Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/18—Manufacture of films or sheets
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/70—Other properties
  • B32B2307/748—Releasability
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/08—PCBs, i.e. printed circuit boards
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
  • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds

Definitions

• the present invention relates to a release film used in a manufacturing process of a flexi-knop printed wiring board or a rigid flexi-no-print wiring board.
• the present invention also relates to a method for manufacturing a flexible printed circuit board using the release film.
• Flexible printed wiring boards are composed of flexible circuit members having predetermined circuits provided on the surface of an insulating base material such as polyimide film.
• Such FPCs are usually made by covering a flexible circuit member with a coverlay, which is a heat-resistant resin film with an adhesive, to provide insulation and circuit protection, and press-laminate using a press with a release film interposed.
• a coverlay which is a heat-resistant resin film with an adhesive, to provide insulation and circuit protection, and press-laminate using a press with a release film interposed.
• the coverlay should sufficiently follow and adhere to the unevenness of the flexi-pure circuit member, It is required that the pressure be uniform throughout. In other words, good “formability” in FPC production including mold release, conformability to shape, and devoid of voids due to uniform pressure over the entire FPC is required.
• An object of the present invention is to provide a release film having the same properties as known release films used in the manufacture of FPCs, but having improved release properties and conformability to shapes that were not sufficient with these films. It is in.
• the present invention also provides a method for producing FPC using the release film. This release film has excellent tear strength, elongation, tensile strength, and cost as compared with known release films.
• the present invention provides a release film having a release layer containing a thermoplastic resin having a viscoelastic modulus at a temperature of 180 ° C. of 50 to 250 MPa.
• a thermoplastic resin having a viscoelastic modulus at a temperature of 180 ° C. of 50 to 250 MPa.
• a polybutylene terephthalate resin is preferable.
• the release film preferably has a release layer and a cushion layer provided on one side thereof and made of a thermoplastic resin different from the release layer. Further, an auxiliary release layer (second release layer) may be further provided on the surface of the cushion layer opposite to the release layer side.
• Another invention of this application is a flexible print in which a flexible circuit member, a coverlay (an adhesive film similar to a coverlay) and the release film are laminated in this order and press-laminated in the production of a flexible or rigid flexible printed wiring board.
• An object of the present invention is to provide a method for manufacturing a printed wiring board including a wiring board and a rigid flexible printed wiring board.
• FPCs Flexible Printed Wiring Boards
• rigid flexible printed wiring boards In addition to FPCs (Flexible Printed Wiring Boards), there are printed wiring boards called rigid flexible printed wiring boards.
• a rigid flexible printed circuit member In the production process of a printed wiring board, as in the case of FPC, a rigid flexible printed circuit member is covered with an adhesive film similar to a coverlay, and this is press-laminated using the release film of the present invention and printed. Wire plates can be manufactured. Therefore, the following description refers to FPC.
• the release film In the production of FPC, the release film needs to have good release properties. If the releasability is low, problems such as tearing of the film by adhesion to the FPC and peeling of the circuit of the FPC may occur when peeling after press lamination.
• the resin used for the release layer of the film is a thermoplastic resin having a viscoelastic modulus (Pa) at a temperature of 180 ° C., a force S50 to 250 MPa, preferably 60 to 20 OMPa, and more preferably 70 to 15 OMPa. . If the viscoelastic modulus is smaller than this, the surface of the release layer resin is softened at the required press temperature, the fluidity is increased, and the resin is fused to the copper foil portion of the FPC, resulting in poor releasability. When the viscoelastic modulus is larger than the above range, the releasability is good, but the flow of the adhesive adhering to the coverlay increases, and the conformability to the shape is reduced. ⁇
• thermoplastic resin specifically, a polybutylene terephthalate-based resin is preferable.
• a resin include polybutylene terephthalate (hereinafter, sometimes referred to as PBT) or a copolymer thereof.
• PBT polybutylene terephthalate
• a copolymer of polybutylene terephthalate and polytetramethylene dalicol is preferable.
• the copolymerization ratio of the copolymer is not particularly limited.
• a cushion layer may be provided on one side of the layer I. Further, it is preferable to further provide an auxiliary release layer on the surface of the cushion layer opposite to the release layer side.
• the two release layers may use the same resin or may be different.
• the thickness of the release layer is 10 to 100 / im, preferably 15 to 50 ⁇ m. If the release layer is thinner than this, the release layer will be broken after press lamination, and the release layer resin will remain on the FPC side when the FPC and release film are separated. On the other hand, if the thickness is larger than the above range, the conformability to the shape is inferior and the flow amount of the adhesive adhering to the coverlay increases.
• the release layer preferably has a surface 10-point average roughness (Rz) of 10 to 45 ⁇ m. Yes.
• the surface roughness of such a release layer can be obtained by a known surface treatment such as embossing.
• embossing a method in which a film is passed through a mat roll at a high temperature and a high pressure, or a method in which a film coming out of a die is pressed against an emboss cooling roll with a touch roll, can be adopted.
• the temperature is preferably 120 to 220 ° C, and more preferably the softening temperature of the release layer resin is 140 to 190 ° C.
• the pressure during the embossing process 50 to 200 kgf ZMM 2 (gauge pressure), preferably 60 ⁇ 120 k gfZmm 2.
• the roughness of pine tronores for embossing is 10-point average roughness (Rz) 0.05! ⁇ Lmm.
• the cushion layer of the release film is a thermoplastic resin different from the release layer.
