US8553312B2 - Electronic device, organic electroluminescence device, and organic thin film semiconductor device - Google Patents

Electronic device, organic electroluminescence device, and organic thin film semiconductor device Download PDF

Info

Publication number
US8553312B2
US8553312B2 US11/844,015 US84401507A US8553312B2 US 8553312 B2 US8553312 B2 US 8553312B2 US 84401507 A US84401507 A US 84401507A US 8553312 B2 US8553312 B2 US 8553312B2
Authority
US
United States
Prior art keywords
electrophoretic
organic
electrolytic
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US11/844,015
Other versions
US20080106191A1 (en
Inventor
Takeo Kawase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Assigned to SEIKO EPSON CORPORATION reassignment SEIKO EPSON CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAWASE, TAKEO
Publication of US20080106191A1 publication Critical patent/US20080106191A1/en
Application granted granted Critical
Publication of US8553312B2 publication Critical patent/US8553312B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations

Definitions

  • the present invention relates to an electronic device, an organic electroluminescence device, and an organic thin film semiconductor device, and in particular to a sealing technology for an electronic device equipped with an organic semiconductor element, an oxide semiconductor element, or an organic electroluminescence element.
  • An organic EL display device is provided with a number of light emitting elements on the surface of the substrate, and performs desired display by independently controlling driving of each of the light emitting elements. Further, it has been considered to form an electrophoretic display device by combining an active matrix substrate provided with organic thin film transistors (hereinafter abbreviated as TFT) with, for example, electrophoretic elements.
  • TFT organic thin film transistors
  • an organic EL display device for example, it is well known that the light emitting sections described above are deteriorated by oxygen and moisture, and accordingly, a highly airtight structure capable of preventing penetration of oxygen and moisture has been required. Further, it is required riot only to prevent oxygen and moisture from penetrating for the outside but also to encapsulate a getter agent (e.g., a desiccating agent or an oxygen absorbing agent) for capturing a small amount of oxygen and moisture penetrating therein. In other words, the sealing structure alone is not sufficient for improving the reliability, and without any means for capturing the penetrating harmful components, the effects of providing the sealing structure do not last long.
  • An example of an organic EL display device having a getter agent inside the space hermetically sealed by a sealing substrate is disclosed in, for example, JP-A-2000-208252 and Japanese Patent No. 2,686,169.
  • an organic TFT there have been some cases in which, although they have operated stably in vacuum or in an inert gas atmosphere, the characteristics thereof have been deteriorated when they have been exposed to the atmosphere including oxygen and moisture. Therefore, as is the case with organic EL display devices, the sealing structure and the capturing means for the harmful components have been required.
  • organic EL elements and organic TFT are preferable for manufacturing flexible elements taking an advantage that they can be manufactured at relatively low temperature.
  • the problem of reliability arises here again.
  • glass or metal can also be used as the material for the sealing structure (a substrate for sealing).
  • highly airtight sealing structure can be realized.
  • plastic substrate is used as the substrate of the device side
  • glass or metal is used as the material of the sealing structure, flexible devices can hardly be realized, and accordingly, the use of the plastic substrate becomes meaningless.
  • an aspect of the invention has an advantage of providing an electronic device, an organic electroluminescence device, and an organic thin film semiconductor device capable of assuring sufficient reliability even in the case in which the sealing structure is formed of a material having relatively high gas-permeability such as an organic material.
  • An electronic device includes a substrate, a functional element formed on the substrate, an electrolytic element provided on at least one of a side of the substrate on which the functional element is formed and a side of the substrate opposite to the side on which the functional element is formed, configured including a solid-state electrolyte layer and a pair of electrodes for holding the solid-state electrolyte layer in between, and capable of applying electrolysis to water and a sealing member for sealing the functional element and the electrolytic element.
  • an organic material layer can be used as the functional element.
  • an oxide semiconductor layer can also be used as the functional element.
  • the inventors of the present invention conducted measurements of variations in the performances of various kinds of functional elements while controlling the environment and found, as a result of the measurements, the most problematical gas in the gas components included in the atmosphere is water (moisture).
  • moisture moisture
  • the inventors regarded the moisture in the atmosphere as the most harmful factor, and have reached the invention relating to the configuration for converting the moisture penetrating the inside of the device into oxygen and hydrogen by electrolysis.
  • the electrolytic element composed of the solid-state electrolyte layer and the pair of electrodes is encapsulated inside the sealing member, even if water penetrates the inside of the sealing member, the water is decomposed by the electrolytic element and converted into oxygen and hydrogen.
  • the functional element positioned adjacent to the electrolytic element can be prevented from the deterioration of performance caused by moisture, thus an electronic device superior in reliability can be realized.
  • the configuration in which the functional element and the electrolytic element are stacked on the same side of the substrate can be adopted.
  • the functional element and the electrolytic element can be arranged in parallel to each other on one side of the substrate, the configuration of stacking the functional element and the electrolytic element can achieve downsizing of the organic electronic device while improving the reliability.
  • a cathode is disposed facing to the functional element side, and an anode is disposed facing to an opposite side to the functional element side.
  • the oxygen gas can be a cause for deteriorating the functional element. Therefore, by disposing the cathode facing to the functional element side while disposing the anode facing to the opposite side to the functional element, the deterioration in the performance of the functional element caused by the oxygen can be prevented.
  • the anode is provided with a gas-permeable hole.
  • the oxygen gas generated in the boundary surface between the solid-state electrolyte layer and the anode is gradually discharged to the outside via the gas-permeable hole, thus the density of the oxygen never exceeds a predetermined value, thus the effect of preventing the deterioration of the element performance caused by oxygen can be maintained.
  • both of the substrate and the sealing member are preferably formed of a resin material.
  • the sealing member Since resin materials generally have a certain level of gas permeability, particularly in the case in which the sealing member is formed of a resin material, the atmospheric air penetrates the inside of the sealing member. However, since in the configuration of this aspect of the invention, the electrolytic element is provided inside the sealing member, as described above, the deterioration of the performance of the functional element caused by moisture can be prevented. In addition to the above, in the case in which the substrate and the sealing member are both formed of a resin material, a flexible electronic device can be realized, which is preferably applied to, for example, portable equipment.
  • the solid-state electrolyte layer is preferably formed of a polymeric electrolyte material.
  • polymeric electrolyte material for example, ion-exchange resin can be used, which can easily be obtained, thus the polymeric electrolyte material can be realized at low cost.
  • the electrolytic performance is enhanced by the increased polarization, and further, in the case in which at least a part of hydrogen composing the polymeric electrolyte material is substituted by fluorine, further large polarization and strong hydrophobicity can be obtained.
  • the material of the pair of electrodes forming the electrolytic element preferably includes platinum or palladium.
  • an organic EL device includes a substrate, an organic EL element including an organic material layer formed on the substrate, an electrolytic element provided on at least one of a side of the substrate on which the organic EL element is formed and a side of the substrate opposite to the side on which the organic EL element is formed, configured including a solid-state electrolyte layer and a pair of electrodes for holding the solid-state electrolyte layer in between, and capable of applying electrolysis to water, and a sealing member for sealing the organic EL element and the electrolytic element.
  • the electrolytic element composed of the solid-state electrolyte layer and the pair of electrodes is encapsulated inside the sealing member, even if water enters into the inside of the sealing member, the water is decomposed by the electrolytic element and converted into oxygen and hydrogen.
  • the organic EL element positioned adjacent to the electrolytic element can be prevented from the deterioration of performance caused by moisture, thus an organic EL device superior in reliability can be realized.
  • the organic EL element includes a transparent electrode and a reflective electrode disposed across the light emitting layer from each other, and the electrolytic element is stacked on the organic EL element on the side to which the reflective electrode is provided.
  • the electrolytic element is stacked on the organic EL element on the side to which the reflective electrode is provided., it is arranged that the electrolytic element is positioned on the opposite side of the organic EL element to the side from which the light is emitted. In this case, since there is no need for the electrolytic element to have translucency, the freedom of selection of the composing material of the electrolytic element increases, thus manufacturability of the electrolytic element can be enhanced.
  • an organic thin film semiconductor device including a substrate, an organic TFT including an organic material layer formed on the substrate, an electrolytic element provided on at least one of a side of the substrate on which the organic TFT is formed and a side of the substrate opposite to the side on which the organic TFT is formed, configured including a solid-state electrolyte layer and a pair of electrodes for holding the solid-state electrolyte layer in between, and capable of applying electrolysis to water, and a sealing member for sealing the organic TFT and the electrolytic element.
  • the electrolytic element composed of the solid-state electrolyte layer and the pair of electrodes is encapsulated inside the sealing member, even if water enters into the inside of the sealing member, the water is decomposed by the electrolytic element and converted into oxygen and hydrogen.
  • the organic TFT positioned adjacent to the electrolytic element can be prevented from the deterioration of performance caused by moisture, thus an organic thin film semiconductor device superior in reliability can be realized.
  • the configuration is preferably provided that the electrolytic element is disposed on the opposite side surface of the substrate to the side on which the organic TFT is provided.
  • the electrolytic element can more easily be manufactured on the surface of the substrate on the opposite side to the side where the organic TFT is formed.
  • FIG. 1 is a cross-sectional view of an organic EL device (an electronic device) according to a first embodiment.
  • FIG. 2 is a cross-sectional view showing a detailed configuration of an organic EL substrate according to the same.
  • FIG. 3 is a cross-sectional view of an organic EL device (an electronic device) according to a second embodiment.
  • FIG. 4 is a cross-sectional view of an electrophoretic display device (an electronic device) according to a third embodiment.
  • FIG. 5 is a cross-sectional view showing a detailed configuration of an organic TFT used for the device according to the same.
  • FIG. 6 is a cross-sectional view of a modified example of the electrophoretic display device according to the third embodiment.
  • FIG. 7 is a cross-sectional view of an electrophoretic display device (an electronic device) according to a fourth embodiment.
  • FIGS. 1 and 2 a first embodiment of the invention will be explained with reference to FIGS. 1 and 2 .
  • An organic electronic device of the present embodiment is an example of an organic EL device having an electrolytic element stacked on an organic EL element as a functional element.
  • FIG. 1 is a cross-sectional view of the organic EL device according to the present embodiment
  • FIG. 2 is an enlarged cross-sectional view showing a detailed configuration of an organic EL substrate. It should be noted that in all of the following drawings, the scale ratios of respective sizes and film thicknesses are set differently for every configuration element so that each of the configuration elements can be viewed easily.
  • the organic EL device 1 As shown in FIG. 1 , the organic EL device 1 according to the present embodiment provided with an organic EL element 3 formed on one surface of a glass substrate 2 , and an electrolytic element 4 stacked on the organic EL element 3 .
  • the electrolytic element 4 is composed of a solid-state electrolyte layer 5 , a cathode 6 , and an anode 7 , the cathode 6 and the anode 7 holding the solid-state electrolyte layer 5 therebetween, and is disposed so that the cathode 6 faces to the organic EL element 3 side and the anode 7 faces to the opposite side to the organic EL element 3 .
  • the organic EL element 3 and the electrolytic element 4 are integrally sealed by a sealing layer 8 (sealing member) formed on the one surface side of the glass layer 2 .
  • the organic EL element 3 has a configuration including a pixel electrode 9 (anode), a hole injection layer 10 , a light emitting layer 11 , an electron transport layer 12 , and a common electrode 13 (cathode) stacked sequentially on the glass substrate 2 .
  • the hole injection layer 10 , the light emitting layer, and the electron transport layer 12 are each formed of an organic material, and an organic functional layer 14 is formed by these organic layers.
  • the organic functional layer 14 is held between the pixel electrode 9 and the common electrode 13
  • the organic EL element 3 is formed of the pixel electrode 9 , the organic functional layer 14 , and the common electrode 13 .
  • the common electrode 13 functions as a reflective electrode, and the isotropically emitted light is emitted towards the side of the glass substrate 2 .
  • the pixel electrode 9 is made of indium tin oxide (hereinafter abbreviated as ITO). Although omitted from the drawings here, the pixel electrode 9 is driven by an active matrix circuit via a TFT. Further, the hole injection layer 10 is formed of an organic material such as arylamine derivatives, phthalocyanine derivatives, polyaniline derivatives and organic acid, polythiophene derivatives and polymer acid. In particular, a mixture of polyethelenedioxithiophene and polystyrene-sulfonic-acid (PEDOT/PSS) is preferable.
  • PEDOT/PSS polystyrene-sulfonic-acid
  • the light emitting layer 11 is configured including a light emitting material having a cross-linking group such as epoxy group.
  • a light emitting material having a cross-linking group such as epoxy group.
  • PF polyfluorene derivatives
  • PV polyparaphenylenevinylene derivatives
  • PP polyphenylene derivatives
  • PPP polyparaphenylene derivatives
  • PVK polywinylcarbazole
  • PMPS polymethylphenylsilane
  • a polymeric organic material such as polyfluorene derivatives, polyparaphenilenevinylene derivatives, polyparaphenilene derivatives, polyvinylcarbazole, polythiophene derivatives, or a polycilane based material such as polyrnethylphenylsilane can preferably be used.
  • a hole injection layer 10 , a light emitting layer 11 , an electron transport layer 12 can be formed by coating the above materials by a wet process such as a spin coat method or an inkjet process.
  • the cathode 6 of the electrolytic element 4 is formed of a platinum thin film formed by an evaporation method.
  • Nafion registered trademark, a product of DuPont
  • the solid-state electrolyte layer 5 can be formed by coating the dispersion liquid of Nafion by a spin coat process.
  • Nafion is perfluorosulfonic acid/PTFE copolymer, which can generally be expressed by a chemical formula [Chemical Formula 1] described below. It includes a sulfonic acid group, and has the hydrogen composing a large molecule polymer be substituted with fluorine.
  • Perfluoropolymer such as Nafion has a higher chemical stability. It is thought to be stabilized because abstraction of hydrogen caused by generation of hydroperoxy radical.
  • polystyrene-sulfonic-acid used as ion-exchange resin can be used. Although it is inferior in stability to perfluoropolymer, even a hydrocarbon material inferior in stability can be used for electrolysis of a small amount of penetrating water.
  • silver iodide Li 2 Ti 3 O 7 , ⁇ -alumina, RbAg 4 I 5 , phosphotungstic acid, and so on can be used.
  • the anode 7 of the electrolytic element 4 is formed of a platinum thin film formed by an evaporation method. Further, it is preferable that the anode 7 is provided with holes or grooves (gas-permeable holes) so small that oxygen gas marginally passes therethrough. In that sense, a conductive graphite sheet as a porous material, for example, can also be used. Further, epoxy resin is used as the sealing layer 8 . Alternatively, the sealing layer 8 can also be formed by laminating the glass substrate 2 with a film made of polytrifluoroethylene or the like.
  • both of the cathode 6 and the anode 7 of the electrolytic element 4 are made of platinum, the electrolytic reaction can be made more effectively progress by the catalytic action of platinum.
  • a conductive graphite sheet is used, it becomes possible to reduce the cost of the electrode while enhancing the gas permeability by holding the platinum fine particles on the surface of the graphite, thus obtaining effective electrolytic reaction.
  • a voltage of no lower than 1.2V and no higher than 50V (preferably no higher than 10V; the electrolysis does not start unless the voltage is at least no lower than 1.2V) has previously been applied between the cathode 6 and the anode 7 of the electrolytic element 4 .
  • the moisture if moisture penetrates inside the sealing layer 8 , and is absorbed by the solid-state electrolyte layer 5 , the moisture is ionized into H + (H 3 O + ) and OH ⁇ , respectively.
  • the H + (H 3 O + ) ions and the OH ⁇ ions diffuse towards the side of the cathode 6 and the side of the anode 7 , respectively, and form hydrogen gas and oxygen gas on the respective electrodes. These gases are gradually discharged outside the device, and will never have densities greater than a certain value.
  • the organic EL device 1 since the electrolytic element 4 is sealed inside the sealing layer 8 together with the organic EL element 3 , even if moisture penetrates inside the sealing layer 8 , the moisture is decomposed by the electrolytic element 4 , and converted into oxygen gas and hydrogen gas. According to this action, since the moisture concentration inside the device can be held down to prevent degradation of performance of the organic EL element 3 by the moisture, the organic EL device superior in reliability can be realized. In particular, by keeping the voltage applied between the cathode 6 and the anode 7 of the electrolytic element 4 , the moisture concentration inside the device can be kept low.
  • the voltage is applied only intermittently, if the moisture permeability of the sealing layer 8 is sufficiently low, it is possible to control the moisture concentration to be kept in a low condition for a long period of time. In general, deterioration of an organic EL device is particularly accelerated in the case in which the organic EL is powered in the presence of moisture. From this point of view, it is preferable that the voltage is applied between the electrodes 6 , 7 of the electrolytic element 4 at least when the organic EL element is in operation.
  • the organic EL element 3 and the electrolytic element 4 are stacked on the same side of the glass substrate 2 , downsizing of organic electronic devices can be achieved while maintaining high reliability.
  • the cathode 6 of the electrolytic element 4 is disposed facing to the side of the organic EL element 3 , and the anode 7 thereof is disposed facing to the opposite side, the deterioration of the organic EL element 3 caused by the oxygen gas generated on the anode 7 can also be prevented. Therefore, it is preferable that the anode 7 is provided with the gas-permeable holes and accordingly high oxygen permeability.
  • An organic electronic device of the present embodiment is an example of an organic EL device having an organic EL element as a functional element and an electrolytic element disposed in parallel to each other on a substrate.
  • FIG. 3 is a cross-sectional view of the organic EL device according to the present embodiment. Further, in FIG. 3 , the elements common to those shown in FIG. 1 are provided with the same reference numerals, and detailed explanations therefor are omitted.
  • the organic EL device 21 As shown in FIG. 3 , the organic EL device 21 according to the present embodiment provided with an organic EL element 3 formed on one surface of a glass substrate 2 , and an electrolytic element 4 formed adjacent to the organic EL element 3 .
  • the cathode 6 of the electrolytic element 4 is disposed on the side of the glass substrate 2
  • the anode 7 thereof is disposed on the side opposite to the glass substrate 2 .
  • the organic EL element 3 and the electrolytic element 4 are integrally sealed by a sealing layer 8 formed on the one surface side of the glass layer 2 .
  • the inside configuration of the organic EL element 21 is common to the first embodiment, and detailed explanations therefor will be omitted, but has a slight difference in the composing material.
  • an NPB thin film is formed by an evaporation process.
  • Alq3 (aluminum chelate complex) thin film is formed using an evaporation method.
  • the electrolytic element 4 includes sheets each formed as one of the cathode 6 and anode 7 by evaporating platinum thin films on both sides of a Nafion 115 sheet disposed on the glass substrate 2 instead of the configuration of the first embodiment having the cathode 6 , the solid-state electrolyte layer 5 , and the anode 7 stacked in sequence.
  • the sealing layer 8 is formed by laminating the glass substrate 2 with a film made of polytrifluoroethylene or the like.
  • the organic EL device 21 according to the present embodiment since the deterioration of the performance of the organic EL element 3 caused by moisture can be prevented, a similar advantage to the advantage of the first embodiment that the organic EL device superior in reliability can be realized can be obtained.
  • FIGS. 4 through 6 a third embodiment of the invention will be described with reference to FIGS. 4 through 6 .
  • An organic electronic device is an example of an electrophoretic display device having an organic TFT as a functional element and an electrophoretic element driven by the organic TFT both formed on one surface of the substrate and the electrolytic element formed on the other surface thereof respectively.
  • FIG. 4 is a cross-sectional view of the electrophoretic display device according to the present embodiment
  • FIG. 5 is a cross-sectional view only showing a part of the organic TFT
  • FIG. 6 is a cross-sectional view of a modified example of the electrophoretic display device of the same.
  • FIGS. 4 through 6 the elements common to those shown in FIG. 1 are provided with the same reference numerals, and detailed explanations therefor are omitted.
  • the electrophoretic display device 31 of the present embodiment is provided with an active matrix circuit 33 with organic TFT formed on one surface of an organic TFT support substrate 32 formed of a well known plastic substrate such as polycarbonate or polyethylene terephthalate, and an electrophoretic element 34 driven by the active matrix circuit 33 formed thereon.
  • the electrophoretic element 34 is configured by, for example, disposing a number of microcapsules 36 encapsulating electrophoretic particles on a display element substrate 35 formed of a similar plastic substrate to the plastic substrate described above. Further, the form is taken in which the side of the electrophoretic element 34 to which the microcapsules 36 are provided is bonded on the active matrix circuit 33 . Further, on the opposite side of the organic TFT support substrate 32 , there is provided the electrolytic element 4 , and the whole structure is sealed by the sealing layer 8 .
  • the organic TFT 38 is a switching element formed mainly using a solution process, and a transistor of a so-called top-gate structure in which a source electrode and a drain electrode 39 , an organic semiconductor layer 40 , an insulating layer 41 , and a gate electrode 42 stacked in sequence from the side of the organic TFT support substrate 32 . Further, pixel electrodes (not shown) are provided corresponding to the organic TFT 38 , and are electrically connected to the drain electrodes 39 , respectively, via contact holes (not shown). It should be noted that although the top-gate structure is explained in the present embodiment, the structure is not a limitation, but the bottom-gate structure can also be adopted.
  • an adhesive layer (not shown) made of chromium or titanium is formed on the organic TFT support substrate 32 , after then, a gold thin film is patterned using a photolithography method, thus forming the source electrode and the drain electrode 39 .
  • the organic semiconductor layer 40 made of a material such as F8T2 (fluorene-bithiophene copolymer) is formed so as to cover the channel section using an inkjet method.
  • the insulating layer 41 made of polystyrene (PS) or polymethylmethacrylate (PMMA) is formed as a film so as to cover the organic semiconductor layer 40 using an inkjet method or a spin coat method, and further, an Ag colloidal liquid is printed thereon, thus forming the gate electrode 42 . Further, a water-soluble polymer film such as PVA is formed as a film on the entire surface using a spin coat method, thus a passivation layer 43 is formed.
  • the electrophoretic element 34 separately manufactured is bonded on the active matrix circuit 33 thus formed with the side of the microcapsule 36 facing to the side of the active matrix circuit 33 .
  • the electrolytic element 4 with the cathode 6 , anode 7 respectively formed by evaporating the platinum thin film on the both surfaces of the solid-state electrolyte layer 5 formed of the Nafion 115 sheet is manufactured in a separate process. Further, by overlapping the electrolytic element 4 on the surface of the organic TFT support substrate 32 opposite to the side of the active matrix circuit 33 , and then holding them with films made of polytrifluoroethylene or the like to form a laminated sealing, the sealing layer 8 is formed.
  • the electrophoretic display device 31 since the deterioration of the performance of the organic TFT 38 caused by moisture can be prevented, a similar advantage to the advantage of the first and the second embodiments that the electrophoretic display device superior in reliability can be realized can be obtained.
  • the voltage is kept applied between the electrodes 6 , 7 of the electrolytic element 4 at least when the organic TFT 38 is in operation.
  • the plastic material is used for all of the organic TFT support substrate 32 , the display element substrate 35 , and the sealing layer 8 , the flexible display device with high reliability while adopting a simple sealing structure can be realized.
  • organic semiconductors such as naphthalene, anthracene, tetracene, pentacene, hexacene, phthalocyanine, perylene, hydrazone, triphenylmethane, diphenylmethane, stilbene, arylvinyl, pyrazoline, triphenylamine, triarylamine, phthalocyanine, or derivatives of the above, or polymeric semiconductor materials such as poly-N-vinvlcarbazole, polyvinylpyrene, polyvinylanthracene, polythiophene, polyhexylthiophene, poly(p-phenylenevinylene), polythenylenevinylene, polyarylamine, pyrene-formaldehyde resin, ehtylcarbazole-formaldehyde resin, fluorene-bithioph
  • the organic semiconductor functioning as a p-type channel layer out of the above mentioned organic semiconductors P-type organic semiconductors are more stable against oxygen compared to n-type organic semiconductors. Therefore, since the electrolytic element 4 according to the embodiment of the invention is hardly influenced by the generated oxygen, the effect that the moisture is removed by the electrolytic element 4 is effectively exerted. In other words, since the p-type organic semiconductors are influenced by water but only slightly influenced by oxygen, an element with high reliability can be realized only by removing water from the atmospheric air penetrating the element. In the p-type organic semiconductors, those with ionization potential of 4.7 eV or higher are hardly influenced by oxygen, and accordingly effective as the organic semiconductor according to the embodiment of the invention.
  • the gate electrode is formed by printing the Ag colloidal liquid.
  • a low temperature e.g., 120° C. or lower
  • high conductivity can be obtained.
  • the Ag colloid is a quite useful material for forming a highly conductive electrode on a plastic.
  • Ag can easily be ionized in the presence of water, and if the voltage is applied thereto, the Ag ions are migrated to problematically cause a short between the electrodes. Therefore, by removing water inside the element with the configuration of the embodiment of the invention, highly reliable electrodes and wiring can be formed even on a plastic. Accordingly, it is particularly effective to use electrodes and wiring formed by printing the colloid dispersing Ag or thin film transistors including such electrodes and wiring to the embodiment of the invention.
  • the electronic device according to the present embodiment is an example of an electrophoretic display device having the electrophoretic element and the electrolytic element stacked on the same substrate.
  • FIG. 7 is a cross-sectional view of the electrophoretic display device according to the present embodiment. Further, in FIG. 7 , the elements common to those shown in FIGS. 4 and 6 are provided with the same reference numerals, and detailed explanations therefor are omitted.
  • an electrophoretic display device 51 is provided with the electrolytic element 4 disposed on one surface of a oxide thin film transistor (oxide TFT) support substrate 53 formed of a well known plastic substrate such as polycarbonate or polyethylene terephthalate, an active matrix circuit 54 including oxide TFT and formed on the electrolytic element 4 , and the electrophoretic element 34 formed on the active matrix circuit 54 .
  • the electrophoretic element 34 is formed by disposing the microcapsules 36 encapsulating the electrophoretic particles on the display element substrate 35 , and has a form in which the side provided with the microcapsules 36 is bonded on the active matrix circuit 54 .
  • the anode 7 is formed by evaporating the platinum thin film on the oxide TFT support substrate 53 , the solid-state electrolyte layer 5 is formed by applying the Nafion dispersion liquid thereon using a spin coat method, and the cathode 6 is formed by evaporating the platinum thin film thereon again. Further, insulator copolymer such as epoxy resin or polyester resin is applied thereon using a spin coat method, and then cured to be insolubilized, thus forming a foundation layer 52 .
  • the active matrix circuit 54 is manufactured by forming oxide TFT on the foundation layer 52 , the electrophoretic element 34 is bonded with the active matrix circuit 54 with the side of the microcapsules 36 facing to the side of the active matrix circuit 54 .
  • the succeeding process of forming the oxide TFT is well known, and accordingly the explanations will be omitted.
  • the electrophoretic display device 51 since the deterioration of the performance of the oxide TFT caused by moisture can be prevented, a similar advantage to the advantage of the third embodiment that the electrophoretic display device superior in reliability can be realized can be obtained.
  • the active matrix circuit having oxide TFT is stacked directly on the electrolytic element 4 , effectiveness of preventing deterioration of performance caused by moisture can further be enhanced. This is because oxide semiconductors are highly hygroscopic in general, and accordingly easily influenced by moisture. As the name suggests, the oxide semiconductors are hardly influenced by oxygen, and accordingly, the embodiment of the invention is especially advantageous.
  • ZnO, NiO, SnO 2 , TiO 2 , In 2 O 5 , V 2 O 5 , SrTiO 3 , WO 2 , amorphous In—Ga—Zn—O (a-IGZO), amorphous Cd—Ge—O, and amorphous Cd—Pb—O can be used by forming as a thin film using an evaporation method, a sputtering method, a sol-gel method and so on.
  • the scope of the invention is not limited to the embodiments described above, but various modifications can be executed thereon within the range of the scope or the spirit of the invention.
  • the specific configurations, materials, manufacturing methods and so on of the organic EL element, organic TFT exemplified as a functional element in the embodiments described above can be modified according to needs.
  • the element according to the embodiment of the invention is especially advantageous for organic functional devices easily influenced by moisture, it is not limited to the organic functional devices.

Abstract

An electronic device includes a substrate, a functional element formed on the substrate, an electrolytic element provided on at least one of a side of the substrate on which the functional element is formed and a side of the substrate opposite to the side on which the functional element is formed, configured including a solid-state electrolyte layer and a pair of electrodes for holding the solid-state electrolyte layer in between, and capable of applying electrolysis to water, and a sealing member for sealing the functional element and the electrolytic element.

