SE0302045D0 - Work piece processing by pulsed electric discharges in solid-gas plasmas - Google Patents
Work piece processing by pulsed electric discharges in solid-gas plasmasInfo
- Publication number
- SE0302045D0 SE0302045D0 SE0302045A SE0302045A SE0302045D0 SE 0302045 D0 SE0302045 D0 SE 0302045D0 SE 0302045 A SE0302045 A SE 0302045A SE 0302045 A SE0302045 A SE 0302045A SE 0302045 D0 SE0302045 D0 SE 0302045D0
- Authority
- SE
- Sweden
- Prior art keywords
- work piece
- anode
- discharges
- solid
- biasing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/351—Sputtering by application of a magnetic field, e.g. magnetron sputtering using a magnetic field in close vicinity to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0302045A SE0302045D0 (sv) | 2003-07-10 | 2003-07-10 | Work piece processing by pulsed electric discharges in solid-gas plasmas |
EP04749165.9A EP1654396B1 (en) | 2003-07-10 | 2004-07-09 | Work piece processing by pulsed electric discharges in solid-gas plasma |
PCT/SE2004/001129 WO2005005684A1 (en) | 2003-07-10 | 2004-07-09 | Work piece processing by pulsed electric discharges in solid-gas plasma |
US10/563,864 US8262869B2 (en) | 2003-07-10 | 2004-07-09 | Work piece processing by pulsed electric discharges in solid-gas plasma |
US13/608,537 US9941102B2 (en) | 2003-07-10 | 2012-09-10 | Apparatus for processing work piece by pulsed electric discharges in solid-gas plasma |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0302045A SE0302045D0 (sv) | 2003-07-10 | 2003-07-10 | Work piece processing by pulsed electric discharges in solid-gas plasmas |
Publications (1)
Publication Number | Publication Date |
---|---|
SE0302045D0 true SE0302045D0 (sv) | 2003-07-10 |
Family
ID=27764967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0302045A SE0302045D0 (sv) | 2003-07-10 | 2003-07-10 | Work piece processing by pulsed electric discharges in solid-gas plasmas |
Country Status (4)
Country | Link |
---|---|
US (2) | US8262869B2 (sv) |
EP (1) | EP1654396B1 (sv) |
SE (1) | SE0302045D0 (sv) |
WO (1) | WO2005005684A1 (sv) |
Cited By (1)
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---|---|---|---|---|
CN117353712A (zh) * | 2023-12-05 | 2024-01-05 | 华中科技大学 | 一种基于数据驱动的强流脉冲电源组件交替复用方法 |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9771648B2 (en) | 2004-08-13 | 2017-09-26 | Zond, Inc. | Method of ionized physical vapor deposition sputter coating high aspect-ratio structures |
US9997338B2 (en) * | 2005-03-24 | 2018-06-12 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for operating a pulsed arc source |
US7615931B2 (en) | 2005-05-02 | 2009-11-10 | International Technology Center | Pulsed dielectric barrier discharge |
US8642135B2 (en) * | 2005-09-01 | 2014-02-04 | Micron Technology, Inc. | Systems and methods for plasma doping microfeature workpieces |
GB2437080B (en) * | 2006-04-11 | 2011-10-12 | Hauzer Techno Coating Bv | A vacuum treatment apparatus, a bias power supply and a method of operating a vacuum treatment apparatus |
CN100408511C (zh) * | 2006-08-11 | 2008-08-06 | 中国科学院上海硅酸盐研究所 | 一种氮化硅/氮化钛纳米复合材料的制备方法 |
EP2102889B1 (en) * | 2006-12-12 | 2020-10-07 | Evatec AG | Rf substrate bias with high power impulse magnetron sputtering (hipims) |
DE102007011230A1 (de) * | 2007-03-06 | 2008-09-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Magnetronplasmaanlage |
US9039871B2 (en) | 2007-11-16 | 2015-05-26 | Advanced Energy Industries, Inc. | Methods and apparatus for applying periodic voltage using direct current |
US8133359B2 (en) * | 2007-11-16 | 2012-03-13 | Advanced Energy Industries, Inc. | Methods and apparatus for sputtering deposition using direct current |
EP2075823B1 (en) * | 2007-12-24 | 2012-02-29 | Huettinger Electronic Sp. z o. o | Current change limiting device |
DE102008028140B3 (de) * | 2008-06-13 | 2009-12-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer transparenten und leitfähigen Metalloxidschicht durch gepulstes, hochionisierendes Magnetronsputtern |
JP2010065240A (ja) * | 2008-09-08 | 2010-03-25 | Kobe Steel Ltd | スパッタ装置 |
DE102008057286B3 (de) * | 2008-11-14 | 2010-05-20 | Systec System- Und Anlagentechnik Gmbh & Co. Kg | Verfahren und Vorrichtung zur PVD-Beschichtung mit schaltbarer Biasspannung |
JP5339965B2 (ja) * | 2009-03-02 | 2013-11-13 | 株式会社アルバック | スパッタリング装置用の交流電源 |
US20230377839A1 (en) * | 2009-05-01 | 2023-11-23 | Advanced Energy Industries, Inc. | Apparatus to produce a waveform |
JP5588645B2 (ja) * | 2009-09-15 | 2014-09-10 | 川崎重工業株式会社 | 横断面に肉厚部位を有する複合材料構造物製造用治具 |
