CN111584568B - Display device and method for manufacturing the same - Google Patents
Display device and method for manufacturing the same Download PDFInfo
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- CN111584568B CN111584568B CN202010398851.1A CN202010398851A CN111584568B CN 111584568 B CN111584568 B CN 111584568B CN 202010398851 A CN202010398851 A CN 202010398851A CN 111584568 B CN111584568 B CN 111584568B
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- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 title description 12
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000000463 material Substances 0.000 claims description 85
- 239000002096 quantum dot Substances 0.000 claims description 28
- 238000002161 passivation Methods 0.000 claims description 19
- 239000002274 desiccant Substances 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 229920000620 organic polymer Polymers 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 222
- 239000010408 film Substances 0.000 description 72
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 8
- -1 acryl Chemical group 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- ZBFOLPMOGPIUGP-UHFFFAOYSA-N dizinc;oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Zn+2].[Zn+2] ZBFOLPMOGPIUGP-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The application provides a display device and a preparation method thereof, wherein the display device comprises an array substrate, a first pixel definition layer, an organic light emitting diode, a first flat layer, a second pixel definition layer and a color film layer, the first pixel definition layer is arranged on the array substrate and comprises a plurality of first through holes, the organic light emitting diode is arranged in the first through holes to be electrically connected with the array substrate, the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, the first flat layer is arranged on the first pixel definition layer and the organic light emitting diode, the second pixel definition layer is arranged on the first flat layer, the second pixel definition layer comprises a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, and the color film layer is arranged in the plurality of second through holes, the plurality of third through holes and the plurality of fourth through holes. The display performance and the service life of the display device are improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display device and a preparation method thereof.
Background
An OLED (Organic Light-Emitting Diode) has been widely focused on its characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, low power consumption, etc., and as a new generation display mode, has been gradually replaced with a conventional LCD (liquid crystal display ), and has been widely used in mobile phone screens, computer displays, full-color televisions, etc. The OLED can be classified into a top emission type and a bottom emission type according to light emitting characteristics, and has a slim characteristic. However, the conventional display device has the problems of poor display performance and low service life.
Disclosure of Invention
The application provides a display device and a preparation method thereof, which are used for solving the problems of weak form performance and low service life of the display device in the prior art.
The present application provides a display device including:
an array substrate;
the first pixel definition layer is arranged on the array substrate and comprises a plurality of first through holes, and the first through holes penetrate through the first pixel definition layer to expose the array substrate;
the organic light-emitting diode is arranged in the first through hole to be electrically connected with the array substrate, and comprises one of a blue organic light-emitting diode and an ultraviolet organic light-emitting diode;
a first planarization layer disposed on the first pixel definition layer and the organic light emitting diode;
the second pixel definition layer is arranged on the first flat layer, and comprises a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, and the second through holes, the third through holes and the fourth through holes penetrate through the second pixel definition layer to expose the first flat layer; and
the color film layer is arranged in the second through holes, the third through holes and the fourth through holes.
In the display device provided by the application, the color film layer comprises a plurality of first color film parts, a plurality of second color film parts and a plurality of third color film parts, wherein each first color film part is arranged in one second through hole, each second color film part is arranged in one third through hole, and each third color film part is arranged in one fourth through hole.
In the display device provided by the application, the material of the first color film part comprises a red quantum dot material, the material of the second color film part comprises a green quantum dot material, and the material of the third color film part comprises one of a blue quantum dot material and an acrylic material.
In the display device provided by the application, the first color film part is excited by the organic light emitting diode to emit red light, the second color film part is excited by the organic light emitting diode to emit green light, and the third color film part is excited by the organic light emitting diode to emit blue light.
In the display device provided by the application, the material of the first color film part, the material of the second color film part and the material of the third color film part further comprise a liquid desiccant.
