WO2005108468A1 - 有機シリカ系膜の形成方法、有機シリカ系膜、配線構造体、半導体装置、および膜形成用組成物 - Google Patents
有機シリカ系膜の形成方法、有機シリカ系膜、配線構造体、半導体装置、および膜形成用組成物 Download PDFInfo
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- WO2005108468A1 WO2005108468A1 PCT/JP2005/008223 JP2005008223W WO2005108468A1 WO 2005108468 A1 WO2005108468 A1 WO 2005108468A1 JP 2005008223 W JP2005008223 W JP 2005008223W WO 2005108468 A1 WO2005108468 A1 WO 2005108468A1
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- Prior art keywords
- film
- forming
- organic silica
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- bis
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 182
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 76
- 239000000203 mixture Substances 0.000 title claims description 63
- 239000004065 semiconductor Substances 0.000 title claims description 29
- 230000015572 biosynthetic process Effects 0.000 title description 26
- 238000000576 coating method Methods 0.000 claims abstract description 62
- 239000011248 coating agent Substances 0.000 claims abstract description 61
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 150000003377 silicon compounds Chemical class 0.000 claims abstract description 28
- 229910000077 silane Inorganic materials 0.000 claims description 27
- 229920003257 polycarbosilane Polymers 0.000 claims description 23
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 21
- 239000011229 interlayer Substances 0.000 claims description 21
- 229910052799 carbon Inorganic materials 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 230000001678 irradiating effect Effects 0.000 claims description 15
- 239000001301 oxygen Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 13
- 239000003960 organic solvent Substances 0.000 claims description 12
- 230000003301 hydrolyzing effect Effects 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 11
- 238000006460 hydrolysis reaction Methods 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 230000007062 hydrolysis Effects 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- -1 wiring structure Substances 0.000 description 62
- 239000000243 solution Substances 0.000 description 49
- 239000010936 titanium Substances 0.000 description 40
- 229910052719 titanium Inorganic materials 0.000 description 40
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 39
- 238000006243 chemical reaction Methods 0.000 description 36
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 33
- 229910052726 zirconium Inorganic materials 0.000 description 33
- 238000001723 curing Methods 0.000 description 29
- 239000000126 substance Substances 0.000 description 29
- 239000007983 Tris buffer Substances 0.000 description 28
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 27
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- 150000001875 compounds Chemical class 0.000 description 22
- 125000005595 acetylacetonate group Chemical group 0.000 description 20
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 16
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 16
- 239000002253 acid Substances 0.000 description 14
- ZZHNUBIHHLQNHX-UHFFFAOYSA-N butoxysilane Chemical compound CCCCO[SiH3] ZZHNUBIHHLQNHX-UHFFFAOYSA-N 0.000 description 13
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 13
- 238000011282 treatment Methods 0.000 description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- UGAPHEBNTGUMBB-UHFFFAOYSA-N acetic acid;ethyl acetate Chemical compound CC(O)=O.CCOC(C)=O UGAPHEBNTGUMBB-UHFFFAOYSA-N 0.000 description 11
- 125000003545 alkoxy group Chemical group 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 11
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 125000004423 acyloxy group Chemical group 0.000 description 10
- 239000002585 base Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 10
- 229910052731 fluorine Inorganic materials 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 9
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 9
- UWIULCYKVGIOPW-UHFFFAOYSA-N Glycolone Natural products CCOC1=C(CC=CC)C(=O)N(C)c2c(O)cccc12 UWIULCYKVGIOPW-UHFFFAOYSA-N 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 9
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 9
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 8
- 239000005977 Ethylene Substances 0.000 description 8
- XEUCQOBUZPQUMQ-UHFFFAOYSA-N Glycolone Chemical compound COC1=C(CC=C(C)C)C(=O)NC2=C1C=CC=C2OC XEUCQOBUZPQUMQ-UHFFFAOYSA-N 0.000 description 8
- 229940022663 acetate Drugs 0.000 description 8
- 239000013522 chelant Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000006482 condensation reaction Methods 0.000 description 8
- 238000010894 electron beam technology Methods 0.000 description 8
- 125000001153 fluoro group Chemical group F* 0.000 description 8
- 125000005843 halogen group Chemical group 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- ZMYXZXUHYAGGKG-UHFFFAOYSA-N propoxysilane Chemical compound CCCO[SiH3] ZMYXZXUHYAGGKG-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 7
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N acetic anhydride Substances CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 7
- 125000003342 alkenyl group Chemical group 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- HCOKJWUULRTBRS-UHFFFAOYSA-N propan-2-yloxysilane Chemical compound CC(C)O[SiH3] HCOKJWUULRTBRS-UHFFFAOYSA-N 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 229910008051 Si-OH Inorganic materials 0.000 description 6
- 229910006358 Si—OH Inorganic materials 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000000010 aprotic solvent Substances 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- XWQLYVIMMBLXPY-UHFFFAOYSA-N butan-2-yloxysilane Chemical compound CCC(C)O[SiH3] XWQLYVIMMBLXPY-UHFFFAOYSA-N 0.000 description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 6
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 6
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 6
- 125000001174 sulfone group Chemical group 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 5
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 5
- 229910003849 O-Si Inorganic materials 0.000 description 5
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 5
- 229910003872 O—Si Inorganic materials 0.000 description 5
- 229940125782 compound 2 Drugs 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 235000006408 oxalic acid Nutrition 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 125000005372 silanol group Chemical group 0.000 description 5
- BVNZLSHMOBSFKP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxysilane Chemical compound CC(C)(C)O[SiH3] BVNZLSHMOBSFKP-UHFFFAOYSA-N 0.000 description 4
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000005456 alcohol based solvent Substances 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 125000005920 sec-butoxy group Chemical group 0.000 description 4
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 4
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- 239000005052 trichlorosilane Substances 0.000 description 4
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 4
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
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- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000003377 acid catalyst Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
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- 150000001408 amides Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229940126214 compound 3 Drugs 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