US8642140B2 (en) * | 2011-03-09 | 2014-02-04 | United Technologies Corporation | Ceramic coating deposition |
US9023437B2 (en) * | 2012-05-15 | 2015-05-05 | United Technologies Corporation | Ceramic coating deposition |
US9793098B2 (en) | 2012-09-14 | 2017-10-17 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
US10056237B2 (en) | 2012-09-14 | 2018-08-21 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
US9412569B2 (en) | 2012-09-14 | 2016-08-09 | Vapor Technologies, Inc. | Remote arc discharge plasma assisted processes |
BR102013031497A2 (pt) * | 2013-12-06 | 2015-11-10 | Mahle Int Gmbh | processo de revestimento de um cilindro de um motor a combustão interna e cilindro/camisa de motor |
JP6403269B2 (ja) * | 2014-07-30 | 2018-10-10 | 株式会社神戸製鋼所 | アーク蒸発源 |
CN104651779A (zh) * | 2015-02-11 | 2015-05-27 | 烟台首钢磁性材料股份有限公司 | 一种用于钕铁硼磁体的镀膜设备及镀膜工艺 |
US9812305B2 (en) | 2015-04-27 | 2017-11-07 | Advanced Energy Industries, Inc. | Rate enhanced pulsed DC sputtering system |
US11049702B2 (en) | 2015-04-27 | 2021-06-29 | Advanced Energy Industries, Inc. | Rate enhanced pulsed DC sputtering system |
US10373811B2 (en) * | 2015-07-24 | 2019-08-06 | Aes Global Holdings, Pte. Ltd | Systems and methods for single magnetron sputtering |
US10566177B2 (en) * | 2016-08-15 | 2020-02-18 | Applied Materials, Inc. | Pulse shape controller for sputter sources |
DE102018204585A1 (de) * | 2017-03-31 | 2018-10-04 | centrotherm international AG | Plasmagenerator, Plasma-Behandlungsvorrichtung und Verfahren zum gepulsten Bereitstellen von elektrischer Leistung |
RU2671522C1 (ru) * | 2017-08-14 | 2018-11-01 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" | Способ плазменного упрочнения внутренней цилиндрической поверхности |
KR101886755B1 (ko) * | 2017-11-17 | 2018-08-09 | 한국원자력연구원 | 다중 펄스 플라즈마를 이용한 음이온 공급의 연속화 시스템 및 방법 |
CN113474483A (zh) * | 2019-02-07 | 2021-10-01 | 朗姆研究公司 | 能时间和/或空间上调制一或更多等离子体的衬底处理 |
EP3945541A1 (en) * | 2020-07-29 | 2022-02-02 | TRUMPF Huettinger Sp. Z o. o. | Pulsing assembly, power supply arrangement and method using the assembly |
US11955324B2 (en) * | 2020-08-07 | 2024-04-09 | Jefferson Science Associates, Llc | High power pulse systems for surface processing |
US11823868B2 (en) | 2021-06-11 | 2023-11-21 | Applied Materials, Inc. | Hardware switch on main feed line in a radio frequency plasma processing chamber |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4963239A (en) * | 1988-01-29 | 1990-10-16 | Hitachi, Ltd. | Sputtering process and an apparatus for carrying out the same |
FR2699934B1 (fr) | 1992-12-30 | 1995-03-17 | Lorraine Inst Nat Polytech | Procédé de contrôle de la concentration en métalloïde d'un dépôt réalisés par voie physique en phase vapeur réactive à l'aide d'un plasma froid de pulvérisation. |
JP3398447B2 (ja) * | 1993-11-26 | 2003-04-21 | 新電元工業株式会社 | スパッタ装置用電源 |
JPH1079372A (ja) * | 1996-09-03 | 1998-03-24 | Matsushita Electric Ind Co Ltd | プラズマ処理方法及びプラズマ処理装置 |
SE9704607D0 (sv) * | 1997-12-09 | 1997-12-09 | Chemfilt R & D Ab | A method and apparatus for magnetically enhanced sputtering |
US6193855B1 (en) * | 1999-10-19 | 2001-02-27 | Applied Materials, Inc. | Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage |
US6344419B1 (en) * | 1999-12-03 | 2002-02-05 | Applied Materials, Inc. | Pulsed-mode RF bias for sidewall coverage improvement |
SE519931C2 (sv) * | 2000-06-19 | 2003-04-29 | Chemfilt R & D Ab | Anordning och förfarande för pulsad, starkt joniserad magnetronsputtering |
US6413382B1 (en) | 2000-11-03 | 2002-07-02 | Applied Materials, Inc. | Pulsed sputtering with a small rotating magnetron |
US20040112735A1 (en) * | 2002-12-17 | 2004-06-17 | Applied Materials, Inc. | Pulsed magnetron for sputter deposition |
-
2003
- 2003-07-10 SE SE0302045A patent/SE0302045D0/sv unknown
-
2004
- 2004-07-09 US US10/563,864 patent/US8262869B2/en active Active
- 2004-07-09 EP EP04749165.9A patent/EP1654396B1/en not_active Expired - Lifetime
- 2004-07-09 WO PCT/SE2004/001129 patent/WO2005005684A1/en active Application Filing
-
2012
- 2012-09-10 US US13/608,537 patent/US9941102B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117353712A (zh) * | 2023-12-05 | 2024-01-05 | 华中科技大学 | 一种基于数据驱动的强流脉冲电源组件交替复用方法 |
CN117353712B (zh) * | 2023-12-05 | 2024-02-20 | 华中科技大学 | 一种基于数据驱动的强流脉冲电源组件交替复用方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1654396B1 (en) | 2017-03-22 |
EP1654396A1 (en) | 2006-05-10 |
WO2005005684A1 (en) | 2005-01-20 |
US20130062198A1 (en) | 2013-03-14 |
US9941102B2 (en) | 2018-04-10 |
US8262869B2 (en) | 2012-09-11 |
US20060278518A1 (en) | 2006-12-14 |
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