for blades
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2230/00—Manufacture
- F05D2230/30—Manufacture with deposition of material
- F05D2230/31—Layer deposition
- F05D2230/313—Layer deposition by physical vapour deposition
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Abstract
Description
Claims (41)
- REIVINDICAÇÕES1. Método para a operação de uma fonte de arco elétrico, no qual uma descarga de centelha elétrica dentro de uma atmosfera que contem gás reativo é queimada ou operada em uma superfície de um alvo, com a descarga da centelha sendo alimentada ao mesmo tempo com uma corrente contínua e com uma corrente pulsada ou alternada, caracterizado pelo fato deque a superfície do alvo é pelo menos parcialmente coberta por um revestimento isolante, o qual é formado por uma reação entre o gás reativo e o material gaseificado do alvo, sendo que pelo um revestimento isolante resulta em um aumento no componente DC da tensão da fonte por pelo menos 10%, de preferência por pelo menos 20%, em comparação com a operação com uma superfície sem um revestimento isolante.
- 2. Método de acordo com a reivindicação 1, caracterizado pelo fato de que a atmosfera contendo gás reativo compreende pelo menos um dos seguintes componentes, um gás contendo oxigênio, nitrogênio, silício, boro ou carbono, em particular oxigênio, nitrogênio, acetileno, metano, silano, tetrametilsilano, tetrametilalumínio, diborano.
- 3. Método de acordo com a reivindicação 1, caracterizado pelo fato de que a proporção de gás reativo é maior do que essa do gás inerte, de preferência maior do que 70%, além do mais preferivelmente maior do que 90% ou aproximadamente 100%.
- 4. Método de acordo com a reivindicação 1, caracterizado pelo fato de que o material alvo compreende pelo menos um dos seguintes materiais: um metal de transição do IVo, Vo, VIogrupo na tabela periódica ou alumínio, boro, carbono ou silício, ou uma liga ou composto dos materiais acima mencionados, tais como TiAI, CrAI, TiAICr, TiSi, TaSi, CrSi, WC.
- 5. Método de acordo com a reivindicação 5, caracterizado pelo fato de que o revestimento isolante é composto de um óxido, niPetição 870180035237, de 30/04/2018, pág. 33/542/8 treto, boreto, silicieto, carbeto do material alvo ou de uma mistura dos compostos do material alvo mencionado.
- 6. Método para a operação de uma fonte de arco elétrico, de acordo com qualquer uma das reivindicações 1 a 5, caracterizado pelo fato de que o componente DC do fluxo da corrente é ajustado em uma faixa entre 100% a 300% de uma corrente de conservação, de preferência entre 100 e 200%.
- 7. Método para a operação de uma fonte de arco elétrico, de acordo com qualquer uma das reivindicações 1 a 5, caracterizado pelo fato de que o componente DC do fluxo da corrente é ajustado em uma faixa entre 30 e 90 A, de preferência entre 30 e 60 A.
- 8. Método de acordo com uma das reivindicações 6 ou 7, caracterizado pelo fato de que gás reativo, gás inerte ou gás reativo e gás inerte é ou são adicionados.
- 9. Método de acordo com uma das reivindicações 6 ou 7, caracterizado pelo fato de que o material alvo compreende pelo menos um dos materiais seguintes: um metal de transição do IVo, Vo, VIo grupo na tabela periódica ou alumínio, boro, carbono ou silício, ou uma liga ou composto dos materiais acima mencionados, tais como TiAI, CrA1, TiAICr, TiSi, TaSi, CrSi, WC.
- 10. Método de acordo com uma das reivindicações 1, 6 ou 7, caracterizado pelo fato de que o material alvo é composto de uma fase cristalográfica única.
- 11. Método de acordo com qualquer uma das reivindicações precedentes, caracterizado pelo fato de que o componente de corrente contínua é produzido por um gerador de corrente contínua, e o componente de corrente pulsada ou alternada é produzido por um gerador de corrente pulsada ou alternada, com os dois geradores sendo conectados em paralelo ou em série entre um cátodo de arco elétrico e pelo menos um ânodo ou terra.Petição 870180035237, de 30/04/2018, pág. 34/543/8
- 12. Método de acordo com uma das reivindicações 1 a 10, caracterizado pelo fato de que o componente de corrente contínua e o componente de corrente pulsada são produzidos por dois geradores de corrente pulsada e alternada que são operados sobrepostos e sincronizados, com os dois geradores sendo conectados em paralelo ou em série entre um cátodo de arco elétrico e pelo menos um ânodo ou terra.