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- 239000003759 ester based solvent Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
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- 239000005453 ketone based solvent Substances 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
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- 238000012545 processing Methods 0.000 description 3
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- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 2
- FEWLNYSYJNLUOO-UHFFFAOYSA-N 1-Piperidinecarboxaldehyde Chemical compound O=CN1CCCCC1 FEWLNYSYJNLUOO-UHFFFAOYSA-N 0.000 description 2
- NOMOPRKYOOSZKV-UHFFFAOYSA-N 2-(diethoxymethylsilyl)ethyl-triethoxysilane Chemical compound CCOC(OCC)[SiH2]CC[Si](OCC)(OCC)OCC NOMOPRKYOOSZKV-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- HITBDIPWYKTHIH-UHFFFAOYSA-N 2-[diethoxy(methyl)silyl]ethyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)CC[Si](C)(OCC)OCC HITBDIPWYKTHIH-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 2
- BJISXPRYXCKVSD-UHFFFAOYSA-J 3-oxobutanoate;titanium(4+) Chemical compound [Ti+4].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O.CC(=O)CC([O-])=O.CC(=O)CC([O-])=O BJISXPRYXCKVSD-UHFFFAOYSA-J 0.000 description 2
- AMUZLNGQQFNPTQ-UHFFFAOYSA-J 3-oxohexanoate zirconium(4+) Chemical compound [Zr+4].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O AMUZLNGQQFNPTQ-UHFFFAOYSA-J 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
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- 229920000555 poly(dimethylsilanediyl) polymer Polymers 0.000 description 1
- 238000000710 polymer precipitation Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- PWVUSFVRYWVBDM-UHFFFAOYSA-N tribromo(tribromosilyloxy)silane Chemical compound Br[Si](Br)(Br)O[Si](Br)(Br)Br PWVUSFVRYWVBDM-UHFFFAOYSA-N 0.000 description 1
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- YBNXDKRALACDIA-UHFFFAOYSA-N tributoxy-(4-tributoxysilylphenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C1=CC=C([Si](OCCCC)(OCCCC)OCCCC)C=C1 YBNXDKRALACDIA-UHFFFAOYSA-N 0.000 description 1
- UCSBCWBHZLSFGC-UHFFFAOYSA-N tributoxysilane Chemical compound CCCCO[SiH](OCCCC)OCCCC UCSBCWBHZLSFGC-UHFFFAOYSA-N 0.000 description 1
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- CAPIMQICDAJXSB-UHFFFAOYSA-N trichloro(1-chloroethyl)silane Chemical compound CC(Cl)[Si](Cl)(Cl)Cl CAPIMQICDAJXSB-UHFFFAOYSA-N 0.000 description 1
- SNYHRPNTNQYJMD-UHFFFAOYSA-N trichloro(1-chloropropyl)silane Chemical compound CCC(Cl)[Si](Cl)(Cl)Cl SNYHRPNTNQYJMD-UHFFFAOYSA-N 0.000 description 1
- FMYXZXAKZWIOHO-UHFFFAOYSA-N trichloro(2-phenylethyl)silane Chemical compound Cl[Si](Cl)(Cl)CCC1=CC=CC=C1 FMYXZXAKZWIOHO-UHFFFAOYSA-N 0.000 description 1
- WDVUXWDZTPZIIE-UHFFFAOYSA-N trichloro(2-trichlorosilylethyl)silane Chemical compound Cl[Si](Cl)(Cl)CC[Si](Cl)(Cl)Cl WDVUXWDZTPZIIE-UHFFFAOYSA-N 0.000 description 1
- SIPHWXREAZVVNS-UHFFFAOYSA-N trichloro(cyclohexyl)silane Chemical compound Cl[Si](Cl)(Cl)C1CCCCC1 SIPHWXREAZVVNS-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- GPWLZOISJZHVHX-UHFFFAOYSA-N trichloro(propan-2-yl)silane Chemical compound CC(C)[Si](Cl)(Cl)Cl GPWLZOISJZHVHX-UHFFFAOYSA-N 0.000 description 1
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 description 1
- ABDDAHLAEXNYRC-UHFFFAOYSA-N trichloro(trichlorosilylmethyl)silane Chemical compound Cl[Si](Cl)(Cl)C[Si](Cl)(Cl)Cl ABDDAHLAEXNYRC-UHFFFAOYSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- XVYIJOWQJOQFBG-UHFFFAOYSA-N triethoxy(fluoro)silane Chemical compound CCO[Si](F)(OCC)OCC XVYIJOWQJOQFBG-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JIOGKDWMNMIDEY-UHFFFAOYSA-N triethoxy-(2-triethoxysilylphenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1[Si](OCC)(OCC)OCC JIOGKDWMNMIDEY-UHFFFAOYSA-N 0.000 description 1
- YYJNCOSWWOMZHX-UHFFFAOYSA-N triethoxy-(4-triethoxysilylphenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=C([Si](OCC)(OCC)OCC)C=C1 YYJNCOSWWOMZHX-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- XPDWGBQVDMORPB-UHFFFAOYSA-N trifluoromethane acid Natural products FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 1
- GBUPQQVBBMOHMJ-UHFFFAOYSA-N triiodo(1-triiodosilylethyl)silane Chemical compound I[Si](I)(I)C(C)[Si](I)(I)I GBUPQQVBBMOHMJ-UHFFFAOYSA-N 0.000 description 1
- OWPIUELMEJJOEM-UHFFFAOYSA-N triiodo(2-phenylethyl)silane Chemical compound I[Si](I)(I)CCC1=CC=CC=C1 OWPIUELMEJJOEM-UHFFFAOYSA-N 0.000 description 1
- ARIHFGQDMNMGQJ-UHFFFAOYSA-N triiodo(methyl)silane Chemical compound C[Si](I)(I)I ARIHFGQDMNMGQJ-UHFFFAOYSA-N 0.000 description 1
- HBVCQKOZPHBDAR-UHFFFAOYSA-N triiodo(phenyl)silane Chemical compound I[Si](I)(I)C1=CC=CC=C1 HBVCQKOZPHBDAR-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DJYGUVIGOGFJOF-UHFFFAOYSA-N trimethoxy(trimethoxysilylmethyl)silane Chemical compound CO[Si](OC)(OC)C[Si](OC)(OC)OC DJYGUVIGOGFJOF-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- MEBONNVPKOBPEA-UHFFFAOYSA-N trimethyl cyclohexane Natural products CC1CCCCC1(C)C MEBONNVPKOBPEA-UHFFFAOYSA-N 0.000 description 1
- XOAJIYVOSJHEQB-UHFFFAOYSA-N trimethyl trimethoxysilyl silicate Chemical compound CO[Si](OC)(OC)O[Si](OC)(OC)OC XOAJIYVOSJHEQB-UHFFFAOYSA-N 0.000 description 1
- IXSPLXSQNNZJJU-UHFFFAOYSA-N trimethyl(silyloxy)silane Chemical compound C[Si](C)(C)O[SiH3] IXSPLXSQNNZJJU-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- AMUIJRKZTXWCEA-UHFFFAOYSA-N triphenoxy(propyl)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(CCC)OC1=CC=CC=C1 AMUIJRKZTXWCEA-UHFFFAOYSA-N 0.000 description 1
- MUCRQDBOUNQJFE-UHFFFAOYSA-N triphenoxy(triphenoxysilyl)silane Chemical compound C=1C=CC=CC=1O[Si]([Si](OC=1C=CC=CC=1)(OC=1C=CC=CC=1)OC=1C=CC=CC=1)(OC=1C=CC=CC=1)OC1=CC=CC=C1 MUCRQDBOUNQJFE-UHFFFAOYSA-N 0.000 description 1
- YRUALOZSEADDBR-UHFFFAOYSA-N triphenyl triphenoxysilyl silicate Chemical compound C=1C=CC=CC=1O[Si](O[Si](OC=1C=CC=CC=1)(OC=1C=CC=CC=1)OC=1C=CC=CC=1)(OC=1C=CC=CC=1)OC1=CC=CC=C1 YRUALOZSEADDBR-UHFFFAOYSA-N 0.000 description 1
- VUWVDNLZJXLQPT-UHFFFAOYSA-N tripropoxy(propyl)silane Chemical compound CCCO[Si](CCC)(OCCC)OCCC VUWVDNLZJXLQPT-UHFFFAOYSA-N 0.000 description 1
- BZIXIRYKSIMLOB-UHFFFAOYSA-N tripropoxy(tripropoxysilylmethyl)silane Chemical compound CCCO[Si](OCCC)(OCCC)C[Si](OCCC)(OCCC)OCCC BZIXIRYKSIMLOB-UHFFFAOYSA-N 0.000 description 1
- OZWKZRFXJPGDFM-UHFFFAOYSA-N tripropoxysilane Chemical compound CCCO[SiH](OCCC)OCCC OZWKZRFXJPGDFM-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- ZZEMYLNHCSTIPH-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-[2-[tris[(2-methylpropan-2-yl)oxy]silyl]phenyl]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C1=CC=CC=C1[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C ZZEMYLNHCSTIPH-UHFFFAOYSA-N 0.000 description 1
- QJJZQRNPNLTSNS-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-[tris[(2-methylpropan-2-yl)oxy]silylmethyl]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C QJJZQRNPNLTSNS-UHFFFAOYSA-N 0.000 description 1
- KGOOITCIBGXHJO-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-phenylsilane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C1=CC=CC=C1 KGOOITCIBGXHJO-UHFFFAOYSA-N 0.000 description 1
- QCKKBOHAYRLMQP-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[SiH](OC(C)(C)C)OC(C)(C)C QCKKBOHAYRLMQP-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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Definitions
- the present invention relates to a method for forming an organic silica-based film, an organic silica-based film, a wiring structure, a semiconductor device, and a film-forming composition.