Description

The entire disclosure of Japanese Patent Application No. 2006-261997, filed Sep. 27, 2006 is expressly incorporated by reference herein.
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to an electronic device, an organic electroluminescence device, and an organic thin film semiconductor device, and in particular to a sealing technology for an electronic device equipped with an organic semiconductor element, an oxide semiconductor element, or an organic electroluminescence element.
2. Related Art
In recent years, portable equipment such as a mobile phone or a PDA, or a personal computer using a low profile display such as an organic electroluminescence (hereinafter also referred to simply as EL) display device or an electrophoretic display device as a display section thereof has been developed. An organic EL display device is provided with a number of light emitting elements on the surface of the substrate, and performs desired display by independently controlling driving of each of the light emitting elements. Further, it has been considered to form an electrophoretic display device by combining an active matrix substrate provided with organic thin film transistors (hereinafter abbreviated as TFT) with, for example, electrophoretic elements. As described above, organic EL elements and organic TFT are thought to be promising as devices for displays, and in particular, since devices using organic materials can be formed at relatively low temperature, plastic substrate can be used therefor, thus possibilities as flexible elements are expected.
However, such organic devices have had a significant problem regarding reliability. In the case with an organic EL display device, for example, it is well known that the light emitting sections described above are deteriorated by oxygen and moisture, and accordingly, a highly airtight structure capable of preventing penetration of oxygen and moisture has been required. Further, it is required riot only to prevent oxygen and moisture from penetrating for the outside but also to encapsulate a getter agent (e.g., a desiccating agent or an oxygen absorbing agent) for capturing a small amount of oxygen and moisture penetrating therein. In other words, the sealing structure alone is not sufficient for improving the reliability, and without any means for capturing the penetrating harmful components, the effects of providing the sealing structure do not last long. An example of an organic EL display device having a getter agent inside the space hermetically sealed by a sealing substrate is disclosed in, for example, JP-A-2000-208252 and Japanese Patent No. 2,686,169.
Further, regarding an organic TFT, there have been some cases in which, although they have operated stably in vacuum or in an inert gas atmosphere, the characteristics thereof have been deteriorated when they have been exposed to the atmosphere including oxygen and moisture. Therefore, as is the case with organic EL display devices, the sealing structure and the capturing means for the harmful components have been required.
As described above, organic EL elements and organic TFT are preferable for manufacturing flexible elements taking an advantage that they can be manufactured at relatively low temperature. However, the problem of reliability arises here again. In other words, if a glass substrate is used as the substrate of the device side, glass or metal can also be used as the material for the sealing structure (a substrate for sealing). In this case, highly airtight sealing structure can be realized. On the contrary, in the case in which a plastic substrate is used as the substrate of the device side, if glass or metal is used as the material of the sealing structure, flexible devices can hardly be realized, and accordingly, the use of the plastic substrate becomes meaningless. Therefore, although in this case, plastic is inevitably used in the sealing structure side, it is quite difficult to realize such a highly airtight sealing structure with plastic material. Specifically, although it has been proposed to seal an organic device with a resin film, an inorganic film, or a multilayered structure thereof, the gas permeabilities of these materials are significantly large in comparison with those of the glass and metal, and accordingly sealing might be insufficient. Further, if the capturing means such as a getter agent is provided, it reaches its capture limit in a relatively short period of time, thus making its practical application difficult.
SUMMARY
In consideration of the above problem, an aspect of the invention has an advantage of providing an electronic device, an organic electroluminescence device, and an organic thin film semiconductor device capable of assuring sufficient reliability even in the case in which the sealing structure is formed of a material having relatively high gas-permeability such as an organic material.
An electronic device according to an aspect of the invention includes a substrate, a functional element formed on the substrate, an electrolytic element provided on at least one of a side of the substrate on which the functional element is formed and a side of the substrate opposite to the side on which the functional element is formed, configured including a solid-state electrolyte layer and a pair of electrodes for holding the solid-state electrolyte layer in between, and capable of applying electrolysis to water and a sealing member for sealing the functional element and the electrolytic element. Further, what includes an organic material layer can be used as the functional element. Alternatively, what includes an oxide semiconductor layer can also be used as the functional element.
The inventors of the present invention conducted measurements of variations in the performances of various kinds of functional elements while controlling the environment and found, as a result of the measurements, the most problematical gas in the gas components included in the atmosphere is water (moisture). At the first stage, although it was thought that the influence of oxygen was as great as that of moisture, it has tuned out that the deterioration of performance is actually remarkable when the element is exposed to the atmosphere including moisture. On the other hand, some elements were not at all deteriorated in the oxygen atmosphere depending on the structure of the element or the composing material. Therefore, the inventors regarded the moisture in the atmosphere as the most harmful factor, and have reached the invention relating to the configuration for converting the moisture penetrating the inside of the device into oxygen and hydrogen by electrolysis.
According to the configuration of the electronic device of an aspect of the invention, since the electrolytic element composed of the solid-state electrolyte layer and the pair of electrodes is encapsulated inside the sealing member, even if water penetrates the inside of the sealing member, the water is decomposed by the electrolytic element and converted into oxygen and hydrogen. By this action, the functional element positioned adjacent to the electrolytic element can be prevented from the deterioration of performance caused by moisture, thus an electronic device superior in reliability can be realized.
Further, the configuration in which the functional element and the electrolytic element are stacked on the same side of the substrate can be adopted.
Although the functional element and the electrolytic element can be arranged in parallel to each other on one side of the substrate, the configuration of stacking the functional element and the electrolytic element can achieve downsizing of the organic electronic device while improving the reliability.
Further, in the configuration described above, it is preferable that out of the pair of electrodes forming the electrolytic element, a cathode is disposed facing to the functional element side, and an anode is disposed facing to an opposite side to the functional element side.
In the electrolysis of water the following reaction is caused in the cathode.
2H++2e →H2
Meanwhile, the following reaction is caused in the anode.
4OH→2H2O+O2+4e
Although the hydrogen gas is not harmful to the functional element, the oxygen gas can be a cause for deteriorating the functional element. Therefore, by disposing the cathode facing to the functional element side while disposing the anode facing to the opposite side to the functional element, the deterioration in the performance of the functional element caused by the oxygen can be prevented.
Further, in the configuration described above, it is preferable that the anode is provided with a gas-permeable hole.
According to the present configuration, since the oxygen gas generated in the boundary surface between the solid-state electrolyte layer and the anode is gradually discharged to the outside via the gas-permeable hole, the density of the oxygen never exceeds a predetermined value, thus the effect of preventing the deterioration of the element performance caused by oxygen can be maintained.
Further, both of the substrate and the sealing member are preferably formed of a resin material.
Since resin materials generally have a certain level of gas permeability, particularly in the case in which the sealing member is formed of a resin material, the atmospheric air penetrates the inside of the sealing member. However, since in the configuration of this aspect of the invention, the electrolytic element is provided inside the sealing member, as described above, the deterioration of the performance of the functional element caused by moisture can be prevented. In addition to the above, in the case in which the substrate and the sealing member are both formed of a resin material, a flexible electronic device can be realized, which is preferably applied to, for example, portable equipment.
Further, the solid-state electrolyte layer is preferably formed of a polymeric electrolyte material.
As the polymeric electrolyte material, for example, ion-exchange resin can be used, which can easily be obtained, thus the polymeric electrolyte material can be realized at low cost.
In particular, if the polymeric electrolyte material includes a sulfonic acid group, the electrolytic performance is enhanced by the increased polarization, and further, in the case in which at least a part of hydrogen composing the polymeric electrolyte material is substituted by fluorine, further large polarization and strong hydrophobicity can be obtained.
Further, the material of the pair of electrodes forming the electrolytic element preferably includes platinum or palladium.
According to this configuration, since the platinum and palladium as the electrode material have catalytic influences, the electrolytic reaction rate becomes higher more effectively.
Further, an organic EL device according to another aspect of the invention includes a substrate, an organic EL element including an organic material layer formed on the substrate, an electrolytic element provided on at least one of a side of the substrate on which the organic EL element is formed and a side of the substrate opposite to the side on which the organic EL element is formed, configured including a solid-state electrolyte layer and a pair of electrodes for holding the solid-state electrolyte layer in between, and capable of applying electrolysis to water, and a sealing member for sealing the organic EL element and the electrolytic element.
According to the configuration of the organic EL device of this aspect of the invention, since the electrolytic element composed of the solid-state electrolyte layer and the pair of electrodes is encapsulated inside the sealing member, even if water enters into the inside of the sealing member, the water is decomposed by the electrolytic element and converted into oxygen and hydrogen. By this action, the organic EL element positioned adjacent to the electrolytic element can be prevented from the deterioration of performance caused by moisture, thus an organic EL device superior in reliability can be realized.
Further, it is preferable to have a configuration that the organic EL element includes a transparent electrode and a reflective electrode disposed across the light emitting layer from each other, and the electrolytic element is stacked on the organic EL element on the side to which the reflective electrode is provided.
In the case in which the electrolytic element is stacked on the organic EL element on the side to which the reflective electrode is provided., it is arranged that the electrolytic element is positioned on the opposite side of the organic EL element to the side from which the light is emitted. In this case, since there is no need for the electrolytic element to have translucency, the freedom of selection of the composing material of the electrolytic element increases, thus manufacturability of the electrolytic element can be enhanced.
Further, according to still another aspect of the invention, there is provided an organic thin film semiconductor device including a substrate, an organic TFT including an organic material layer formed on the substrate, an electrolytic element provided on at least one of a side of the substrate on which the organic TFT is formed and a side of the substrate opposite to the side on which the organic TFT is formed, configured including a solid-state electrolyte layer and a pair of electrodes for holding the solid-state electrolyte layer in between, and capable of applying electrolysis to water, and a sealing member for sealing the organic TFT and the electrolytic element.
According to the configuration of the organic thin film semiconductor device of this aspect of the invention, since the electrolytic element composed of the solid-state electrolyte layer and the pair of electrodes is encapsulated inside the sealing member, even if water enters into the inside of the sealing member, the water is decomposed by the electrolytic element and converted into oxygen and hydrogen. By this action, the organic TFT positioned adjacent to the electrolytic element can be prevented from the deterioration of performance caused by moisture, thus an organic thin film semiconductor device superior in reliability can be realized.
Further, the configuration is preferably provided that the electrolytic element is disposed on the opposite side surface of the substrate to the side on which the organic TFT is provided.
In the case of the organic TFT, since the source, drain, and gate are formed on the surface of the substrate, steps must be caused on the substrate. Therefore, the electrolytic element can more easily be manufactured on the surface of the substrate on the opposite side to the side where the organic TFT is formed.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will now be described with reference to the accompanying drawings, wherein like numbers refer to like elements.
FIG. 1 is a cross-sectional view of an organic EL device (an electronic device) according to a first embodiment.
FIG. 2 is a cross-sectional view showing a detailed configuration of an organic EL substrate according to the same.
FIG. 3 is a cross-sectional view of an organic EL device (an electronic device) according to a second embodiment.
FIG. 4 is a cross-sectional view of an electrophoretic display device (an electronic device) according to a third embodiment.
FIG. 5 is a cross-sectional view showing a detailed configuration of an organic TFT used for the device according to the same.
FIG. 6 is a cross-sectional view of a modified example of the electrophoretic display device according to the third embodiment.
FIG. 7 is a cross-sectional view of an electrophoretic display device (an electronic device) according to a fourth embodiment.
DESCRIPTION OF THE EMBODIMENTS First Embodiment
Hereinafter, a first embodiment of the invention will be explained with reference to FIGS. 1 and 2.
An organic electronic device of the present embodiment is an example of an organic EL device having an electrolytic element stacked on an organic EL element as a functional element.
FIG. 1 is a cross-sectional view of the organic EL device according to the present embodiment, and FIG. 2 is an enlarged cross-sectional view showing a detailed configuration of an organic EL substrate. It should be noted that in all of the following drawings, the scale ratios of respective sizes and film thicknesses are set differently for every configuration element so that each of the configuration elements can be viewed easily.
As shown in FIG. 1, the organic EL device 1 according to the present embodiment provided with an organic EL element 3 formed on one surface of a glass substrate 2, and an electrolytic element 4 stacked on the organic EL element 3. The electrolytic element 4 is composed of a solid-state electrolyte layer 5, a cathode 6, and an anode 7, the cathode 6 and the anode 7 holding the solid-state electrolyte layer 5 therebetween, and is disposed so that the cathode 6 faces to the organic EL element 3 side and the anode 7 faces to the opposite side to the organic EL element 3. Further, the organic EL element 3 and the electrolytic element 4 are integrally sealed by a sealing layer 8 (sealing member) formed on the one surface side of the glass layer 2.
As shown in FIG. 2, the organic EL element 3 has a configuration including a pixel electrode 9 (anode), a hole injection layer 10, a light emitting layer 11, an electron transport layer 12, and a common electrode 13 (cathode) stacked sequentially on the glass substrate 2. The hole injection layer 10, the light emitting layer, and the electron transport layer 12 are each formed of an organic material, and an organic functional layer 14 is formed by these organic layers. In other words, the organic functional layer 14 is held between the pixel electrode 9 and the common electrode 13, and the organic EL element 3 is formed of the pixel electrode 9, the organic functional layer 14, and the common electrode 13. In the configuration, when a voltage is applied between the pixel electrode 9 and the common electrode 13, the electrons injected from the common electrode 13 and the holes injected from the pixel electrode 9 are recombined in the light emitting layer 11, and the energy emitted in the recombination is emitted in the form of fluorescence or phosphorescence. The light L emitted from the organic EL element 3 is emitted from the glass substrate 2 to the outside (a bottom emission type). Therefore, in the present embodiment the common electrode 13 functions as a reflective electrode, and the isotropically emitted light is emitted towards the side of the glass substrate 2.
The pixel electrode 9 is made of indium tin oxide (hereinafter abbreviated as ITO). Although omitted from the drawings here, the pixel electrode 9 is driven by an active matrix circuit via a TFT. Further, the hole injection layer 10 is formed of an organic material such as arylamine derivatives, phthalocyanine derivatives, polyaniline derivatives and organic acid, polythiophene derivatives and polymer acid. In particular, a mixture of polyethelenedioxithiophene and polystyrene-sulfonic-acid (PEDOT/PSS) is preferable.
The light emitting layer 11 is configured including a light emitting material having a cross-linking group such as epoxy group. As such a light emitting material, polyfluorene derivatives (PF; e.g., F8BT), polyparaphenylenevinylene derivatives (PPV), polyphenylene derivatives (PP), polyparaphenylene derivatives (PPP), polywinylcarbazole (PVK) polythiophene derivatives, and a polycilane based material such as polymethylphenylsilane (PMPS) which are known polymeric light emitting material capable of fluorescent emission or phosphorescent emission, can preferably be used.
As a material of the electron transport layer 12, a polymeric organic material such as polyfluorene derivatives, polyparaphenilenevinylene derivatives, polyparaphenilene derivatives, polyvinylcarbazole, polythiophene derivatives, or a polycilane based material such as polyrnethylphenylsilane can preferably be used. Each of such a hole injection layer 10, a light emitting layer 11, an electron transport layer 12 can be formed by coating the above materials by a wet process such as a spin coat method or an inkjet process.
Further, the common electrode 13 is formed of a thin film of, for example, a magnesium-gold alloy (in mole ratio, Mg:Au=1:2).
On the other hand, the cathode 6 of the electrolytic element 4 is formed of a platinum thin film formed by an evaporation method.
As the material of the solid-state electrolyte layer 5, Nafion (registered trademark, a product of DuPont) can be used, and the solid-state electrolyte layer 5 can be formed by coating the dispersion liquid of Nafion by a spin coat process. Nafion is perfluorosulfonic acid/PTFE copolymer, which can generally be expressed by a chemical formula [Chemical Formula 1] described below. It includes a sulfonic acid group, and has the hydrogen composing a large molecule polymer be substituted with fluorine. Perfluoropolymer such as Nafion has a higher chemical stability. It is thought to be stabilized because abstraction of hydrogen caused by generation of hydroperoxy radical.
Figure US08553312-20131008-C00001
Alternatively, as other organic materials than Nafion, poly(bis(4-sulfophenoxy)phosphazene) ([Chemical Formula 2] described below), poly[(vinylchloride-co-(1 methyl-4-vinylpiperazine)) ([Chemical Formula 3] described below), poly(2-vinylpyridine-co-styrene), Average Mw 220,000 by LS, Average Mn 130,000, granular ([Chemical Formula 4] described below), and so on can also be used. Alternatively, polystyrene-sulfonic-acid used as ion-exchange resin can be used. Although it is inferior in stability to perfluoropolymer, even a hydrocarbon material inferior in stability can be used for electrolysis of a small amount of penetrating water.
Figure US08553312-20131008-C00002
Further, as an inorganic material, silver iodide, Li2Ti3O7, β-alumina, RbAg4I5, phosphotungstic acid, and so on can be used.
Further, similar to the cathode 6, the anode 7 of the electrolytic element 4 is formed of a platinum thin film formed by an evaporation method. Further, it is preferable that the anode 7 is provided with holes or grooves (gas-permeable holes) so small that oxygen gas marginally passes therethrough. In that sense, a conductive graphite sheet as a porous material, for example, can also be used. Further, epoxy resin is used as the sealing layer 8. Alternatively, the sealing layer 8 can also be formed by laminating the glass substrate 2 with a film made of polytrifluoroethylene or the like. In the present embodiment, since both of the cathode 6 and the anode 7 of the electrolytic element 4 are made of platinum, the electrolytic reaction can be made more effectively progress by the catalytic action of platinum. In the case in which a conductive graphite sheet is used, it becomes possible to reduce the cost of the electrode while enhancing the gas permeability by holding the platinum fine particles on the surface of the graphite, thus obtaining effective electrolytic reaction.
When using the organic EL device 1 having the configuration described above, a voltage of no lower than 1.2V and no higher than 50V (preferably no higher than 10V; the electrolysis does not start unless the voltage is at least no lower than 1.2V) has previously been applied between the cathode 6 and the anode 7 of the electrolytic element 4. In this case, if moisture penetrates inside the sealing layer 8, and is absorbed by the solid-state electrolyte layer 5, the moisture is ionized into H+ (H3O+) and OH, respectively. Then, the H+ (H3O+) ions and the OH ions diffuse towards the side of the cathode 6 and the side of the anode 7, respectively, and form hydrogen gas and oxygen gas on the respective electrodes. These gases are gradually discharged outside the device, and will never have densities greater than a certain value.
In the organic EL device 1 according to the present embodiment, since the electrolytic element 4 is sealed inside the sealing layer 8 together with the organic EL element 3, even if moisture penetrates inside the sealing layer 8, the moisture is decomposed by the electrolytic element 4, and converted into oxygen gas and hydrogen gas. According to this action, since the moisture concentration inside the device can be held down to prevent degradation of performance of the organic EL element 3 by the moisture, the organic EL device superior in reliability can be realized. In particular, by keeping the voltage applied between the cathode 6 and the anode 7 of the electrolytic element 4, the moisture concentration inside the device can be kept low. Alternatively, in the case in which the voltage is applied only intermittently, if the moisture permeability of the sealing layer 8 is sufficiently low, it is possible to control the moisture concentration to be kept in a low condition for a long period of time. In general, deterioration of an organic EL device is particularly accelerated in the case in which the organic EL is powered in the presence of moisture. From this point of view, it is preferable that the voltage is applied between the electrodes 6, 7 of the electrolytic element 4 at least when the organic EL element is in operation.
In the case of the present embodiment, since the organic EL element 3 and the electrolytic element 4 are stacked on the same side of the glass substrate 2, downsizing of organic electronic devices can be achieved while maintaining high reliability. In this case, since the cathode 6 of the electrolytic element 4 is disposed facing to the side of the organic EL element 3, and the anode 7 thereof is disposed facing to the opposite side, the deterioration of the organic EL element 3 caused by the oxygen gas generated on the anode 7 can also be prevented. Therefore, it is preferable that the anode 7 is provided with the gas-permeable holes and accordingly high oxygen permeability.
Second Embodiment
Hereinafter, a second embodiment of the invention will be described with reference to FIG. 3.
An organic electronic device of the present embodiment is an example of an organic EL device having an organic EL element as a functional element and an electrolytic element disposed in parallel to each other on a substrate.
FIG. 3 is a cross-sectional view of the organic EL device according to the present embodiment. Further, in FIG. 3, the elements common to those shown in FIG. 1 are provided with the same reference numerals, and detailed explanations therefor are omitted.
As shown in FIG. 3, the organic EL device 21 according to the present embodiment provided with an organic EL element 3 formed on one surface of a glass substrate 2, and an electrolytic element 4 formed adjacent to the organic EL element 3. The cathode 6 of the electrolytic element 4 is disposed on the side of the glass substrate 2, and the anode 7 thereof is disposed on the side opposite to the glass substrate 2. Further, the organic EL element 3 and the electrolytic element 4 are integrally sealed by a sealing layer 8 formed on the one surface side of the glass layer 2.
The inside configuration of the organic EL element 21 is common to the first embodiment, and detailed explanations therefor will be omitted, but has a slight difference in the composing material. As the hole injection layer 10 shown in FIG. 2, an NPB thin film is formed by an evaporation process. Further, as the light emitting layer 11 on the hole injection layer 10, Alq3 (aluminum chelate complex) thin film is formed using an evaporation method. Further, the electrolytic element 4 includes sheets each formed as one of the cathode 6 and anode 7 by evaporating platinum thin films on both sides of a Nafion 115 sheet disposed on the glass substrate 2 instead of the configuration of the first embodiment having the cathode 6, the solid-state electrolyte layer 5, and the anode 7 stacked in sequence. Further, the sealing layer 8 is formed by laminating the glass substrate 2 with a film made of polytrifluoroethylene or the like.
Also in the organic EL device 21 according to the present embodiment, since the deterioration of the performance of the organic EL element 3 caused by moisture can be prevented, a similar advantage to the advantage of the first embodiment that the organic EL device superior in reliability can be realized can be obtained.
Third Embodiment
Hereinafter, a third embodiment of the invention will be described with reference to FIGS. 4 through 6.
An organic electronic device according to the present embodiment is an example of an electrophoretic display device having an organic TFT as a functional element and an electrophoretic element driven by the organic TFT both formed on one surface of the substrate and the electrolytic element formed on the other surface thereof respectively.
FIG. 4 is a cross-sectional view of the electrophoretic display device according to the present embodiment, FIG. 5 is a cross-sectional view only showing a part of the organic TFT, and FIG. 6 is a cross-sectional view of a modified example of the electrophoretic display device of the same. Further, in FIGS. 4 through 6, the elements common to those shown in FIG. 1 are provided with the same reference numerals, and detailed explanations therefor are omitted.
As shown in FIG. 4, the electrophoretic display device 31 of the present embodiment is provided with an active matrix circuit 33 with organic TFT formed on one surface of an organic TFT support substrate 32 formed of a well known plastic substrate such as polycarbonate or polyethylene terephthalate, and an electrophoretic element 34 driven by the active matrix circuit 33 formed thereon. The electrophoretic element 34 is configured by, for example, disposing a number of microcapsules 36 encapsulating electrophoretic particles on a display element substrate 35 formed of a similar plastic substrate to the plastic substrate described above. Further, the form is taken in which the side of the electrophoretic element 34 to which the microcapsules 36 are provided is bonded on the active matrix circuit 33. Further, on the opposite side of the organic TFT support substrate 32, there is provided the electrolytic element 4, and the whole structure is sealed by the sealing layer 8.
As shown in FIG. 5, the organic TFT 38 is a switching element formed mainly using a solution process, and a transistor of a so-called top-gate structure in which a source electrode and a drain electrode 39, an organic semiconductor layer 40, an insulating layer 41, and a gate electrode 42 stacked in sequence from the side of the organic TFT support substrate 32. Further, pixel electrodes (not shown) are provided corresponding to the organic TFT 38, and are electrically connected to the drain electrodes 39, respectively, via contact holes (not shown). It should be noted that although the top-gate structure is explained in the present embodiment, the structure is not a limitation, but the bottom-gate structure can also be adopted.
Further specifically, an adhesive layer (not shown) made of chromium or titanium is formed on the organic TFT support substrate 32, after then, a gold thin film is patterned using a photolithography method, thus forming the source electrode and the drain electrode 39. Further, the organic semiconductor layer 40 made of a material such as F8T2 (fluorene-bithiophene copolymer) is formed so as to cover the channel section using an inkjet method. Then, the insulating layer 41 made of polystyrene (PS) or polymethylmethacrylate (PMMA) is formed as a film so as to cover the organic semiconductor layer 40 using an inkjet method or a spin coat method, and further, an Ag colloidal liquid is printed thereon, thus forming the gate electrode 42. Further, a water-soluble polymer film such as PVA is formed as a film on the entire surface using a spin coat method, thus a passivation layer 43 is formed. The electrophoretic element 34 separately manufactured is bonded on the active matrix circuit 33 thus formed with the side of the microcapsule 36 facing to the side of the active matrix circuit 33.
Meanwhile, the electrolytic element 4 with the cathode 6, anode 7 respectively formed by evaporating the platinum thin film on the both surfaces of the solid-state electrolyte layer 5 formed of the Nafion 115 sheet is manufactured in a separate process. Further, by overlapping the electrolytic element 4 on the surface of the organic TFT support substrate 32 opposite to the side of the active matrix circuit 33, and then holding them with films made of polytrifluoroethylene or the like to form a laminated sealing, the sealing layer 8 is formed.
Also in the electrophoretic display device 31 according to the present embodiment, since the deterioration of the performance of the organic TFT 38 caused by moisture can be prevented, a similar advantage to the advantage of the first and the second embodiments that the electrophoretic display device superior in reliability can be realized can be obtained. Similarly to the case with the organic EL device, since the deterioration of the organic TFT 38 is also accelerated in the case in which the organic TFT 38 is powered in the presence of moisture, it is preferable that the voltage is kept applied between the electrodes 6, 7 of the electrolytic element 4 at least when the organic TFT 38 is in operation. Further, in the case of the present embodiment, since the plastic material is used for all of the organic TFT support substrate 32, the display element substrate 35, and the sealing layer 8, the flexible display device with high reliability while adopting a simple sealing structure can be realized.
It should be noted that as shown in FIG. 6, it is possible to adopt the configuration that the electrolytic element 4 is previously formed on an electrolytic element support substrate 45 and then bonded with the organic TFT support substrate 32.
It is also possible to widely use any known organic semiconductors as the organic semiconductor in addition to F8T2. For example, small molecule organic semiconductor materials such as naphthalene, anthracene, tetracene, pentacene, hexacene, phthalocyanine, perylene, hydrazone, triphenylmethane, diphenylmethane, stilbene, arylvinyl, pyrazoline, triphenylamine, triarylamine, phthalocyanine, or derivatives of the above, or polymeric semiconductor materials such as poly-N-vinvlcarbazole, polyvinylpyrene, polyvinylanthracene, polythiophene, polyhexylthiophene, poly(p-phenylenevinylene), polythenylenevinylene, polyarylamine, pyrene-formaldehyde resin, ehtylcarbazole-formaldehyde resin, fluorene-bithiophene copolymer, fluorene-arylamine copolymer, or derivatives of the above can be cited, and these materials can be used alone or in combination. Alternatively, oligomer including thiophene, triphenylamine, naphthalene, perylene, fluorene, or the like can also be used.
It is especially effective to use the organic semiconductor functioning as a p-type channel layer out of the above mentioned organic semiconductors. P-type organic semiconductors are more stable against oxygen compared to n-type organic semiconductors. Therefore, since the electrolytic element 4 according to the embodiment of the invention is hardly influenced by the generated oxygen, the effect that the moisture is removed by the electrolytic element 4 is effectively exerted. In other words, since the p-type organic semiconductors are influenced by water but only slightly influenced by oxygen, an element with high reliability can be realized only by removing water from the atmospheric air penetrating the element. In the p-type organic semiconductors, those with ionization potential of 4.7 eV or higher are hardly influenced by oxygen, and accordingly effective as the organic semiconductor according to the embodiment of the invention.
Further, in the present embodiment, the gate electrode is formed by printing the Ag colloidal liquid. By annealing the Ag colloid thus printed at a low temperature (e.g., 120° C. or lower), high conductivity can be obtained. The Ag colloid is a quite useful material for forming a highly conductive electrode on a plastic. On the other hand, Ag can easily be ionized in the presence of water, and if the voltage is applied thereto, the Ag ions are migrated to problematically cause a short between the electrodes. Therefore, by removing water inside the element with the configuration of the embodiment of the invention, highly reliable electrodes and wiring can be formed even on a plastic. Accordingly, it is particularly effective to use electrodes and wiring formed by printing the colloid dispersing Ag or thin film transistors including such electrodes and wiring to the embodiment of the invention.
Fourth Embodiment
Hereinafter, a fourth embodiment of the invention will be described with reference to FIG. 7.
The electronic device according to the present embodiment is an example of an electrophoretic display device having the electrophoretic element and the electrolytic element stacked on the same substrate.
FIG. 7 is a cross-sectional view of the electrophoretic display device according to the present embodiment. Further, in FIG. 7, the elements common to those shown in FIGS. 4 and 6 are provided with the same reference numerals, and detailed explanations therefor are omitted.
As shown in FIG. 7, an electrophoretic display device 51 according to the present embodiment is provided with the electrolytic element 4 disposed on one surface of a oxide thin film transistor (oxide TFT) support substrate 53 formed of a well known plastic substrate such as polycarbonate or polyethylene terephthalate, an active matrix circuit 54 including oxide TFT and formed on the electrolytic element 4, and the electrophoretic element 34 formed on the active matrix circuit 54. The electrophoretic element 34 is formed by disposing the microcapsules 36 encapsulating the electrophoretic particles on the display element substrate 35, and has a form in which the side provided with the microcapsules 36 is bonded on the active matrix circuit 54.
The anode 7 is formed by evaporating the platinum thin film on the oxide TFT support substrate 53, the solid-state electrolyte layer 5 is formed by applying the Nafion dispersion liquid thereon using a spin coat method, and the cathode 6 is formed by evaporating the platinum thin film thereon again. Further, insulator copolymer such as epoxy resin or polyester resin is applied thereon using a spin coat method, and then cured to be insolubilized, thus forming a foundation layer 52. The active matrix circuit 54 is manufactured by forming oxide TFT on the foundation layer 52, the electrophoretic element 34 is bonded with the active matrix circuit 54 with the side of the microcapsules 36 facing to the side of the active matrix circuit 54. The succeeding process of forming the oxide TFT is well known, and accordingly the explanations will be omitted.
Also in the electrophoretic display device 51 according to the present embodiment, since the deterioration of the performance of the oxide TFT caused by moisture can be prevented, a similar advantage to the advantage of the third embodiment that the electrophoretic display device superior in reliability can be realized can be obtained. In particular in the case of the present embodiment, since the active matrix circuit having oxide TFT is stacked directly on the electrolytic element 4, effectiveness of preventing deterioration of performance caused by moisture can further be enhanced. This is because oxide semiconductors are highly hygroscopic in general, and accordingly easily influenced by moisture. As the name suggests, the oxide semiconductors are hardly influenced by oxygen, and accordingly, the embodiment of the invention is especially advantageous.
As the oxide semiconductor, ZnO, NiO, SnO2, TiO2, In2O5, V2O5, SrTiO3, WO2, amorphous In—Ga—Zn—O (a-IGZO), amorphous Cd—Ge—O, and amorphous Cd—Pb—O can be used by forming as a thin film using an evaporation method, a sputtering method, a sol-gel method and so on.
It should be noted that the scope of the invention is not limited to the embodiments described above, but various modifications can be executed thereon within the range of the scope or the spirit of the invention. For example, the specific configurations, materials, manufacturing methods and so on of the organic EL element, organic TFT exemplified as a functional element in the embodiments described above can be modified according to needs. Further, although the element according to the embodiment of the invention is especially advantageous for organic functional devices easily influenced by moisture, it is not limited to the organic functional devices. For example, it is also advantageous for an electroluminescence element or a thin film transistor using an oxide semiconductor. Further, it is also advantageous to apply the present structure to solar cells using an organic semiconductor or an oxide semiconductor.