• the resin preferably has a softening temperature (Vicat softening temperature) of 50 to 160 ° C. If the softening temperature of the resin is less than 50 ° C, the resin will ooze out from the end face of the release film during pressing and adhere to the press hot platen, etc., and there is concern about secondary contamination in the next process. On the other hand, if the temperature exceeds 160 ° C, the moldability is reduced and voids are generated in the details of the FPC.
• the thickness of the cushion layer is not particularly limited.
• Such a resin examples include a polyethylene resin, a polypropylene resin, and an ethylene monomethyl acrylate (hereinafter, referred to as EMMA) resin.
• An adhesive resin may be interposed between the release layer and the cushion layer. However, it is preferable that no adhesive resin is present since the exudation of the film end surface is small.
• the release film of the present invention in order to produce a multilayer film, conventionally known lamination methods such as a co-extrusion lamination method, an extrusion lamination method, and a dry lamination method may be used.
• the film of the present invention is used as a release film at the time of press lamination of a cover lay in the process of manufacturing an FPC in the same manner as a known release film.
• a component consisting of a stack of S US plate, paper, release film, cover lay (adhesive film), flexible circuit member (single section, S US plate) is placed between hot plates.
• a release film, a coverlay, and a flexible circuit member can be repeatedly laminated. It can be used for both the method (press method generally called Hot-Hot press) and the press method called Co 1d-Hot press.
• PBT resin Part number 1200D (manufactured by Toray Industries, Inc.) Viscoelasticity 30MPa
• Polybutylene terephthalate and filler loading B (silica) (PBT based resin): 5020 SCAMD24 (Mitsubishi Engineering Plastics Co., Ltd.) Viscoelasticity 300MPa
• Ethylene-vinyl acetate copolymer (EVA): Part number Evatate K 5010 (Sumitomo Chemical Co., Ltd.) Softening temperature 41 ° C
• the softening temperature is the Vicat softening temperature (JIS K6730-1981).
• the release layer resin and the cushion layer resin shown in Table 1 were supplied to each of the two extruders, and coextruded with a two-layer die to form a release multilayer film (Examples 1 to 4). Further, the release layer resin, the cushion layer resin, and the auxiliary release layer resin shown in Table 1 were supplied to three extruders, respectively, and coextruded from a three-layer die to form a release multilayer film (Example 5). , 6). '
• the resulting multilayer film and flexible printed wiring board were heated and pressed at 185 ° C and 5 MPa for 2 minutes using a single-stage press, and then taken out and described later. Items were evaluated. The results are shown in Table 1.
• the resin shown in Table 2 is supplied to one extruder, extruded from a single-layer die, Lum created.
• the obtained release single-layer film and flexible printed wiring board (FPC) were heated and calo-pressured at 175 ° C and 4 MPa for 60 minutes using a multi-stage press. Next, this was taken out, and the result of evaluation in the same manner as described above is shown in Table 2.
• a release film was coextruded with a two-layer die in the same manner as in Example 1.
• Off-line embossing (temperature 170 ° C, pressure 100 kgf / mm 2 (gauge pressure)) was performed.
• a release film was prepared in the same manner as in Example 1 using the resins shown in Table 3. Among them, embossing treatment was carried out in addition to Comparative Example 4. Table 3 shows the results of the evaluation performed in the same manner as described above.
• the resin shown in Table 4 was co-extruded with a two-layer die in the same manner as in Example 1 to prepare a release film.
• the obtained release film was treated and evaluated in the same manner as described above.
• Table 4 shows the results.
• the viscoelastic modulus of the release layer of the release film was measured using a viscoelasticity measuring device “DMS-210” manufactured by Seiko Electronics Co., Ltd.
• the evaluation was based on the JPCA standard (design guide manual, single-sided and double-sided flexible printed wiring boards-JPCA—DGO2), and the evaluation was performed according to the following items and standards.
• the surface roughness of the release layer of the release film was measured by Handy Surf Graph E-3OA (Tokyo Seimitsu Co., Ltd.).
• the numerical values in the table represent the thickness (im) PT / JP2004 / 009520
• the release film (single-layer or multilayer) of the present invention When an FPC is manufactured using the release film (single-layer or multilayer) of the present invention, excellent properties such as releasability, conformability to shape, uniform moldability, stickiness, and FPC finish appearance are maintained. However, excellent release properties and moldability during press lamination that cannot be obtained with conventional release single-layer films can be obtained. Also, by embossing the surface of the release layer, the releasability at the time of pressing is improved. Further, the release film of the present invention is superior to known release films in terms of tear strength, elongation, tensile strength, and cost. Further, it can be similarly preferably used as a release film in the production of rigid flexible printed wiring boards.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Materials Engineering (AREA)
• Health & Medical Sciences (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Laminated Bodies (AREA)
• Non-Metallic Protective Coatings For Printed Circuits (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Manufacture Of Macromolecular Shaped Articles (AREA)

Priority Applications (2)

Applications Claiming Priority (6)

Publications (1)

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Cited By (23)

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• 2004
  • 2004-06-24 TW TW093118365A patent/TWI476103B/zh not_active IP Right Cessation
  • 2004-06-29 JP JP2005511371A patent/JPWO2005002850A1/ja active Pending
  • 2004-06-29 CN CN201010269797.7A patent/CN101961937B/zh not_active Expired - Fee Related
  • 2004-06-29 KR KR1020057025198A patent/KR101256662B1/ko active IP Right Review Request
  • 2004-06-29 MY MYPI20042586A patent/MY158267A/en unknown
  • 2004-06-29 WO PCT/JP2004/009520 patent/WO2005002850A1/ja active Application Filing
• 2008
  • 2008-10-30 JP JP2008279681A patent/JP5424159B2/ja not_active Expired - Fee Related
• 2010
  • 2010-01-18 JP JP2010007897A patent/JP2010149520A/ja active Pending
• 2014
  • 2014-06-06 JP JP2014118216A patent/JP2014210434A/ja active Pending

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