In the display device provided by the application, the structural formula of the liquid desiccant comprisesWherein the R is 1 Radicals, R 2 Radicals and R 3 The structural formula of the group is C n H 2n+1 ，n＝1-20。
In the display device provided by the application, the display device further comprises a passivation layer, and the passivation layer is arranged on the first pixel definition layer and the organic light emitting diode.
The application also provides a preparation method of the display device, which comprises the following steps:
providing a carrier substrate;
arranging an array substrate on the carrier substrate;
forming a first pixel definition layer on the array substrate, wherein the first pixel definition layer comprises a plurality of first through holes, and the first through holes penetrate through the first pixel definition layer to expose the array substrate;
an organic light emitting diode is arranged in the first through hole, and is electrically connected with the array substrate, wherein the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode;
forming a first planarization layer on the first pixel defining layer and the organic light emitting diode;
forming a second pixel defining layer on the first planarization layer, the second pixel defining layer including a plurality of second through holes, a plurality of third through holes, and a plurality of fourth through holes, the plurality of second through holes, the plurality of third through holes, and the plurality of fourth through holes penetrating the second pixel defining layer to expose the first planarization layer;
arranging color film layers in the second through holes, the third through holes and the fourth through holes; and
and separating the carrier substrate from the array substrate.
In the method for manufacturing a display device provided by the present application, the first through hole is provided with an organic light emitting diode, the organic light emitting diode is electrically connected with the array substrate, and after the step of the organic light emitting diode including one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, the method further includes:
and forming a passivation layer on the first pixel defining layer and the organic light emitting diode.
In the method for manufacturing a display device provided by the present application, after the step of disposing the color film layer in the plurality of second through holes, the plurality of third through holes, and the plurality of fourth through holes, the method further includes:
and forming an encapsulation layer on the second pixel definition layer and the organic light emitting diode.
The application provides a display device and a preparation method thereof, wherein the display device comprises an array substrate, a first pixel definition layer, an organic light emitting diode, a first flat layer, a second pixel definition layer and a color film layer, wherein the first pixel definition layer is arranged on the array substrate and comprises a plurality of first through holes, the first through holes penetrate through the first pixel definition layer to expose the array substrate, the organic light emitting diode is arranged in the first through holes to be electrically connected with the array substrate, the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, the first flat layer is arranged on the first pixel definition layer and the organic light emitting diode, the second pixel definition layer is arranged on the first flat layer, the second pixel definition layer comprises a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, the plurality of third through holes and the fourth through holes penetrate through the first through holes to expose the first flat layer, the second through holes and the fourth through holes. In the application, the organic light-emitting diode is adopted to excite the color film layer to emit light, thereby improving the display performance and prolonging the service life of the display device.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a cross-sectional view of a first structure of a display device according to the present application.
Fig. 2 is a structural cross-sectional view of an array substrate provided by the present application.
Fig. 3 is a cross-sectional view of an organic light emitting diode according to the present application.
Fig. 4 is a cross-sectional view of a second structure of the display device according to the present application.
Fig. 5 is a flowchart of a method for manufacturing a display device according to the present application.
Fig. 6 is a flow cross-sectional view of a method for manufacturing a display device according to the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
Referring to fig. 1, fig. 1 is a cross-sectional view of a first structure of a display device according to the present application. The present application provides a display device 10. The display device 10 includes an array substrate 100, a first pixel defining layer 200, an organic light emitting diode 300, a first planarization layer 400, a second pixel defining layer 500, and a color film layer 600.