- CVD Chemical Vapor
- a silica (SiO 2) film formed by a vacuum process such as a deposition method is often used.
- a coating-type insulating film called a SOG (Spin on Glass) film which is mainly composed of a hydrolysis product of tetraalkoxylan. It has become.
- an interlayer insulating film having a low relative dielectric constant which is mainly composed of polyorganosiloxane and is called organic SOG, has been developed.
- organic SOG organic silica sol
- a dehydration condensation reaction by heating at 350 ° C to 500 ° C, and by using an organic silica sol, a semiconductor device is cured.
- the reaction of this organic silica sol is a solid-phase reaction, and the dehydration condensation does not progress very much due to the diffusion rule, and it is necessary to heat for a long time, at least about 30 minutes at least, usually 1 hour or more. There were drawbacks.
- UV ultraviolet
- a photoacid generator or photobase generator that can generate an acid or base upon irradiation with ultraviolet light to promote the condensation reaction of silanol and alkoxide to gel the silica sol.
- silica sol-gel technique is applied to the formation of optical waveguides (Japanese Patent Application Laid-Open No. 2000-109695).
- Silica-based films obtained by curing using such photoacid generators and photobase generators generally contain a large amount of residual silanol and have high hygroscopicity, resulting in a high dielectric constant. .
- Moisture due to residual silanol can be reduced by heating at about 250 ° C to 500 ° C for a certain period of time (usually 30 minutes or more) after gelling by UV irradiation.
- the method is no different from the above-described curing of a silica-based film by heating.
- the composition containing these photoacid generators and photobase generators has a photo-acid generator, a photo-base generator itself, and the acid or basic substance generated from these photo-acid generators or photo-base generators as carriers for electric charges.
- problems such as deterioration of performance and deterioration of wiring metal may occur. For this reason, high insulation reliability is required
- the quality of an insulating film of a semiconductor device for LSI cannot be satisfied.
- Sisiloxane conjugates have excellent transparency to ultraviolet light, and have been actively studied as the main skeleton of F2 photoresist using an ultraviolet ray having a wavelength of 157 nm.
- siloxane as a backbone
- a photoacid generator generates an acidic substance upon irradiation with ultraviolet light, and a chemical bond cleaved by the acid is easily dissolved in a basic developer such as a carboxylic acid! / ⁇ It is produced and does not promote the crosslinking reaction of the silica sol by ultraviolet rays.
- the surface of the organic silica-based film cured by heat or electron beam is rich in hydrophobicity, and ultraviolet irradiation may be performed to improve the hydrophobicity of the surface
- US Patent No. 63 83913, JP-A-63-248710, JP-A-63-289939, JP-B-8-29932, JP-A-2001-110802, etc. the hydrophobic surface is modified into a highly reactive hydrophilic surface such as silanol by oxidizing the extreme surface of the organic silica-based film with ozone generated by ultraviolet irradiation in air. It is characterized by. This modification is mainly performed for the purpose of improving the adhesion to the film formed on the upper layer.
- Japanese Patent Application Laid-Open No. 3-30427 discloses a method in which a solution of tetraalkoxysilane (eg, tetraethoxysilane: TEOS) dissolved in collodion is applied to a semiconductor substrate, and then ultraviolet irradiation is performed in a nitrogen atmosphere.
- a technique for obtaining a silicon dioxide film at a low temperature is disclosed. This technology is characterized by fixing highly volatile TEOS with collodion and promoting the decomposition of collodion and the dehydration-condensation of TEOS by ultraviolet irradiation.
- JP-A-1-194980 discloses that after coating an organic siloxane resin on a substrate, ultraviolet light having a main wavelength of 254 nm is irradiated under heating at a temperature of 200 ° C or less, and The technology has been disclosed that the surface of the organic siloxane film is oxidized by the generated ozone and subsequently heated at 400 ° C or more, particularly around 900 ° C, to obtain a dense silicon dioxide film. Have been.
- the formed insulating film is processed.
- the plasma etching resistance is not enough! With / ⁇ ! ⁇ ⁇ ⁇ There was a problem.
- Plasma damage caused during processing of an insulating film is mainly caused by radicals generated by plasma extracting CH from the Si-CH structure of polysiloxane.
- silanol groups Reacts quickly with oxygen atoms and oxygen radicals, and further draws in hydrogen, converting it to silanol groups (Si-OH).
- the presence of the silanol group increases the hygroscopicity of the insulating film, causing an increase in the relative dielectric constant, a deterioration in chemical resistance, and a decrease in electrical insulation.
- the Si—CH structure in the insulating film is simply used.
- Methods to improve plasma resistance while maintaining the physical property balance of Si include: CH—Si
- the two units are more resistant to radical
- Reactive radicals diffuse into the film by dispersing the remaining Si—CH—Si units in the film.
- This composition is intended to improve heat resistance and moisture absorption resistance, but when forming a film, polysiloxane and polycarbosilane undergo microphase separation, and Si-CH-Si
- a coating film can be efficiently cured at a low temperature in a shorter time, and can be suitably used as an interlayer insulating film in a semiconductor element, for example, and has a small relative dielectric constant.
- a method for forming an organic silica-based film capable of forming a film having excellent mechanical strength and adhesion as well as plasma resistance and chemical solution resistance and a film-forming composition used in the method. It is in.
- Another object of the present invention is to provide an organic silica-based film obtained by the method for forming an organic silica-based film of the present invention, a wiring structure including the organic silica-based film, and a semiconductor including the wiring structure. It is to provide a device.
- the method for forming an organic silica-based film of the present invention comprises:
- the silicon compound has a structure of —Si—O—Si— and —Si—CH—Si— / S
- the carbon content of the Kei-containing compound can be 11 to 26 mole 0/0.
- the ultraviolet light may have a wavelength power S250 nm or less.
- heating and irradiation with ultraviolet rays can be performed simultaneously.
- the heating can be performed at 300 to 450 ° C.
- the ultraviolet irradiation can be performed in the absence of oxygen.
- the silicon compound may be:
- hydrolytic shrinkage of hydrolyzable group-containing silane monomer It can be a hydrolyzed condensate obtained in combination.
- the organic silica-based film of the present invention is obtained by the method for forming an organic silica-based film of the present invention.
- Relative dielectric constant from 1.5 to 3.5 and is and film density can be 0. 7 ⁇ 1.
- the wiring structure of the present invention uses the organic silica-based film of the present invention as an interlayer insulating film.
- a semiconductor device of the present invention includes the wiring structure of the present invention.
- the film-forming composition of the present invention comprises:
- the hydrolysis-condensation product can be 11 to 26 mole 0/0 containing TansoHara child.
- the amount of the component (A) used is based on 100 parts by weight of the component (B) converted to the complete 311 hydrolytic condensation product. And 1 to 1000 parts by weight.
- an organic silica-based film of the present invention a step of forming a coating film made of the silicon compound on a substrate, a step of heating the coating film, and applying ultraviolet rays to the coating film
- the coating film can be efficiently cured at a low temperature in a shorter time.
- an organic silica-based film that can be suitably used as an interlayer insulating film in a semiconductor element or the like and has a small relative dielectric constant and is excellent in chemical resistance, plasma resistance, and mechanical strength in a semiconductor manufacturing process is obtained. I can do it.
- Organic Silica Film and Method for Forming the Same comprises the steps of -Si-O Si-structure and -Si-CH
- a step of forming a coating film having a silicon compound having a Si structure (hereinafter, also simply referred to as a “silicon compound”) on a substrate, a step of heating the coating film, and applying ultraviolet rays to the coating film. Irradiating and performing a curing treatment.
- a Si O Si structure and a Si—CH—Si structure are provided.