Claims (12)

What is claimed is:
1. An electrophoretic device comprising:
a substrate including:
a first side; and
a second side opposite to the first side;
an electrophoretic element including electrophoretic particles, the electrophoretic element being disposed on the first side of the substrate;
an electrolytic element disposed on the second side of the substrate, the electrolytic element having an overlap with the electrophoretic element in plan view, the electrolytic element being capable of applying electrolysis to water, and the electrolytic element including:
a solid-state electrolyte layer; and
a pair of electrodes configured to hold the solid-state electrolyte layer in between; and
a sealing member configured to seal the electrophoretic element and the electrolytic element, the electrolytic element and the electrophoretic element being disposed between the sealing member and the substrate.
2. The electrophoretic device according to claim 1, wherein out of the pair of electrodes forming the electrolytic element, a cathode is disposed facing to the electrophoretic element side, and an anode is disposed facing to a side opposite the electrophoretic element side.
3. The electrophoretic device according to claim 2, wherein the anode is provided with a gas-permeable hole.
4. The electrophoretic device according to claim 1, wherein an active matrix circuit is formed between the electrophoretic element and the substrate, the active matrix circuit including a thin film transistor.
5. The electrophoretic device according to claim 4, wherein the thin film transistor includes an organic material layer.
6. The electrophoretic device according to claim 4, wherein the thin film transistor includes an oxide semiconductor layer.
7. The electrophoretic device according to claim 1, wherein the substrate and the sealing member are formed of a resin material.
8. The electrophoretic device according to claim 1, wherein the solid-state electrolyte layer is formed of a polymeric electrolyte material.
9. The electrophoretic device according to claim 8, wherein the polymeric electrolyte material includes a sulfonic acid group.
10. The electrophoretic device according to claim 8, wherein at least a part of hydrogen composing the polymeric electrolyte material is substituted by fluorine.
11. The electrophoretic device according to claim 1, wherein a material of the pair of electrodes forming the electrolytic element includes one of platinum and palladium.
12. An electrophoretic device comprising:
an electrophoretic element including electrophoretic particles;
an electrolytic element having an overlap with the electrophoretic element in plan view, the electrolytic element being capable of applying electrolysis to water, and the electrolytic element including:
a solid-state electrolyte layer; and
a pair of electrodes configured to hold the solid-state electrolyte layer in between;
an underlying layer disposed between the electrophoretic element and the electrolytic element; and
an active matrix circuit being formed between the electrophoretic element and the underlying layer, the active matrix circuit including a thin film transistor.
US11/844,015 2006-09-27 2007-08-23 Electronic device, organic electroluminescence device, and organic thin film semiconductor device Expired - Fee Related US8553312B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006261997A JP4274219B2 (en) 2006-09-27 2006-09-27 Electronic devices, organic electroluminescence devices, organic thin film semiconductor devices
JP2006-261997 2006-09-27

Publications (2)

Publication Number Publication Date
US20080106191A1 US20080106191A1 (en) 2008-05-08
US8553312B2 true US8553312B2 (en) 2013-10-08

Family

ID=39256240

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/844,015 Expired - Fee Related US8553312B2 (en) 2006-09-27 2007-08-23 Electronic device, organic electroluminescence device, and organic thin film semiconductor device

Country Status (4)

Country Link
US (1) US8553312B2 (en)
JP (1) JP4274219B2 (en)
KR (1) KR101367858B1 (en)
CN (1) CN101154716B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150349128A1 (en) * 2014-05-27 2015-12-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20160018678A1 (en) * 2014-07-18 2016-01-21 Samsung Display Co., Ltd. Organic light emitting display devices