Referring to fig. 2, fig. 2 is a cross-sectional view of an array substrate according to the present application. The array substrate 100 includes a flexible substrate 110 and a thin film crystalTube layer 120. The material of the flexible substrate 110 includes polyimide. The thin film transistor layer 120 is disposed on the flexible substrate 110. The thin film transistor 120 includes a buffer layer 121, an active layer 122, a gate insulating layer 123, a gate layer 124, an interlayer dielectric layer 125, a source electrode 126, and a drain electrode 127. The buffer layer 121 is disposed on the substrate 110. The material of the buffer layer 121 comprises SiO x And SiN x . The active layer 122 is disposed on the buffer layer 121. The material of the active layer 122 includes indium gallium zinc oxide, indium zinc tin oxide, gallium zinc oxide, zinc oxynitride, and indium gallium zinc titanium oxide. The gate insulating layer 123 is disposed on the active layer 122. The material of the gate insulating layer 123 includes SiO x And SiN x . The gate electrode layer 124 is disposed on the gate insulating layer 123. The material of the gate layer 124 includes one or a combination of Mo, al, cu, and Ti. The interlayer dielectric layer 125 covers the buffer layer 121, the active layer 122, the gate insulating layer 123, and the gate layer 124. The interlayer dielectric layer 125 has a fifth via 1251 and a sixth via 1252. The fifth via 1251 penetrates the interlayer dielectric layer 125 to expose one side of the active layer 122. The sixth via 1252 penetrates the interlayer dielectric layer 125 to expose the other side of the active layer 122. The material of the interlayer dielectric layer 125 comprises SiO x And SiN x . The source electrode 126 is filled in the fifth via 1251 and on the interlayer dielectric layer 125 to electrically connect the active layer 122. The drain electrode 127 is filled in the sixth via hole 1252 and on the interlayer dielectric layer 125 to electrically connect the active layer 122. The materials of the source electrode 126 and the drain electrode 127 include one or a combination of several of Mo, al, cu, and Ti.
In another embodiment, the display device 10 further includes a second planarization layer 700. The second planarization layer 700 is disposed on the array substrate 100. The material of the second flat layer 700 includes polyimide. The second planarization layer 700 is used for planarizing the thin film transistor layer 120.
The first pixel defining layer 200 is disposed on the array substrate 100. The first pixel definition layer 200 includes a number of first via holes 210. The first via hole 210 penetrates the first pixel defining layer 200 to expose the array substrate 100. The material of the first pixel defining layer 200 includes polyimide.
Referring to fig. 3, fig. 3 is a cross-sectional view of an organic light emitting diode according to the present application. The organic light emitting diode 300 is disposed in the first through hole 210 to electrically connect the array substrate 100. The organic light emitting diode 300 includes one or a combination of two of a blue organic light emitting diode and an ultraviolet organic light emitting diode. In this embodiment, the organic light emitting diode 300 is an ultraviolet organic light emitting diode. The organic light emitting diode 300 includes an anode 310, a hole injection layer 320, a hole transport layer 330, a light emitting layer 340, an electron transport layer 350, an electron injection layer 360, and a cathode 370. The hole injection layer 320 is disposed on the anode layer 310. The anode layer 310 is made of a material including one or a combination of several of indium tin oxide, aluminum and silver. The hole transport layer 330 is disposed on the hole injection layer 320. The light emitting layer 340 is disposed on the hole transport layer 330. The light emitting layer 340 includes one or a combination of two of a blue light emitting layer and an ultraviolet light emitting layer. The electron transport layer 350 is disposed on the light emitting layer 340. The electron injection layer 360 is disposed on the electron transport layer 350. The cathode 370 is disposed on the electron injection layer 360.
In another embodiment, the display device 10 further includes a passivation layer 800. The passivation layer 800 is disposed on the first pixel defining layer 200 and the organic light emitting diode 300. The passivation layer 800 serves to passivate and protect the cathode 370 of the organic light emitting diode 300.
The first planarization layer 400 is disposed on the first pixel defining layer 200 and the organic light emitting diode 300. The material of the first planarization layer 400 includes SiO x 、Al 2 O 3 And SiN x One or a combination of more than one of them.
In the present application, the first planarization layer 400 is used to planarize the passivation layer 800.