- a coating film made of a silicon compound is formed on a substrate.
- the 2ZSiOSi structure (molar ratio) is preferably from 0.025 to 2.000. If the molar ratio is less than 0.025 or exceeds 2,000, it becomes difficult to improve the plasma resistance and the chemical resistance while maintaining the relative dielectric constant and the mechanical strength.
- the number of moles of the Si O Si structure is based on the assumption that the total amount of the hydrolyzable silane monomer used is hydrolyzed and condensed in a silicon compound composed of a hydrolyzed condensate described later. Moles, Si— CH— Si
- the number of moles of the structure is the number of moles of the Si—CH—Si structure present in the polycarbosilane described below.
- the carbon atom concentration in the coating film which is also a silicon compound, is preferably 11 to 26 mol%. If the concentration of carbon atoms in the silicon compound is less than 11 mol%, the resulting film may not have sufficient plasma resistance and chemical resistance, whereas if it exceeds 26 mol%, the resulting film may have an interlayer resistance. In some cases, the balance between the insulating properties and mechanical strength of the insulating film is lacking.
- the carbon atom concentration in the silicon compound-based coating film is determined by the amount of the hydrolyzable condensate obtained when the hydrolyzable silane monomer described below is completely hydrolyzed and condensed. It is the carbon atom weight.
- the thickness of the coating film which is also a silicon compound, is usually from 1 to 2, OOOnm, preferably from 10 to L, 000nm.
- the coating film having the capability of a silicon compound may be formed by applying a solution obtained by dissolving a polymer in an organic solvent and drying the film, or by a CVD method or the like. But however, a film obtained by applying the film-forming composition described below to a substrate and drying it is preferable.
- the film-forming composition for forming a coating film composed of a silicon compound is preferably one containing polycarbosilane and polysiloxane as a polymer component.
- the film-forming composition of the present invention can be produced by dissolving polycarbosilane and polysiloxane in an organic solvent, and particularly, (A) polycarbosilane (hereinafter also referred to as “component (A)”). ) In the presence of (B) a hydrolyzable condensate obtained by hydrolyzing and condensing a hydrolyzable group-containing silane monomer (hereinafter, also referred to as “(B) component! / ⁇ ⁇ )” (hereinafter simply referred to as “hydrolysis”). The condensate is also preferably obtained by dissolving U) in an organic solvent.
- the term "hydrolyzable group” refers to a group that can be hydrolyzed by carohydrate during production of the film-forming composition of the present invention.
- Specific examples of the hydrolyzable group include, but are not particularly limited to, a halogen atom, a hydroxy group, an alkoxy group, an acyloxy group, a sulfone group, a methanesulfone group, and a trifluoromethanesulfone group.
- the polystyrene-equivalent weight average molecular weight (Mw) of the hydrolyzed condensate is preferably 1,500 to 500,000, a force S preferably ⁇ , 2,000 to 200,000, and more preferably a force S, ⁇ 2. , 00 to 100, 000, more preferably. If the weight average molecular weight in terms of polystyrene of the hydrolysis condensate is less than 1,500, the desired relative dielectric constant may not be obtained.On the other hand, if it exceeds 500,000, the in-plane uniformity of the coating film may be reduced. May be inferior.
- the proportion of the component (A) used is preferably 1 to L000 parts by weight based on 100 parts by weight of the completely hydrolyzed condensate of the component (B). 5 to: more preferably L00 parts by weight, and even more preferably 5 to 20 parts by weight.
- the amount of the component (A) is less than 1 part by weight, sufficient chemical resistance may not be exhibited after film formation, and when it exceeds 1000 parts by weight, low dielectric constant cannot be achieved. There is.
- the polycarbosilane (A), which is the component (A), may be, for example, a polycarbosilane conjugate represented by the following general formula (1) (hereinafter, also referred to as “diridge 1”). ).
- R 8 represents a hydrogen atom, a halogen atom, a hydroxy group, an alkoxy group, an acyloxy group, a sulfone group, a methanesulfone group, a trifluoromethanesulfone group, an alkyl group, an alkyl group, and an aryl group.
- R 9 is selected from the group consisting of a halogen atom, a hydroxy group, an alkoxy group, an acyloxy group, a sulfone group, a methanesulfone group, a trifluoromethanesulfone group, an alkyl group, an alkenyl group, and an aryl group.
- R 10 and R 11 are the same or different, and are a halogen atom, a hydroxy group, an alkoxy group, an acyloxy group, a sulfone group, a methane sulfone group, a trifluoromethane sulfone group, an alkyl group having 2 to 6 carbon atoms, and an alkenyl group.
- R 12 to R 14 are the same or different Ri, a methylene group, an alkylene group, Aruke - indicates alkylene group, and Ariren groups force group, also selected from the group consisting of at least one of R 12 to R 14 is methylene group, X, y, z are each 0 ⁇ : Indicates the number of L0,000 and satisfies the condition of 5 x x + y + z x 10,000.
- R 9 , R 10 , and R 11 are halogenated A hydrogen atom, a hydroxy group, an alkoxy group, an acyloxy group, a sulfone group, a methanesulfone group, or a trifluoromethanesulfone group.
- an alkoxy group is a methoxy group, an ethoxy group, a propoxy group, a butoxy group, etc.
- an acyloxy group is an acetoxy group, a benzoyloxy group, etc.
- an alkyl group is a methyl group, Ethyl, propyl, butyl, etc., alkenyl, alkenyl, butyl, aryl, 3-butenyl, 3-pentenyl, 3-hexyl, etc.
- aryl groups such as phenyl, naphthyl, methyl, ethyl, chloro, bromo, and fluoro. Mouth-forming groups and the like can be mentioned.
- examples of the alkylene group include an ethylene group, a propylene group, a butylene group, a hexylene group, and a decylene group, and preferably have 2 to 6 carbon atoms.
- the alkylene group may be linear or branched, or may further form a ring, and the hydrogen atom may be substituted with a fluorine atom or the like.
- examples of the alkene-group include an eturene group, a probenylene group, a 1-butylene group, and a 2-butylene group. It preferably has 1 to 4 carbon atoms, and a hydrogen atom may be substituted by a fluorine atom or the like.
- examples of the arylene group include a phenylene group and a naphthylene group, and a hydrogen atom may be substituted with a fluorine atom or the like.
- R 8 to R U may be filed in different groups in the same group.
- the general formula (1) [where X, y, and X are 0 to L0,000, and 5 ⁇ x + y + z ⁇ 10,000].
- x + y + z + 5 the storage stability of the film-forming composition may be poor, and in the case of 10,000 + x + y + z, the component (A) and Wakes up and forms a uniform film.
- X, y, and z are 0 ⁇ x ⁇ 800, 0 ⁇ y ⁇ 500, and 0 ⁇ 1,000, respectively, and more preferably, 0 ⁇ x ⁇ 500, 0 ⁇ y ⁇ 300, 0 ⁇ z ⁇ 500, and more preferably 0 ⁇ x ⁇ 100, 0 ⁇ y ⁇ 50, and 0 ⁇ z ⁇ 100.
- + y + z 500 more preferably 5 x + y + z 250, most preferably 5 x + y + z 100.
- the component (A) has a functional group that generates a Si—OH group or a Si—OH group by a hydrolysis reaction, and the Si—OH group in the component (A) is included in the component (B). By condensing with the above-mentioned Si—OH group, compounding can proceed.
- Compound 1 is, for example, chloromethyltrichlorosilane, bromomethyltrichlorosilane, chloromethylmethyldichlorosilane, chloromethylethyldichlorosilane, chloromethylvinyldichlorosilane.