Families Citing this family (1793)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7579224B2 (en) * 2005-01-21 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a thin film semiconductor device
TWI412138B (en) * 2005-01-28 2013-10-11 Semiconductor Energy Lab Semiconductor device, electronic device, and method of manufacturing semiconductor device
US7608531B2 (en) 2005-01-28 2009-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic device, and method of manufacturing semiconductor device
US7858451B2 (en) 2005-02-03 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
US7948171B2 (en) * 2005-02-18 2011-05-24 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7928938B2 (en) 2005-04-19 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including memory circuit, display device and electronic apparatus
US8629819B2 (en) 2005-07-14 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
EP1758072A3 (en) * 2005-08-24 2007-05-02 Semiconductor Energy Laboratory Co., Ltd. Display device and driving method thereof
EP1998375A3 (en) * 2005-09-29 2012-01-18 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device having oxide semiconductor layer and manufacturing method
KR101358954B1 (en) * 2005-11-15 2014-02-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Diode and Active Matrix Display Device
EP1843194A1 (en) 2006-04-06 2007-10-10 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device, semiconductor device, and electronic appliance
JP5116277B2 (en) 2006-09-29 2013-01-09 株式会社半導体エネルギー研究所 Semiconductor device, display device, liquid crystal display device, display module, and electronic apparatus
US7646015B2 (en) * 2006-10-31 2010-01-12 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device and semiconductor device
JP5542296B2 (en) 2007-05-17 2014-07-09 株式会社半導体エネルギー研究所 Liquid crystal display device, display module, and electronic device
JP5542297B2 (en) 2007-05-17 2014-07-09 株式会社半導体エネルギー研究所 Liquid crystal display device, display module, and electronic device
JP4989309B2 (en) 2007-05-18 2012-08-01 株式会社半導体エネルギー研究所 Liquid crystal display
US7897482B2 (en) * 2007-05-31 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2009010102A (en) * 2007-06-27 2009-01-15 Gunze Ltd Semiconductor element
US8354674B2 (en) * 2007-06-29 2013-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer
WO2009014155A1 (en) 2007-07-25 2009-01-29 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and electronic device having the same
NO332409B1 (en) * 2008-01-24 2012-09-17 Well Technology As Apparatus and method for isolating a section of a wellbore
US9041202B2 (en) 2008-05-16 2015-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
US8314765B2 (en) 2008-06-17 2012-11-20 Semiconductor Energy Laboratory Co., Ltd. Driver circuit, display device, and electronic device
KR101811782B1 (en) 2008-07-10 2018-01-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Light-emitting device and electronic device using the same
TWI711182B (en) 2008-07-31 2020-11-21 日商半導體能源研究所股份有限公司 Semiconductor device and method of manufacturing semiconductor device
US8945981B2 (en) 2008-07-31 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI495108B (en) 2008-07-31 2015-08-01 Semiconductor Energy Lab Method for manufacturing semiconductor devices
TWI491048B (en) * 2008-07-31 2015-07-01 Semiconductor Energy Lab Semiconductor device
US9666719B2 (en) 2008-07-31 2017-05-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI500160B (en) * 2008-08-08 2015-09-11 Semiconductor Energy Lab Semiconductor device and method for manufacturing the same
TWI508282B (en) 2008-08-08 2015-11-11 Semiconductor Energy Lab Semiconductor device and method for manufacturing the same
TWI642113B (en) 2008-08-08 2018-11-21 半導體能源研究所股份有限公司 Method for manufacturing semiconductor device
JP5480554B2 (en) 2008-08-08 2014-04-23 株式会社半導体エネルギー研究所 Semiconductor device
JP5525778B2 (en) * 2008-08-08 2014-06-18 株式会社半導体エネルギー研究所 Semiconductor device
TWI569454B (en) 2008-09-01 2017-02-01 半導體能源研究所股份有限公司 Method for manufacturing semiconductor device
US9082857B2 (en) * 2008-09-01 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an oxide semiconductor layer
JP5627071B2 (en) 2008-09-01 2014-11-19 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
KR101545460B1 (en) * 2008-09-12 2015-08-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
WO2010029866A1 (en) 2008-09-12 2010-03-18 Semiconductor Energy Laboratory Co., Ltd. Display device
WO2010029865A1 (en) 2008-09-12 2010-03-18 Semiconductor Energy Laboratory Co., Ltd. Display device
WO2010029859A1 (en) 2008-09-12 2010-03-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR101722409B1 (en) * 2008-09-19 2017-04-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101609557B1 (en) * 2008-09-19 2016-04-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101760341B1 (en) * 2008-09-19 2017-07-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
WO2010032640A1 (en) * 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Display device
CN102881696A (en) 2008-09-19 2013-01-16 株式会社半导体能源研究所 Display device
KR101611643B1 (en) * 2008-10-01 2016-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
EP2172804B1 (en) 2008-10-03 2016-05-11 Semiconductor Energy Laboratory Co, Ltd. Display device
EP2172977A1 (en) 2008-10-03 2010-04-07 Semiconductor Energy Laboratory Co., Ltd. Display device
KR20160113329A (en) 2008-10-03 2016-09-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
KR101803720B1 (en) 2008-10-03 2017-12-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
CN101714546B (en) 2008-10-03 2014-05-14 株式会社半导体能源研究所 Display device and method for producing same
CN101719493B (en) 2008-10-08 2014-05-14 株式会社半导体能源研究所 Display device
JP5484853B2 (en) * 2008-10-10 2014-05-07 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
WO2010044478A1 (en) * 2008-10-16 2010-04-22 Semiconductor Energy Laboratory Co., Ltd. Light-emitting display device
JP5361651B2 (en) 2008-10-22 2013-12-04 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP5616012B2 (en) 2008-10-24 2014-10-29 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
EP2180518B1 (en) 2008-10-24 2018-04-25 Semiconductor Energy Laboratory Co, Ltd. Method for manufacturing semiconductor device
KR101633142B1 (en) 2008-10-24 2016-06-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP5442234B2 (en) 2008-10-24 2014-03-12 株式会社半導体エネルギー研究所 Semiconductor device and display device
US8106400B2 (en) 2008-10-24 2012-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2010047288A1 (en) * 2008-10-24 2010-04-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductordevice
US8741702B2 (en) 2008-10-24 2014-06-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR101667909B1 (en) * 2008-10-24 2016-10-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
KR101603303B1 (en) 2008-10-31 2016-03-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Conductive oxynitride and method for manufacturing conductive oxynitride film
KR101631454B1 (en) 2008-10-31 2016-06-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Logic circuit
TWI606520B (en) 2008-10-31 2017-11-21 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
KR101634411B1 (en) * 2008-10-31 2016-06-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Driver circuit, display device and electronic device
TWI467663B (en) 2008-11-07 2015-01-01 Semiconductor Energy Lab Semiconductor device and method for manufacturing the semiconductor device
TWI535037B (en) * 2008-11-07 2016-05-21 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
CN101740631B (en) * 2008-11-07 2014-07-16 株式会社半导体能源研究所 Semiconductor device and method for manufacturing the semiconductor device
EP2184783B1 (en) * 2008-11-07 2012-10-03 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and method for manufacturing the same
TWI518913B (en) 2008-11-07 2016-01-21 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
KR20170021903A (en) * 2008-11-07 2017-02-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method of manufacturing a semiconductor device
TWI536577B (en) 2008-11-13 2016-06-01 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
KR101432764B1 (en) * 2008-11-13 2014-08-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
US8232947B2 (en) 2008-11-14 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
JP2010153802A (en) 2008-11-20 2010-07-08 Semiconductor Energy Lab Co Ltd Semiconductor device and method of manufacturing the same
KR101291384B1 (en) 2008-11-21 2013-07-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TWI595297B (en) 2008-11-28 2017-08-11 半導體能源研究所股份有限公司 Liquid crystal display device
TWI529949B (en) * 2008-11-28 2016-04-11 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
TWI585955B (en) * 2008-11-28 2017-06-01 半導體能源研究所股份有限公司 Photosensor and display device
KR101643204B1 (en) * 2008-12-01 2016-07-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
JP2010156960A (en) * 2008-12-03 2010-07-15 Semiconductor Energy Lab Co Ltd Liquid crystal display device
JP5501604B2 (en) * 2008-12-04 2014-05-28 シャープ株式会社 Organic thin film transistor
JP5491833B2 (en) * 2008-12-05 2014-05-14 株式会社半導体エネルギー研究所 Semiconductor device
CN102257621B (en) * 2008-12-19 2013-08-21 株式会社半导体能源研究所 Method for manufacturing transistor
JP5615540B2 (en) * 2008-12-19 2014-10-29 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
EP2515337B1 (en) 2008-12-24 2016-02-24 Semiconductor Energy Laboratory Co., Ltd. Driver circuit and semiconductor device
US8383470B2 (en) 2008-12-25 2013-02-26 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor (TFT) having a protective layer and manufacturing method thereof
KR101719350B1 (en) * 2008-12-25 2017-03-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
US8114720B2 (en) * 2008-12-25 2012-02-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8441007B2 (en) 2008-12-25 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
JP5590877B2 (en) * 2008-12-26 2014-09-17 株式会社半導体エネルギー研究所 Semiconductor device
TWI501319B (en) * 2008-12-26 2015-09-21 Semiconductor Energy Lab Semiconductor device and manufacturing method thereof
KR101648927B1 (en) 2009-01-16 2016-08-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
US8492756B2 (en) 2009-01-23 2013-07-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8436350B2 (en) * 2009-01-30 2013-05-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device using an oxide semiconductor with a plurality of metal clusters
US8367486B2 (en) 2009-02-05 2013-02-05 Semiconductor Energy Laboratory Co., Ltd. Transistor and method for manufacturing the transistor
US8174021B2 (en) 2009-02-06 2012-05-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the semiconductor device
US8749930B2 (en) * 2009-02-09 2014-06-10 Semiconductor Energy Laboratory Co., Ltd. Protection circuit, semiconductor device, photoelectric conversion device, and electronic device
US8278657B2 (en) * 2009-02-13 2012-10-02 Semiconductor Energy Laboratory Co., Ltd. Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device
CN101840936B (en) 2009-02-13 2014-10-08 株式会社半导体能源研究所 Semiconductor device including a transistor, and manufacturing method of the semiconductor device
US8247812B2 (en) * 2009-02-13 2012-08-21 Semiconductor Energy Laboratory Co., Ltd. Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device
US8247276B2 (en) * 2009-02-20 2012-08-21 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor, method for manufacturing the same, and semiconductor device
US8841661B2 (en) * 2009-02-25 2014-09-23 Semiconductor Energy Laboratory Co., Ltd. Staggered oxide semiconductor TFT semiconductor device and manufacturing method thereof
US8704216B2 (en) 2009-02-27 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20100224880A1 (en) * 2009-03-05 2010-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8461582B2 (en) * 2009-03-05 2013-06-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20100224878A1 (en) 2009-03-05 2010-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101671210B1 (en) 2009-03-06 2016-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
KR101743164B1 (en) * 2009-03-12 2017-06-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
TWI485781B (en) * 2009-03-13 2015-05-21 Semiconductor Energy Lab Semiconductor device and method for manufacturing the semiconductor device
US8450144B2 (en) * 2009-03-26 2013-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TWI617029B (en) * 2009-03-27 2018-03-01 半導體能源研究所股份有限公司 Semiconductor device
KR101681884B1 (en) 2009-03-27 2016-12-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, display device, and electronic appliance
KR101752640B1 (en) 2009-03-27 2017-06-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TWI485851B (en) * 2009-03-30 2015-05-21 Semiconductor Energy Lab Semiconductor device and method for manufacturing the same
US8338226B2 (en) * 2009-04-02 2012-12-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
TWI489628B (en) 2009-04-02 2015-06-21 Semiconductor Energy Lab Semiconductor device and method for manufacturing the same
JP5615018B2 (en) 2009-04-10 2014-10-29 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
TWI535023B (en) 2009-04-16 2016-05-21 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
CN102422426B (en) * 2009-05-01 2016-06-01 株式会社半导体能源研究所 The manufacture method of semiconductor device
JP5751762B2 (en) 2009-05-21 2015-07-22 株式会社半導体エネルギー研究所 Semiconductor device
EP2256795B1 (en) * 2009-05-29 2014-11-19 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for oxide semiconductor device
JP5564331B2 (en) * 2009-05-29 2014-07-30 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
EP2256814B1 (en) * 2009-05-29 2019-01-16 Semiconductor Energy Laboratory Co, Ltd. Oxide semiconductor device and method for manufacturing the same
WO2011002046A1 (en) * 2009-06-30 2011-01-06 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR101968855B1 (en) 2009-06-30 2019-04-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
CN111081550A (en) 2009-06-30 2020-04-28 株式会社半导体能源研究所 Method for manufacturing semiconductor device and semiconductor device
KR102435377B1 (en) 2009-06-30 2022-08-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
US20110000175A1 (en) * 2009-07-01 2011-01-06 Husqvarna Consumer Outdoor Products N.A. Inc. Variable speed controller
KR101476817B1 (en) 2009-07-03 2014-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device including transistor and manufacturing method thereof
KR102096109B1 (en) * 2009-07-03 2020-04-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
JP5663214B2 (en) * 2009-07-03 2015-02-04 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
KR20210131462A (en) 2009-07-10 2021-11-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing liquid crystal display device
KR101460868B1 (en) 2009-07-10 2014-11-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR102011614B1 (en) 2009-07-10 2019-08-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
WO2011007675A1 (en) * 2009-07-17 2011-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2011007677A1 (en) 2009-07-17 2011-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2011007682A1 (en) 2009-07-17 2011-01-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
KR101851403B1 (en) 2009-07-18 2018-04-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing semiconductor device
KR101782176B1 (en) 2009-07-18 2017-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
WO2011010545A1 (en) * 2009-07-18 2011-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2011010544A1 (en) 2009-07-18 2011-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
WO2011010542A1 (en) * 2009-07-23 2011-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR101904811B1 (en) * 2009-07-24 2018-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR102526493B1 (en) 2009-07-31 2023-04-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
WO2011013523A1 (en) 2009-07-31 2011-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN105070761B (en) 2009-07-31 2019-08-20 株式会社半导体能源研究所 Display device
WO2011013502A1 (en) * 2009-07-31 2011-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2011013596A1 (en) * 2009-07-31 2011-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5663231B2 (en) * 2009-08-07 2015-02-04 株式会社半導体エネルギー研究所 Light emitting device
EP2284891B1 (en) 2009-08-07 2019-07-24 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and manufacturing method thereof
TWI650848B (en) * 2009-08-07 2019-02-11 日商半導體能源研究所股份有限公司 Semiconductor device and method of manufacturing same
TWI596741B (en) * 2009-08-07 2017-08-21 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
JP5642447B2 (en) 2009-08-07 2014-12-17 株式会社半導体エネルギー研究所 Semiconductor device
TWI582951B (en) * 2009-08-07 2017-05-11 半導體能源研究所股份有限公司 Semiconductor device and phone, watch, and display device comprising the same
TWI634642B (en) 2009-08-07 2018-09-01 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
US8115883B2 (en) 2009-08-27 2012-02-14 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
WO2011027649A1 (en) * 2009-09-02 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including a transistor, and manufacturing method of semiconductor device
KR101791812B1 (en) 2009-09-04 2017-10-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing method of semiconductor device
WO2011027701A1 (en) 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
WO2011027702A1 (en) * 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
KR101746198B1 (en) * 2009-09-04 2017-06-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and electronic device
US9805641B2 (en) * 2009-09-04 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device including the same
WO2011027661A1 (en) 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
WO2011027676A1 (en) 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2011027656A1 (en) 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
WO2011027664A1 (en) * 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method for manufacturing the same
CN105810753A (en) 2009-09-04 2016-07-27 株式会社半导体能源研究所 Semiconductor device and method for manufacturing same
WO2011034012A1 (en) * 2009-09-16 2011-03-24 Semiconductor Energy Laboratory Co., Ltd. Logic circuit, light emitting device, semiconductor device, and electronic device
WO2011033993A1 (en) * 2009-09-16 2011-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR101700470B1 (en) * 2009-09-16 2017-01-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Driver circuit, display device including the driver circuit, and electronic device including the display device
KR20230165355A (en) 2009-09-16 2023-12-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
CN105428424A (en) 2009-09-16 2016-03-23 株式会社半导体能源研究所 Transistor and display device
US9715845B2 (en) 2009-09-16 2017-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
KR101927922B1 (en) 2009-09-16 2018-12-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Light-emitting device and manufacturing method thereof
KR101709749B1 (en) 2009-09-16 2017-03-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Driving method of display device and display device
CN102474256B (en) 2009-09-24 2016-03-02 株式会社半导体能源研究所 Drive circuit, comprise the display device of drive circuit and comprise the electronic apparatus of display device
KR101342179B1 (en) 2009-09-24 2013-12-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor element and method for manufacturing the same
EP2481089A4 (en) 2009-09-24 2015-09-23 Semiconductor Energy Lab Semiconductor device and manufacturing method thereof
WO2011036981A1 (en) * 2009-09-24 2011-03-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011037008A1 (en) * 2009-09-24 2011-03-31 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing oxide semiconductor film and method for manufacturing semiconductor device
WO2011036987A1 (en) * 2009-09-24 2011-03-31 Semiconductor Energy Laboratory Co., Ltd. Display device
KR102219095B1 (en) 2009-09-24 2021-02-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
KR101914026B1 (en) 2009-09-24 2018-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Oxide semiconductor film and semiconductor device
TWI512997B (en) * 2009-09-24 2015-12-11 Semiconductor Energy Lab Semiconductor device, power circuit, and manufacturing method of semiconductor device
KR101837103B1 (en) * 2009-09-30 2018-03-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Electrochemical capacitor
JP5613508B2 (en) * 2009-09-30 2014-10-22 株式会社半導体エネルギー研究所 Redox capacitor
KR101767035B1 (en) * 2009-10-01 2017-08-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
KR20120084751A (en) * 2009-10-05 2012-07-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
WO2011043182A1 (en) 2009-10-05 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Method for removing electricity and method for manufacturing semiconductor device
CN102484139B (en) 2009-10-08 2016-07-06 株式会社半导体能源研究所 Oxide semiconductor layer and semiconductor device
CN105185837B (en) 2009-10-08 2018-08-03 株式会社半导体能源研究所 Semiconductor devices, display device and electronic apparatus
WO2011043206A1 (en) 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN112242173A (en) * 2009-10-09 2021-01-19 株式会社半导体能源研究所 Semiconductor device with a plurality of transistors
WO2011043194A1 (en) 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR101944239B1 (en) 2009-10-09 2019-01-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Light-emitting display device and electronic device including the same
WO2011043217A1 (en) 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and electronic device including the same
WO2011043164A1 (en) * 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
KR101396096B1 (en) 2009-10-09 2014-05-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
WO2011043451A1 (en) 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Shift register and display device
WO2011043162A1 (en) * 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
KR101754701B1 (en) 2009-10-09 2017-07-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
EP2486595B1 (en) * 2009-10-09 2019-10-23 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device
KR101779349B1 (en) * 2009-10-14 2017-09-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
KR102314748B1 (en) 2009-10-16 2021-10-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing method of semiconductor device
WO2011046010A1 (en) 2009-10-16 2011-04-21 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and electronic device including the liquid crystal display device
CN116722019A (en) 2009-10-16 2023-09-08 株式会社半导体能源研究所 Display apparatus
EP2489075A4 (en) 2009-10-16 2014-06-11 Semiconductor Energy Lab Logic circuit and semiconductor device
KR101915251B1 (en) * 2009-10-16 2018-11-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR20120096463A (en) 2009-10-21 2012-08-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and electronic device including display device
CN105702688B (en) 2009-10-21 2020-09-08 株式会社半导体能源研究所 Liquid crystal display device and electronic apparatus including the same
JP5730529B2 (en) 2009-10-21 2015-06-10 株式会社半導体エネルギー研究所 Semiconductor device
WO2011048925A1 (en) 2009-10-21 2011-04-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2011048959A1 (en) 2009-10-21 2011-04-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR20220038542A (en) 2009-10-21 2022-03-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Analog circuit and semiconductor device
WO2011048923A1 (en) 2009-10-21 2011-04-28 Semiconductor Energy Laboratory Co., Ltd. E-book reader
KR101490726B1 (en) 2009-10-21 2015-02-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
GB2474689B (en) * 2009-10-23 2015-08-26 Plastic Logic Ltd Electronic document reading devices
KR102369024B1 (en) 2009-10-29 2022-02-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
SG10201406934WA (en) 2009-10-29 2014-11-27 Semiconductor Energy Lab Semiconductor device
KR101796909B1 (en) 2009-10-30 2017-12-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Non-linear element, display device, and electronic device
WO2011052366A1 (en) 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Voltage regulator circuit
WO2011052409A1 (en) * 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Transistor
WO2011052411A1 (en) * 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Transistor
CN102598249B (en) * 2009-10-30 2014-11-05 株式会社半导体能源研究所 Semiconductor device
WO2011052344A1 (en) * 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device, driving method of the same, and electronic appliance including the same
CN102687400B (en) 2009-10-30 2016-08-24 株式会社半导体能源研究所 Logic circuit and semiconductor device
WO2011052385A1 (en) * 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011052382A1 (en) 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2011052410A1 (en) 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Power diode, rectifier, and semiconductor device including the same
KR101788521B1 (en) 2009-10-30 2017-10-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR20120102653A (en) * 2009-10-30 2012-09-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
KR101712340B1 (en) * 2009-10-30 2017-03-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Driver circuit, display device including the driver circuit, and electronic device including the display device
WO2011052437A1 (en) 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Non-linear element, display device including non-linear element, and electronic device including display device
KR101488521B1 (en) 2009-11-06 2015-02-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101876473B1 (en) 2009-11-06 2018-07-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
CN102598279B (en) * 2009-11-06 2015-10-07 株式会社半导体能源研究所 Semiconductor device
KR102220606B1 (en) 2009-11-06 2021-03-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
KR101727469B1 (en) 2009-11-06 2017-04-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
KR101861980B1 (en) 2009-11-06 2018-05-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101824854B1 (en) 2009-11-06 2018-02-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR20120093952A (en) * 2009-11-06 2012-08-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor element and semiconductor device, and deposition apparatus
KR101952065B1 (en) * 2009-11-06 2019-02-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and operating method thereof
KR101876470B1 (en) * 2009-11-06 2018-07-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101930230B1 (en) 2009-11-06 2018-12-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
JP5539846B2 (en) 2009-11-06 2014-07-02 株式会社半導体エネルギー研究所 Evaluation method, manufacturing method of semiconductor device
CN102612714B (en) 2009-11-13 2016-06-29 株式会社半导体能源研究所 Semiconductor device and driving method thereof
KR20170076818A (en) * 2009-11-13 2017-07-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Sputtering target and method for manufacturing the same, and transistor
KR20230107711A (en) 2009-11-13 2023-07-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and electronic device including the same
WO2011058864A1 (en) * 2009-11-13 2011-05-19 Semiconductor Energy Laboratory Co., Ltd. Device including nonvolatile memory element
KR101975741B1 (en) * 2009-11-13 2019-05-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for packaging target material and method for mounting target
WO2011058913A1 (en) * 2009-11-13 2011-05-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101787353B1 (en) 2009-11-13 2017-10-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR20170072965A (en) * 2009-11-13 2017-06-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Sputtering target and manufacturing method thereof, and transistor
KR101721850B1 (en) 2009-11-13 2017-03-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011058865A1 (en) * 2009-11-13 2011-05-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor devi ce
WO2011062029A1 (en) 2009-11-18 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Memory device
WO2011062048A1 (en) 2009-11-20 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
KR101790365B1 (en) * 2009-11-20 2017-10-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
MY166309A (en) 2009-11-20 2018-06-25 Semiconductor Energy Lab Nonvolatile latch circuit and logic circuit, and semiconductor device using the same
KR101693914B1 (en) 2009-11-20 2017-01-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101448908B1 (en) * 2009-11-20 2014-10-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011062041A1 (en) * 2009-11-20 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Transistor
JP5762723B2 (en) 2009-11-20 2015-08-12 株式会社半導体エネルギー研究所 Modulation circuit and semiconductor device having the same
KR102451852B1 (en) 2009-11-20 2022-10-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011062057A1 (en) 2009-11-20 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011062043A1 (en) 2009-11-20 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2011065183A1 (en) * 2009-11-24 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including memory cell
KR101517944B1 (en) 2009-11-27 2015-05-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
CN102640293B (en) 2009-11-27 2015-07-22 株式会社半导体能源研究所 Semiconductor device
KR101911382B1 (en) * 2009-11-27 2018-10-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011065209A1 (en) * 2009-11-27 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Non-linear element, display device including non-linear element, and electronic device including display device
KR101396015B1 (en) 2009-11-28 2014-05-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011065210A1 (en) * 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Stacked oxide material, semiconductor device, and method for manufacturing the semiconductor device
CN102668028B (en) 2009-11-28 2015-09-02 株式会社半导体能源研究所 Stacked oxide material, semiconductor device and the method for the manufacture of this semiconductor device
WO2011065244A1 (en) 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN105739209B (en) 2009-11-30 2022-05-27 株式会社半导体能源研究所 Liquid crystal display device, method for driving the same
CN103746001B (en) * 2009-12-04 2017-05-03 株式会社半导体能源研究所 Display device
WO2011068022A1 (en) 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20220136513A (en) 2009-12-04 2022-10-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP2011139052A (en) * 2009-12-04 2011-07-14 Semiconductor Energy Lab Co Ltd Semiconductor memory device
WO2011068025A1 (en) 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Dc converter circuit and power supply circuit
KR102241766B1 (en) 2009-12-04 2021-04-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
WO2011068106A1 (en) * 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device including the same
WO2011068021A1 (en) * 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Display device
KR101797253B1 (en) * 2009-12-04 2017-11-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
JP5584103B2 (en) 2009-12-04 2014-09-03 株式会社半導体エネルギー研究所 Semiconductor device
KR20120103676A (en) * 2009-12-04 2012-09-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011068028A1 (en) 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, semiconductor device, and method for manufacturing the same
KR102153034B1 (en) 2009-12-04 2020-09-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011070892A1 (en) * 2009-12-08 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2011070900A1 (en) 2009-12-08 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN102763154B (en) 2009-12-10 2015-05-20 株式会社半导体能源研究所 Display device and driving method thereof
WO2011070901A1 (en) 2009-12-11 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101770976B1 (en) 2009-12-11 2017-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011070929A1 (en) 2009-12-11 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
KR101720072B1 (en) 2009-12-11 2017-03-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Nonvolatile latch circuit and logic circuit, and semiconductor device using the same
KR20120102748A (en) * 2009-12-11 2012-09-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Field effect transistor
JP5727204B2 (en) 2009-12-11 2015-06-03 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP5185357B2 (en) * 2009-12-17 2013-04-17 株式会社半導体エネルギー研究所 Semiconductor device
KR102329671B1 (en) 2009-12-18 2021-11-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR102275522B1 (en) 2009-12-18 2021-07-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Liquid crystal display device and electronic device
CN102668377B (en) 2009-12-18 2015-04-08 株式会社半导体能源研究所 Non-volatile latch circuit and logic circuit, and semiconductor device using the same
KR101900662B1 (en) * 2009-12-18 2018-11-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Liquid crystal display device and driving method thereof
WO2011074407A1 (en) 2009-12-18 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2011074409A1 (en) 2009-12-18 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2011074392A1 (en) 2009-12-18 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101887837B1 (en) * 2009-12-18 2018-08-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device including optical sensor and driving method thereof
US9057758B2 (en) * 2009-12-18 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Method for measuring current, method for inspecting semiconductor device, semiconductor device, and test element group
CN105429621B (en) * 2009-12-23 2019-03-19 株式会社半导体能源研究所 Semiconductor device
WO2011077916A1 (en) 2009-12-24 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Display device
WO2011077926A1 (en) 2009-12-24 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
KR101613701B1 (en) * 2009-12-25 2016-04-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for driving liquid crystal display device
CN102804360B (en) 2009-12-25 2014-12-17 株式会社半导体能源研究所 Semiconductor device
KR101301463B1 (en) 2009-12-25 2013-08-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
US8441009B2 (en) * 2009-12-25 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP2517245B1 (en) 2009-12-25 2019-07-24 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device
CN102656801B (en) * 2009-12-25 2016-04-27 株式会社半导体能源研究所 Storage arrangement, semiconductor device and electronic installation
WO2011077978A1 (en) 2009-12-25 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
KR101883802B1 (en) 2009-12-28 2018-07-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
KR101842413B1 (en) * 2009-12-28 2018-03-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
CN102844806B (en) 2009-12-28 2016-01-20 株式会社半导体能源研究所 Liquid crystal indicator and electronic equipment
WO2011081041A1 (en) 2009-12-28 2011-07-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
CN102656691B (en) * 2009-12-28 2015-07-29 株式会社半导体能源研究所 Storage arrangement and semiconductor device
EP2519969A4 (en) * 2009-12-28 2016-07-06 Semiconductor Energy Lab Semiconductor device
JP2011145391A (en) * 2010-01-13 2011-07-28 Seiko Epson Corp Electrophoretic display device and electronic equipment
KR102471810B1 (en) 2010-01-15 2022-11-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for driving the same
WO2011086837A1 (en) 2010-01-15 2011-07-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
WO2011086871A1 (en) * 2010-01-15 2011-07-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101698537B1 (en) * 2010-01-15 2017-01-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011086847A1 (en) 2010-01-15 2011-07-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011086846A1 (en) * 2010-01-15 2011-07-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8780629B2 (en) * 2010-01-15 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
WO2011089842A1 (en) 2010-01-20 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Driving method of liquid crystal display device
WO2011089832A1 (en) 2010-01-20 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Method for driving display device and liquid crystal display device
WO2011090087A1 (en) * 2010-01-20 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Display method of display device
KR101722420B1 (en) 2010-01-20 2017-04-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Portable electronic device
WO2011089833A1 (en) 2010-01-20 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Display device
KR101889382B1 (en) * 2010-01-20 2018-08-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Electronic device and electronic system
US8415731B2 (en) * 2010-01-20 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor storage device with integrated capacitor and having transistor overlapping sections
CN102804603B (en) 2010-01-20 2015-07-15 株式会社半导体能源研究所 Signal processing circuit and method for driving the same
WO2011089843A1 (en) * 2010-01-20 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Method for driving display device
US9984617B2 (en) 2010-01-20 2018-05-29 Semiconductor Energy Laboratory Co., Ltd. Display device including light emitting element
KR101883629B1 (en) 2010-01-20 2018-07-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101855060B1 (en) 2010-01-22 2018-05-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor memory device and driving method thereof
WO2011089841A1 (en) 2010-01-22 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101993584B1 (en) * 2010-01-22 2019-06-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US8879010B2 (en) 2010-01-24 2014-11-04 Semiconductor Energy Laboratory Co., Ltd. Display device
WO2011089853A1 (en) 2010-01-24 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Display device
KR102008754B1 (en) 2010-01-24 2019-08-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and manufacturing method thereof
WO2011093150A1 (en) 2010-01-29 2011-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101948707B1 (en) * 2010-01-29 2019-02-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor memory device
WO2011093151A1 (en) * 2010-01-29 2011-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device including the same
KR101921618B1 (en) 2010-02-05 2018-11-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method of driving semiconductor device
CN102742001B (en) * 2010-02-05 2017-03-22 株式会社半导体能源研究所 Semiconductor device
WO2011096277A1 (en) * 2010-02-05 2011-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving semiconductor device
WO2011096286A1 (en) 2010-02-05 2011-08-11 Semiconductor Energy Laboratory Co., Ltd. Field effect transistor and semiconductor device
US9391209B2 (en) 2010-02-05 2016-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20230141883A (en) 2010-02-05 2023-10-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
WO2011096153A1 (en) 2010-02-05 2011-08-11 Semiconductor Energy Laboratory Co., Ltd. Display device
CN102725842B (en) * 2010-02-05 2014-12-03 株式会社半导体能源研究所 Semiconductor device
US8436403B2 (en) 2010-02-05 2013-05-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including transistor provided with sidewall and electronic appliance
KR20200124772A (en) 2010-02-05 2020-11-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing semiconductor device
CN109560140A (en) * 2010-02-05 2019-04-02 株式会社半导体能源研究所 Semiconductor device
KR101810261B1 (en) 2010-02-10 2017-12-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Field effect transistor
US8947337B2 (en) 2010-02-11 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Display device
KR101838130B1 (en) 2010-02-12 2018-03-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
KR101814222B1 (en) * 2010-02-12 2018-01-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Liquid crystal display device and electronic device
KR101775180B1 (en) 2010-02-12 2017-09-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for driving the same
WO2011099336A1 (en) 2010-02-12 2011-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
WO2011099359A1 (en) * 2010-02-12 2011-08-18 Semiconductor Energy Laboratory Co., Ltd. Display device and driving method
EP2534679B1 (en) 2010-02-12 2021-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of the same
WO2011099343A1 (en) 2010-02-12 2011-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
US8617920B2 (en) * 2010-02-12 2013-12-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2011099368A1 (en) * 2010-02-12 2011-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the same
KR102070537B1 (en) * 2010-02-18 2020-01-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and electronic device
CN102812421B (en) * 2010-02-19 2016-05-18 株式会社半导体能源研究所 Display device and driving method thereof
KR101848684B1 (en) * 2010-02-19 2018-04-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Liquid crystal display device and electronic device
KR101906151B1 (en) 2010-02-19 2018-10-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Transistor and display device using the same
KR101820776B1 (en) 2010-02-19 2018-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011102183A1 (en) 2010-02-19 2011-08-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN102754163B (en) * 2010-02-19 2015-11-25 株式会社半导体能源研究所 Semiconductor devices
JP5740169B2 (en) * 2010-02-19 2015-06-24 株式会社半導体エネルギー研究所 Method for manufacturing transistor
KR102081035B1 (en) * 2010-02-19 2020-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
KR102015762B1 (en) * 2010-02-19 2019-08-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor memory device, driving method thereof, and method for manufacturing semiconductor device
WO2011102228A1 (en) 2010-02-19 2011-08-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of semiconductor device
WO2011102190A1 (en) * 2010-02-19 2011-08-25 Semiconductor Energy Laboratory Co., Ltd. Demodulation circuit and rfid tag including the demodulation circuit
KR101772246B1 (en) 2010-02-23 2017-08-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device, semiconductor device, and driving method thereof
WO2011105198A1 (en) 2010-02-26 2011-09-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011105183A1 (en) * 2010-02-26 2011-09-01 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor element and deposition apparatus
WO2011105310A1 (en) 2010-02-26 2011-09-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101913657B1 (en) 2010-02-26 2018-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
WO2011105210A1 (en) * 2010-02-26 2011-09-01 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
WO2011105200A1 (en) * 2010-02-26 2011-09-01 Semiconductor Energy Laboratory Co., Ltd. Display device and driving method thereof
WO2011105218A1 (en) * 2010-02-26 2011-09-01 Semiconductor Energy Laboratory Co., Ltd. Display device and e-book reader provided therewith
CN102782859B (en) 2010-02-26 2015-07-29 株式会社半导体能源研究所 The manufacture method of semiconductor device
US9000438B2 (en) 2010-02-26 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101838628B1 (en) * 2010-03-02 2018-03-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Pulse signal output circuit and shift register
KR101828961B1 (en) 2010-03-02 2018-02-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Pulse signal output circuit and shift register
KR101817926B1 (en) 2010-03-02 2018-01-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Boosting circuit and rfid tag including boosting circuit
CN105245218B (en) 2010-03-02 2019-01-22 株式会社半导体能源研究所 Output of pulse signal circuit and shift register
WO2011108475A1 (en) * 2010-03-04 2011-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and semiconductor device
KR101929190B1 (en) * 2010-03-05 2018-12-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011108374A1 (en) * 2010-03-05 2011-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
WO2011108382A1 (en) * 2010-03-05 2011-09-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2011108346A1 (en) * 2010-03-05 2011-09-09 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of oxide semiconductor film and manufacturing method of transistor
WO2011111503A1 (en) 2010-03-08 2011-09-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
KR101898297B1 (en) 2010-03-08 2018-09-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and driving method thereof
EP2365417A3 (en) * 2010-03-08 2015-04-29 Semiconductor Energy Laboratory Co, Ltd. Electronic device and electronic system
KR101812467B1 (en) * 2010-03-08 2017-12-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR20190018049A (en) * 2010-03-08 2019-02-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing semiconductor device
KR101784676B1 (en) * 2010-03-08 2017-10-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
WO2011111504A1 (en) 2010-03-08 2011-09-15 Semiconductor Energy Laboratory Co., Ltd. Electronic device and electronic system
KR101761558B1 (en) * 2010-03-12 2017-07-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for driving input circuit and method for driving input-output device
US8900362B2 (en) * 2010-03-12 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of gallium oxide single crystal
CN102782622B (en) 2010-03-12 2016-11-02 株式会社半导体能源研究所 The driving method of display device
KR101773992B1 (en) 2010-03-12 2017-09-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101840185B1 (en) 2010-03-12 2018-03-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for driving circuit and method for driving display device
CN102822978B (en) * 2010-03-12 2015-07-22 株式会社半导体能源研究所 Semiconductor device and method for manufacturing the same
WO2011114866A1 (en) * 2010-03-17 2011-09-22 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
KR101891065B1 (en) * 2010-03-19 2018-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and driving method of semiconductor device
US20110227082A1 (en) * 2010-03-19 2011-09-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN102812547B (en) 2010-03-19 2015-09-09 株式会社半导体能源研究所 Semiconductor device
WO2011114868A1 (en) 2010-03-19 2011-09-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101840797B1 (en) * 2010-03-19 2018-03-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor memory device
WO2011118351A1 (en) * 2010-03-25 2011-09-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20130062919A (en) * 2010-03-26 2013-06-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
KR101862539B1 (en) * 2010-03-26 2018-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP5731244B2 (en) * 2010-03-26 2015-06-10 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
WO2011118741A1 (en) 2010-03-26 2011-09-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
CN105304502B (en) 2010-03-26 2018-07-03 株式会社半导体能源研究所 The manufacturing method of semiconductor device
CN102844873B (en) 2010-03-31 2015-06-17 株式会社半导体能源研究所 Semiconductor display device
WO2011122271A1 (en) 2010-03-31 2011-10-06 Semiconductor Energy Laboratory Co., Ltd. Field-sequential display device
WO2011122299A1 (en) 2010-03-31 2011-10-06 Semiconductor Energy Laboratory Co., Ltd. Driving method of liquid crystal display device
KR101761966B1 (en) 2010-03-31 2017-07-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Power supply device and driving method thereof
WO2011122312A1 (en) 2010-03-31 2011-10-06 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method for driving the same
KR20130032304A (en) 2010-04-02 2013-04-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US9196739B2 (en) 2010-04-02 2015-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor film and metal oxide film
US9147768B2 (en) 2010-04-02 2015-09-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an oxide semiconductor and a metal oxide film
US8884282B2 (en) 2010-04-02 2014-11-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN106098788B (en) 2010-04-02 2020-10-16 株式会社半导体能源研究所 Semiconductor device with a plurality of semiconductor chips
US9190522B2 (en) 2010-04-02 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an oxide semiconductor
WO2011125432A1 (en) 2010-04-07 2011-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
WO2011125453A1 (en) 2010-04-07 2011-10-13 Semiconductor Energy Laboratory Co., Ltd. Transistor
WO2011125455A1 (en) 2010-04-09 2011-10-13 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor memory device
WO2011125806A1 (en) 2010-04-09 2011-10-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
CN102834861B (en) 2010-04-09 2016-02-10 株式会社半导体能源研究所 The method of liquid crystal display and this liquid crystal display of driving
WO2011125456A1 (en) 2010-04-09 2011-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8653514B2 (en) 2010-04-09 2014-02-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8207025B2 (en) 2010-04-09 2012-06-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
WO2011125454A1 (en) 2010-04-09 2011-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5744366B2 (en) 2010-04-12 2015-07-08 株式会社半導体エネルギー研究所 Liquid crystal display
US8854583B2 (en) 2010-04-12 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and liquid crystal display device
KR101904445B1 (en) 2010-04-16 2018-10-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US8552712B2 (en) 2010-04-16 2013-10-08 Semiconductor Energy Laboratory Co., Ltd. Current measurement method, inspection method of semiconductor device, semiconductor device, and test element group
WO2011129456A1 (en) 2010-04-16 2011-10-20 Semiconductor Energy Laboratory Co., Ltd. Deposition method and method for manufacturing semiconductor device
WO2011129209A1 (en) 2010-04-16 2011-10-20 Semiconductor Energy Laboratory Co., Ltd. Power source circuit
US8692243B2 (en) 2010-04-20 2014-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2011132555A1 (en) 2010-04-23 2011-10-27 Semiconductor Energy Laboratory Co., Ltd. Display device and driving method thereof
DE112011101410B4 (en) 2010-04-23 2018-03-01 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor device
KR20130055607A (en) 2010-04-23 2013-05-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing method of semiconductor device
US9537043B2 (en) 2010-04-23 2017-01-03 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and manufacturing method thereof
CN117410348A (en) 2010-04-23 2024-01-16 株式会社半导体能源研究所 Method for manufacturing semiconductor device and transistor
KR101754380B1 (en) 2010-04-23 2017-07-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
WO2011132591A1 (en) 2010-04-23 2011-10-27 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
CN104465408B (en) 2010-04-23 2017-09-15 株式会社半导体能源研究所 The manufacture method of semiconductor device and semiconductor device
WO2011135999A1 (en) 2010-04-27 2011-11-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US9697788B2 (en) 2010-04-28 2017-07-04 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
WO2011136018A1 (en) 2010-04-28 2011-11-03 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and electronic appliance
KR101831147B1 (en) 2010-04-28 2018-02-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor display device and driving method the same
WO2011135987A1 (en) 2010-04-28 2011-11-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8890555B2 (en) 2010-04-28 2014-11-18 Semiconductor Energy Laboratory Co., Ltd. Method for measuring transistor
US9349325B2 (en) 2010-04-28 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and electronic device
US9064473B2 (en) 2010-05-12 2015-06-23 Semiconductor Energy Laboratory Co., Ltd. Electro-optical display device and display method thereof
US9478185B2 (en) 2010-05-12 2016-10-25 Semiconductor Energy Laboratory Co., Ltd. Electro-optical display device and display method thereof
JP5797449B2 (en) 2010-05-13 2015-10-21 株式会社半導体エネルギー研究所 Semiconductor device evaluation method
KR101806271B1 (en) 2010-05-14 2017-12-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
US8664658B2 (en) 2010-05-14 2014-03-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI511236B (en) 2010-05-14 2015-12-01 Semiconductor Energy Lab Semiconductor device
WO2011142371A1 (en) 2010-05-14 2011-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8588000B2 (en) 2010-05-20 2013-11-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device having a reading transistor with a back-gate electrode
US9496405B2 (en) 2010-05-20 2016-11-15 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device including step of adding cation to oxide semiconductor layer
US9490368B2 (en) 2010-05-20 2016-11-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
US8416622B2 (en) 2010-05-20 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Driving method of a semiconductor device with an inverted period having a negative potential applied to a gate of an oxide semiconductor transistor
US8624239B2 (en) 2010-05-20 2014-01-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN102906881B (en) 2010-05-21 2016-02-10 株式会社半导体能源研究所 Semiconductor device
US8906756B2 (en) 2010-05-21 2014-12-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2011145707A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
JP5766012B2 (en) 2010-05-21 2015-08-19 株式会社半導体エネルギー研究所 Liquid crystal display
WO2011145484A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5852793B2 (en) 2010-05-21 2016-02-03 株式会社半導体エネルギー研究所 Method for manufacturing liquid crystal display device
WO2011145706A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
WO2011145633A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011145634A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8629438B2 (en) 2010-05-21 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5714973B2 (en) 2010-05-21 2015-05-07 株式会社半導体エネルギー研究所 Semiconductor device
WO2011145632A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
WO2011145537A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
WO2011145538A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2011145468A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
JP5749975B2 (en) 2010-05-28 2015-07-15 株式会社半導体エネルギー研究所 Photodetector and touch panel
US8895375B2 (en) 2010-06-01 2014-11-25 Semiconductor Energy Laboratory Co., Ltd. Field effect transistor and method for manufacturing the same
KR101894897B1 (en) 2010-06-04 2018-09-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011152286A1 (en) 2010-06-04 2011-12-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8779433B2 (en) 2010-06-04 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011152254A1 (en) 2010-06-04 2011-12-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011155295A1 (en) 2010-06-10 2011-12-15 Semiconductor Energy Laboratory Co., Ltd. Dc/dc converter, power supply circuit, and semiconductor device
US8610180B2 (en) 2010-06-11 2013-12-17 Semiconductor Energy Laboratory Co., Ltd. Gas sensor and method for manufacturing the gas sensor
WO2011155302A1 (en) 2010-06-11 2011-12-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101938726B1 (en) 2010-06-11 2019-01-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
US9209314B2 (en) 2010-06-16 2015-12-08 Semiconductor Energy Laboratory Co., Ltd. Field effect transistor
JP5823740B2 (en) 2010-06-16 2015-11-25 株式会社半導体エネルギー研究所 I / O device
JP5797471B2 (en) 2010-06-16 2015-10-21 株式会社半導体エネルギー研究所 I / O device
US8552425B2 (en) 2010-06-18 2013-10-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101862808B1 (en) 2010-06-18 2018-05-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
WO2011158704A1 (en) 2010-06-18 2011-12-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8637802B2 (en) 2010-06-18 2014-01-28 Semiconductor Energy Laboratory Co., Ltd. Photosensor, semiconductor device including photosensor, and light measurement method using photosensor
WO2011162147A1 (en) 2010-06-23 2011-12-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20120000499A (en) 2010-06-25 2012-01-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Transistor and semiconductor device
WO2011162104A1 (en) 2010-06-25 2011-12-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving the same
KR101746197B1 (en) 2010-06-25 2017-06-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing method and test method of semiconductor device
US9437454B2 (en) 2010-06-29 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Wiring board, semiconductor device, and manufacturing methods thereof
WO2012002104A1 (en) 2010-06-30 2012-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101350751B1 (en) 2010-07-01 2014-01-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Driving method of liquid crystal display device
US8441010B2 (en) 2010-07-01 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9473714B2 (en) 2010-07-01 2016-10-18 Semiconductor Energy Laboratory Co., Ltd. Solid-state imaging device and semiconductor display device
JP5792524B2 (en) 2010-07-02 2015-10-14 株式会社半導体エネルギー研究所 apparatus
CN107195686B (en) 2010-07-02 2021-02-09 株式会社半导体能源研究所 Semiconductor device with a plurality of semiconductor chips
TWI541782B (en) 2010-07-02 2016-07-11 半導體能源研究所股份有限公司 Liquid crystal display device
US8605059B2 (en) 2010-07-02 2013-12-10 Semiconductor Energy Laboratory Co., Ltd. Input/output device and driving method thereof
US9336739B2 (en) 2010-07-02 2016-05-10 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
WO2012002197A1 (en) 2010-07-02 2012-01-05 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
KR20130030295A (en) 2010-07-02 2013-03-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
US8642380B2 (en) 2010-07-02 2014-02-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
WO2012002186A1 (en) 2010-07-02 2012-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8785241B2 (en) 2010-07-16 2014-07-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2012008390A1 (en) 2010-07-16 2012-01-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2012008304A1 (en) 2010-07-16 2012-01-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101859361B1 (en) 2010-07-16 2018-05-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP5917035B2 (en) 2010-07-26 2016-05-11 株式会社半導体エネルギー研究所 Semiconductor device
KR20180088759A (en) 2010-07-27 2018-08-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method of manufacturing the same
WO2012014790A1 (en) 2010-07-27 2012-02-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI565001B (en) 2010-07-28 2017-01-01 半導體能源研究所股份有限公司 Semiconductor device and method for driving the same
JP5846789B2 (en) 2010-07-29 2016-01-20 株式会社半導体エネルギー研究所 Semiconductor device
WO2012014786A1 (en) 2010-07-30 2012-02-02 Semiconductor Energy Laboratory Co., Ltd. Semicondcutor device and manufacturing method thereof
US8928466B2 (en) 2010-08-04 2015-01-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8537600B2 (en) 2010-08-04 2013-09-17 Semiconductor Energy Laboratory Co., Ltd. Low off-state leakage current semiconductor memory device
KR101842181B1 (en) 2010-08-04 2018-03-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP5739257B2 (en) 2010-08-05 2015-06-24 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US8467231B2 (en) 2010-08-06 2013-06-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
TWI555128B (en) 2010-08-06 2016-10-21 半導體能源研究所股份有限公司 Semiconductor device and driving method thereof
TWI688047B (en) 2010-08-06 2020-03-11 半導體能源研究所股份有限公司 Semiconductor device
TWI545587B (en) 2010-08-06 2016-08-11 半導體能源研究所股份有限公司 Semiconductor device and method for driving semiconductor device
US8467232B2 (en) 2010-08-06 2013-06-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5832181B2 (en) 2010-08-06 2015-12-16 株式会社半導体エネルギー研究所 Liquid crystal display
US8803164B2 (en) 2010-08-06 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Solid-state image sensing device and semiconductor display device
US8792284B2 (en) 2010-08-06 2014-07-29 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor memory device
JP5671418B2 (en) 2010-08-06 2015-02-18 株式会社半導体エネルギー研究所 Driving method of semiconductor device
KR101925159B1 (en) 2010-08-06 2018-12-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR101809105B1 (en) 2010-08-06 2017-12-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor integrated circuit
US8582348B2 (en) 2010-08-06 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving semiconductor device
US8422272B2 (en) 2010-08-06 2013-04-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
TWI509707B (en) 2010-08-16 2015-11-21 Semiconductor Energy Lab Manufacturing method of semiconductor device
JP5848912B2 (en) 2010-08-16 2016-01-27 株式会社半導体エネルギー研究所 Control circuit for liquid crystal display device, liquid crystal display device, and electronic apparatus including the liquid crystal display device
US9129703B2 (en) 2010-08-16 2015-09-08 Semiconductor Energy Laboratory Co., Ltd. Method for driving semiconductor memory device
US9343480B2 (en) 2010-08-16 2016-05-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI508294B (en) 2010-08-19 2015-11-11 Semiconductor Energy Lab Semiconductor device
US8759820B2 (en) 2010-08-20 2014-06-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8685787B2 (en) 2010-08-25 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US8508276B2 (en) 2010-08-25 2013-08-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including latch circuit
US8883555B2 (en) 2010-08-25 2014-11-11 Semiconductor Energy Laboratory Co., Ltd. Electronic device, manufacturing method of electronic device, and sputtering target
JP2013009285A (en) 2010-08-26 2013-01-10 Semiconductor Energy Lab Co Ltd Signal processing circuit and method of driving the same
JP5727892B2 (en) 2010-08-26 2015-06-03 株式会社半導体エネルギー研究所 Semiconductor device
US9058047B2 (en) 2010-08-26 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101979758B1 (en) 2010-08-27 2019-05-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Memory device and semiconductor device
US8603841B2 (en) 2010-08-27 2013-12-10 Semiconductor Energy Laboratory Co., Ltd. Manufacturing methods of semiconductor device and light-emitting display device
US8592261B2 (en) 2010-08-27 2013-11-26 Semiconductor Energy Laboratory Co., Ltd. Method for designing semiconductor device
US8450123B2 (en) 2010-08-27 2013-05-28 Semiconductor Energy Laboratory Co., Ltd. Oxygen diffusion evaluation method of oxide film stacked body
JP5674594B2 (en) 2010-08-27 2015-02-25 株式会社半導体エネルギー研究所 Semiconductor device and driving method of semiconductor device
JP5763474B2 (en) 2010-08-27 2015-08-12 株式会社半導体エネルギー研究所 Optical sensor
JP5806043B2 (en) 2010-08-27 2015-11-10 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP5702689B2 (en) 2010-08-31 2015-04-15 株式会社半導体エネルギー研究所 Semiconductor device driving method and semiconductor device
US8634228B2 (en) 2010-09-02 2014-01-21 Semiconductor Energy Laboratory Co., Ltd. Driving method of semiconductor device
US8575610B2 (en) 2010-09-02 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving the same
WO2012029596A1 (en) 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2012029638A1 (en) 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20130102581A (en) 2010-09-03 2013-09-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Field effect transistor and method for manufacturing semiconductor device
KR20130099074A (en) 2010-09-03 2013-09-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Sputtering target and method for manufacturing semiconductor device
JP2012256819A (en) 2010-09-08 2012-12-27 Semiconductor Energy Lab Co Ltd Semiconductor device
US8520426B2 (en) 2010-09-08 2013-08-27 Semiconductor Energy Laboratory Co., Ltd. Method for driving semiconductor device
US8487844B2 (en) 2010-09-08 2013-07-16 Semiconductor Energy Laboratory Co., Ltd. EL display device and electronic device including the same
US8797487B2 (en) 2010-09-10 2014-08-05 Semiconductor Energy Laboratory Co., Ltd. Transistor, liquid crystal display device, and manufacturing method thereof
KR20120026970A (en) 2010-09-10 2012-03-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and light-emitting device
KR101824125B1 (en) 2010-09-10 2018-02-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
US9142568B2 (en) 2010-09-10 2015-09-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting display device
US8766253B2 (en) 2010-09-10 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8871565B2 (en) 2010-09-13 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8546161B2 (en) 2010-09-13 2013-10-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor and liquid crystal display device
JP5815337B2 (en) 2010-09-13 2015-11-17 株式会社半導体エネルギー研究所 Semiconductor device
US8558960B2 (en) 2010-09-13 2013-10-15 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method for manufacturing the same
US9546416B2 (en) 2010-09-13 2017-01-17 Semiconductor Energy Laboratory Co., Ltd. Method of forming crystalline oxide semiconductor film
JP5827520B2 (en) 2010-09-13 2015-12-02 株式会社半導体エネルギー研究所 Semiconductor memory device
TWI543166B (en) 2010-09-13 2016-07-21 半導體能源研究所股份有限公司 Semiconductor device
US9496743B2 (en) 2010-09-13 2016-11-15 Semiconductor Energy Laboratory Co., Ltd. Power receiving device and wireless power feed system
US8664097B2 (en) 2010-09-13 2014-03-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
KR101952235B1 (en) 2010-09-13 2019-02-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
US8835917B2 (en) 2010-09-13 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, power diode, and rectifier
US8592879B2 (en) 2010-09-13 2013-11-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR101932576B1 (en) 2010-09-13 2018-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP2012256821A (en) 2010-09-13 2012-12-27 Semiconductor Energy Lab Co Ltd Memory device
KR101872926B1 (en) 2010-09-13 2018-06-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US8647919B2 (en) 2010-09-13 2014-02-11 Semiconductor Energy Laboratory Co., Ltd. Light-emitting display device and method for manufacturing the same
TWI539453B (en) 2010-09-14 2016-06-21 半導體能源研究所股份有限公司 Memory device and semiconductor device
WO2012035984A1 (en) 2010-09-15 2012-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
JP2012256012A (en) 2010-09-15 2012-12-27 Semiconductor Energy Lab Co Ltd Display device
KR20130106398A (en) 2010-09-15 2013-09-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Liquid crystal display device and manufacturing method thereof
US9230994B2 (en) 2010-09-15 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
US8767443B2 (en) 2010-09-22 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and method for inspecting the same
KR101856722B1 (en) 2010-09-22 2018-05-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Power-insulated-gate field-effect transistor
US8792260B2 (en) 2010-09-27 2014-07-29 Semiconductor Energy Laboratory Co., Ltd. Rectifier circuit and semiconductor device using the same
TWI574259B (en) 2010-09-29 2017-03-11 半導體能源研究所股份有限公司 Semiconductor memory device and method for driving the same
TWI620176B (en) 2010-10-05 2018-04-01 半導體能源研究所股份有限公司 Semiconductor memory device and driving method thereof
US9437743B2 (en) 2010-10-07 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Thin film element, semiconductor device, and method for manufacturing the same
US8716646B2 (en) 2010-10-08 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method for operating the same
US8679986B2 (en) 2010-10-14 2014-03-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
US8546892B2 (en) 2010-10-20 2013-10-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8803143B2 (en) 2010-10-20 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor including buffer layers with high resistivity
TWI543158B (en) 2010-10-25 2016-07-21 半導體能源研究所股份有限公司 Semiconductor memory device and driving method thereof
KR101924231B1 (en) 2010-10-29 2018-11-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor memory device
JP5771505B2 (en) 2010-10-29 2015-09-02 株式会社半導体エネルギー研究所 Receiver circuit
KR101952456B1 (en) 2010-10-29 2019-02-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Storage device
CN103313993A (en) 2010-11-02 2013-09-18 宇部兴产株式会社 (Amide amino alkane) metal compound, method of manufacturing metal-containing thin film by using said metal compound
US8916866B2 (en) 2010-11-03 2014-12-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8569754B2 (en) 2010-11-05 2013-10-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9087744B2 (en) 2010-11-05 2015-07-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving transistor
CN103201831B (en) 2010-11-05 2015-08-05 株式会社半导体能源研究所 Semiconductor device
US8957468B2 (en) 2010-11-05 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Variable capacitor and liquid crystal display device
WO2012060253A1 (en) 2010-11-05 2012-05-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI555205B (en) 2010-11-05 2016-10-21 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
JP6010291B2 (en) 2010-11-05 2016-10-19 株式会社半導体エネルギー研究所 Driving method of display device
US8902637B2 (en) 2010-11-08 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device comprising inverting amplifier circuit and driving method thereof
TWI535014B (en) 2010-11-11 2016-05-21 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
JP5770068B2 (en) 2010-11-12 2015-08-26 株式会社半導体エネルギー研究所 Semiconductor device
US8854865B2 (en) 2010-11-24 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US8936965B2 (en) 2010-11-26 2015-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI562379B (en) 2010-11-30 2016-12-11 Semiconductor Energy Lab Co Ltd Semiconductor device and method for manufacturing semiconductor device
US8629496B2 (en) 2010-11-30 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8816425B2 (en) 2010-11-30 2014-08-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9103724B2 (en) 2010-11-30 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising photosensor comprising oxide semiconductor, method for driving the semiconductor device, method for driving the photosensor, and electronic device
US8809852B2 (en) 2010-11-30 2014-08-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor film, semiconductor element, semiconductor device, and method for manufacturing the same
US8823092B2 (en) 2010-11-30 2014-09-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8461630B2 (en) 2010-12-01 2013-06-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR20240025046A (en) 2010-12-03 2024-02-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Oxide semiconductor film and semiconductor device
TWI632551B (en) 2010-12-03 2018-08-11 半導體能源研究所股份有限公司 Integrated circuit, method for driving the same, and semiconductor device
JP5908263B2 (en) 2010-12-03 2016-04-26 株式会社半導体エネルギー研究所 DC-DC converter
US8957462B2 (en) 2010-12-09 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an N-type transistor with an N-type semiconductor containing nitrogen as a gate
TWI534905B (en) 2010-12-10 2016-05-21 半導體能源研究所股份有限公司 Display device and method for manufacturing the same
JP2012256020A (en) 2010-12-15 2012-12-27 Semiconductor Energy Lab Co Ltd Semiconductor device and driving method for the same
US9202822B2 (en) 2010-12-17 2015-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8730416B2 (en) 2010-12-17 2014-05-20 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
US8894825B2 (en) 2010-12-17 2014-11-25 Semiconductor Energy Laboratory Co., Ltd. Sputtering target, method for manufacturing the same, manufacturing semiconductor device
JP2012142562A (en) 2010-12-17 2012-07-26 Semiconductor Energy Lab Co Ltd Semiconductor memory device
US9024317B2 (en) 2010-12-24 2015-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor circuit, method for driving the same, storage device, register circuit, display device, and electronic device
JP5993141B2 (en) 2010-12-28 2016-09-14 株式会社半導体エネルギー研究所 Storage device
KR101981808B1 (en) 2010-12-28 2019-08-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP5864054B2 (en) 2010-12-28 2016-02-17 株式会社半導体エネルギー研究所 Semiconductor device
JP5852874B2 (en) 2010-12-28 2016-02-03 株式会社半導体エネルギー研究所 Semiconductor device
US9048142B2 (en) 2010-12-28 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5784479B2 (en) 2010-12-28 2015-09-24 株式会社半導体エネルギー研究所 Semiconductor device
WO2012090799A1 (en) 2010-12-28 2012-07-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9443984B2 (en) 2010-12-28 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5973165B2 (en) 2010-12-28 2016-08-23 株式会社半導体エネルギー研究所 Semiconductor device
JP2012151453A (en) 2010-12-28 2012-08-09 Semiconductor Energy Lab Co Ltd Semiconductor device and driving method of the same
WO2012090973A1 (en) 2010-12-28 2012-07-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5975635B2 (en) 2010-12-28 2016-08-23 株式会社半導体エネルギー研究所 Semiconductor device
JP6030298B2 (en) 2010-12-28 2016-11-24 株式会社半導体エネルギー研究所 Buffer storage device and signal processing circuit
TWI525614B (en) 2011-01-05 2016-03-11 半導體能源研究所股份有限公司 Storage element, storage device, and signal processing circuit
JP5977523B2 (en) 2011-01-12 2016-08-24 株式会社半導体エネルギー研究所 Method for manufacturing transistor
JP5982125B2 (en) 2011-01-12 2016-08-31 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US8536571B2 (en) 2011-01-12 2013-09-17 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
TWI570809B (en) 2011-01-12 2017-02-11 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
TWI535032B (en) 2011-01-12 2016-05-21 半導體能源研究所股份有限公司 Method for manufacturing semiconductor device
US8421071B2 (en) 2011-01-13 2013-04-16 Semiconductor Energy Laboratory Co., Ltd. Memory device
US8575678B2 (en) 2011-01-13 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device with floating gate
JP5859839B2 (en) 2011-01-14 2016-02-16 株式会社半導体エネルギー研究所 Storage element driving method and storage element
TWI619230B (en) 2011-01-14 2018-03-21 半導體能源研究所股份有限公司 Semiconductor memory device
KR102026718B1 (en) 2011-01-14 2019-09-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Memory device, semiconductor device, and detecting method
JP5897910B2 (en) 2011-01-20 2016-04-06 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP5798933B2 (en) 2011-01-26 2015-10-21 株式会社半導体エネルギー研究所 Signal processing circuit
TWI570920B (en) 2011-01-26 2017-02-11 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
TWI552345B (en) 2011-01-26 2016-10-01 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
WO2012102183A1 (en) 2011-01-26 2012-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI539597B (en) 2011-01-26 2016-06-21 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
US9601178B2 (en) 2011-01-26 2017-03-21 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
WO2012102182A1 (en) 2011-01-26 2012-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20190007525A (en) 2011-01-27 2019-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TWI525619B (en) 2011-01-27 2016-03-11 半導體能源研究所股份有限公司 Memory circuit
WO2012102281A1 (en) 2011-01-28 2012-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8634230B2 (en) 2011-01-28 2014-01-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving the same
US9494829B2 (en) 2011-01-28 2016-11-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and liquid crystal display device containing the same
DE112012000601T5 (en) 2011-01-28 2014-01-30 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor device and semiconductor device
JP6000560B2 (en) 2011-02-02 2016-09-28 株式会社半導体エネルギー研究所 Semiconductor memory device
US9799773B2 (en) 2011-02-02 2017-10-24 Semiconductor Energy Laboratory Co., Ltd. Transistor and semiconductor device
US8513773B2 (en) 2011-02-02 2013-08-20 Semiconductor Energy Laboratory Co., Ltd. Capacitor and semiconductor device including dielectric and N-type semiconductor
TWI520273B (en) 2011-02-02 2016-02-01 半導體能源研究所股份有限公司 Semiconductor memory device
US9431400B2 (en) 2011-02-08 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and method for manufacturing the same
US8787083B2 (en) 2011-02-10 2014-07-22 Semiconductor Energy Laboratory Co., Ltd. Memory circuit
US9167234B2 (en) 2011-02-14 2015-10-20 Semiconductor Energy Laboratory Co., Ltd. Display device
KR101899880B1 (en) 2011-02-17 2018-09-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Programmable lsi
US8975680B2 (en) 2011-02-17 2015-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and method manufacturing semiconductor memory device
US8643007B2 (en) 2011-02-23 2014-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8709920B2 (en) 2011-02-24 2014-04-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9443455B2 (en) 2011-02-25 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Display device having a plurality of pixels
US9691772B2 (en) 2011-03-03 2017-06-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device including memory cell which includes transistor and capacitor
US9023684B2 (en) 2011-03-04 2015-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8659015B2 (en) 2011-03-04 2014-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8841664B2 (en) 2011-03-04 2014-09-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8785933B2 (en) 2011-03-04 2014-07-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5898527B2 (en) 2011-03-04 2016-04-06 株式会社半導体エネルギー研究所 Semiconductor device
US9646829B2 (en) 2011-03-04 2017-05-09 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US8659957B2 (en) 2011-03-07 2014-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving semiconductor device
JP5827145B2 (en) 2011-03-08 2015-12-02 株式会社半導体エネルギー研究所 Signal processing circuit
US8625085B2 (en) 2011-03-08 2014-01-07 Semiconductor Energy Laboratory Co., Ltd. Defect evaluation method for semiconductor
US9099437B2 (en) 2011-03-08 2015-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8772849B2 (en) 2011-03-10 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US8541781B2 (en) 2011-03-10 2013-09-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2012121265A1 (en) 2011-03-10 2012-09-13 Semiconductor Energy Laboratory Co., Ltd. Memory device and method for manufacturing the same
US8760903B2 (en) 2011-03-11 2014-06-24 Semiconductor Energy Laboratory Co., Ltd. Storage circuit
TWI521612B (en) 2011-03-11 2016-02-11 半導體能源研究所股份有限公司 Method of manufacturing semiconductor device
JP2012209543A (en) 2011-03-11 2012-10-25 Semiconductor Energy Lab Co Ltd Semiconductor device
TWI624878B (en) 2011-03-11 2018-05-21 半導體能源研究所股份有限公司 Method of manufacturing semiconductor device
JP5933300B2 (en) 2011-03-16 2016-06-08 株式会社半導体エネルギー研究所 Semiconductor device
JP5933897B2 (en) 2011-03-18 2016-06-15 株式会社半導体エネルギー研究所 Semiconductor device
KR101900525B1 (en) 2011-03-18 2018-09-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Oxide semiconductor film, semiconductor device, and manufacturing method of semiconductor device
US8859330B2 (en) 2011-03-23 2014-10-14 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5839474B2 (en) 2011-03-24 2016-01-06 株式会社半導体エネルギー研究所 Signal processing circuit
US9219159B2 (en) 2011-03-25 2015-12-22 Semiconductor Energy Laboratory Co., Ltd. Method for forming oxide semiconductor film and method for manufacturing semiconductor device
TWI627756B (en) 2011-03-25 2018-06-21 半導體能源研究所股份有限公司 Field-effect transistor, and memory and semiconductor circuit including the same
US9012904B2 (en) 2011-03-25 2015-04-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8956944B2 (en) 2011-03-25 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TWI545652B (en) 2011-03-25 2016-08-11 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
US8686416B2 (en) 2011-03-25 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US8987728B2 (en) 2011-03-25 2015-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
JP6053098B2 (en) 2011-03-28 2016-12-27 株式会社半導体エネルギー研究所 Semiconductor device
US8927329B2 (en) 2011-03-30 2015-01-06 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing oxide semiconductor device with improved electronic properties
JP5879165B2 (en) 2011-03-30 2016-03-08 株式会社半導体エネルギー研究所 Semiconductor device
US8686486B2 (en) 2011-03-31 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Memory device
US9082860B2 (en) 2011-03-31 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI567735B (en) 2011-03-31 2017-01-21 半導體能源研究所股份有限公司 Memory circuit, memory unit, and signal processing circuit
JP5982147B2 (en) 2011-04-01 2016-08-31 株式会社半導体エネルギー研究所 Light emitting device
US8541266B2 (en) 2011-04-01 2013-09-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9960278B2 (en) 2011-04-06 2018-05-01 Yuhei Sato Manufacturing method of semiconductor device
US9012905B2 (en) 2011-04-08 2015-04-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including transistor comprising oxide semiconductor and method for manufacturing the same
US9093538B2 (en) 2011-04-08 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2012256406A (en) 2011-04-08 2012-12-27 Semiconductor Energy Lab Co Ltd Memory device and semiconductor device using the same
US9142320B2 (en) 2011-04-08 2015-09-22 Semiconductor Energy Laboratory Co., Ltd. Memory element and signal processing circuit
US9478668B2 (en) 2011-04-13 2016-10-25 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US8854867B2 (en) 2011-04-13 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Memory device and driving method of the memory device
JP5883699B2 (en) 2011-04-13 2016-03-15 株式会社半導体エネルギー研究所 Programmable LSI
US8878270B2 (en) 2011-04-15 2014-11-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
JP5890234B2 (en) 2011-04-15 2016-03-22 株式会社半導体エネルギー研究所 Semiconductor device and driving method thereof
US8878174B2 (en) 2011-04-15 2014-11-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, memory circuit, integrated circuit, and driving method of the integrated circuit
US8779488B2 (en) 2011-04-15 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
JP6001900B2 (en) 2011-04-21 2016-10-05 株式会社半導体エネルギー研究所 Signal processing circuit
US8878288B2 (en) 2011-04-22 2014-11-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9331206B2 (en) 2011-04-22 2016-05-03 Semiconductor Energy Laboratory Co., Ltd. Oxide material and semiconductor device
US10079053B2 (en) 2011-04-22 2018-09-18 Semiconductor Energy Laboratory Co., Ltd. Memory element and memory device
US8932913B2 (en) 2011-04-22 2015-01-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US8941958B2 (en) 2011-04-22 2015-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5946683B2 (en) 2011-04-22 2016-07-06 株式会社半導体エネルギー研究所 Semiconductor device
US8916868B2 (en) 2011-04-22 2014-12-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9006803B2 (en) 2011-04-22 2015-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing thereof
US8809854B2 (en) 2011-04-22 2014-08-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN102760697B (en) 2011-04-27 2016-08-03 株式会社半导体能源研究所 The manufacture method of semiconductor device
KR101919056B1 (en) 2011-04-28 2018-11-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor circuit
US8681533B2 (en) 2011-04-28 2014-03-25 Semiconductor Energy Laboratory Co., Ltd. Memory circuit, signal processing circuit, and electronic device
US8729545B2 (en) 2011-04-28 2014-05-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US9935622B2 (en) 2011-04-28 2018-04-03 Semiconductor Energy Laboratory Co., Ltd. Comparator and semiconductor device including comparator
TWI525615B (en) 2011-04-29 2016-03-11 半導體能源研究所股份有限公司 Semiconductor storage device
KR101963457B1 (en) 2011-04-29 2019-03-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and driving method thereof
US9614094B2 (en) 2011-04-29 2017-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor layer and method for driving the same
US8785923B2 (en) 2011-04-29 2014-07-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8476927B2 (en) 2011-04-29 2013-07-02 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device
US8446171B2 (en) 2011-04-29 2013-05-21 Semiconductor Energy Laboratory Co., Ltd. Signal processing unit
US9111795B2 (en) 2011-04-29 2015-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with capacitor connected to memory element through oxide semiconductor film
US8848464B2 (en) 2011-04-29 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving semiconductor device
TW202230814A (en) 2011-05-05 2022-08-01 日商半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
WO2012153473A1 (en) 2011-05-06 2012-11-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8809928B2 (en) 2011-05-06 2014-08-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, and method for manufacturing the semiconductor device
US9117701B2 (en) 2011-05-06 2015-08-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8709922B2 (en) 2011-05-06 2014-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI568181B (en) 2011-05-06 2017-01-21 半導體能源研究所股份有限公司 Logic circuit and semiconductor device
KR101874144B1 (en) 2011-05-06 2018-07-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor memory device
US9443844B2 (en) 2011-05-10 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Gain cell semiconductor memory device and driving method thereof
US8946066B2 (en) 2011-05-11 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
TWI541978B (en) 2011-05-11 2016-07-11 半導體能源研究所股份有限公司 Semiconductor device and method for driving semiconductor device
US8847233B2 (en) 2011-05-12 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a trenched insulating layer coated with an oxide semiconductor film
TWI557711B (en) 2011-05-12 2016-11-11 半導體能源研究所股份有限公司 Method for driving display device
US9048788B2 (en) 2011-05-13 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a photoelectric conversion portion
US9397222B2 (en) 2011-05-13 2016-07-19 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US9466618B2 (en) 2011-05-13 2016-10-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including two thin film transistors and method of manufacturing the same
US9093539B2 (en) 2011-05-13 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2012157463A1 (en) 2011-05-13 2012-11-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8564331B2 (en) 2011-05-13 2013-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9105749B2 (en) 2011-05-13 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6013773B2 (en) 2011-05-13 2016-10-25 株式会社半導体エネルギー研究所 Semiconductor device
JP6109489B2 (en) 2011-05-13 2017-04-05 株式会社半導体エネルギー研究所 EL display device
TWI536502B (en) 2011-05-13 2016-06-01 半導體能源研究所股份有限公司 Memory circuit and electronic device
WO2012157472A1 (en) 2011-05-13 2012-11-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5886128B2 (en) 2011-05-13 2016-03-16 株式会社半導体エネルギー研究所 Semiconductor device
DE112012002113T5 (en) 2011-05-16 2014-02-13 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device
TWI570891B (en) 2011-05-17 2017-02-11 半導體能源研究所股份有限公司 Semiconductor device
US9673823B2 (en) 2011-05-18 2017-06-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving semiconductor device
TWI552150B (en) 2011-05-18 2016-10-01 半導體能源研究所股份有限公司 Semiconductor storage device
KR101991735B1 (en) 2011-05-19 2019-06-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor integrated circuit
US8709889B2 (en) 2011-05-19 2014-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and manufacturing method thereof
KR102093909B1 (en) 2011-05-19 2020-03-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Circuit and method of driving the same
US8779799B2 (en) 2011-05-19 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Logic circuit
US8837203B2 (en) 2011-05-19 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102081792B1 (en) 2011-05-19 2020-02-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Arithmetic circuit and method of driving the same
US8581625B2 (en) 2011-05-19 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device
JP6006975B2 (en) 2011-05-19 2016-10-12 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP5936908B2 (en) 2011-05-20 2016-06-22 株式会社半導体エネルギー研究所 Parity bit output circuit and parity check circuit
JP6030334B2 (en) 2011-05-20 2016-11-24 株式会社半導体エネルギー研究所 Storage device
JP6013682B2 (en) 2011-05-20 2016-10-25 株式会社半導体エネルギー研究所 Driving method of semiconductor device
JP5892852B2 (en) 2011-05-20 2016-03-23 株式会社半導体エネルギー研究所 Programmable logic device
JP5820335B2 (en) 2011-05-20 2015-11-24 株式会社半導体エネルギー研究所 Semiconductor device
TWI614995B (en) 2011-05-20 2018-02-11 半導體能源研究所股份有限公司 Phase locked loop and semiconductor device using the same
JP5951351B2 (en) 2011-05-20 2016-07-13 株式会社半導体エネルギー研究所 Adder and full adder
TWI557739B (en) 2011-05-20 2016-11-11 半導體能源研究所股份有限公司 Semiconductor integrated circuit
JP5820336B2 (en) 2011-05-20 2015-11-24 株式会社半導体エネルギー研究所 Semiconductor device
TWI570730B (en) 2011-05-20 2017-02-11 半導體能源研究所股份有限公司 Semiconductor device
JP5947099B2 (en) 2011-05-20 2016-07-06 株式会社半導体エネルギー研究所 Semiconductor device
JP6013680B2 (en) 2011-05-20 2016-10-25 株式会社半導体エネルギー研究所 Semiconductor device
JP5886496B2 (en) 2011-05-20 2016-03-16 株式会社半導体エネルギー研究所 Semiconductor device
TWI559683B (en) 2011-05-20 2016-11-21 半導體能源研究所股份有限公司 Semiconductor integrated circuit
JP6091083B2 (en) 2011-05-20 2017-03-08 株式会社半導体エネルギー研究所 Storage device
TWI573136B (en) 2011-05-20 2017-03-01 半導體能源研究所股份有限公司 Memory device and signal processing circuit
TWI616873B (en) 2011-05-20 2018-03-01 半導體能源研究所股份有限公司 Memory device and signal processing circuit
CN102789808B (en) 2011-05-20 2018-03-06 株式会社半导体能源研究所 Storage arrangement and the method for driving storage arrangement
US8508256B2 (en) 2011-05-20 2013-08-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor integrated circuit
WO2012160963A1 (en) 2011-05-20 2012-11-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2012161059A1 (en) 2011-05-20 2012-11-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving the same
US20120298998A1 (en) 2011-05-25 2012-11-29 Semiconductor Energy Laboratory Co., Ltd. Method for forming oxide semiconductor film, semiconductor device, and method for manufacturing semiconductor device
US9171840B2 (en) 2011-05-26 2015-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101912971B1 (en) 2011-05-26 2018-10-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Divider circuit and semiconductor device using the same
US8610482B2 (en) 2011-05-27 2013-12-17 Semiconductor Energy Laboratory Co., Ltd. Trimming circuit and method for driving trimming circuit
JP5912844B2 (en) 2011-05-31 2016-04-27 株式会社半導体エネルギー研究所 Programmable logic device
US9467047B2 (en) 2011-05-31 2016-10-11 Semiconductor Energy Laboratory Co., Ltd. DC-DC converter, power source circuit, and semiconductor device
US8669781B2 (en) 2011-05-31 2014-03-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5890251B2 (en) 2011-06-08 2016-03-22 株式会社半導体エネルギー研究所 Communication method
KR20180064565A (en) 2011-06-08 2018-06-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Sputtering target, method for manufacturing sputtering target, and method for forming thin film
JP2013016243A (en) 2011-06-09 2013-01-24 Semiconductor Energy Lab Co Ltd Memory device
US8891285B2 (en) 2011-06-10 2014-11-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US9112036B2 (en) 2011-06-10 2015-08-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
JP6104522B2 (en) 2011-06-10 2017-03-29 株式会社半導体エネルギー研究所 Semiconductor device
JP6005401B2 (en) 2011-06-10 2016-10-12 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US8958263B2 (en) 2011-06-10 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9299852B2 (en) 2011-06-16 2016-03-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8804405B2 (en) 2011-06-16 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
TWI557910B (en) 2011-06-16 2016-11-11 半導體能源研究所股份有限公司 Semiconductor device and a method for manufacturing the same
US9099885B2 (en) 2011-06-17 2015-08-04 Semiconductor Energy Laboratory Co., Ltd. Wireless power feeding system
KR20130007426A (en) 2011-06-17 2013-01-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
SG11201504734VA (en) 2011-06-17 2015-07-30 Semiconductor Energy Lab Semiconductor device and method for manufacturing the same
US9166055B2 (en) 2011-06-17 2015-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8901554B2 (en) 2011-06-17 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including channel formation region including oxide semiconductor
US8673426B2 (en) 2011-06-29 2014-03-18 Semiconductor Energy Laboratory Co., Ltd. Driver circuit, method of manufacturing the driver circuit, and display device including the driver circuit
US8878589B2 (en) 2011-06-30 2014-11-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
US9130044B2 (en) 2011-07-01 2015-09-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8952377B2 (en) 2011-07-08 2015-02-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9385238B2 (en) 2011-07-08 2016-07-05 Semiconductor Energy Laboratory Co., Ltd. Transistor using oxide semiconductor
KR102014876B1 (en) 2011-07-08 2019-08-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
TWI565067B (en) 2011-07-08 2017-01-01 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
US8748886B2 (en) 2011-07-08 2014-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9490241B2 (en) 2011-07-08 2016-11-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a first inverter and a second inverter
US9496138B2 (en) 2011-07-08 2016-11-15 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing oxide semiconductor film, method for manufacturing semiconductor device, and semiconductor device
US9214474B2 (en) 2011-07-08 2015-12-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8847220B2 (en) 2011-07-15 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2013042117A (en) 2011-07-15 2013-02-28 Semiconductor Energy Lab Co Ltd Semiconductor device
US9200952B2 (en) 2011-07-15 2015-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a photodetector and an analog arithmetic circuit
US8836626B2 (en) 2011-07-15 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving the same
US8946812B2 (en) 2011-07-21 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8716073B2 (en) 2011-07-22 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Method for processing oxide semiconductor film and method for manufacturing semiconductor device
US9012993B2 (en) 2011-07-22 2015-04-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102378948B1 (en) 2011-07-22 2022-03-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Light-emitting device
JP6013685B2 (en) 2011-07-22 2016-10-25 株式会社半導体エネルギー研究所 Semiconductor device
US8643008B2 (en) 2011-07-22 2014-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8994019B2 (en) 2011-08-05 2015-03-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8718224B2 (en) 2011-08-05 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Pulse signal output circuit and shift register
JP6006572B2 (en) 2011-08-18 2016-10-12 株式会社半導体エネルギー研究所 Semiconductor device
TWI575494B (en) 2011-08-19 2017-03-21 半導體能源研究所股份有限公司 Method for driving semiconductor device