The second pixel defining layer 500 is disposed on the first planarization layer 400. The second pixel defining layer 500 includes a plurality of second through holes 510, a plurality of third through holes 520, and a plurality of fourth through holes 530. The number of second through holes 510, the number of third through holes 520, and the number of fourth through holes 530 penetrate the second pixel defining layer 500 to expose the first planarization layer 400. The material of the second pixel defining layer 500 includes a fluorine-containing organic polymer. The fluorine-containing organic polymer is used as the material of the second pixel definition layer, so that the hydrophobicity of the second pixel definition layer 500 is improved, and the contact angle between the organic solvent and the second pixel definition layer is more than 50 degrees and is used for isolating the quantum dot layer of the color film layer 600.
The color film layer 600 is disposed in the second through holes 510, the third through holes 520, and the fourth through holes 530. The color film layer 600 includes a plurality of first color film portions 610, a plurality of second color film portions 620, and a plurality of third color film portions 630. Each of the first color film portions 610 is disposed in one of the second through holes 510. The material of the first color film portion 610 includes a red quantum dot material. The first color film portion 610 is excited by the organic light emitting diode 300 to emit red light. Specifically, when the ultraviolet organic light emitting diode 300 emits ultraviolet light, the first color film portion 610 formed of the red quantum dot material is excited to emit red light. Each of the second color film portions 620 is disposed in one of the third through holes 520. The material of the second color film 620 includes a green quantum dot material. The second color film 620 is excited by the organic light emitting diode 300 to emit green light. Specifically, when the ultraviolet organic light emitting diode 300 emits ultraviolet light, the second color film portion 620 formed of the green quantum dot material is excited to emit green light. Each third color film portion 630 is disposed in one of the fourth through holes 530. The material of the third color film portion 630 includes one of a blue quantum dot material and an acryl material. In this embodiment, the material of the third color film portion 630 is an acrylic material. The third color film portion 630 is excited by the organic light emitting diode 300 to emit blue light. When the ultraviolet organic light emitting diode 300 emits ultraviolet light, the third color film portion 630 formed of acryl material is excited to emit blue light.
In another embodiment, theThe material of the first color film portion 610, the material of the second color film portion 620, and the material of the third color film portion 630 further include a liquid desiccant. Specifically, the structural formula of the liquid desiccant comprisesWherein the R is 1 Radicals, R 2 Radicals and R 3 The structural formula of the group is C n H 2n+1 N=1 to 20, and Al atoms in the liquid desiccant formula may be replaced with B or Ga. For example, a particular desiccant may beAnd->Etc.
In the application, the liquid desiccant is added into the red quantum dot material, the blue quantum dot material or the acrylic material and the green quantum dot material for adsorbing water vapor and oxygen, so that the organic light emitting diode is prevented from being corroded by the reaction of the organic light emitting diode.
In another embodiment, the display device 10 further includes an encapsulation layer 900. The encapsulation layer 900 is disposed on the second pixel defining layer 500 and the color film layer 600. The encapsulation layer 900 is used to protect functional layers in the display device 10. The encapsulation layer 900 includes a first inorganic layer 910, an organic layer 920, and a second inorganic layer 930. The material of the first inorganic layer 910 and the second inorganic layer 930 comprises SiO x And SiN x One or a combination of more than one of them. The material of the organic layer 920 includes an acryl material.
Referring to fig. 4, fig. 4 is a cross-sectional view of a second structure of the display device according to the present application. Fig. 4 is different from fig. 1 in that the organic light emitting diode 300 in fig. 4 is a blue organic light emitting diode, the first color film portion 610 is formed of a red quantum dot material, the second color film portion 620 is formed of a green quantum dot material, and the third color film portion 630 is formed of a blue quantum dot material. When the blue organic light emitting diode 300 emits blue light, the first color film portion 610 formed of the red quantum dot material is excited to emit red light, the second color film portion 620 formed of the green quantum dot material is excited to emit green light, and the third color film portion 630 formed of the blue quantum dot material is excited to emit blue light.