- Chlorosilane chloromethylphenyldichlorosilane, bromomethylmethyldichlorosilane, bromomethylvinyldichlorosilane, chloromethinoresmethinolechlorosilane, chloromethinoresylvinylchlorosilane, bromomethinoledimethylchlorosilane, (1 chloroethyl) trichlorosilane, (1-chloro Propyl) trichlorosilane, chloromethyltrimethoxysilane, bromomethyltrimethoxysilane, chloromethylmethyldimethoxysilane, chloromethylvinyldimethoxysilane, chloromethylphenyldimethoxysilane, bromomethylmethyldimethoxysilane, bromomethylvinyldimethoxysilane, Bromomethylphenyldimethoxysilane, chloromethyldimethylmethoxysilane, chloromethyl
- alkali metal Li, Na, and K are preferable, and as the alkaline earth metal, Mg and the like are preferable.
- Compound 1 can also be obtained by a thermal decomposition rearrangement reaction (yajima rearrangement reaction) of polydimethylsilanes.
- the hydrolyzable group-containing silane monomer (B) is not particularly limited as long as it is a silane monomer having a hydrolyzable group.
- a compound represented by the following general formula (2) Group of the compound represented by the following general formula (3) (hereinafter, also referred to as "compound 3"). At least one selected silanied compound may be used. it can be used.
- R 1 SiX (2) (In the formula, R 1 represents a hydrogen atom, a fluorine atom or a monovalent organic group, X represents a halogen atom, a hydroxy group, an alkoxy group, or an acyloxy group, and a represents an integer of 0 to 3. Shown.)
- R 2 and R 3 are the same or different and each represents a monovalent organic group
- b and c are the same or different and represent an integer of 0 to 2
- R 4 is an oxygen atom, a phenylene group Or— (CH)
- Y and Z are the same or different and represent a halogen atom, a hydroxy group, an alkoxy group, or an acyloxy group.
- D represents 0 or 1.
- examples of the halogen atom represented by X and Y include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
- R of the alkoxy group (—OR) represented by X and Y is the same as the alkyl group and aryl group of I ⁇ to R 4 described later. Can be mentioned.
- R of the acyloxy group (—OCOR) represented by X and Y represents an alkyl group and an aryl group represented by I ⁇ to R 4 described below. Similar ones can be mentioned.
- R 1 is a hydrogen atom, a fluorine atom or a monovalent organic group.
- the monovalent organic group include an alkyl group, an alkenyl group, an aryl group and the like.
- R 2 is preferably a monovalent organic group, particularly an alkyl group, an alkenyl group, or a phenyl group.
- examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group and the like, and preferably have 1 to 5 carbon atoms.
- These alkyl groups may be chain-like or branched, and may further be substituted with a hydrogen atom by a fluorine atom or the like.
- alkenyl group examples include a butyl group, an aryl group, a 3-butenyl group, a 3-pentenyl group, and a 3-hexyl group.
- Examples of the aryl group include a phenyl group, a naphthyl group, a methylphenyl group, an ethylphenyl group, a chlorophenol group, a bromophenyl group, and a fluorophenyl group.
- a hydrocarbon moiety of the alkoxy group for X those cited as monovalent organic groups for can be applied as they are.
- compound 2 examples include tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-iso-propoxysilane, tetra-n-butoxysilane, tetra-sec-butoxysilane, tetra-tert-butoxysilane, and tetra-tert-butoxysilane.
- Compound 2 is preferably methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, methyltriisopropoxysilane, ethyltrimethoxy.
- examples of the monovalent organic group represented by R 2 and R 3 include the same organic groups as those in the general formula (2).
- Te contact in the general formula (3), as the compound of R 4 is an oxygen atom, to the key Sacro Logistics siloxane, to hexa bromo disiloxane, to Kisayo one de Siji siloxane, the key Samethoxydisiloxane, hexaethoxydisiloxane, hexaphenoxydisiloxane, 1,1,1,3,3 pentamethoxy-13-methinoresisiloxane, 1,1,1,3,3 pentaethoxy-3- Methyldisiloxane, 1,1,1,3,3-pentaphenoxy-3 Methyldisiloxane, 1,1,1,3,3-pentamethoxy-3-ethyldisiloxane, 1,1,1,3,3-penta Ethoxy-3-ethyldisiloxane, 1,1,1,3,3-pentaphenoxy-3-ethyldisiloxane, 1,1,1,3,3-pentaphenoxy-3-e
- Preferred V ⁇ Can be mentioned as an example.
- the compounds where d is 0 include hexachlorodisilane, hexabromodisilane, hexaiodosidisilane, hexamethoxydisilane, hexaethoxydisilane, Hexaphenoxydisilane, 1,1,1,2,2-pentamethoxy-2-methyldisilane, 1,1,1,2,2-pentaethoxy-2-methyldisilane, 1,1,1,2 2-pentaphenoxy 2-methyldisilane, 1,1,1,2,2-pentamethoxy-2-ethyldisilane, 1,1,1,2,2-pentaethoxy-2-ethyldisilane, 1,1,1,2 , 2-Pentaphenoxy-1-ethyldisilane, 1,1,1,2,2-pentamethoxy-12-phenyldisilane, 1,1,1,2,2-pentaethoxy-1-phenylphenolesilane
- R 4 is a group represented by — (CH 2) 1
- one or more compounds can be used.
- water of more than 5 mol and 150 mol or less It is particularly preferable to use water of more than 0.5 mol and 130 mol or less.
- the hydrolytic condensate of the present invention can be obtained by hydrolyzing and condensing the component (B) in the presence of the component (A).
- component (B) is hydrolyzed while component (A) and component (B) are dissolved in an organic solvent.
- organic solvent that can be used in this case include methanol, ethanol, propanol, butanol, tetrahydrofuran, ⁇ -butyrolataton, propylene glycol monoalkyl ethers, and ethylene glycol monoalkyl ethers.
- the reaction temperature in the hydrolytic condensation is 0 to 100 ° C, preferably 20 to 60 ° C, and the reaction time is 30 minutes to 24 hours, preferably 1 hour to 8 hours.
- a specific catalyst can be used when the component (B) is hydrolyzed and condensed in the presence of the component (A) to produce a hydrolyzed condensate.
- the catalyst at least one selected from the group consisting of an alkali catalyst, a metal chelate catalyst, and an acid catalyst can be used.
- alkali catalyst examples include sodium hydroxide, potassium hydroxide, lithium hydroxide, pyridine, pyrrole, piperazine, pyrrolidine, piperidine, picoline, monoethanolamine, diethanolamine, and dimethyl.
- Monoethanolamine monomethyl ethanolamine, triethanolamine, diazabicyclooctane, diazabicyclononane, diazabicycloundecene, tetramethylammonium-dimethylhydroxide, tetraethylammonium-dimethylhydroxide, tetrapropylammonium Demoxide mouth oxide, tetrabutylammonium-Demoxide mouth oxide, ammonia, methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, pentylamine, octylamine, noni N, N dimethylamine, N, N dimethylamine, N, N dipropylamine, N, N dibutylamine, trimethylamine, triethylamine, tripropylamine, tributylamine, cyclohexylamine, trimethylimidine, 1— Examples thereof include amino-3-methylbutane, dimethyldar
- these alkali catalysts may be used at the same time.
- metal chelate catalysts include triethoxy mono (acetylacetonate) titanium, tree n-propoxy'mono (acetylacetonate) titanium, and tree i-propoxy'mono (acetylacetonate).
- Aluminum chelate toys such as rubber;
- a chelate conjugate of titanium or aluminum particularly preferably a chelate of titanium.
- metal chelate catalysts may be used simultaneously.