JP6128775B2 (en) 2011-08-19 2017-05-17 株式会社半導体エネルギー研究所 Semiconductor device
JP6116149B2 (en) 2011-08-24 2017-04-19 株式会社半導体エネルギー研究所 Semiconductor device
WO2013033035A1 (en) * 2011-08-26 2013-03-07 Sumitomo Chemical Co., Ltd. Permeable electrodes for high performance organic electronic devices
TWI703708B (en) 2011-08-29 2020-09-01 日商半導體能源研究所股份有限公司 Semiconductor device
US9252279B2 (en) 2011-08-31 2016-02-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9660092B2 (en) 2011-08-31 2017-05-23 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor thin film transistor including oxygen release layer
JP6016532B2 (en) 2011-09-07 2016-10-26 株式会社半導体エネルギー研究所 Semiconductor device
JP6050054B2 (en) 2011-09-09 2016-12-21 株式会社半導体エネルギー研究所 Semiconductor device
US8802493B2 (en) 2011-09-13 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of oxide semiconductor device
JP5825744B2 (en) 2011-09-15 2015-12-02 株式会社半導体エネルギー研究所 Power insulated gate field effect transistor
US9082663B2 (en) 2011-09-16 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8952379B2 (en) 2011-09-16 2015-02-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5832399B2 (en) 2011-09-16 2015-12-16 株式会社半導体エネルギー研究所 Light emitting device
WO2013039126A1 (en) 2011-09-16 2013-03-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN103022012B (en) 2011-09-21 2017-03-01 株式会社半导体能源研究所 Semiconductor storage
WO2013042562A1 (en) 2011-09-22 2013-03-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2013042643A1 (en) 2011-09-22 2013-03-28 Semiconductor Energy Laboratory Co., Ltd. Photodetector and method for driving photodetector
US9431545B2 (en) 2011-09-23 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8841675B2 (en) 2011-09-23 2014-09-23 Semiconductor Energy Laboratory Co., Ltd. Minute transistor
KR102108572B1 (en) 2011-09-26 2020-05-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP2013084333A (en) 2011-09-28 2013-05-09 Semiconductor Energy Lab Co Ltd Shift register circuit
CN103843146B (en) 2011-09-29 2016-03-16 株式会社半导体能源研究所 Semiconductor device
US8716708B2 (en) 2011-09-29 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2013047629A1 (en) 2011-09-29 2013-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101506303B1 (en) 2011-09-29 2015-03-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP5806905B2 (en) 2011-09-30 2015-11-10 株式会社半導体エネルギー研究所 Semiconductor device
US8982607B2 (en) 2011-09-30 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Memory element and signal processing circuit
US20130087784A1 (en) 2011-10-05 2013-04-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6022880B2 (en) 2011-10-07 2016-11-09 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
JP2013093565A (en) 2011-10-07 2013-05-16 Semiconductor Energy Lab Co Ltd Semiconductor device
JP2013083758A (en) 2011-10-07 2013-05-09 Sony Corp Display device, method of manufacturing the same, and electronic unit
JP2013093561A (en) 2011-10-07 2013-05-16 Semiconductor Energy Lab Co Ltd Oxide semiconductor film and semiconductor device
US9018629B2 (en) 2011-10-13 2015-04-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8637864B2 (en) 2011-10-13 2014-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US9117916B2 (en) 2011-10-13 2015-08-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor film
JP5912394B2 (en) 2011-10-13 2016-04-27 株式会社半導体エネルギー研究所 Semiconductor device
JP6026839B2 (en) 2011-10-13 2016-11-16 株式会社半導体エネルギー研究所 Semiconductor device
US9287405B2 (en) 2011-10-13 2016-03-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor
KR20130040706A (en) 2011-10-14 2013-04-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method of manufacturing semiconductor device
KR20140074384A (en) 2011-10-14 2014-06-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR20130043063A (en) 2011-10-19 2013-04-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
TWI567985B (en) 2011-10-21 2017-01-21 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
KR101976212B1 (en) 2011-10-24 2019-05-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP6226518B2 (en) 2011-10-24 2017-11-08 株式会社半導体エネルギー研究所 Semiconductor device
JP6045285B2 (en) 2011-10-24 2016-12-14 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
KR20130046357A (en) 2011-10-27 2013-05-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP6082562B2 (en) 2011-10-27 2017-02-15 株式会社半導体エネルギー研究所 Semiconductor device
KR20140086954A (en) 2011-10-28 2014-07-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
KR102012981B1 (en) 2011-11-09 2019-08-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP5933895B2 (en) 2011-11-10 2016-06-15 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
JP6076038B2 (en) 2011-11-11 2017-02-08 株式会社半導体エネルギー研究所 Method for manufacturing display device
US8878177B2 (en) 2011-11-11 2014-11-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8796682B2 (en) 2011-11-11 2014-08-05 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
JP6122275B2 (en) 2011-11-11 2017-04-26 株式会社半導体エネルギー研究所 Display device
WO2013069548A1 (en) 2011-11-11 2013-05-16 Semiconductor Energy Laboratory Co., Ltd. Signal line driver circuit and liquid crystal display device
US9082861B2 (en) 2011-11-11 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Transistor with oxide semiconductor channel having protective layer
KR20130055521A (en) 2011-11-18 2013-05-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor element, method for manufacturing semiconductor element, and semiconductor device including semiconductor element
US8969130B2 (en) 2011-11-18 2015-03-03 Semiconductor Energy Laboratory Co., Ltd. Insulating film, formation method thereof, semiconductor device, and manufacturing method thereof
US8962386B2 (en) 2011-11-25 2015-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8772094B2 (en) 2011-11-25 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8829528B2 (en) 2011-11-25 2014-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including groove portion extending beyond pixel electrode
US8951899B2 (en) 2011-11-25 2015-02-10 Semiconductor Energy Laboratory Method for manufacturing semiconductor device
JP6099368B2 (en) 2011-11-25 2017-03-22 株式会社半導体エネルギー研究所 Storage device
US9057126B2 (en) 2011-11-29 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sputtering target and method for manufacturing semiconductor device
TWI591611B (en) 2011-11-30 2017-07-11 半導體能源研究所股份有限公司 Semiconductor display device
KR102072244B1 (en) 2011-11-30 2020-01-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
US20130137232A1 (en) 2011-11-30 2013-05-30 Semiconductor Energy Laboratory Co., Ltd. Method for forming oxide semiconductor film and method for manufacturing semiconductor device
US8956929B2 (en) 2011-11-30 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9076871B2 (en) 2011-11-30 2015-07-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN103137701B (en) 2011-11-30 2018-01-19 株式会社半导体能源研究所 Transistor and semiconductor device
TWI621183B (en) 2011-12-01 2018-04-11 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
US8981367B2 (en) 2011-12-01 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6050662B2 (en) 2011-12-02 2016-12-21 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
KR20140101817A (en) 2011-12-02 2014-08-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP2013137853A (en) 2011-12-02 2013-07-11 Semiconductor Energy Lab Co Ltd Storage device and driving method thereof
US9257422B2 (en) 2011-12-06 2016-02-09 Semiconductor Energy Laboratory Co., Ltd. Signal processing circuit and method for driving signal processing circuit
US9076505B2 (en) 2011-12-09 2015-07-07 Semiconductor Energy Laboratory Co., Ltd. Memory device
US10002968B2 (en) 2011-12-14 2018-06-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the same
JP6105266B2 (en) 2011-12-15 2017-03-29 株式会社半導体エネルギー研究所 Storage device
KR102084274B1 (en) 2011-12-15 2020-03-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
US8785258B2 (en) 2011-12-20 2014-07-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2013149953A (en) 2011-12-20 2013-08-01 Semiconductor Energy Lab Co Ltd Semiconductor device and method for manufacturing semiconductor device
US8748240B2 (en) 2011-12-22 2014-06-10 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8907392B2 (en) 2011-12-22 2014-12-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device including stacked sub memory cells
JP2013130802A (en) 2011-12-22 2013-07-04 Semiconductor Energy Lab Co Ltd Semiconductor device, image display device, storage device, and electronic apparatus
TWI569446B (en) 2011-12-23 2017-02-01 半導體能源研究所股份有限公司 Semiconductor element, method for manufacturing the semiconductor element, and semiconductor device including the semiconductor element
JP6012450B2 (en) 2011-12-23 2016-10-25 株式会社半導体エネルギー研究所 Driving method of semiconductor device
TWI580047B (en) 2011-12-23 2017-04-21 半導體能源研究所股份有限公司 Semiconductor device
WO2013094547A1 (en) 2011-12-23 2013-06-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6033071B2 (en) 2011-12-23 2016-11-30 株式会社半導体エネルギー研究所 Semiconductor device
JP6053490B2 (en) 2011-12-23 2016-12-27 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
TWI580189B (en) 2011-12-23 2017-04-21 半導體能源研究所股份有限公司 Level-shift circuit and semiconductor integrated circuit
US8704221B2 (en) 2011-12-23 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2013099537A1 (en) 2011-12-26 2013-07-04 Semiconductor Energy Laboratory Co., Ltd. Motion recognition device
TWI584383B (en) 2011-12-27 2017-05-21 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
KR102100425B1 (en) 2011-12-27 2020-04-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
KR102103913B1 (en) 2012-01-10 2020-04-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing semiconductor device
US8969867B2 (en) 2012-01-18 2015-03-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8836555B2 (en) 2012-01-18 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Circuit, sensor circuit, and semiconductor device using the sensor circuit
US9099560B2 (en) 2012-01-20 2015-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9040981B2 (en) 2012-01-20 2015-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102433736B1 (en) 2012-01-23 2022-08-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US9653614B2 (en) 2012-01-23 2017-05-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR102412138B1 (en) 2012-01-25 2022-06-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing semiconductor device
US9419146B2 (en) 2012-01-26 2016-08-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8956912B2 (en) 2012-01-26 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
TW201901972A (en) 2012-01-26 2019-01-01 日商半導體能源研究所股份有限公司 Semiconductor device and method of manufacturing semiconductor device
US9006733B2 (en) 2012-01-26 2015-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing thereof
JP6091905B2 (en) 2012-01-26 2017-03-08 株式会社半導体エネルギー研究所 Semiconductor device
TWI561951B (en) 2012-01-30 2016-12-11 Semiconductor Energy Lab Co Ltd Power supply circuit
TWI604609B (en) 2012-02-02 2017-11-01 半導體能源研究所股份有限公司 Semiconductor device
US9362417B2 (en) 2012-02-03 2016-06-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102101167B1 (en) 2012-02-03 2020-04-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US9196741B2 (en) 2012-02-03 2015-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8916424B2 (en) 2012-02-07 2014-12-23 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9859114B2 (en) 2012-02-08 2018-01-02 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor device with an oxygen-controlling insulating layer
US20130207111A1 (en) 2012-02-09 2013-08-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including semiconductor device, electronic device including semiconductor device, and method for manufacturing semiconductor device
JP6125850B2 (en) 2012-02-09 2017-05-10 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
US9112037B2 (en) 2012-02-09 2015-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5981157B2 (en) 2012-02-09 2016-08-31 株式会社半導体エネルギー研究所 Semiconductor device
US8817516B2 (en) 2012-02-17 2014-08-26 Semiconductor Energy Laboratory Co., Ltd. Memory circuit and semiconductor device
JP2014063557A (en) 2012-02-24 2014-04-10 Semiconductor Energy Lab Co Ltd Storage element and semiconductor element
US20130221345A1 (en) 2012-02-28 2013-08-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8988152B2 (en) 2012-02-29 2015-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6220526B2 (en) 2012-02-29 2017-10-25 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9312257B2 (en) 2012-02-29 2016-04-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6151530B2 (en) 2012-02-29 2017-06-21 株式会社半導体エネルギー研究所 Image sensor, camera, and surveillance system
US8975917B2 (en) 2012-03-01 2015-03-10 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device
JP6046514B2 (en) 2012-03-01 2016-12-14 株式会社半導体エネルギー研究所 Semiconductor device
JP2013183001A (en) 2012-03-01 2013-09-12 Semiconductor Energy Lab Co Ltd Semiconductor device
US9735280B2 (en) 2012-03-02 2017-08-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, and method for forming oxide film
US9176571B2 (en) 2012-03-02 2015-11-03 Semiconductor Energy Laboratories Co., Ltd. Microprocessor and method for driving microprocessor
US9287370B2 (en) 2012-03-02 2016-03-15 Semiconductor Energy Laboratory Co., Ltd. Memory device comprising a transistor including an oxide semiconductor and semiconductor device including the same
JP6100559B2 (en) 2012-03-05 2017-03-22 株式会社半導体エネルギー研究所 Semiconductor memory device
US8754693B2 (en) 2012-03-05 2014-06-17 Semiconductor Energy Laboratory Co., Ltd. Latch circuit and semiconductor device
US8995218B2 (en) 2012-03-07 2015-03-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8981370B2 (en) 2012-03-08 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2013133143A1 (en) 2012-03-09 2013-09-12 Semiconductor Energy Laboratory Co., Ltd. Method for driving semiconductor device
CN106504697B (en) 2012-03-13 2019-11-26 株式会社半导体能源研究所 Light emitting device and its driving method
KR102108248B1 (en) 2012-03-14 2020-05-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Oxide semiconductor film, transistor, and semiconductor device
US9058892B2 (en) 2012-03-14 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and shift register
US9117409B2 (en) 2012-03-14 2015-08-25 Semiconductor Energy Laboratory Co., Ltd. Light-emitting display device with transistor and capacitor discharging gate of driving electrode and oxide semiconductor layer
JP6168795B2 (en) 2012-03-14 2017-07-26 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9541386B2 (en) 2012-03-21 2017-01-10 Semiconductor Energy Laboratory Co., Ltd. Distance measurement device and distance measurement system
US9349849B2 (en) 2012-03-28 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device including the semiconductor device
US9324449B2 (en) 2012-03-28 2016-04-26 Semiconductor Energy Laboratory Co., Ltd. Driver circuit, signal processing unit having the driver circuit, method for manufacturing the signal processing unit, and display device
JP6169376B2 (en) 2012-03-28 2017-07-26 株式会社半導体エネルギー研究所 Battery management unit, protection circuit, power storage device
JP2013229013A (en) 2012-03-29 2013-11-07 Semiconductor Energy Lab Co Ltd Array controller and storage system
JP6139187B2 (en) 2012-03-29 2017-05-31 株式会社半導体エネルギー研究所 Semiconductor device
WO2013146154A1 (en) 2012-03-29 2013-10-03 Semiconductor Energy Laboratory Co., Ltd. Power supply control device
US9786793B2 (en) 2012-03-29 2017-10-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor layer including regions with different concentrations of resistance-reducing elements
US8941113B2 (en) 2012-03-30 2015-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, semiconductor device, and manufacturing method of semiconductor element
US8999773B2 (en) 2012-04-05 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Processing method of stacked-layer film and manufacturing method of semiconductor device
US9711110B2 (en) 2012-04-06 2017-07-18 Semiconductor Energy Laboratory Co., Ltd. Display device comprising grayscale conversion portion and display portion
US8901556B2 (en) 2012-04-06 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Insulating film, method for manufacturing semiconductor device, and semiconductor device
US9793444B2 (en) 2012-04-06 2017-10-17 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
JP2013232885A (en) 2012-04-06 2013-11-14 Semiconductor Energy Lab Co Ltd Semiconductor relay
JP5975907B2 (en) 2012-04-11 2016-08-23 株式会社半導体エネルギー研究所 Semiconductor device
US9208849B2 (en) 2012-04-12 2015-12-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving semiconductor device, and electronic device
JP2013236068A (en) 2012-04-12 2013-11-21 Semiconductor Energy Lab Co Ltd Semiconductor device and manufacturing method therefor
JP6128906B2 (en) 2012-04-13 2017-05-17 株式会社半導体エネルギー研究所 Semiconductor device
US9030232B2 (en) 2012-04-13 2015-05-12 Semiconductor Energy Laboratory Co., Ltd. Isolator circuit and semiconductor device
JP6059566B2 (en) 2012-04-13 2017-01-11 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
KR102254731B1 (en) 2012-04-13 2021-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP6143423B2 (en) 2012-04-16 2017-06-07 株式会社半導体エネルギー研究所 Manufacturing method of semiconductor device
JP6076612B2 (en) 2012-04-17 2017-02-08 株式会社半導体エネルギー研究所 Semiconductor device
JP6001308B2 (en) 2012-04-17 2016-10-05 株式会社半導体エネルギー研究所 Semiconductor device
US9029863B2 (en) 2012-04-20 2015-05-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9219164B2 (en) 2012-04-20 2015-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with oxide semiconductor channel
US9230683B2 (en) 2012-04-25 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
US9236408B2 (en) 2012-04-25 2016-01-12 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor device including photodiode
US9006024B2 (en) 2012-04-25 2015-04-14 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP6199583B2 (en) 2012-04-27 2017-09-20 株式会社半導体エネルギー研究所 Semiconductor device
US8860022B2 (en) 2012-04-27 2014-10-14 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US9285848B2 (en) 2012-04-27 2016-03-15 Semiconductor Energy Laboratory Co., Ltd. Power reception control device, power reception device, power transmission and reception system, and electronic device
US9331689B2 (en) 2012-04-27 2016-05-03 Semiconductor Energy Laboratory Co., Ltd. Power supply circuit and semiconductor device including the same
US9048323B2 (en) 2012-04-30 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6228381B2 (en) 2012-04-30 2017-11-08 株式会社半導体エネルギー研究所 Semiconductor device
JP6100071B2 (en) 2012-04-30 2017-03-22 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9703704B2 (en) 2012-05-01 2017-07-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8860023B2 (en) 2012-05-01 2014-10-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9007090B2 (en) 2012-05-01 2015-04-14 Semiconductor Energy Laboratory Co., Ltd. Method of driving semiconductor device
KR102025722B1 (en) 2012-05-02 2019-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Temperature sensor circuit and semiconductor device including temperature sensor circuit
JP6100076B2 (en) 2012-05-02 2017-03-22 株式会社半導体エネルギー研究所 Processor
JP6227890B2 (en) 2012-05-02 2017-11-08 株式会社半導体エネルギー研究所 Signal processing circuit and control circuit
US9261943B2 (en) 2012-05-02 2016-02-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
SG10201608665WA (en) 2012-05-02 2016-12-29 Semiconductor Energy Lab Co Ltd Programmable logic device
US8866510B2 (en) 2012-05-02 2014-10-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6243136B2 (en) 2012-05-02 2017-12-06 株式会社半導体エネルギー研究所 Switching converter
KR20130125717A (en) 2012-05-09 2013-11-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for driving the same
WO2013168687A1 (en) 2012-05-10 2013-11-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102069158B1 (en) 2012-05-10 2020-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for forming wiring, semiconductor device, and method for manufacturing semiconductor device
KR102173074B1 (en) 2012-05-10 2020-11-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR102087443B1 (en) 2012-05-11 2020-03-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and driving method of semiconductor device
DE102013022449B3 (en) 2012-05-11 2019-11-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US8994891B2 (en) 2012-05-16 2015-03-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and touch panel
US8929128B2 (en) 2012-05-17 2015-01-06 Semiconductor Energy Laboratory Co., Ltd. Storage device and writing method of the same
US9817032B2 (en) 2012-05-23 2017-11-14 Semiconductor Energy Laboratory Co., Ltd. Measurement device
JP2014003594A (en) 2012-05-25 2014-01-09 Semiconductor Energy Lab Co Ltd Semiconductor device and method of driving the same
JP6250955B2 (en) 2012-05-25 2017-12-20 株式会社半導体エネルギー研究所 Driving method of semiconductor device
WO2013176199A1 (en) 2012-05-25 2013-11-28 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device and semiconductor device
KR102164990B1 (en) 2012-05-25 2020-10-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for driving memory element
JP6050721B2 (en) 2012-05-25 2016-12-21 株式会社半導体エネルギー研究所 Semiconductor device
US9147706B2 (en) 2012-05-29 2015-09-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having sensor circuit having amplifier circuit
JP6377317B2 (en) 2012-05-30 2018-08-22 株式会社半導体エネルギー研究所 Programmable logic device
JP6208469B2 (en) 2012-05-31 2017-10-04 株式会社半導体エネルギー研究所 Semiconductor device
US8995607B2 (en) 2012-05-31 2015-03-31 Semiconductor Energy Laboratory Co., Ltd. Pulse signal output circuit and shift register
WO2013179922A1 (en) 2012-05-31 2013-12-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR102316107B1 (en) 2012-05-31 2021-10-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US9048265B2 (en) 2012-05-31 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device comprising oxide semiconductor layer
JP6158588B2 (en) 2012-05-31 2017-07-05 株式会社半導体エネルギー研究所 Light emitting device
US9916793B2 (en) 2012-06-01 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving the same
US9135182B2 (en) 2012-06-01 2015-09-15 Semiconductor Energy Laboratory Co., Ltd. Central processing unit and driving method thereof
JP6108960B2 (en) 2012-06-01 2017-04-05 株式会社半導体エネルギー研究所 Semiconductor devices and processing equipment
US8872174B2 (en) 2012-06-01 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
KR20150023547A (en) 2012-06-01 2015-03-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and alarm device
US9153699B2 (en) 2012-06-15 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor with multiple oxide semiconductor layers
US8901557B2 (en) 2012-06-15 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9059219B2 (en) 2012-06-27 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9742378B2 (en) 2012-06-29 2017-08-22 Semiconductor Energy Laboratory Co., Ltd. Pulse output circuit and semiconductor device
TWI596778B (en) 2012-06-29 2017-08-21 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing semiconductor device
DE112013003041T5 (en) 2012-06-29 2015-03-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102161077B1 (en) 2012-06-29 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US8873308B2 (en) 2012-06-29 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Signal processing circuit
KR102082794B1 (en) 2012-06-29 2020-02-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method of driving display device, and display device
US9054678B2 (en) 2012-07-06 2015-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
US9083327B2 (en) 2012-07-06 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving semiconductor device
US9190525B2 (en) 2012-07-06 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor layer
KR102099262B1 (en) 2012-07-11 2020-04-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Liquid crystal display device and method for driving the same
JP2014032399A (en) 2012-07-13 2014-02-20 Semiconductor Energy Lab Co Ltd Liquid crystal display device
JP6006558B2 (en) 2012-07-17 2016-10-12 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
KR102259916B1 (en) 2012-07-20 2021-06-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
JP6185311B2 (en) 2012-07-20 2017-08-23 株式会社半導体エネルギー研究所 Power supply control circuit and signal processing circuit
KR20230003262A (en) 2012-07-20 2023-01-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Liquid crystal display device
DE112013003609B4 (en) 2012-07-20 2017-04-27 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device that includes the display device
KR20140013931A (en) 2012-07-26 2014-02-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Liquid crystal display device
JP2014042004A (en) 2012-07-26 2014-03-06 Semiconductor Energy Lab Co Ltd Semiconductor device and manufacturing method of the same
JP6224931B2 (en) 2012-07-27 2017-11-01 株式会社半導体エネルギー研究所 Semiconductor device
JP2014045175A (en) 2012-08-02 2014-03-13 Semiconductor Energy Lab Co Ltd Semiconductor device
JP6134598B2 (en) 2012-08-02 2017-05-24 株式会社半導体エネルギー研究所 Semiconductor device
SG11201505225TA (en) 2012-08-03 2015-08-28 Semiconductor Energy Lab Oxide semiconductor stacked film and semiconductor device
CN108054175A (en) 2012-08-03 2018-05-18 株式会社半导体能源研究所 Semiconductor device
US10557192B2 (en) 2012-08-07 2020-02-11 Semiconductor Energy Laboratory Co., Ltd. Method for using sputtering target and method for forming oxide film
US9885108B2 (en) 2012-08-07 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Method for forming sputtering target
KR102099261B1 (en) 2012-08-10 2020-04-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
TWI581404B (en) 2012-08-10 2017-05-01 半導體能源研究所股份有限公司 Semiconductor device and method for driving semiconductor device
US9929276B2 (en) 2012-08-10 2018-03-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6220597B2 (en) 2012-08-10 2017-10-25 株式会社半導体エネルギー研究所 Semiconductor device
JP2014199899A (en) 2012-08-10 2014-10-23 株式会社半導体エネルギー研究所 Semiconductor device
US8937307B2 (en) 2012-08-10 2015-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9245958B2 (en) 2012-08-10 2016-01-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2014057296A (en) 2012-08-10 2014-03-27 Semiconductor Energy Lab Co Ltd Semiconductor device driving method
WO2014025002A1 (en) 2012-08-10 2014-02-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for fabricating the same
KR102171650B1 (en) 2012-08-10 2020-10-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
JP2014057298A (en) 2012-08-10 2014-03-27 Semiconductor Energy Lab Co Ltd Semiconductor device driving method
US8872120B2 (en) 2012-08-23 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Imaging device and method for driving the same
KR102069683B1 (en) 2012-08-24 2020-01-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Radiation detection panel, radiation imaging device, and diagnostic imaging device
DE102013216824A1 (en) 2012-08-28 2014-03-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102161078B1 (en) 2012-08-28 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and manufacturing method thereof
US9625764B2 (en) 2012-08-28 2017-04-18 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
KR20140029202A (en) 2012-08-28 2014-03-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
TWI611511B (en) 2012-08-31 2018-01-11 半導體能源研究所股份有限公司 Semiconductor device
SG11201504939RA (en) 2012-09-03 2015-07-30 Semiconductor Energy Lab Microcontroller
US8947158B2 (en) 2012-09-03 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
DE102013217278B4 (en) 2012-09-12 2017-03-30 Semiconductor Energy Laboratory Co., Ltd. A photodetector circuit, an imaging device, and a method of driving a photodetector circuit
KR102400509B1 (en) 2012-09-13 2022-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
US9018624B2 (en) 2012-09-13 2015-04-28 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic appliance
US8981372B2 (en) 2012-09-13 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic appliance
TWI644437B (en) 2012-09-14 2018-12-11 半導體能源研究所股份有限公司 Semiconductor device and method for fabricating the same
US8927985B2 (en) 2012-09-20 2015-01-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2014046222A1 (en) 2012-09-24 2014-03-27 Semiconductor Energy Laboratory Co., Ltd. Display device
TWI709244B (en) 2012-09-24 2020-11-01 日商半導體能源研究所股份有限公司 Semiconductor device
TWI681233B (en) 2012-10-12 2020-01-01 日商半導體能源研究所股份有限公司 Liquid crystal display device, touch panel and method for manufacturing liquid crystal display device
JP6290576B2 (en) 2012-10-12 2018-03-07 株式会社半導体エネルギー研究所 Liquid crystal display device and driving method thereof
JP6351947B2 (en) 2012-10-12 2018-07-04 株式会社半導体エネルギー研究所 Method for manufacturing liquid crystal display device
KR102226090B1 (en) 2012-10-12 2021-03-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device and manufacturing apparatus of semiconductor device
US9166021B2 (en) 2012-10-17 2015-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TWI591966B (en) 2012-10-17 2017-07-11 半導體能源研究所股份有限公司 Programmable logic device and method for driving programmable logic device
KR102102589B1 (en) 2012-10-17 2020-04-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Programmable logic device
JP5951442B2 (en) 2012-10-17 2016-07-13 株式会社半導体エネルギー研究所 Semiconductor device
JP6283191B2 (en) 2012-10-17 2018-02-21 株式会社半導体エネルギー研究所 Semiconductor device
WO2014061761A1 (en) 2012-10-17 2014-04-24 Semiconductor Energy Laboratory Co., Ltd. Microcontroller and method for manufacturing the same
JP6021586B2 (en) 2012-10-17 2016-11-09 株式会社半導体エネルギー研究所 Semiconductor device
KR102094568B1 (en) 2012-10-17 2020-03-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
WO2014061535A1 (en) 2012-10-17 2014-04-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6059501B2 (en) 2012-10-17 2017-01-11 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP2014082388A (en) 2012-10-17 2014-05-08 Semiconductor Energy Lab Co Ltd Semiconductor device
KR102220279B1 (en) 2012-10-19 2021-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for forming multilayer film including oxide semiconductor film and method for manufacturing semiconductor device
JP6204145B2 (en) 2012-10-23 2017-09-27 株式会社半導体エネルギー研究所 Semiconductor device
KR102130184B1 (en) 2012-10-24 2020-07-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TWI691084B (en) 2012-10-24 2020-04-11 日商半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
WO2014065343A1 (en) 2012-10-24 2014-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102279459B1 (en) 2012-10-24 2021-07-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
US9287411B2 (en) 2012-10-24 2016-03-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2014065389A1 (en) 2012-10-25 2014-05-01 Semiconductor Energy Laboratory Co., Ltd. Central control system
JP6219562B2 (en) 2012-10-30 2017-10-25 株式会社半導体エネルギー研究所 Display device and electronic device
TWI618075B (en) 2012-11-06 2018-03-11 半導體能源研究所股份有限公司 Semiconductor device and driving method thereof
CN104769150B (en) 2012-11-08 2018-09-21 株式会社半导体能源研究所 The forming method of metal oxide film and metal oxide film
TWI608616B (en) 2012-11-15 2017-12-11 半導體能源研究所股份有限公司 Semiconductor device
JP6220641B2 (en) 2012-11-15 2017-10-25 株式会社半導体エネルギー研究所 Semiconductor device
TWI605593B (en) 2012-11-15 2017-11-11 半導體能源研究所股份有限公司 Semiconductor device
TWI620323B (en) 2012-11-16 2018-04-01 半導體能源研究所股份有限公司 Semiconductor device
JP6285150B2 (en) 2012-11-16 2018-02-28 株式会社半導体エネルギー研究所 Semiconductor device
JP6317059B2 (en) 2012-11-16 2018-04-25 株式会社半導体エネルギー研究所 Semiconductor device and display device
TWI613813B (en) 2012-11-16 2018-02-01 半導體能源研究所股份有限公司 Semiconductor device
TWI820614B (en) 2012-11-28 2023-11-01 日商半導體能源研究所股份有限公司 Display device
TWI627483B (en) 2012-11-28 2018-06-21 半導體能源研究所股份有限公司 Display device and television receiver
US9412764B2 (en) 2012-11-28 2016-08-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device, and electronic device
US9263531B2 (en) 2012-11-28 2016-02-16 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film, film formation method thereof, and semiconductor device
WO2014084153A1 (en) 2012-11-28 2014-06-05 Semiconductor Energy Laboratory Co., Ltd. Display device
US9594281B2 (en) 2012-11-30 2017-03-14 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
US9153649B2 (en) 2012-11-30 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for evaluating semiconductor device
US9246011B2 (en) 2012-11-30 2016-01-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI582993B (en) 2012-11-30 2017-05-11 半導體能源研究所股份有限公司 Semiconductor device
KR102248765B1 (en) 2012-11-30 2021-05-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP2014130336A (en) 2012-11-30 2014-07-10 Semiconductor Energy Lab Co Ltd Display device
US9349593B2 (en) 2012-12-03 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR102207028B1 (en) 2012-12-03 2021-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP2014135478A (en) 2012-12-03 2014-07-24 Semiconductor Energy Lab Co Ltd Semiconductor device and manufacturing method of the same
CN104798221B (en) * 2012-12-05 2017-04-12 默克专利有限公司 Electronic apparatus having an oxygen ion pump
JP6254834B2 (en) 2012-12-06 2017-12-27 株式会社半導体エネルギー研究所 Semiconductor device
US9577446B2 (en) 2012-12-13 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Power storage system and power storage device storing data for the identifying power storage device
TWI611419B (en) 2012-12-24 2018-01-11 半導體能源研究所股份有限公司 Programmable logic device and semiconductor device
US9905585B2 (en) 2012-12-25 2018-02-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising capacitor
KR102209871B1 (en) 2012-12-25 2021-02-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR102241249B1 (en) 2012-12-25 2021-04-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Resistor, display device, and electronic device
DE112013006219T5 (en) 2012-12-25 2015-09-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and its manufacturing method
US9437273B2 (en) 2012-12-26 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2014143410A (en) 2012-12-28 2014-08-07 Semiconductor Energy Lab Co Ltd Semiconductor device and manufacturing method of the same
US9316695B2 (en) 2012-12-28 2016-04-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6329762B2 (en) 2012-12-28 2018-05-23 株式会社半導体エネルギー研究所 Semiconductor device
KR102370239B1 (en) 2012-12-28 2022-03-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
CN110137181A (en) 2012-12-28 2019-08-16 株式会社半导体能源研究所 The manufacturing method of semiconductor device and semiconductor device
TWI607510B (en) 2012-12-28 2017-12-01 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method of the same
US9391096B2 (en) 2013-01-18 2016-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TWI614813B (en) 2013-01-21 2018-02-11 半導體能源研究所股份有限公司 Method for manufacturing semiconductor device
US9466725B2 (en) 2013-01-24 2016-10-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9190172B2 (en) 2013-01-24 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6223198B2 (en) 2013-01-24 2017-11-01 株式会社半導体エネルギー研究所 Semiconductor device
JP5807076B2 (en) 2013-01-24 2015-11-10 株式会社半導体エネルギー研究所 Semiconductor device
TWI619010B (en) 2013-01-24 2018-03-21 半導體能源研究所股份有限公司 Semiconductor device
US9076825B2 (en) 2013-01-30 2015-07-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
US8981374B2 (en) 2013-01-30 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI593025B (en) 2013-01-30 2017-07-21 半導體能源研究所股份有限公司 Method for processing oxide semiconductor layer
KR102112367B1 (en) 2013-02-12 2020-05-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TWI618252B (en) 2013-02-12 2018-03-11 半導體能源研究所股份有限公司 Semiconductor device
US9190527B2 (en) 2013-02-13 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of semiconductor device
US8952723B2 (en) 2013-02-13 2015-02-10 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device and semiconductor device
WO2014125979A1 (en) 2013-02-13 2014-08-21 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device and semiconductor device
US9231111B2 (en) 2013-02-13 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9318484B2 (en) 2013-02-20 2016-04-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI611566B (en) 2013-02-25 2018-01-11 半導體能源研究所股份有限公司 Display device and electronic device
US9293544B2 (en) 2013-02-26 2016-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having buried channel structure
US9373711B2 (en) 2013-02-27 2016-06-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI651839B (en) 2013-02-27 2019-02-21 半導體能源研究所股份有限公司 Semiconductor device, drive circuit and display device
TWI612321B (en) 2013-02-27 2018-01-21 半導體能源研究所股份有限公司 Imaging device
JP2014195241A (en) 2013-02-28 2014-10-09 Semiconductor Energy Lab Co Ltd Semiconductor device
KR102238682B1 (en) 2013-02-28 2021-04-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP2014195243A (en) 2013-02-28 2014-10-09 Semiconductor Energy Lab Co Ltd Semiconductor device
JP6141777B2 (en) 2013-02-28 2017-06-07 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9276125B2 (en) 2013-03-01 2016-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2014195060A (en) 2013-03-01 2014-10-09 Semiconductor Energy Lab Co Ltd Sensor circuit and semiconductor device using sensor circuit
KR102153110B1 (en) 2013-03-06 2020-09-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor film and semiconductor device
US9269315B2 (en) 2013-03-08 2016-02-23 Semiconductor Energy Laboratory Co., Ltd. Driving method of semiconductor device
US8947121B2 (en) 2013-03-12 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device
TWI644433B (en) 2013-03-13 2018-12-11 半導體能源研究所股份有限公司 Semiconductor device
JP6283237B2 (en) 2013-03-14 2018-02-21 株式会社半導体エネルギー研究所 Semiconductor device
JP2014199708A (en) 2013-03-14 2014-10-23 株式会社半導体エネルギー研究所 Method for driving semiconductor device
JP2014199709A (en) 2013-03-14 2014-10-23 株式会社半導体エネルギー研究所 Memory device and semiconductor device
WO2014142043A1 (en) 2013-03-14 2014-09-18 Semiconductor Energy Laboratory Co., Ltd. Method for driving semiconductor device and semiconductor device
JP6298662B2 (en) 2013-03-14 2018-03-20 株式会社半導体エネルギー研究所 Semiconductor device
US9294075B2 (en) 2013-03-14 2016-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102290247B1 (en) 2013-03-14 2021-08-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and manufacturing method thereof
US9245650B2 (en) 2013-03-15 2016-01-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9786350B2 (en) 2013-03-18 2017-10-10 Semiconductor Energy Laboratory Co., Ltd. Memory device
US9153650B2 (en) 2013-03-19 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor
US9577107B2 (en) 2013-03-19 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and method for forming oxide semiconductor film
JP6093726B2 (en) 2013-03-22 2017-03-08 株式会社半導体エネルギー研究所 Semiconductor device
US9007092B2 (en) 2013-03-22 2015-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6355374B2 (en) 2013-03-22 2018-07-11 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP6272713B2 (en) 2013-03-25 2018-01-31 株式会社半導体エネルギー研究所 Programmable logic device and semiconductor device
US10347769B2 (en) 2013-03-25 2019-07-09 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor with multi-layer source/drain electrodes
WO2014157019A1 (en) 2013-03-25 2014-10-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6376788B2 (en) 2013-03-26 2018-08-22 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
JP6316630B2 (en) 2013-03-26 2018-04-25 株式会社半導体エネルギー研究所 Semiconductor device
US9608122B2 (en) 2013-03-27 2017-03-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2014209209A (en) 2013-03-28 2014-11-06 株式会社半導体エネルギー研究所 Display device
US9368636B2 (en) 2013-04-01 2016-06-14 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device comprising a plurality of oxide semiconductor layers
JP6300589B2 (en) 2013-04-04 2018-03-28 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9112460B2 (en) 2013-04-05 2015-08-18 Semiconductor Energy Laboratory Co., Ltd. Signal processing device
JP6198434B2 (en) 2013-04-11 2017-09-20 株式会社半導体エネルギー研究所 Display device and electronic device
JP6224338B2 (en) 2013-04-11 2017-11-01 株式会社半導体エネルギー研究所 Semiconductor device, display device, and method for manufacturing semiconductor device
JP6280794B2 (en) 2013-04-12 2018-02-14 株式会社半導体エネルギー研究所 Semiconductor device and driving method thereof
TWI620324B (en) 2013-04-12 2018-04-01 半導體能源研究所股份有限公司 Semiconductor device
US10304859B2 (en) 2013-04-12 2019-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an oxide film on an oxide semiconductor film
US9915848B2 (en) 2013-04-19 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
JP6333028B2 (en) 2013-04-19 2018-05-30 株式会社半導体エネルギー研究所 Memory device and semiconductor device
JP6456598B2 (en) 2013-04-19 2019-01-23 株式会社半導体エネルギー研究所 Display device
TWI647559B (en) 2013-04-24 2019-01-11 日商半導體能源研究所股份有限公司 Display device
US9893192B2 (en) 2013-04-24 2018-02-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6396671B2 (en) 2013-04-26 2018-09-26 株式会社半導体エネルギー研究所 Semiconductor device
JP6401483B2 (en) 2013-04-26 2018-10-10 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
TWI644434B (en) 2013-04-29 2018-12-11 日商半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
TWI631711B (en) 2013-05-01 2018-08-01 半導體能源研究所股份有限公司 Semiconductor device
KR102222344B1 (en) 2013-05-02 2021-03-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US9231002B2 (en) 2013-05-03 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
US9882058B2 (en) 2013-05-03 2018-01-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2014181785A1 (en) 2013-05-09 2014-11-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9704894B2 (en) 2013-05-10 2017-07-11 Semiconductor Energy Laboratory Co., Ltd. Display device including pixel electrode including oxide
US9246476B2 (en) 2013-05-10 2016-01-26 Semiconductor Energy Laboratory Co., Ltd. Driver circuit
TWI621337B (en) 2013-05-14 2018-04-11 半導體能源研究所股份有限公司 Signal processing device
TWI809225B (en) 2013-05-16 2023-07-21 日商半導體能源研究所股份有限公司 Semiconductor device
US9312392B2 (en) 2013-05-16 2016-04-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI618058B (en) 2013-05-16 2018-03-11 半導體能源研究所股份有限公司 Semiconductor device
TWI742574B (en) 2013-05-16 2021-10-11 日商半導體能源研究所股份有限公司 Semiconductor device
TWI638519B (en) 2013-05-17 2018-10-11 半導體能源研究所股份有限公司 Programmable logic device and semiconductor device
US9209795B2 (en) 2013-05-17 2015-12-08 Semiconductor Energy Laboratory Co., Ltd. Signal processing device and measuring method
US10032872B2 (en) 2013-05-17 2018-07-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, and apparatus for manufacturing semiconductor device
US9454923B2 (en) 2013-05-17 2016-09-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9754971B2 (en) 2013-05-18 2017-09-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102358739B1 (en) 2013-05-20 2022-02-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TWI664731B (en) 2013-05-20 2019-07-01 半導體能源研究所股份有限公司 Semiconductor device
US9343579B2 (en) 2013-05-20 2016-05-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
DE112014002485T5 (en) 2013-05-20 2016-03-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
DE102014208859B4 (en) 2013-05-20 2021-03-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9647125B2 (en) 2013-05-20 2017-05-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9293599B2 (en) 2013-05-20 2016-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR20160009626A (en) 2013-05-21 2016-01-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Oxide semiconductor film and formation method thereof
US10416504B2 (en) 2013-05-21 2019-09-17 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
JP6400336B2 (en) 2013-06-05 2018-10-03 株式会社半導体エネルギー研究所 Semiconductor device
JP2015195327A (en) 2013-06-05 2015-11-05 株式会社半導体エネルギー研究所 semiconductor device
TWI687748B (en) 2013-06-05 2020-03-11 日商半導體能源研究所股份有限公司 Display device and electronic device
JP6475424B2 (en) 2013-06-05 2019-02-27 株式会社半導体エネルギー研究所 Semiconductor device
TWI624936B (en) 2013-06-05 2018-05-21 半導體能源研究所股份有限公司 Display device
US9806198B2 (en) 2013-06-05 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9773915B2 (en) 2013-06-11 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI641112B (en) 2013-06-13 2018-11-11 半導體能源研究所股份有限公司 Semiconductor device
JP6368155B2 (en) 2013-06-18 2018-08-01 株式会社半導体エネルギー研究所 Programmable logic device
TWI652822B (en) 2013-06-19 2019-03-01 日商半導體能源研究所股份有限公司 Oxide semiconductor film and formation method thereof
US9035301B2 (en) 2013-06-19 2015-05-19 Semiconductor Energy Laboratory Co., Ltd. Imaging device
TWI633650B (en) 2013-06-21 2018-08-21 半導體能源研究所股份有限公司 Semiconductor device
US9515094B2 (en) 2013-06-26 2016-12-06 Semiconductor Energy Laboratory Co., Ltd. Storage device and semiconductor device
KR20210079411A (en) 2013-06-27 2021-06-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TW201513128A (en) 2013-07-05 2015-04-01 Semiconductor Energy Lab Semiconductor device
US20150008428A1 (en) 2013-07-08 2015-01-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9666697B2 (en) 2013-07-08 2017-05-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device including an electron trap layer
JP6435124B2 (en) 2013-07-08 2018-12-05 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9293480B2 (en) 2013-07-10 2016-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
TWI622053B (en) 2013-07-10 2018-04-21 半導體能源研究所股份有限公司 Semiconductor device
US9818763B2 (en) 2013-07-12 2017-11-14 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing display device
US9006736B2 (en) 2013-07-12 2015-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6322503B2 (en) 2013-07-16 2018-05-09 株式会社半導体エネルギー研究所 Semiconductor device
JP6516978B2 (en) 2013-07-17 2019-05-22 株式会社半導体エネルギー研究所 Semiconductor device
TWI621130B (en) 2013-07-18 2018-04-11 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing semiconductor device
TWI608523B (en) 2013-07-19 2017-12-11 半導體能源研究所股份有限公司 Oxide semiconductor film, method of manufacturing oxide semiconductor film, and semiconductor device
US9379138B2 (en) 2013-07-19 2016-06-28 Semiconductor Energy Laboratory Co., Ltd. Imaging device with drive voltage dependent on external light intensity
US9395070B2 (en) 2013-07-19 2016-07-19 Semiconductor Energy Laboratory Co., Ltd. Support of flexible component and light-emitting device
TWI636309B (en) 2013-07-25 2018-09-21 日商半導體能源研究所股份有限公司 Liquid crystal display device and electronic device
TWI632688B (en) 2013-07-25 2018-08-11 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing semiconductor device
US10529740B2 (en) 2013-07-25 2020-01-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including semiconductor layer and conductive layer
TWI641208B (en) 2013-07-26 2018-11-11 日商半導體能源研究所股份有限公司 Dcdc converter
US9343288B2 (en) 2013-07-31 2016-05-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6410496B2 (en) 2013-07-31 2018-10-24 株式会社半導体エネルギー研究所 Multi-gate transistor
JP6460592B2 (en) 2013-07-31 2019-01-30 株式会社半導体エネルギー研究所 DC-DC converter and semiconductor device
US9496330B2 (en) 2013-08-02 2016-11-15 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
TWI635750B (en) 2013-08-02 2018-09-11 半導體能源研究所股份有限公司 Imaging device and operation method thereof
JP2015053477A (en) 2013-08-05 2015-03-19 株式会社半導体エネルギー研究所 Semiconductor device and method for manufacturing the same
JP6345023B2 (en) 2013-08-07 2018-06-20 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
KR102304824B1 (en) 2013-08-09 2021-09-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US9601591B2 (en) 2013-08-09 2017-03-21 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP6329843B2 (en) 2013-08-19 2018-05-23 株式会社半導体エネルギー研究所 Semiconductor device
US9374048B2 (en) 2013-08-20 2016-06-21 Semiconductor Energy Laboratory Co., Ltd. Signal processing device, and driving method and program thereof
TWI643435B (en) 2013-08-21 2018-12-01 日商半導體能源研究所股份有限公司 Charge pump circuit and semiconductor device including the same
KR102232133B1 (en) 2013-08-22 2021-03-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
KR102244553B1 (en) 2013-08-23 2021-04-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Capacitor and semiconductor device
US9443987B2 (en) 2013-08-23 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI749810B (en) 2013-08-28 2021-12-11 日商半導體能源研究所股份有限公司 Display device
US9552767B2 (en) 2013-08-30 2017-01-24 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
WO2015030150A1 (en) 2013-08-30 2015-03-05 Semiconductor Energy Laboratory Co., Ltd. Storage circuit and semiconductor device
US9590109B2 (en) 2013-08-30 2017-03-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6426402B2 (en) 2013-08-30 2018-11-21 株式会社半導体エネルギー研究所 Display device
US9360564B2 (en) 2013-08-30 2016-06-07 Semiconductor Energy Laboratory Co., Ltd. Imaging device
JP6406926B2 (en) 2013-09-04 2018-10-17 株式会社半導体エネルギー研究所 Semiconductor device
US9449853B2 (en) 2013-09-04 2016-09-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device comprising electron trap layer
US9607991B2 (en) 2013-09-05 2017-03-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10008513B2 (en) 2013-09-05 2018-06-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6345544B2 (en) 2013-09-05 2018-06-20 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
KR102294507B1 (en) 2013-09-06 2021-08-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP6401977B2 (en) 2013-09-06 2018-10-10 株式会社半導体エネルギー研究所 Semiconductor device
US9590110B2 (en) 2013-09-10 2017-03-07 Semiconductor Energy Laboratory Co., Ltd. Ultraviolet light sensor circuit
TWI640014B (en) 2013-09-11 2018-11-01 半導體能源研究所股份有限公司 Memory device, semiconductor device, and electronic device
US9893194B2 (en) 2013-09-12 2018-02-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9269822B2 (en) 2013-09-12 2016-02-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9461126B2 (en) 2013-09-13 2016-10-04 Semiconductor Energy Laboratory Co., Ltd. Transistor, clocked inverter circuit, sequential circuit, and semiconductor device including sequential circuit
US9805952B2 (en) 2013-09-13 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR20240033151A (en) 2013-09-13 2024-03-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
TWI646690B (en) 2013-09-13 2019-01-01 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
US9716003B2 (en) 2013-09-13 2017-07-25 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
US9887297B2 (en) 2013-09-17 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor layer in which thickness of the oxide semiconductor layer is greater than or equal to width of the oxide semiconductor layer
US9859439B2 (en) 2013-09-18 2018-01-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9269915B2 (en) 2013-09-18 2016-02-23 Semiconductor Energy Laboratory Co., Ltd. Display device
TWI677989B (en) 2013-09-19 2019-11-21 日商半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
JP2015084418A (en) 2013-09-23 2015-04-30 株式会社半導体エネルギー研究所 Semiconductor device
US9425217B2 (en) 2013-09-23 2016-08-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI678740B (en) 2013-09-23 2019-12-01 日商半導體能源研究所股份有限公司 Semiconductor device
JP6570817B2 (en) 2013-09-23 2019-09-04 株式会社半導体エネルギー研究所 Semiconductor device
JP6383616B2 (en) 2013-09-25 2018-08-29 株式会社半導体エネルギー研究所 Semiconductor device
WO2015046025A1 (en) 2013-09-26 2015-04-02 Semiconductor Energy Laboratory Co., Ltd. Switch circuit, semiconductor device, and system
JP6392603B2 (en) 2013-09-27 2018-09-19 株式会社半導体エネルギー研究所 Semiconductor device
JP6581765B2 (en) 2013-10-02 2019-09-25 株式会社半導体エネルギー研究所 Bootstrap circuit and semiconductor device having bootstrap circuit
JP6386323B2 (en) 2013-10-04 2018-09-05 株式会社半導体エネルギー研究所 Semiconductor device
TWI741298B (en) 2013-10-10 2021-10-01 日商半導體能源研究所股份有限公司 Semiconductor device
US9293592B2 (en) 2013-10-11 2016-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9245593B2 (en) 2013-10-16 2016-01-26 Semiconductor Energy Laboratory Co., Ltd. Method for driving arithmetic processing unit
TWI621127B (en) 2013-10-18 2018-04-11 半導體能源研究所股份有限公司 Arithmetic processing unit and driving method thereof
TWI642170B (en) 2013-10-18 2018-11-21 半導體能源研究所股份有限公司 Display device and electronic device
DE112014004839T5 (en) 2013-10-22 2016-07-07 Semiconductor Energy Laboratory Co., Ltd. display device
JP2015179247A (en) 2013-10-22 2015-10-08 株式会社半導体エネルギー研究所 display device
WO2015060318A1 (en) 2013-10-22 2015-04-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
DE102014220672A1 (en) 2013-10-22 2015-05-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9276128B2 (en) 2013-10-22 2016-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, and etchant used for the same
WO2015060133A1 (en) 2013-10-22 2015-04-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2015109422A (en) * 2013-10-22 2015-06-11 株式会社半導体エネルギー研究所 Semiconductor device evaluation method
US9455349B2 (en) 2013-10-22 2016-09-27 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor thin film transistor with reduced impurity diffusion
US9583516B2 (en) 2013-10-25 2017-02-28 Semiconductor Energy Laboratory Co., Ltd. Display device
JP6457239B2 (en) 2013-10-31 2019-01-23 株式会社半導体エネルギー研究所 Semiconductor device
US9590111B2 (en) 2013-11-06 2017-03-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
JP6478562B2 (en) 2013-11-07 2019-03-06 株式会社半導体エネルギー研究所 Semiconductor device
JP6440457B2 (en) 2013-11-07 2018-12-19 株式会社半導体エネルギー研究所 Semiconductor device
US9385054B2 (en) 2013-11-08 2016-07-05 Semiconductor Energy Laboratory Co., Ltd. Data processing device and manufacturing method thereof
JP2015118724A (en) 2013-11-13 2015-06-25 株式会社半導体エネルギー研究所 Semiconductor device and method for driving the semiconductor device
JP6426437B2 (en) 2013-11-22 2018-11-21 株式会社半導体エネルギー研究所 Semiconductor device
JP6393590B2 (en) 2013-11-22 2018-09-19 株式会社半導体エネルギー研究所 Semiconductor device
JP6486660B2 (en) 2013-11-27 2019-03-20 株式会社半導体エネルギー研究所 Display device
US9882014B2 (en) 2013-11-29 2018-01-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2016001712A (en) 2013-11-29 2016-01-07 株式会社半導体エネルギー研究所 Method of manufacturing semiconductor device
US20150155313A1 (en) 2013-11-29 2015-06-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN110010625A (en) 2013-12-02 2019-07-12 株式会社半导体能源研究所 Display device and its manufacturing method
US9601634B2 (en) 2013-12-02 2017-03-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN105874524B (en) 2013-12-02 2019-05-28 株式会社半导体能源研究所 Display device
US9991392B2 (en) 2013-12-03 2018-06-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US10098734B2 (en) 2013-12-05 2018-10-16 Edwards Lifesciences Corporation Prosthetic heart valve and delivery apparatus
JP2016027597A (en) 2013-12-06 2016-02-18 株式会社半導体エネルギー研究所 Semiconductor device
US9349751B2 (en) 2013-12-12 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6537264B2 (en) 2013-12-12 2019-07-03 株式会社半導体エネルギー研究所 Semiconductor device
TWI642186B (en) 2013-12-18 2018-11-21 日商半導體能源研究所股份有限公司 Semiconductor device
TWI666770B (en) 2013-12-19 2019-07-21 日商半導體能源研究所股份有限公司 Semiconductor device
JP6444714B2 (en) 2013-12-20 2018-12-26 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9379192B2 (en) 2013-12-20 2016-06-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2015097586A1 (en) 2013-12-25 2015-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
SG11201604650SA (en) 2013-12-26 2016-07-28 Semiconductor Energy Lab Semiconductor device
JP6402017B2 (en) 2013-12-26 2018-10-10 株式会社半導体エネルギー研究所 Semiconductor device
TWI637484B (en) 2013-12-26 2018-10-01 日商半導體能源研究所股份有限公司 Semiconductor device
US9960280B2 (en) 2013-12-26 2018-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2015097596A1 (en) 2013-12-26 2015-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6506961B2 (en) 2013-12-27 2019-04-24 株式会社半導体エネルギー研究所 Liquid crystal display
US9397149B2 (en) 2013-12-27 2016-07-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6488124B2 (en) 2013-12-27 2019-03-20 株式会社半導体エネルギー研究所 Semiconductor device
US9577110B2 (en) 2013-12-27 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including an oxide semiconductor and the display device including the semiconductor device
JP6506545B2 (en) 2013-12-27 2019-04-24 株式会社半導体エネルギー研究所 Semiconductor device
DE112014006046T5 (en) 2013-12-27 2016-09-15 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US9349418B2 (en) 2013-12-27 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving the same
KR102320576B1 (en) 2013-12-27 2021-11-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US9318618B2 (en) 2013-12-27 2016-04-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6444723B2 (en) 2014-01-09 2018-12-26 株式会社半導体エネルギー研究所 apparatus
US9300292B2 (en) 2014-01-10 2016-03-29 Semiconductor Energy Laboratory Co., Ltd. Circuit including transistor
US9401432B2 (en) 2014-01-16 2016-07-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US9379713B2 (en) 2014-01-17 2016-06-28 Semiconductor Energy Laboratory Co., Ltd. Data processing device and driving method thereof
KR102306200B1 (en) 2014-01-24 2021-09-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
CN104812183A (en) * 2014-01-24 2015-07-29 胜华科技股份有限公司 Electronic device
WO2015114476A1 (en) 2014-01-28 2015-08-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9929044B2 (en) 2014-01-30 2018-03-27 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
US9929279B2 (en) 2014-02-05 2018-03-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9443876B2 (en) 2014-02-05 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, and the display module
JP6523695B2 (en) 2014-02-05 2019-06-05 株式会社半導体エネルギー研究所 Semiconductor device
TWI665778B (en) 2014-02-05 2019-07-11 日商半導體能源研究所股份有限公司 Semiconductor device, module, and electronic device
JP6473626B2 (en) 2014-02-06 2019-02-20 株式会社半導体エネルギー研究所 Semiconductor device
WO2015118436A1 (en) 2014-02-07 2015-08-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, device, and electronic device
US9479175B2 (en) 2014-02-07 2016-10-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
TWI658597B (en) 2014-02-07 2019-05-01 日商半導體能源研究所股份有限公司 Semiconductor device
JP2015165226A (en) 2014-02-07 2015-09-17 株式会社半導体エネルギー研究所 Device
JP6545970B2 (en) 2014-02-07 2019-07-17 株式会社半導体エネルギー研究所 apparatus
US10055232B2 (en) 2014-02-07 2018-08-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising memory circuit
WO2015121770A1 (en) 2014-02-11 2015-08-20 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
KR102317297B1 (en) 2014-02-19 2021-10-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Oxide, semiconductor device, module, and electronic device
JP2015172991A (en) 2014-02-21 2015-10-01 株式会社半導体エネルギー研究所 Semiconductor device, electronic component, and electronic device
US9817040B2 (en) 2014-02-21 2017-11-14 Semiconductor Energy Laboratory Co., Ltd. Measuring method of low off-state current of transistor
JP6629509B2 (en) 2014-02-21 2020-01-15 株式会社半導体エネルギー研究所 Oxide semiconductor film
US9564535B2 (en) 2014-02-28 2017-02-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic appliance including the semiconductor device, the display device, and the display module
CN106104772B (en) 2014-02-28 2020-11-10 株式会社半导体能源研究所 Semiconductor device and display device having the same
KR102329066B1 (en) 2014-02-28 2021-11-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, method for driving the same, and electronic appliance
US9294096B2 (en) 2014-02-28 2016-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10074576B2 (en) 2014-02-28 2018-09-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
JP6474280B2 (en) 2014-03-05 2019-02-27 株式会社半導体エネルギー研究所 Semiconductor device
KR20150104518A (en) 2014-03-05 2015-09-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Level shifter circuit
US9537478B2 (en) 2014-03-06 2017-01-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10096489B2 (en) 2014-03-06 2018-10-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP6625328B2 (en) 2014-03-06 2019-12-25 株式会社半導体エネルギー研究所 Method for driving semiconductor device
US9397637B2 (en) 2014-03-06 2016-07-19 Semiconductor Energy Laboratory Co., Ltd. Voltage controlled oscillator, semiconductor device, and electronic device
JP6607681B2 (en) 2014-03-07 2019-11-20 株式会社半導体エネルギー研究所 Semiconductor device
WO2015132697A1 (en) 2014-03-07 2015-09-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102267237B1 (en) 2014-03-07 2021-06-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and electronic device
US9419622B2 (en) 2014-03-07 2016-08-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9711536B2 (en) 2014-03-07 2017-07-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic component, and electronic device
JP6585354B2 (en) 2014-03-07 2019-10-02 株式会社半導体エネルギー研究所 Semiconductor device
JP6545976B2 (en) 2014-03-07 2019-07-17 株式会社半導体エネルギー研究所 Semiconductor device
WO2015132694A1 (en) 2014-03-07 2015-09-11 Semiconductor Energy Laboratory Co., Ltd. Touch sensor, touch panel, and manufacturing method of touch panel
JP6442321B2 (en) 2014-03-07 2018-12-19 株式会社半導体エネルギー研究所 Semiconductor device, driving method thereof, and electronic apparatus
KR20160132405A (en) 2014-03-12 2016-11-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP6541376B2 (en) 2014-03-13 2019-07-10 株式会社半導体エネルギー研究所 Method of operating programmable logic device
US9640669B2 (en) 2014-03-13 2017-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic appliance including the semiconductor device, the display device, and the display module
US9324747B2 (en) 2014-03-13 2016-04-26 Semiconductor Energy Laboratory Co., Ltd. Imaging device
KR102528615B1 (en) 2014-03-13 2023-05-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Imaging device
JP6560508B2 (en) 2014-03-13 2019-08-14 株式会社半導体エネルギー研究所 Semiconductor device
JP6525421B2 (en) 2014-03-13 2019-06-05 株式会社半導体エネルギー研究所 Semiconductor device
JP6677449B2 (en) 2014-03-13 2020-04-08 株式会社半導体エネルギー研究所 Driving method of semiconductor device
SG11201606647PA (en) 2014-03-14 2016-09-29 Semiconductor Energy Lab Co Ltd Circuit system
JP2015188071A (en) 2014-03-14 2015-10-29 株式会社半導体エネルギー研究所 semiconductor device
US9887212B2 (en) 2014-03-14 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US9299848B2 (en) 2014-03-14 2016-03-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, RF tag, and electronic device
JP6559444B2 (en) 2014-03-14 2019-08-14 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
WO2015140656A1 (en) 2014-03-18 2015-09-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6509596B2 (en) 2014-03-18 2019-05-08 株式会社半導体エネルギー研究所 Semiconductor device
US9887291B2 (en) 2014-03-19 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, or the display module
US9842842B2 (en) 2014-03-19 2017-12-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and semiconductor device and electronic device having the same
TWI657488B (en) 2014-03-20 2019-04-21 日商半導體能源研究所股份有限公司 Semiconductor device, display device including semiconductor device, display module including display device, and electronic device including semiconductor device, display device, and display module
KR102398965B1 (en) 2014-03-20 2022-05-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, electronic component, and electronic device
CN111048509B (en) 2014-03-28 2023-12-01 株式会社半导体能源研究所 Semiconductor device with a semiconductor device having a plurality of semiconductor chips
JP6487738B2 (en) 2014-03-31 2019-03-20 株式会社半導体エネルギー研究所 Semiconductor devices, electronic components
TWI735206B (en) 2014-04-10 2021-08-01 日商半導體能源研究所股份有限公司 Memory device and semiconductor device
JP6635670B2 (en) 2014-04-11 2020-01-29 株式会社半導体エネルギー研究所 Semiconductor device
US9674470B2 (en) 2014-04-11 2017-06-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for driving semiconductor device, and method for driving electronic device
TWI646782B (en) 2014-04-11 2019-01-01 日商半導體能源研究所股份有限公司 Holding circuit, driving method of holding circuit, and semiconductor device including holding circuit
JP6541398B2 (en) 2014-04-11 2019-07-10 株式会社半導体エネルギー研究所 Semiconductor device
DE112015001878B4 (en) 2014-04-18 2021-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic equipment
KR102511325B1 (en) 2014-04-18 2023-03-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and operation method thereof
CN106256017B (en) 2014-04-18 2020-02-07 株式会社半导体能源研究所 Semiconductor device and display device including the same
JP6613044B2 (en) 2014-04-22 2019-11-27 株式会社半導体エネルギー研究所 Display device, display module, and electronic device
KR102380829B1 (en) 2014-04-23 2022-03-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Imaging device
US9780226B2 (en) 2014-04-25 2017-10-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102330412B1 (en) 2014-04-25 2021-11-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, electronic component, and electronic device
JP6468686B2 (en) 2014-04-25 2019-02-13 株式会社半導体エネルギー研究所 I / O device
TWI643457B (en) 2014-04-25 2018-12-01 日商半導體能源研究所股份有限公司 Semiconductor device
US10043913B2 (en) 2014-04-30 2018-08-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor film, semiconductor device, display device, module, and electronic device
US10656799B2 (en) 2014-05-02 2020-05-19 Semiconductor Energy Laboratory Co., Ltd. Display device and operation method thereof
TWI679624B (en) 2014-05-02 2019-12-11 日商半導體能源研究所股份有限公司 Semiconductor device
JP6537341B2 (en) 2014-05-07 2019-07-03 株式会社半導体エネルギー研究所 Semiconductor device
JP6653997B2 (en) 2014-05-09 2020-02-26 株式会社半導体エネルギー研究所 Display correction circuit and display device
KR102333604B1 (en) 2014-05-15 2021-11-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and display device including the same
JP6612056B2 (en) 2014-05-16 2019-11-27 株式会社半導体エネルギー研究所 Imaging device and monitoring device
JP2015233130A (en) 2014-05-16 2015-12-24 株式会社半導体エネルギー研究所 Semiconductor substrate and semiconductor device manufacturing method
JP6580863B2 (en) 2014-05-22 2019-09-25 株式会社半導体エネルギー研究所 Semiconductor devices, health management systems
JP6616102B2 (en) 2014-05-23 2019-12-04 株式会社半導体エネルギー研究所 Storage device and electronic device
TWI672804B (en) 2014-05-23 2019-09-21 日商半導體能源研究所股份有限公司 Manufacturing method of semiconductor device
US10020403B2 (en) 2014-05-27 2018-07-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9874775B2 (en) 2014-05-28 2018-01-23 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and electronic device
KR102354008B1 (en) 2014-05-29 2022-01-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, method for manufacturing semiconductor device, and electronic device
JP6525722B2 (en) 2014-05-29 2019-06-05 株式会社半導体エネルギー研究所 Memory device, electronic component, and electronic device
KR102418666B1 (en) 2014-05-29 2022-07-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Imaging element, electronic appliance, method for driving imaging device, and method for driving electronic appliance
JP6653129B2 (en) 2014-05-29 2020-02-26 株式会社半導体エネルギー研究所 Storage device
KR20150138026A (en) 2014-05-29 2015-12-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
TWI646658B (en) 2014-05-30 2019-01-01 日商半導體能源研究所股份有限公司 Semiconductor device
WO2015182000A1 (en) 2014-05-30 2015-12-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and electronic device
JP6537892B2 (en) 2014-05-30 2019-07-03 株式会社半導体エネルギー研究所 Semiconductor device and electronic device
KR20170013240A (en) 2014-05-30 2017-02-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
TWI663726B (en) 2014-05-30 2019-06-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, module, and electronic device
JP6538426B2 (en) 2014-05-30 2019-07-03 株式会社半導体エネルギー研究所 Semiconductor device and electronic device
US9831238B2 (en) 2014-05-30 2017-11-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including insulating film having opening portion and conductive film in the opening portion
JP2016015475A (en) 2014-06-13 2016-01-28 株式会社半導体エネルギー研究所 Semiconductor device and electronic apparatus
KR102344782B1 (en) 2014-06-13 2021-12-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Input device and input/output device
WO2015189731A1 (en) 2014-06-13 2015-12-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device including the semiconductor device
TWI663733B (en) 2014-06-18 2019-06-21 日商半導體能源研究所股份有限公司 Transistor and semiconductor device
TWI666776B (en) 2014-06-20 2019-07-21 日商半導體能源研究所股份有限公司 Semiconductor device and display device having the same
KR20150146409A (en) 2014-06-20 2015-12-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, display device, input/output device, and electronic device
US9722090B2 (en) 2014-06-23 2017-08-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including first gate oxide semiconductor film, and second gate
JP6545541B2 (en) 2014-06-25 2019-07-17 株式会社半導体エネルギー研究所 Imaging device, monitoring device, and electronic device
US10002971B2 (en) 2014-07-03 2018-06-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
US9647129B2 (en) 2014-07-04 2017-05-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9461179B2 (en) 2014-07-11 2016-10-04 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor device (TFT) comprising stacked oxide semiconductor layers and having a surrounded channel structure
CN112038410A (en) 2014-07-15 2020-12-04 株式会社半导体能源研究所 Semiconductor device, method of manufacturing the same, and display device including the same
JP6581825B2 (en) 2014-07-18 2019-09-25 株式会社半導体エネルギー研究所 Display system
JP2016029795A (en) 2014-07-18 2016-03-03 株式会社半導体エネルギー研究所 Semiconductor device, imaging device, and electronic device
US9312280B2 (en) 2014-07-25 2016-04-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102352633B1 (en) 2014-07-25 2022-01-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Oscillator circuit and semiconductor device including the same
US10115830B2 (en) 2014-07-29 2018-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and electronic device
KR102533396B1 (en) 2014-07-31 2023-05-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and electronic device
JP6555956B2 (en) 2014-07-31 2019-08-07 株式会社半導体エネルギー研究所 Imaging device, monitoring device, and electronic device
US9705004B2 (en) 2014-08-01 2017-07-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6652342B2 (en) 2014-08-08 2020-02-19 株式会社半導体エネルギー研究所 Semiconductor device
US9595955B2 (en) 2014-08-08 2017-03-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including power storage elements and switches
JP6553444B2 (en) 2014-08-08 2019-07-31 株式会社半導体エネルギー研究所 Semiconductor device
US10147747B2 (en) 2014-08-21 2018-12-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and electronic device
US10032888B2 (en) 2014-08-22 2018-07-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having semiconductor device
US10559667B2 (en) 2014-08-25 2020-02-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for measuring current of semiconductor device
KR102388997B1 (en) 2014-08-29 2022-04-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Imaging device and electronic device
KR102393272B1 (en) 2014-09-02 2022-05-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Imaging device and electronic device
KR102329498B1 (en) 2014-09-04 2021-11-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
JP2016066065A (en) 2014-09-05 2016-04-28 株式会社半導体エネルギー研究所 Display device and electronic device
US9766517B2 (en) 2014-09-05 2017-09-19 Semiconductor Energy Laboratory Co., Ltd. Display device and display module
JP6676316B2 (en) 2014-09-12 2020-04-08 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9722091B2 (en) 2014-09-12 2017-08-01 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2016066788A (en) 2014-09-19 2016-04-28 株式会社半導体エネルギー研究所 Method of evaluating semiconductor film, and method of manufacturing semiconductor device
KR102513878B1 (en) 2014-09-19 2023-03-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
KR20160034200A (en) 2014-09-19 2016-03-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
US9401364B2 (en) 2014-09-19 2016-07-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic component, and electronic device
US10071904B2 (en) 2014-09-25 2018-09-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display module, and electronic device
WO2016046685A1 (en) 2014-09-26 2016-03-31 Semiconductor Energy Laboratory Co., Ltd. Imaging device
US10170055B2 (en) 2014-09-26 2019-01-01 Semiconductor Energy Laboratory Co., Ltd. Display device and driving method thereof
JP2016111677A (en) 2014-09-26 2016-06-20 株式会社半導体エネルギー研究所 Semiconductor device, wireless sensor and electronic device
US10141342B2 (en) 2014-09-26 2018-11-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
US9450581B2 (en) 2014-09-30 2016-09-20 Semiconductor Energy Laboratory Co., Ltd. Logic circuit, semiconductor device, electronic component, and electronic device
WO2016055894A1 (en) 2014-10-06 2016-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US9698170B2 (en) 2014-10-07 2017-07-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display module, and electronic device
KR20220119177A (en) 2014-10-10 2022-08-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Logic circuit, processing unit, electronic component, and electronic device
KR20170069207A (en) 2014-10-10 2017-06-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, circuit board, and electronic device
US9991393B2 (en) 2014-10-16 2018-06-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, module, and electronic device
JP6645793B2 (en) 2014-10-17 2020-02-14 株式会社半導体エネルギー研究所 Semiconductor device
WO2016063159A1 (en) 2014-10-20 2016-04-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof, module, and electronic device
US10068927B2 (en) 2014-10-23 2018-09-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display module, and electronic device
JP6615565B2 (en) 2014-10-24 2019-12-04 株式会社半導体エネルギー研究所 Semiconductor device
US9704704B2 (en) 2014-10-28 2017-07-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the same
CN113540130A (en) 2014-10-28 2021-10-22 株式会社半导体能源研究所 Display device, method for manufacturing display device, and electronic apparatus
TWI652362B (en) 2014-10-28 2019-03-01 日商半導體能源研究所股份有限公司 Oxide and manufacturing method thereof
JP6780927B2 (en) 2014-10-31 2020-11-04 株式会社半導体エネルギー研究所 Semiconductor device
US10680017B2 (en) 2014-11-07 2020-06-09 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element including EL layer, electrode which has high reflectance and a high work function, display device, electronic device, and lighting device
US9548327B2 (en) 2014-11-10 2017-01-17 Semiconductor Energy Laboratory Co., Ltd. Imaging device having a selenium containing photoelectric conversion layer
US9584707B2 (en) 2014-11-10 2017-02-28 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
TWI711165B (en) 2014-11-21 2020-11-21 日商半導體能源研究所股份有限公司 Semiconductor device and electronic device
JP6563313B2 (en) 2014-11-21 2019-08-21 株式会社半導体エネルギー研究所 Semiconductor device and electronic device
US9438234B2 (en) 2014-11-21 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Logic circuit and semiconductor device including logic circuit
TWI699897B (en) 2014-11-21 2020-07-21 日商半導體能源研究所股份有限公司 Semiconductor device
KR102524983B1 (en) 2014-11-28 2023-04-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, module, and electronic device
JP6647841B2 (en) 2014-12-01 2020-02-14 株式会社半導体エネルギー研究所 Preparation method of oxide
US9768317B2 (en) 2014-12-08 2017-09-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and electronic device
JP6667267B2 (en) 2014-12-08 2020-03-18 株式会社半導体エネルギー研究所 Semiconductor device
US9773832B2 (en) 2014-12-10 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP6689062B2 (en) 2014-12-10 2020-04-28 株式会社半導体エネルギー研究所 Semiconductor device
JP6833315B2 (en) 2014-12-10 2021-02-24 株式会社半導体エネルギー研究所 Semiconductor devices and electronic devices
WO2016092427A1 (en) 2014-12-10 2016-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2016092416A1 (en) 2014-12-11 2016-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, and electronic device
JP2016116220A (en) 2014-12-16 2016-06-23 株式会社半導体エネルギー研究所 Semiconductor device and electronic device
JP6676354B2 (en) 2014-12-16 2020-04-08 株式会社半導体エネルギー研究所 Semiconductor device
KR102581808B1 (en) 2014-12-18 2023-09-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, sensor device, and electronic device
TWI686874B (en) 2014-12-26 2020-03-01 日商半導體能源研究所股份有限公司 Semiconductor device, display device, display module, electronic evice, oxide, and manufacturing method of oxide
US10396210B2 (en) 2014-12-26 2019-08-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with stacked metal oxide and oxide semiconductor layers and display device including the semiconductor device
KR20170101233A (en) 2014-12-26 2017-09-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for producing sputtering target
CN111933668A (en) 2014-12-29 2020-11-13 株式会社半导体能源研究所 Semiconductor device with a plurality of semiconductor chips
US10522693B2 (en) 2015-01-16 2019-12-31 Semiconductor Energy Laboratory Co., Ltd. Memory device and electronic device
US9443564B2 (en) 2015-01-26 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic component, and electronic device
US9954112B2 (en) 2015-01-26 2018-04-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6857447B2 (en) 2015-01-26 2021-04-14 株式会社半導体エネルギー研究所 Semiconductor device
TWI792065B (en) 2015-01-30 2023-02-11 日商半導體能源研究所股份有限公司 Imaging device and electronic device
US9647132B2 (en) 2015-01-30 2017-05-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and memory device
KR20170109231A (en) 2015-02-02 2017-09-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Oxides and methods for making them
KR20170109237A (en) 2015-02-04 2017-09-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, method of manufacturing semiconductor device, or display device including semiconductor device
US9660100B2 (en) 2015-02-06 2017-05-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2016125044A1 (en) 2015-02-06 2016-08-11 Semiconductor Energy Laboratory Co., Ltd. Device, manufacturing method thereof, and electronic device
JP6717604B2 (en) 2015-02-09 2020-07-01 株式会社半導体エネルギー研究所 Semiconductor device, central processing unit and electronic equipment
JP6674269B2 (en) 2015-02-09 2020-04-01 株式会社半導体エネルギー研究所 Semiconductor device and method for manufacturing semiconductor device
WO2016128859A1 (en) 2015-02-11 2016-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN107210230B (en) 2015-02-12 2022-02-11 株式会社半导体能源研究所 Oxide semiconductor film and semiconductor device
JP2016154225A (en) 2015-02-12 2016-08-25 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of the same
US9818880B2 (en) 2015-02-12 2017-11-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
JP6758844B2 (en) 2015-02-13 2020-09-23 株式会社半導体エネルギー研究所 Display device
US10403646B2 (en) 2015-02-20 2019-09-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9991394B2 (en) 2015-02-20 2018-06-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method thereof
US9489988B2 (en) 2015-02-20 2016-11-08 Semiconductor Energy Laboratory Co., Ltd. Memory device
JP6711642B2 (en) 2015-02-25 2020-06-17 株式会社半導体エネルギー研究所 Semiconductor device
JP6739185B2 (en) 2015-02-26 2020-08-12 株式会社半導体エネルギー研究所 Storage system and storage control circuit
US9653613B2 (en) 2015-02-27 2017-05-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9685560B2 (en) 2015-03-02 2017-06-20 Semiconductor Energy Laboratory Co., Ltd. Transistor, method for manufacturing transistor, semiconductor device, and electronic device
TWI718125B (en) 2015-03-03 2021-02-11 日商半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
CN107406966B (en) 2015-03-03 2020-11-20 株式会社半导体能源研究所 Oxide semiconductor film, semiconductor device including the same, and display device including the semiconductor device
KR102509582B1 (en) 2015-03-03 2023-03-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, manufacturing method thereof, or display device including the same
US9905700B2 (en) 2015-03-13 2018-02-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device or memory device and driving method thereof
CN114546158A (en) 2015-03-17 2022-05-27 株式会社半导体能源研究所 Touch screen
US9882061B2 (en) 2015-03-17 2018-01-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US10008609B2 (en) 2015-03-17 2018-06-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, or display device including the same
US9964799B2 (en) 2015-03-17 2018-05-08 Semiconductor Energy Laboratory Co., Ltd. Display device, display module, and electronic device
US10134332B2 (en) 2015-03-18 2018-11-20 Semiconductor Energy Laboratory Co., Ltd. Display device, electronic device, and driving method of display device
JP6662665B2 (en) 2015-03-19 2020-03-11 株式会社半導体エネルギー研究所 Liquid crystal display device and electronic equipment using the liquid crystal display device
US10147823B2 (en) 2015-03-19 2018-12-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102582523B1 (en) 2015-03-19 2023-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and electronic device
US9634048B2 (en) 2015-03-24 2017-04-25 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
US9842938B2 (en) 2015-03-24 2017-12-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including semiconductor device
KR20160114511A (en) 2015-03-24 2016-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
US10429704B2 (en) 2015-03-26 2019-10-01 Semiconductor Energy Laboratory Co., Ltd. Display device, display module including the display device, and electronic device including the display device or the display module
US10096715B2 (en) 2015-03-26 2018-10-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, and electronic device
JP6736321B2 (en) 2015-03-27 2020-08-05 株式会社半導体エネルギー研究所 Method of manufacturing semiconductor device
TWI695513B (en) 2015-03-27 2020-06-01 日商半導體能源研究所股份有限公司 Semiconductor device and electronic device
US9806200B2 (en) 2015-03-27 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI777164B (en) 2015-03-30 2022-09-11 日商半導體能源研究所股份有限公司 Method for manufacturing semiconductor device
US9716852B2 (en) 2015-04-03 2017-07-25 Semiconductor Energy Laboratory Co., Ltd. Broadcast system
US10389961B2 (en) 2015-04-09 2019-08-20 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
KR102546189B1 (en) 2015-04-13 2023-06-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US10372274B2 (en) 2015-04-13 2019-08-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and touch panel
US10460984B2 (en) 2015-04-15 2019-10-29 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating electrode and semiconductor device
US10056497B2 (en) 2015-04-15 2018-08-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9916791B2 (en) 2015-04-16 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Display device, electronic device, and method for driving display device
US10192995B2 (en) 2015-04-28 2019-01-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US10002970B2 (en) 2015-04-30 2018-06-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of the same, or display device including the same
US10671204B2 (en) 2015-05-04 2020-06-02 Semiconductor Energy Laboratory Co., Ltd. Touch panel and data processor
KR102549926B1 (en) 2015-05-04 2023-06-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, method for manufacturing the same, and electronic device
JP6681780B2 (en) 2015-05-07 2020-04-15 株式会社半導体エネルギー研究所 Display systems and electronic devices
DE102016207737A1 (en) 2015-05-11 2016-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the semiconductor device, tire and moving object
TWI693719B (en) 2015-05-11 2020-05-11 日商半導體能源研究所股份有限公司 Manufacturing method of semiconductor device
US11728356B2 (en) 2015-05-14 2023-08-15 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion element and imaging device
JP6935171B2 (en) 2015-05-14 2021-09-15 株式会社半導体エネルギー研究所 Semiconductor device
US9627034B2 (en) 2015-05-15 2017-04-18 Semiconductor Energy Laboratory Co., Ltd. Electronic device
KR20240014632A (en) 2015-05-22 2024-02-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and display device including the semiconductor device
US9837547B2 (en) 2015-05-22 2017-12-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide conductor and display device including the semiconductor device
JP2016225614A (en) 2015-05-26 2016-12-28 株式会社半導体エネルギー研究所 Semiconductor device
JP6773453B2 (en) 2015-05-26 2020-10-21 株式会社半導体エネルギー研究所 Storage devices and electronic devices
US10139663B2 (en) 2015-05-29 2018-11-27 Semiconductor Energy Laboratory Co., Ltd. Input/output device and electronic device
KR102553553B1 (en) 2015-06-12 2023-07-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Imaging device, method for operating the same, and electronic device
KR102593883B1 (en) 2015-06-19 2023-10-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device, manufacturing method thereof, and electronic device
US9860465B2 (en) 2015-06-23 2018-01-02 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
US9935633B2 (en) 2015-06-30 2018-04-03 Semiconductor Energy Laboratory Co., Ltd. Logic circuit, semiconductor device, electronic component, and electronic device
US10290573B2 (en) 2015-07-02 2019-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US9917209B2 (en) 2015-07-03 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device including step of forming trench over semiconductor
WO2017006207A1 (en) 2015-07-08 2017-01-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2017022377A (en) 2015-07-14 2017-01-26 株式会社半導体エネルギー研究所 Semiconductor device
US10501003B2 (en) 2015-07-17 2019-12-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, lighting device, and vehicle
US10985278B2 (en) 2015-07-21 2021-04-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US10978489B2 (en) 2015-07-24 2021-04-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display panel, method for manufacturing semiconductor device, method for manufacturing display panel, and information processing device
US11024725B2 (en) 2015-07-24 2021-06-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including metal oxide film
US11189736B2 (en) 2015-07-24 2021-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US10424671B2 (en) 2015-07-29 2019-09-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, circuit board, and electronic device
US10585506B2 (en) 2015-07-30 2020-03-10 Semiconductor Energy Laboratory Co., Ltd. Display device with high visibility regardless of illuminance of external light
US10019025B2 (en) 2015-07-30 2018-07-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
CN106409919A (en) 2015-07-30 2017-02-15 株式会社半导体能源研究所 Semiconductor device and display device including the semiconductor device
US9825177B2 (en) 2015-07-30 2017-11-21 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of a semiconductor device using multiple etching mask
US9876946B2 (en) 2015-08-03 2018-01-23 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
JP6725357B2 (en) 2015-08-03 2020-07-15 株式会社半導体エネルギー研究所 Semiconductor device and method for manufacturing semiconductor device
JP6791661B2 (en) 2015-08-07 2020-11-25 株式会社半導体エネルギー研究所 Display panel
US9893202B2 (en) 2015-08-19 2018-02-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US9666606B2 (en) 2015-08-21 2017-05-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP2017041877A (en) 2015-08-21 2017-02-23 株式会社半導体エネルギー研究所 Semiconductor device, electronic component, and electronic apparatus
US9773919B2 (en) 2015-08-26 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2017037564A1 (en) 2015-08-28 2017-03-09 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor, transistor, and semiconductor device
US9911756B2 (en) 2015-08-31 2018-03-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including transistor and electronic device surrounded by layer having assigned band gap to prevent electrostatic discharge damage
JP2017050537A (en) 2015-08-31 2017-03-09 株式会社半導体エネルギー研究所 Semiconductor device
JP6807683B2 (en) 2015-09-11 2021-01-06 株式会社半導体エネルギー研究所 Input / output panel
SG10201607278TA (en) 2015-09-18 2017-04-27 Semiconductor Energy Lab Co Ltd Semiconductor device and electronic device
JP2017063420A (en) 2015-09-25 2017-03-30 株式会社半導体エネルギー研究所 Semiconductor device
CN108140657A (en) 2015-09-30 2018-06-08 株式会社半导体能源研究所 Semiconductor device and electronic equipment
WO2017064587A1 (en) 2015-10-12 2017-04-20 Semiconductor Energy Laboratory Co., Ltd. Display panel, input/output device, data processor, and method for manufacturing display panel
WO2017064590A1 (en) 2015-10-12 2017-04-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9852926B2 (en) 2015-10-20 2017-12-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for semiconductor device
WO2017068491A1 (en) 2015-10-23 2017-04-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP2017102904A (en) 2015-10-23 2017-06-08 株式会社半導体エネルギー研究所 Semiconductor device and electronic device
US10007161B2 (en) 2015-10-26 2018-06-26 Semiconductor Energy Laboratory Co., Ltd. Display device
SG10201608814YA (en) 2015-10-29 2017-05-30 Semiconductor Energy Lab Co Ltd Semiconductor device and method for manufacturing the semiconductor device
US9773787B2 (en) 2015-11-03 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, electronic device, or method for driving the semiconductor device
US9741400B2 (en) 2015-11-05 2017-08-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, electronic device, and method for operating the semiconductor device
JP6796461B2 (en) 2015-11-18 2020-12-09 株式会社半導体エネルギー研究所 Semiconductor devices, computers and electronic devices
JP6887243B2 (en) 2015-12-11 2021-06-16 株式会社半導体エネルギー研究所 Transistors, semiconductor devices, electronic devices and semi-conducting wafers
JP2018032839A (en) 2015-12-11 2018-03-01 株式会社半導体エネルギー研究所 Transistor, circuit, semiconductor device, display device, and electronic apparatus
JP2017112374A (en) 2015-12-16 2017-06-22 株式会社半導体エネルギー研究所 Transistor, semiconductor device, and electronic apparatus
WO2017103731A1 (en) 2015-12-18 2017-06-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the same
US10177142B2 (en) 2015-12-25 2019-01-08 Semiconductor Energy Laboratory Co., Ltd. Circuit, logic circuit, processor, electronic component, and electronic device
CN113327948A (en) 2015-12-28 2021-08-31 株式会社半导体能源研究所 Semiconductor device and display device including the same
JP6851814B2 (en) 2015-12-29 2021-03-31 株式会社半導体エネルギー研究所 Transistor
CN113105213A (en) 2015-12-29 2021-07-13 株式会社半导体能源研究所 Metal oxide film and semiconductor device
JP2017135698A (en) 2015-12-29 2017-08-03 株式会社半導体エネルギー研究所 Semiconductor device, computer, and electronic device
JP6827328B2 (en) 2016-01-15 2021-02-10 株式会社半導体エネルギー研究所 Semiconductor devices and electronic devices
CN108474106B (en) 2016-01-18 2021-02-26 株式会社半导体能源研究所 Metal oxide film, semiconductor device, and display device
US9905657B2 (en) 2016-01-20 2018-02-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP6822853B2 (en) 2016-01-21 2021-01-27 株式会社半導体エネルギー研究所 Storage device and driving method of storage device
US10411013B2 (en) 2016-01-22 2019-09-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and memory device
US10700212B2 (en) 2016-01-28 2020-06-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, semiconductor wafer, module, electronic device, and manufacturing method thereof
US10115741B2 (en) 2016-02-05 2018-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US10250247B2 (en) 2016-02-10 2019-04-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, electronic component, and electronic device
KR102655935B1 (en) 2016-02-12 2024-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and display device including the semiconductor device
JP6970511B2 (en) 2016-02-12 2021-11-24 株式会社半導体エネルギー研究所 Transistor
US9954003B2 (en) 2016-02-17 2018-04-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
WO2017149428A1 (en) 2016-03-04 2017-09-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and display device including the semiconductor device
US10263114B2 (en) 2016-03-04 2019-04-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, or display device including the same
WO2017149413A1 (en) 2016-03-04 2017-09-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6904730B2 (en) 2016-03-08 2021-07-21 株式会社半導体エネルギー研究所 Imaging device
US9882064B2 (en) 2016-03-10 2018-01-30 Semiconductor Energy Laboratory Co., Ltd. Transistor and electronic device
US10096720B2 (en) 2016-03-25 2018-10-09 Semiconductor Energy Laboratory Co., Ltd. Transistor, semiconductor device, and electronic device
JP6668455B2 (en) 2016-04-01 2020-03-18 株式会社半導体エネルギー研究所 Method for manufacturing oxide semiconductor film
US10236875B2 (en) 2016-04-15 2019-03-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for operating the semiconductor device
KR102295315B1 (en) 2016-04-15 2021-08-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor devices, electronic components, and electronic devices
KR102358829B1 (en) 2016-05-19 2022-02-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Composite Oxide Semiconductors and Transistors
WO2017208119A1 (en) 2016-06-03 2017-12-07 Semiconductor Energy Laboratory Co., Ltd. Metal oxide and field-effect transistor
KR102330605B1 (en) 2016-06-22 2021-11-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device
US10411003B2 (en) 2016-10-14 2019-09-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN114115609A (en) 2016-11-25 2022-03-01 株式会社半导体能源研究所 Display device and working method thereof
CN110114897B (en) * 2016-12-28 2021-08-31 柯尼卡美能达株式会社 Electronic device
JP7258754B2 (en) 2017-07-31 2023-04-17 株式会社半導体エネルギー研究所 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
JP6782211B2 (en) * 2017-09-08 2020-11-11 株式会社東芝 Transparent electrodes, devices using them, and methods for manufacturing devices
WO2019145803A1 (en) 2018-01-24 2019-08-01 株式会社半導体エネルギー研究所 Semiconductor device, electronic component, and electronic apparatus
US11209877B2 (en) 2018-03-16 2021-12-28 Semiconductor Energy Laboratory Co., Ltd. Electrical module, display panel, display device, input/output device, data processing device, and method of manufacturing electrical module
CN108899436B (en) 2018-06-29 2020-03-06 京东方科技集团股份有限公司 Packaging structure, display panel, display device and manufacturing method thereof
JPWO2020012276A1 (en) 2018-07-09 2021-08-12 株式会社半導体エネルギー研究所 Semiconductor device
TWI690060B (en) * 2019-04-25 2020-04-01 元太科技工業股份有限公司 Memory structure and manufacturing method thereof
WO2020240331A1 (en) 2019-05-31 2020-12-03 株式会社半導体エネルギー研究所 Semiconductor device and wireless communication device including said semiconductor device

Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127789A (en) 1985-11-29 1987-06-10 日産自動車株式会社 Thin film el panel
US5540999A (en) * 1993-09-09 1996-07-30 Takakazu Yamamoto EL element using polythiophene
US5618392A (en) * 1991-10-31 1997-04-08 Tanaka Kikinzoku Kogyo K.K. Gas diffusion electrode
JP2686169B2 (en) 1990-07-11 1997-12-08 シャープ株式会社 Thin film EL panel
US5703436A (en) * 1994-12-13 1997-12-30 The Trustees Of Princeton University Transparent contacts for organic devices
JP2000208252A (en) 1999-01-14 2000-07-28 Tdk Corp Organic electroluminescent element
JP2000294369A (en) 1999-04-05 2000-10-20 Chisso Corp Organic el element
US6198217B1 (en) * 1997-05-12 2001-03-06 Matsushita Electric Industrial Co., Ltd. Organic electroluminescent device having a protective covering comprising organic and inorganic layers
US6337492B1 (en) * 1997-07-11 2002-01-08 Emagin Corporation Serially-connected organic light emitting diode stack having conductors sandwiching each light emitting layer
JP2002033187A (en) 2000-05-08 2002-01-31 Futaba Corp Organic el element
US20020125817A1 (en) * 1999-09-22 2002-09-12 Shunpei Yamazaki EL display device and electronic device
JP2002533877A (en) 1998-12-22 2002-10-08 デイビッド・システムズ・テクノロジー・ソシエダッド・リミターダ Membrane-electrode assembly and method of manufacturing the same
US20020180347A1 (en) * 2001-03-02 2002-12-05 Chihaya Adachi Double doped-layer, phosphorescent organic light emitting devices
US20020185967A1 (en) * 1997-09-01 2002-12-12 Friend Richard Henry Display device with improved contrast
US20030137242A1 (en) * 2001-12-18 2003-07-24 Seiko Epson Corporation Display apparatus, electric device, and manufacturing method of display apparatus
US20030151355A1 (en) * 2000-02-16 2003-08-14 Idemitsu Kosan Co., Ltd. Actively driven organic EL device and manufacturing method thereof
US20040046496A1 (en) * 2002-08-14 2004-03-11 Masayuki Mishima Light-emitting device and its production
US20040051444A1 (en) * 2002-09-17 2004-03-18 General Electric Company Articles having raised features and methods for making the same
US20040119399A1 (en) * 2002-09-12 2004-06-24 Pioneer Corporation Organic electroluminescence display and method of fabricating the same
US20040157167A1 (en) * 2002-12-26 2004-08-12 Seiko Epson Corporation Manufacturing method of organic electroluminescent device, organic electroluminescent device, and electronic apparatus
US20040169467A1 (en) * 2001-05-11 2004-09-02 Pioneer Corporation Luminescent display device and method of manufacturing same
US20050008893A1 (en) * 2003-07-10 2005-01-13 Kawamura Institute Of Chemical Research Diarylamino group-containing copolymer, organic electroluminescent device, and method of producing hole transport layer for organic electroluminescent device
US20050057136A1 (en) * 2003-08-19 2005-03-17 Seiko Epson Corporation Electrode, method for forming an electrode, thin-film transistor, electronic circuit, organic electroluminescent element, display, and electronic equipment
WO2005088594A1 (en) * 2004-03-12 2005-09-22 Fujitsu Limited Display and method for driving same
US20050237279A1 (en) * 2004-04-21 2005-10-27 Wen-Kuen Chen Bottom and top emission OLED pixel structure
US20050269568A1 (en) * 2004-06-08 2005-12-08 Jae-Bon Koo Organic thin film transistor and flat panel display comprising the same
US20060102896A1 (en) 2004-11-15 2006-05-18 Suh Min-Chul Organic thin film transistor
US20060113549A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Light-emitting device
US20070057932A1 (en) * 2005-09-13 2007-03-15 Shin Hyun S Flat panel display and organic light emitting display