- 13. Método de acordo com uma das reivindicações 1 a 10, caracterizado pelo fato de que os componentes de corrente contínua e de corrente pulsada são produzidos por um gerador de corrente cronometrado secundário, com o gerador sendo conectado em paralelo ou em série entre um cátodo de arco elétrico e pelo menos um ânodo ou terra.
- 14. Método de acordo com uma das reivindicações 1 a 10, caracterizado pelo fato de que os componentes de corrente contínua e de corrente pulsada são produzidos por um gerador de corrente cronometrado primário, com o gerador sendo conectado em paralelo ou em série entre um cátodo de arco elétrico e pelo menos um ânodo ou terra.
- 15. Método de revestimento, caracterizado pelo fato de que uma fonte de arco elétrico de acordo com uma das reivindicações precedentes é operada de modo a depositar uma ou mais camadas em uma peça.
- 16. Método de revestimento de acordo com a reivindicação 15, caracterizado pelo fato de que a camada é composta de pelo menos um dos materiais seguintes: um metal de transição do IVo, Vo ou VIogrupo na tabela periódica e alumínio e seus com postos com oxigênio, nitrogênio, carbono, boro ou silício.
- 17. Método de revestimento de acordo com a reivindicação 15, caracterizado pelo fato de que a camada é composta de pelo mePetição 870180035237, de 30/04/2018, pág. 35/544/8 nos um dos seguintes materiais: óxido de alumínio, nitreto de alumínio, oxinitreto de alumínio, óxido de cromo, nitreto de cromo, oxinitreto de cromo, óxido de alumínio cromo, nitreto de alumínio cromo, oxinitreto de aluminiocromo, oxicarbonitreto de aluminiocromo, óxido de silício, nitreto de silício, oxinitreto de silício, óxido de alumínio silício, nitreto de alumínio silício, oxinitreto de alumínio silício, nitreto de silício titânio, oxinitreto de silício titânio, nitreto de silício tântalo, óxido de tântalo, oxinitreto de tântalo, nitreto de silício tungstênio, carbeto de silício tungstênio, nitreto de silício nióbio, carbeto de titânio, carbeto de tungstênio ou uma liga ou composto dos materiais acima mencionados.
- 18. Método de revestimento de acordo com a reivindicação 15, caracterizado pelo fato de que uma polarização de corrente DC, pulsada ou alternada é aplicada na peça.
- 19. Método de revestimento de acordo com a reivindicação 18, caracterizado pelo fato de que uma polarização de corrente pulsada ou alternada é aplicada, sincronizada com a corrente pulsada ou corrente alternada da fonte.
- 20. Método de revestimento de acordo com a reivindicação 15, caracterizado pelo fato de que pelo menos um gás inerte ou gás reativo é adicionado em uma primeira taxa de fluxo pelo menos uma vez, e pelo menos um gás reativo adicional é a seguir adicionado em uma segunda taxa de fluxo, ou vice-versa, de modo a variar a composição da camada.
- 21. Método de revestimento de acordo com a reivindicação 20, caracterizado pelo fato de que a primeira taxa de fluxo é reduzida antes, durante ou depois do ajuste da segunda taxa de fluxo, e a segunda taxa de fluxo é ajustada de um pequeno valor para um valor mais alto ou vice-versa.
- 22. Método de revestimento de acordo com a reivindicaçãoPetição 870180035237, de 30/04/2018, pág. 36/545/820, caracterizado pelo fato de que o processo de adição ou ajuste é executado na forma de uma rampa ou um degrau, de modo a produzir uma variação substancialmente constante ou escalonada na composição da camada.
- 23. Método de revestimento de acordo com a reivindicação 20, caracterizado pelo fato de que uma camada com dois ou mais elementos de camada é depositada aumentando e diminuindo alternadamente a primeira e a segunda taxas de fluxo.
- 24. Método de revestimento de acordo com a reivindicação 15, caracterizado pelo fato de que uma pluralidade de fontes é operada ao mesmo tempo, com material alvo idêntico ou diferente.