- the acid catalyst examples include, for example, inorganic acids such as hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, phosphoric acid, boric acid; acetic acid, propionic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, Nonanoic acid, decanoic acid, oxalic acid, maleic acid, methylmalonic acid, adipic acid, sebacic acid, gallic acid, butyric acid, melitic acid, arachidonic acid, shikimic acid, 2-ethylhexanoic acid, oleic acid, stearic acid, Linoleic acid, linoleic acid, salicylic acid, benzoic acid, p-aminobenzoic acid, ⁇ -toluenesulfonic acid, benzenesulfonic acid, monochloroacetic acid, dichloroace
- the amount of the catalyst to be used is usually 0.0001 to 10 mol, preferably ⁇ 0.00005, per 1 mol of the total amount of the groups represented by X, ⁇ , and Z in compounds 2 and 3. ⁇ 5 mol.
- the temperature at which the compounds 2 and 3 are hydrolyzed is usually 0 to: LOO ° C, preferably 15 to 80 ° C.
- the "complete 311 hydrolyzed condensate” refers to (A) a polycarbosilane and the hydrolyzable groups in the compounds 2 and 3 are hydrolyzed 100% to form Si-OH groups, Furthermore, those which completely condensed to form a siloxane structure!
- the hydrolyzed condensate is preferably (A) a hydrolyzed condensate of polycarbosilane and compound 2 from the viewpoint that the storage stability of the obtained composition is more excellent.
- the amount of compound 2,3 used for (A) polycarbosilane is more preferably 500 to 4000 parts by weight, based on 100 parts by weight of (A) polycarbosilane. Is from 1000 to 3000 parts by weight.
- the hydrolyzed condensate and, if necessary, other components described later can be dissolved or dispersed in an organic solvent.
- the organic solvent used as a component of the film-forming composition of the present invention is not particularly limited as long as it can be removed before a final film is obtained, but more specifically, a protic solvent And aprotic solvents.
- the protic solvent include alcohol solvents.
- the aprotic solvent include ketone solvents, ester solvents, ether solvents, amide solvents, and other aprotic solvents described below.
- the alcohol solvent includes methanol, ethanol, n-propanol, i-propanol, n -butanol, i-butanol, sec-butanol, t-butanol, n-pentanol, i-pentanol, and 2-methyl.
- Ethylene glycolone 1,2-propylene glycol, 1,3-butylene glycolone, 2,4-pentanediol, 2-methyl-2,4-pentanediol, 2,5-hexanediol, 2,4 heptanediol, 2-ethyl-1,3
- Polyhydric alcohol solvents such as hexanediol, diethylene glycol, dipropylene glycol, triethylene glycol, and tripropylene glycol;
- One or more of these alcohol solvents may be used at the same time.
- Examples of the ketone solvent include acetone, methyl ethyl ketone, methyl n-propyl ketone, methyl n-butyl ketone, getyl ketone, methyl i-butyl ketone, methyl n-pentyl ketone, ethyl n-butyl ketone, methyl n-xyl ketone, and di-ketone.
- i-Butyl ketone trimethylnonanone, cyclohexanone, 2-hexanone, methylcyclohexanone, 2,4 pentanedine, acetoninoleacetone, acetophenone, fencheon, etc.
- amide solvents examples include formamide, N-methylformamide, N, N dimethylformamide, N-ethylformamide, N, N-dimethylformamide, acetoamide, N-methylacetamide, N, N dimethylacetamide, N Ethyl acetoamide, N, N acetyl acetoamide, N-methylpropionamide, N-methylpyrrolidone, N-formylmorpholine, N-formylpiperidine, N-formylpyrrolidine, N-acetylmorpholine, N-acetylbiperidine, N-acetylpyrrolidine and the like.
- One or more of these amide solvents may be used simultaneously.
- ester solvents include getyl carbonate, ethylene carbonate, propylene carbonate, Getyl carbonate, methyl acetate, ethyl acetate, ⁇ -butyrate ratatone, ⁇ -valerolatatatone, ⁇ -propyl acetate, i-propyl acetate, n-butyl acetate, i-butyl acetate, sec-butyl acetate, n-pentyl acetate, sec-pentyl acetate 3-methoxybutyl acetate, methyl ethyl acetate, 2-ethyl butyl acetate, 2-ethyl hexyl acetate, benzyl acetate, cycle hexyl acetate, methyl cyclohexyl acetate, n-nor acetate, methyl acetate acetate, acetate Ethyl acetate, Ethylene glycol monomethyl
- aprotic solvents examples include acetonitrile, dimethyl sulfoxide, N, N, ⁇ ', ⁇ '-tetraethylsulfamide, hexamethylphosphoric triamide, ⁇ methylmorpholone, ⁇ methylpyrrole, ⁇ ethylpyrrole, ⁇ — Methyl- ⁇ pyrroline, ⁇ -methylpiperidi
- aprotic solvents may be used simultaneously.
- ketone solvents such as 2 heptanone, methyl isobutyl ketone, getyl ketone and cyclohexanone are preferred, and alcoholic solvents such as propylene glycol monopropyl ether are preferred.
- the total solid concentration of the film-forming composition of the present invention is preferably It is 2 to 30% by weight, and is appropriately adjusted depending on the purpose of use.
- the total solid content of the film-forming composition is 2 to 30% by weight, the thickness of the coating film is in an appropriate range, and the storage stability is more excellent.
- the adjustment of the total solid content concentration is performed, if necessary, by concentration and dilution with the organic solvent.
- reaction accelerator means any one of a reaction initiator, a catalyst (acid generator, base generator) and a sensitizer having an ultraviolet absorbing function, or a combination of two or more of these. I do.
- a silica film cured using an acid generator or a base generator has a large amount of residual silanol and therefore has high hygroscopicity, and as a result, a film having a high dielectric constant.
- the acid generator or the base generator itself, and an acid or a basic substance generated from the acid generator or the base substance serve as a charge carrier to impair the insulating property of the film.
- the quality as an insulating film of a semiconductor device for LSI that requires high insulation reliability may be deteriorated due to, for example, deterioration of wiring metal.
- the coating film can be cured through the heating step and the ultraviolet irradiation step without including such a reaction accelerator.
- the film-forming composition of the present invention may further contain components such as a surfactant and a silane coupling agent. Further, these additives may be added to a solvent in which each component is dissolved or dispersed before manufacturing the film-forming composition.
- the surfactant examples include a nonionic surfactant, an anionic surfactant, a cationic surfactant, an amphoteric surfactant, and the like. Further, a fluorine-based surfactant, a silicone-based surfactant, Examples thereof include a polyalkylene oxide-based surfactant and a poly (meth) atalylate-based surfactant.
- fluorosurfactant examples include 1,1,2,2-tetrafluorooctynole (1,1,2, 2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di (1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol ( 1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1,2,2-tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2, 2,3,3—Hexafluoropentyl) ether, sodium perfluorododecylsulfonate, 1,1,2,2,8,8,9,9,10,10—decaffored rhododecane, 1, 1, 2, 2, 3,3-hexafluorodecane, N- [3- (per
- silicone-based surfactant for example, SH7PA, SH21PA, SH30PA, ST94PA [the deviation can be obtained from Dow Kojung Silicone Co., Ltd.] can be used.
- SH28PA and SH30PA are particularly preferable.
- the amount of the surfactant to be used is generally 0.000001 to 1 part by weight based on 100 parts by weight of the film-forming composition. These may be used alone or in combination of two or more.
- silane coupling agent examples include 3-glycidyloxypropinoletrimethoxysilane, 3-aminoglycidyloxypropinoletriethoxysilane, 3-methacryloxypropyltrimethypyrmethyldimethoxysilane, and 3-aminopropyltrimethylsilane.
- the method for forming an organic silica-based film of the present invention includes the steps of forming a coating film having a silicon compound power on a substrate, heating the coating film, and irradiating the coating film with ultraviolet light. Performing a curing treatment by spraying.
- the step of heating the coating film and the step of irradiating the coating film with ultraviolet rays may be performed simultaneously.
- the curing treatment of the present invention by performing heating and ultraviolet irradiation simultaneously, the condensation reaction of the organic silica sol can be sufficiently achieved at a relatively low temperature and in a short time. Obtainable.