The application provides a display device, which comprises an array substrate, a first pixel definition layer, an organic light emitting diode, a first flat layer, a second pixel definition layer and a color film layer, wherein the first pixel definition layer is arranged on the array substrate, the first pixel definition layer comprises a plurality of first through holes, the first through holes penetrate through the first pixel definition layer to expose the array substrate, the organic light emitting diode is arranged in the first through holes to be electrically connected with the array substrate, the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, the first flat layer is arranged on the first pixel definition layer and the organic light emitting diode, the second pixel definition layer is arranged on the first flat layer, the second pixel definition layer comprises a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, the plurality of second through holes, the plurality of third through holes and the fourth through holes penetrate through the second pixel definition layer to be electrically connected with the array substrate, and the first flat layer, the second pixel definition layer and the plurality of fourth through holes are arranged in the second through holes and the plurality of fourth through holes. In the application, the blue or ultraviolet organic light-emitting diode is adopted to excite the color film layer to emit light, so that the light-emitting efficiency and the service life of the organic light-emitting diode are improved, and the display performance and the service life of the display device are further improved.
Referring to fig. 5, fig. 5 is a flowchart of a method for manufacturing a display device according to the present application. The application also provides a preparation method of the display device, which comprises the following steps:
20. a carrier substrate 101 is provided.
30. An array substrate 100 is provided on the carrier substrate 101.
An array substrate 100 is provided on the carrier substrate 101. The array substrate 100 includes a flexible substrate 110 and a thin film transistor layer 120. The material of the flexible substrate 110 includes polyimide. The thin film transistor layer 120 is disposed on the flexible substrate 110.
In another embodiment, after the step of disposing the array substrate 100 on the carrier substrate 101, the method further includes forming a second planarization layer 700 on the array substrate 100. The material of the second flat layer 700 includes polyimide. The second planarization layer 700 is used for planarizing the thin film transistor layer 120.
40. A first pixel defining layer 200 is formed on the array substrate 100. The first pixel definition layer 200 includes a number of first via holes 210. The first via hole 210 penetrates the first pixel defining layer 200 to expose the array substrate 100.
The material of the first pixel defining layer 200 includes polyimide.
50. An organic light emitting diode 300 is disposed in the first through hole 210. The organic light emitting diode 300 is electrically connected to the array substrate 100. The organic light emitting diode 300 includes one of a blue organic light emitting diode and an ultraviolet organic light emitting diode.
An anode 310, a hole injection layer 320, a hole transport layer 330, a light emitting layer 340, an electron transport layer 350, an electron injection layer 360, and a cathode 370 are sequentially stacked in the first through hole 210 by vacuum evaporation. The light emitting layer 340 includes one or a combination of two of a blue light emitting layer and an ultraviolet light emitting layer. In this embodiment, the light emitting layer 340 is an ultraviolet light emitting layer.
In another embodiment, after the step of disposing the organic light emitting diode 300 in the first via 210, a passivation layer 800 is further formed on the first pixel defining layer 200 and the organic light emitting diode 300. The passivation layer 800 serves to passivate and protect the cathode 370 of the organic light emitting diode 300.
60. A first planarization layer 400 is formed on the first pixel defining layer 200 and the organic light emitting diode 300.
The material of the first planarization layer 400 includes SiO x 、Al 2 O 3 And SiN x One or a combination of more than one of them. The first planarization layer 400 is used for planarizationThe passivation layer 800.
70. A second pixel defining layer 500 is formed on the first planarization layer 400. The second pixel defining layer 500 includes a plurality of second through holes 510, a plurality of third through holes 520, and a plurality of fourth through holes 530. The number of second through holes 510, the number of third through holes 520, and the number of fourth through holes 530 penetrate the second pixel defining layer 500 to expose the first planarization layer 400.
The material of the second pixel defining layer 500 includes a fluorine-containing organic polymer. The fluorine-containing organic polymer is used as the material of the second pixel definition layer, so that the hydrophobicity of the second pixel definition layer 500 is improved, and the contact angle between the organic solvent and the second pixel definition layer is more than 50 degrees and is used for isolating the quantum dot layer of the color film layer 600.
80. The color film layer 600 is disposed in the second through holes 510, the third through holes 520, and the fourth through holes 530.