- 25. Método de gravura a água-forte para gravura a águaforte com íons metálicos, caracterizado pelo fato de que uma fonte de arco elétrico de acordo com uma das reivindicações 1 a 13 é operada com uma polarização de corrente DC, pulsada ou alternada sendo aplicada, de modo a gravar a água-forte pelo menos uma peça.
- 26. Método de gravura a água-forte de acordo com a reivindicação 27, caracterizado pelo fato de que uma polarização DC entre 50 e -2000 V, de preferência entre -200 e -1500 V é ajustada na peça.
- 27. Método de gravura a água-forte de acordo com uma das reivindicações 25 ou 26, caracterizado pelo fato de que um gás de gravura a água-forte adicional é introduzido.
- 28. Método de gravura a água-forte de acordo com a reivindicação 27, caracterizado pelo fato de que o gás de gravura a águaforte contém pelo menos um dos seguintes componentes: hélio, argônio, criptônio, oxigênio, nitrogênio, hidrogênio, halogênio (por exemplo, cloro, flúor, bromo, iodo) ou um composto contendo halogênio.
- 29. Método de revestimento ou gravura a água-forte de acordo com uma das reivindicações 15 a 28, caracterizado pelo fato de que a taxa de revestimento e a energia introduzida na peça sãoPetição 870180035237, de 30/04/2018, pág. 37/546/8 ajustadas pelo ajuste de pelo menos um dos seguintes parâmetros: a largura de pulso do pulso da corrente, a magnitude do pulso da corrente, a razão ativa.
- 30. Método de revestimento ou gravura a água-forte de acordo com uma das reivindicações 15 a 29, caracterizado pelo fato de que a peça é uma ferramenta ou um componente.
- 31. Método de revestimento ou gravura a água-forte de acordo com uma das reivindicações 14 a 26, caracterizado pelo fato de que a peça é composta essencialmente de silício ou de algum outro material semicondutor.
- 32. Fonte de arco elétrico tendo um alvo (5) e pelo menos um eletrodo oposto (6,20,20j e uma unidade de suprimento de força elétrica que é conectada no alvo (5), o qual apresenta pelo menos uma primeira suprimento de força elétrica DC (13', 18”), bem como um suprimento de força elétrica adicional (18, 181), com o qual uma corrente DC pode ser sobreposta com uma corrente alternada ou com uma corrente pulsada, caracterizado pelo fato de que a superfície do alvo (5) fica pelo menos parcialmente coberta por um revestimento isolante, o qual foi formado por uma reação entre o gás reativo e o material gaseificado do alvo (5), sendo que o revestimento isolante em uma operação do arco elétrico, no qual uma descarga de centelha elétrica que ocorre dentro de uma atmosfera que apresenta o gás reativo é alimentada ao mesmo tempo com uma corrente contínua e também com uma corrente pulsada, isto é, alternada e promove um aumento da fração de corrente contínua da tensão de fonte de pelo menos 10%, mais preferivelmente por pelo menos 20% em comparação com a operação sem um revestimento isolante.
- 33. Fonte de arco elétrico de acordo com a reivindicação 32, caracterizada pelo fato de que a unidade de suprimento de força elétrica adicionalmente compreende um suprimento de corrente DCPetição 870180035237, de 30/04/2018, pág. 38/547/8 (13'), que é projetado pelo menos para manter uma corrente de conservação.
- 34. Fonte de arco elétrico de acordo com a reivindicação 32, caracterizada pelo fato de que a unidade de suprimento de força elétrica compreende um segundo suprimento de alta corrente pulsada (18), que pode ser sincronizado com a primeira fonte corrente contínua tal que uma corrente de conservação com um sinal pulsado sobreposto pode ser ajustada.
- 35. Fonte de arco elétrico de acordo com a reivindicação 32, caracterizada pelo fato de que a primeira fonte de corrente contínua é um suprimento de alta corrente (18”) e o suprimento de alta corrente pulsante (18', 18”) podem ser sincronizadas tal que a corrente de conservação tem uma ou mais pausas de corrente de conservação em pausas de pulso individuais ou em todas as pausas de pulso, na qual nenhuma tensão é aplicada no alvo ou no eletrodo, em cujo caso as pausas da corrente de conservação podem ser ajustadas para serem tão curtas que o plasma do arco elétrico não é extinto nas pausas.