- the curing treatment can be carried out preferably for 30 seconds to 10 minutes, more preferably for 30 seconds to 7 minutes.
- an organic silica-based film of the present invention when forming a coating film composed of a silicon compound, a coating method such as spin coating, dipping, roll coating, or spraying is used.
- the substrate to be applied is not particularly limited, and examples thereof include Si-containing layers such as Si, SiO, SiN, SiC, SiCN, and SiON. Specific as base material
- a semiconductor substrate made of the above material may be used.
- the formed coating film is then dried at room temperature or heated to a temperature of about 80 to 600 ° C, usually for about 5 to 240 minutes, and dried to form a vitreous or macromolecular coating film. Can be formed.
- a hot plate, an oven, a furnace, or the like can be used, and the heating atmosphere may be air, a nitrogen atmosphere, an argon atmosphere, a vacuum, or a decompression controlled oxygen concentration. It can be performed below.
- Irradiation with ultraviolet light is preferably performed using ultraviolet light having a wavelength of 250 nm or less, more preferably 150 to 250 m.
- ultraviolet light having a wavelength in this range the condensation reaction of molecules in the organic silica sol can be performed at a low temperature and in a short time without using a reaction accelerator which is active against ultraviolet light. If the wavelength of the ultraviolet light is longer than 250 nm, the organic silica sol does not have a sufficient effect of accelerating the condensation reaction. If the wavelength of ultraviolet light is shorter than 150 nm, organic groups are decomposed and bonded to silicon atoms in the organic silica sol! / Elimination of organic groups is likely to occur.
- ultraviolet irradiation includes a plurality of wavelengths of 250 nm or less in order to prevent local change in film quality due to standing waves due to reflection from the substrate on which the film-forming composition is applied. It is desirable to use a light source.
- the heating temperature of the substrate during the irradiation of ultraviolet rays is usually 300 to 450 ° C. If the heating temperature is lower than 300 ° C, the mobility of the molecular chains in the organic silica sol is not activated, and a sufficiently high condensation rate cannot be obtained. Also, if the heating temperature is higher than 450 ° C, molecules in the organic silica sol Is easily decomposed. On the other hand, if the heating temperature is higher than 450 ° C., it will not be compatible with the steps in the semiconductor device manufacturing process, for example, the copper damascene process usually performed at 450 ° C. or lower.
- a hot plate or infrared lamp annealing may be used as a means for heating simultaneously with the irradiation of ultraviolet rays.
- the time required to cure the coating by simultaneously performing heating and irradiation with ultraviolet light is 30 seconds to 10 minutes (preferably 30 seconds to 7 minutes), and 15 minutes required for thermal curing. It is significantly shorter than 2 hours. For this reason, it can be said that the ultraviolet irradiation is suitable for each wafer processing.
- the coating film of the present invention was previously heat-cured in a state where the substrate was heated to 250 ° C. or more and 500 ° C. or less to obtain a relative dielectric constant of 3.
- the organic silica-based film may be irradiated with ultraviolet rays.
- heating may be performed stepwise, or an atmosphere such as nitrogen, air, oxygen, or reduced pressure may be used. Or you can choose.
- the curing treatment of the coating film of the present invention can be performed under an inert atmosphere or under reduced pressure.
- the absence of oxygen means that the oxygen partial pressure is preferably 0.1 lkPa or less, more preferably 0.1 OlkPa or less. If the oxygen partial pressure is higher than 0.1 lkPa, ozone is generated at the time of ultraviolet irradiation, and the silicon compound is oxidized by the ozone, thereby increasing the hydrophilicity of the resulting organic silica-based film and increasing the hygroscopicity of the film. Or an increase in the relative dielectric constant. Therefore, by performing the curing treatment in the absence of oxygen, it is possible to obtain an organic silica-based film that is highly hydrophobic and hardly causes an increase in the dielectric constant.
- irradiation with ultraviolet rays may be performed in an inert gas atmosphere.
- the inert gas used is N, He, Ar, Kr and Xe, preferably He and Ar
- the film is oxidized, and the resulting coating film can maintain a low dielectric constant.
- ultraviolet irradiation may be performed under a pressurized or reduced pressure atmosphere.
- the pressure at that time is preferably 0.001 to 1000 kPa, more preferably 0.001 to 101.3 kPa.
- an organic silica-based film of the present invention by including a step of heating a coating film made of a silicon compound and a step of irradiating the coating film with ultraviolet rays to perform a curing treatment, The coating can be cured in a shorter time and at a lower temperature.
- the organic silica-based film of the present invention is obtained by the above-described method for forming an organic silica-based film of the present invention.
- the carbon content (number of atoms) is 11 to 26 mol%, preferably 12 to 20 mol%.
- the coating film can be cured in a shorter time by irradiating with ultraviolet light, and the mechanical strength is improved while maintaining a low relative dielectric constant of the obtained organic silicon-based film. Can be done.
- the carbon content is less than 11 mol%, the diffusion barrier in the solid-state reaction is high, and the reaction is accelerated even when irradiated with ultraviolet light, resulting in a film having poor plasma resistance.
- the carbon content is less than 26 mol%. If the amount is too large, the mobility of the molecules becomes too high, and the elastic modulus is low.
- the organic silica-based film of the present invention has a low dielectric constant, which is extremely high in elastic modulus and film density, as is clear from the examples described later. More specifically, the film density of the organic silica-based film of the present invention is usually 0.7 to 1.3 gZcm 3 , preferably 0.7 to 1.2 g / cm 3 , and more preferably 0.7 to 1.3 g / cm 3 . 1. is a OgZcm 3. If the film density is less than 0.7 gZcm 3 , the mechanical strength of the coating film will decrease, while if it exceeds 1.3 gZcm 3 , a low dielectric constant cannot be obtained.
- the relative dielectric constant of the organic silica-based film of the present invention is usually 1.5 to 3.5, preferably 1.9 to 3.1, and more preferably 2.0 to 3.0. From these facts, it can be said that the organic silica-based film of the present invention has extremely excellent insulating film properties such as mechanical strength and relative dielectric constant.
- the organic silica-based film of the present invention has a water contact angle of preferably 60 ° or more, more preferably 70 ° or more. This indicates that the organic silica-based film of the present invention is hydrophobic. , Low specific permittivity with low hygroscopicity. Further, such an organic silica-based film has low hygroscopicity, so that it is not easily damaged by RIE (reactive ion etching) used in a semiconductor process, and has excellent chemical resistance to a wet cleaning solution. This tendency is particularly remarkable in an organic silica-based film having a porous structure in which the insulating film itself has a relative dielectric constant k of 2.5 or less.
- the silicon compound has a specific composition and carbon content, it has excellent insulating film properties such as relative dielectric constant, elastic modulus, plasma resistance, and chemical resistance, and can be formed at low temperature and in a short time.
- the film-forming composition of the present invention used for forming a coating film is an ionic substance such as an ultraviolet-active acid generator, a base generator, or a sensitizer, a charge carrier, or a corrosive compound. It is not necessary to include the source of the pollution, so that it does not contain contaminants to the semiconductor device.
- the organic silica-based film of the present invention has a low relative dielectric constant, excellent mechanical strength and adhesiveness, and excellent plasma resistance and chemical resistance, so that it can be used for LSI, system LSI, DRAM, and SDRAM.
- RDRAM, D Interlayer insulating film for semiconductor devices such as RDRAM, etching stop film, protective film such as surface coat film of semiconductor device, intermediate layer in semiconductor manufacturing process using multilayer resist, interlayer insulating film for multilayer wiring board It can be suitably used for applications such as a protective film and an insulating film for a liquid crystal display element.
- the organic silica-based film of the present invention can be suitably used for a semiconductor device including a wiring structure such as a copper damascene wiring structure.