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127789A (en) 1985-11-29 1987-06-10 日産自動車株式会社 Thin film el panel
JP2686169B2 (en) 1990-07-11 1997-12-08 シャープ株式会社 Thin film EL panel
US5618392A (en) * 1991-10-31 1997-04-08 Tanaka Kikinzoku Kogyo K.K. Gas diffusion electrode
US5540999A (en) * 1993-09-09 1996-07-30 Takakazu Yamamoto EL element using polythiophene
US5703436A (en) * 1994-12-13 1997-12-30 The Trustees Of Princeton University Transparent contacts for organic devices
US6198217B1 (en) * 1997-05-12 2001-03-06 Matsushita Electric Industrial Co., Ltd. Organic electroluminescent device having a protective covering comprising organic and inorganic layers
US6337492B1 (en) * 1997-07-11 2002-01-08 Emagin Corporation Serially-connected organic light emitting diode stack having conductors sandwiching each light emitting layer
US20020185967A1 (en) * 1997-09-01 2002-12-12 Friend Richard Henry Display device with improved contrast
JP2002533877A (en) 1998-12-22 2002-10-08 デイビッド・システムズ・テクノロジー・ソシエダッド・リミターダ Membrane-electrode assembly and method of manufacturing the same
US6685806B1 (en) 1998-12-22 2004-02-03 David Fuel Cell Components, S.L. Membrane electrode assembly and method of its production
JP2000208252A (en) 1999-01-14 2000-07-28 Tdk Corp Organic electroluminescent element
US6635988B1 (en) 1999-04-05 2003-10-21 Chisso Corporation Organic el device
JP2000294369A (en) 1999-04-05 2000-10-20 Chisso Corp Organic el element
US20020125817A1 (en) * 1999-09-22 2002-09-12 Shunpei Yamazaki EL display device and electronic device
US20030151355A1 (en) * 2000-02-16 2003-08-14 Idemitsu Kosan Co., Ltd. Actively driven organic EL device and manufacturing method thereof
JP2002033187A (en) 2000-05-08 2002-01-31 Futaba Corp Organic el element
US6656609B2 (en) 2000-05-08 2003-12-02 Futaba Corporation Organic EL element
US20020180347A1 (en) * 2001-03-02 2002-12-05 Chihaya Adachi Double doped-layer, phosphorescent organic light emitting devices
US20040169467A1 (en) * 2001-05-11 2004-09-02 Pioneer Corporation Luminescent display device and method of manufacturing same
US20030137242A1 (en) * 2001-12-18 2003-07-24 Seiko Epson Corporation Display apparatus, electric device, and manufacturing method of display apparatus
US20040046496A1 (en) * 2002-08-14 2004-03-11 Masayuki Mishima Light-emitting device and its production
US20040119399A1 (en) * 2002-09-12 2004-06-24 Pioneer Corporation Organic electroluminescence display and method of fabricating the same
US20040051444A1 (en) * 2002-09-17 2004-03-18 General Electric Company Articles having raised features and methods for making the same
US20040157167A1 (en) * 2002-12-26 2004-08-12 Seiko Epson Corporation Manufacturing method of organic electroluminescent device, organic electroluminescent device, and electronic apparatus
US20050008893A1 (en) * 2003-07-10 2005-01-13 Kawamura Institute Of Chemical Research Diarylamino group-containing copolymer, organic electroluminescent device, and method of producing hole transport layer for organic electroluminescent device
US20050057136A1 (en) * 2003-08-19 2005-03-17 Seiko Epson Corporation Electrode, method for forming an electrode, thin-film transistor, electronic circuit, organic electroluminescent element, display, and electronic equipment
WO2005088594A1 (en) * 2004-03-12 2005-09-22 Fujitsu Limited Display and method for driving same
US20080238828A1 (en) * 2004-03-12 2008-10-02 Fuji Photo Film Co., Ltd. Display Apparatus and Driving Method for the Same
US20050237279A1 (en) * 2004-04-21 2005-10-27 Wen-Kuen Chen Bottom and top emission OLED pixel structure
US20050269568A1 (en) * 2004-06-08 2005-12-08 Jae-Bon Koo Organic thin film transistor and flat panel display comprising the same
US20060113549A1 (en) 2004-11-10 2006-06-01 Canon Kabushiki Kaisha Light-emitting device
JP2006186319A (en) 2004-11-10 2006-07-13 Canon Inc Light emitting device and indicating device
US20060102896A1 (en) 2004-11-15 2006-05-18 Suh Min-Chul Organic thin film transistor
JP2006148054A (en) 2004-11-15 2006-06-08 Samsung Sdi Co Ltd Organic thin film transistor and flat panel display comprising it
US20070057932A1 (en) * 2005-09-13 2007-03-15 Shin Hyun S Flat panel display and organic light emitting display