- 36. Fonte de arco elétrico de acordo com a reivindicação 35, caracterizada pelo fato de que as pausas da corrente de conservação podem ser ajustadas entre 1 ns e 1 ps, em particular entre 1 e 100 ns.
- 37. Fonte de arco elétrico de acordo com a reivindicação 32, caracterizada pelo fato de que a primeira fonte de corrente contínua (13', 18”) e o suprimento de força elétrica adicional (18,18) são conectados em paralelo ou em série.
- 38. Fonte de arco elétrico de acordo com a reivindicação 32, caracterizada pelo fato de que a primeira fonte de corrente contínua (13', 18”) ou pelo menos o suprimento de força elétrica adicional (13', 18) é conectado entre o alvo (5) e um eletrodo (6) que compreende o alvo, ou eletrodos adicionais (20,20').Petição 870180035237, de 30/04/2018, pág. 39/548/8
- 39. Fonte de arco elétrico de acordo com a reivindicação 32, caracterizada pelo fato de que tendo um alvo (5) e pelo menos um eletrodo oposto (6,20,20j e uma unidade de suprimento de força elétrica que é conectada no alvo (5), sendo que a unidade de suprimento de força elétrica é um suprimento de força elétrica cronometrado secundário (21,21j, por meio do qual o sinal do suprimento de força elétrica cronometrado secundário (21,21 j é modulado tal que uma corrente de conservação DC é produzida, com um sinal pulsado ou sinal AC sobreposto nela.
- 40. Fonte de arco elétrico de acordo com a reivindicação 42, caracterizada pelo fato de que o suprimento de força elétrica cronometrado secundário é na forma de um conversor redutor (21 j ou um conversor elevador (21).
- 41. Fonte de arco elétrico de acordo com a reivindicação 32, caracterizada pelo fato de que, a unidade de suprimento de força elétrica é um suprimento de força elétrica cronometrado primário (22), por meio do qual o sinal do suprimento de força elétrica cronometrado primário (22) é modulado tal que uma corrente de conservação DC é produzida, com um sinal pulsado ou sinal AC sobreposto nela.Petição 870180035237, de 30/04/2018, pág. 40/541/10Petição 870180035237, de 30/04/2018, pág. 45/542/10CMΟα. Α©, □Petição 870180035237, de 30/04/2018, pág. 46/543/10Petição 870180035237, de 30/04/2018, pág. 47/544/10KL,_np3Petição 870180035237, de 30/04/2018, pág. 48/545/10Petição 870180035237, de 30/04/2018, pág. 49/546/10 <·—β-jllCDFIG 6Petição 870180035237, de 30/04/2018, pág. 50/547/10Γο u_Petição 870180035237, de 30/04/2018, pág. 51/548/10 ¢0ΟKlΚ* /'-?Ο ♦—teaflΠ-κ /ο α§ <ΝPetição 870180035237, de 30/04/2018, pág. 52/549/10Petição 870180035237, de 30/04/2018, pág. 53/5410/10Petição 870180035237, de 30/04/2018, pág. 54/54
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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PCT/CH2006/000123 WO2006099758A2 (de) | 2005-03-24 | 2006-03-01 | Verfahren zum betreiben einer gepulsten arcquelle |
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EP (2) | EP2447978A3 (pt) |
JP (5) | JP5571898B2 (pt) |
KR (2) | KR101361207B1 (pt) |
CN (4) | CN101175867B (pt) |
BR (1) | BRPI0609127B1 (pt) |
ES (1) | ES2539017T5 (pt) |
PL (1) | PL1869690T5 (pt) |
SG (2) | SG160351A1 (pt) |
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SE0302045D0 (sv) * | 2003-07-10 | 2003-07-10 | Chemfilt R & D Ab | Work piece processing by pulsed electric discharges in solid-gas plasmas |
US7455890B2 (en) * | 2003-08-05 | 2008-11-25 | General Electric Company | Ion implantation of turbine engine rotor component |
CN1616707A (zh) * | 2003-11-11 | 2005-05-18 | 北京长城钛金公司 | 用脉冲电弧等离子体蒸发离化源制备纳米多层膜的方法 |
JP4500061B2 (ja) * | 2004-02-02 | 2010-07-14 | 株式会社神戸製鋼所 | 硬質皮膜の成膜方法 |
US9997338B2 (en) * | 2005-03-24 | 2018-06-12 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for operating a pulsed arc source |
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2005
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