- Standard polystyrene Standard polystyrene manufactured by Pressure Chemika Nore USA was used.
- Apparatus High temperature high speed gel permeation chromatogram (Model 150—C ALC / GPC) manufactured by Waters, USA
- An aluminum electrode pattern was formed on the obtained polymer film by a vapor deposition method to prepare a sample for measuring a relative dielectric constant.
- the relative permittivity of the coating film was measured at room temperature by a CV method at a frequency of 100 kHz using an HP16451B electrode and an HP4284A precision LCR meter manufactured by Yokogawa Hewlett-Packard Co., Ltd.
- the relative permittivity at 200 ° C was measured in the same manner as in 2.1.2, and the difference from the relative permittivity in 2.1.2 was shown.
- the obtained polymer film was measured by SAW (Surface Acoustic Wave) method.
- the relative dielectric constant of the film was measured, and the film was rated according to the value of the relative dielectric constant that increased before and after the plasma irradiation.
- the cured organic silica film was immersed in a triethanolamine aqueous solution of pH 12 at room temperature for 10 minutes, washed with water, and water droplets on the surface were dried by nitrogen blow, and then the relative dielectric constant was measured, which increased before and after the test. It was rated according to the value of the relative permittivity.
- composition has a carbon content of 13.58 mol%, a weight average molecular weight of 45,000, and a Si-CH 31731-0-3 molar ratio of 0.070.
- This composition has a carbon content of 23.17 mol%, weight average The molecular weight was 3,200, and the molar ratio of Si-CH—SiZSi—O—Si was 1.607.
- composition D for film formation had a carbon content of 23.53 mol%, a weight average molecular weight of 2,700, and Si-CH SiZSi-O-Si (molar ratio) of 2.00.
- polycarbosilane A235.68 g, methyltrimethoxysilane 5.80 g, and tetramethoxysilane 1.62 g used in Synthesis Example 3 were dissolved in 647.32 g of a propylene glycol monoethyl ether solution. After that, the mixture was stirred by a three-one motor, and the solution temperature was stabilized at 55 ° C. Next, 9.51 g of ion-exchanged water in which 0.052 g of oxalic acid was dissolved was added to the solution over 1 hour. Then, after reacting at 60 ° C. for 12 hours, the reaction solution was cooled to room temperature.
- This composition had a carbon content of 23.88 mol%, a weight average molecular weight of 4,400, and a Si-CH—SiZSi—O—Si (molar ratio) of 2.580.
- composition G for film formation had a carbon content of 10.34 mol%, a weight average molecular weight of 4,400, and a Si-CH 31731-0-3 molar ratio) of 0.056. [0143] 2. 3. Examples and Comparative Examples
- compositions obtained in Synthesis Example 17 were applied on a silicon wafer by spin coating, and then placed on a hot plate at 90 ° C for 1 minute, and then at 200 ° C for 1 minute in a nitrogen atmosphere.
- the substrate was dried and baked under the curing conditions shown in Table 1.
- the polymer film obtained after the firing (hereinafter referred to as “silica-based film”) was evaluated according to the above-mentioned evaluation method. Table 1 shows the evaluation results.
- white ultraviolet light (ultraviolet light 1) having a wavelength of 250 nm or less was used.
- the oxygen partial pressure when irradiating with ultraviolet rays was set at 0.1 OlkPa or less.
- the ultraviolet light 1 was an effective method because it was white ultraviolet light, and the illuminance could not be measured.
- Example 17 and Comparative Example 7 in the curing treatment, heating and irradiation with ultraviolet light 1 were performed at the same time.
- Comparative Examples 1-6 instead of irradiating ultraviolet rays, only the heat treatment was performed at 400 ° C. for 60 minutes to cure the coating film to obtain a silica-based film.
- Example 1-6 curing by ultraviolet light 1 was performed, and a silica-based film having a low Deltak and a high V ⁇ elasticity and having excellent plasma resistance and chemical resistance was obtained.
- Comparative Example 16 as compared with the force Example 16 in which heat curing was performed without irradiation with ultraviolet light, Delta k And a silica-based film having a low modulus of elasticity was obtained. Further, in Comparative Examples 1-6, the plasma resistance and the chemical liquid resistance were poor, and an undesirable silica-based film was obtained. It is considered that this is because the condensation reaction of the silanol groups did not sufficiently proceed and remained as silanol groups remaining in the silica-based film.
- Example 7 UV curing was performed at a higher temperature than in Example 1. However, in a shorter time than in Example 1, it had a low Delta k and a high elastic modulus, and was resistant to plasma and chemicals. A silica-based film having excellent resistance was obtained.
- the silica-based film obtained in Comparative Example 7 had a carbon content of 12.84 mol%, —Si—CH
- a composition of 0.000 was cured with ultraviolet light 1. Although a silica-based film having a low Delta k and a high elastic modulus was obtained, the silica-based film had poor plasma resistance and chemical resistance.
- the silica-based film obtained by the present invention is excellent in mechanical strength, and can be suitably used as an interlayer insulating film of a semiconductor device having a low relative dielectric constant and a low hygroscopicity.
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CN2005800150934A CN1957020B (zh) | 2004-05-11 | 2005-04-28 | 有机二氧化硅系膜及形成法、布线结构体、半导体装置及膜形成用组合物 |
US11/596,295 US8268403B2 (en) | 2004-05-11 | 2005-04-28 | Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation |
KR1020067025873A KR101163251B1 (ko) | 2004-05-11 | 2005-04-28 | 유기 실리카계 막의 형성 방법, 유기 실리카계 막, 배선구조체, 반도체 장치, 및 막 형성용 조성물 |
EP20050737244 EP1746122B1 (en) | 2004-05-11 | 2005-04-28 | Method for forming organic silica film, organic silica film, wiring structure and semiconductor device |
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JP2005050590A JP5110239B2 (ja) | 2004-05-11 | 2005-02-25 | 有機シリカ系膜の形成方法、膜形成用組成物 |
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- 2005-04-28 US US11/596,295 patent/US8268403B2/en not_active Expired - Fee Related
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- 2005-04-28 WO PCT/JP2005/008223 patent/WO2005108468A1/ja active Application Filing
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JP2007204626A (ja) * | 2006-02-02 | 2007-08-16 | Jsr Corp | ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、およびシリカ系絶縁膜 |
EP1981074A4 (en) * | 2006-02-02 | 2010-03-10 | Jsr Corp | ORGANIC SILICONE FILM AND METHOD FOR THE PRODUCTION THEREOF, COMPOSITION FOR FORMING AN INSULATION FILM OF A SEMICONDUCTOR ARRANGEMENT AND PROCESS FOR ITS MANUFACTURE, WIRING STRUCTURE AND SEMICONDUCTOR ARRANGEMENT |
WO2008066060A1 (fr) * | 2006-11-30 | 2008-06-05 | Jsr Corporation | Procédé de fabrication d'un polymère, composition de formation d'un film isolant et film isolant de silice et son procédé de fabrication |
JPWO2008066060A1 (ja) * | 2006-11-30 | 2010-03-04 | Jsr株式会社 | ポリマーの製造方法、絶縁膜形成用組成物、ならびにシリカ系絶縁膜およびその製造方法 |
Also Published As
Publication number | Publication date |
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US8268403B2 (en) | 2012-09-18 |
TWI356830B (ja) | 2012-01-21 |
EP1746122B1 (en) | 2013-06-12 |
JP5110239B2 (ja) | 2012-12-26 |
JP2005350653A (ja) | 2005-12-22 |
KR20070010081A (ko) | 2007-01-19 |
TW200613375A (en) | 2006-05-01 |
KR101163251B1 (ko) | 2012-07-05 |
EP1746122A4 (en) | 2011-06-29 |
US20080268264A1 (en) | 2008-10-30 |
EP1746122A1 (en) | 2007-01-24 |
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