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150349128A1 (en) * 2014-05-27 2015-12-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20160018678A1 (en) * 2014-07-18 2016-01-21 Samsung Display Co., Ltd. Organic light emitting display devices

Also Published As

Publication number Publication date
CN101154716A (en) 2008-04-02
CN101154716B (en) 2010-12-15
JP2008084642A (en) 2008-04-10
US20080106191A1 (en) 2008-05-08
JP4274219B2 (en) 2009-06-03
KR101367858B1 (en) 2014-02-27
KR20080028775A (en) 2008-04-01

Similar Documents

Publication Publication Date Title
US8553312B2 (en) Electronic device, organic electroluminescence device, and organic thin film semiconductor device
TWI375346B (en) Metal compound-metal multilayer electrodes for organic electronic devices
KR101295988B1 (en) Stacked organic electroluminescent devices
US9515288B2 (en) Organic electroluminescent device
US20100117072A1 (en) Light emitting apparatus and method of manufacturing the same
KR20060105587A (en) Organic electroluminescent device
JP2006269323A (en) Organic semiconductor device
CN111725422A (en) Display panel, preparation method thereof and display device
US20050221122A1 (en) Organic electroluminescence device, manufacturing method thereof and electronic equipment
CN100477129C (en) Thin film transistor, organic electro-luminescent display unit and making method thereof
JP2007053041A (en) Organic light emitting element
US7741163B2 (en) Method of fabricating thin film transistor and organic electro-luminescent display device
WO2004062321A1 (en) Organic el device and organic el display
JP5035255B2 (en) Electrophoretic display device
US9525152B2 (en) Permeable electrodes for high performance organic electronic devices
US20180198087A1 (en) Organic light-emitting component and method for producing an organic light-emitting component
Fukagawa et al. P‐154: Fabrication of 8‐Inch VGA Flexible Display Using Air‐Stable Inverted OLED
CN111584568B (en) Display device and method for manufacturing the same
US20060177690A1 (en) Tri-layer PLED devices with both room-temperature and high-temperature operational stability
JP4272145B2 (en) Organic electroluminescent device and organic electroluminescent display device having the same
CN113871553A (en) Light emitting layer patterning method and preparation method of light emitting diode device
JP4730132B2 (en) Manufacturing method of organic EL device
JP2007234729A (en) Organic el device and electronic equipment
KR100567220B1 (en) Organic light emitting device and display on the basis of organic light emitting device with improved effciency
CN117560948A (en) Perovskite light-emitting transistor and preparation method thereof

Legal Events

Date Code Title Description
AS Assignment

Owner name: SEIKO EPSON CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KAWASE, TAKEO;REEL/FRAME:019746/0866

Effective date: 20070821

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.)

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20171008