Specifically, the color film layer 600 is formed by printing the color film layer 600 material in the second through holes 510, the third through holes 520 and the fourth through holes 530 in an inkjet printing manner. The color film layer 600 includes a plurality of first color film portions 610, a plurality of second color film portions 620, and a plurality of third color film portions 630. The first color film portion 610 is formed by printing red quantum dot material in the second through hole 510. The second color film part 620 is formed by printing green quantum dot material in the third through hole 520. The third color film portion 630 is formed by printing blue quantum dot material or acryl material in the fourth through hole 530. In this embodiment, the third color film portion 630 is formed of an acryl material. When the ultraviolet organic light emitting diode 300 emits blue light, the first color film portion 610 formed of the red quantum dot material is excited to emit red light, the second color film portion 620 formed of the green quantum dot material is excited to emit green light, and the third color film portion 630 formed of the acryl material is excited to emit blue light.
In another embodiment, after the step of disposing the color film layer 600 in the second through holes 510, the third through holes 520 and the fourth through holes 530, the method further includes:
an encapsulation layer 900 is formed on the second pixel defining layer 500 and the color film layer 600. The encapsulation layer 900 is used to protect functional layers in the display device 10. The encapsulation layer 900 includes a first inorganic layer 910, an organic layer 920, and a second inorganic layer 930. The material of the first inorganic layer 910 and the second inorganic layer 930 comprises SiO x And SiN x One or a combination of more than one of them. The material of the organic layer 920 includes an acryl material.
90. The carrier substrate 101 is separated from the array substrate 100.
Referring to fig. 6, fig. 6 is a flow cross-sectional view of a method for manufacturing a display device according to the present application. The carrier substrate 101 is separated from the array substrate 100, thereby obtaining the display device 10.
The application provides a display device and a preparation method thereof, wherein the display device comprises an array substrate, a first pixel definition layer, an organic light emitting diode, a first flat layer, a second pixel definition layer and a color film layer, wherein the first pixel definition layer is arranged on the array substrate and comprises a plurality of first through holes, the first through holes penetrate through the first pixel definition layer to expose the array substrate, the organic light emitting diode is arranged in the first through holes to be electrically connected with the array substrate, the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, the first flat layer is arranged on the first pixel definition layer and the organic light emitting diode, the second pixel definition layer is arranged on the first flat layer, the second pixel definition layer comprises a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, the plurality of third through holes and the fourth through holes penetrate through the first through holes to expose the first flat layer, the second through holes and the fourth through holes. In the application, the blue or ultraviolet organic light emitting diode is adopted to excite the emergent light of the color film layer, so that the display performance and the service life of the display device are improved.
The foregoing has provided a detailed description of embodiments of the application, with specific examples being set forth herein to provide a thorough understanding of the application. Meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.
Claims (6)
1. A display device, comprising:
an array substrate;
the first pixel definition layer is arranged on the array substrate and comprises a plurality of first through holes, and the first through holes penetrate through the first pixel definition layer to expose the array substrate;
the organic light-emitting diode is arranged in the first through hole to be electrically connected with the array substrate, and comprises one of a blue organic light-emitting diode and an ultraviolet organic light-emitting diode;
the passivation layer is arranged on the first pixel definition layer and the organic light-emitting diode, and the thickness of the passivation layer on the organic light-emitting diode is equal to that of the passivation layer on the first pixel definition layer;
a first planarization layer disposed on the passivation layer, the first planarization layer on the organic light emitting diode having a thickness greater than that of the first planarization layer on the first pixel defining layer;
a second pixel defining layer disposed on the first planarization layer, the second pixel defining layer including a plurality of second through holes, a plurality of third through holes, and a plurality of fourth through holes, the plurality of second through holes, the plurality of third through holes, and the plurality of fourth through holes penetrating the second pixel defining layer to expose the first planarization layer, a material of the second pixel defining layer including a fluorine-containing organic polymer, and a contact angle of an organic solvent with the second pixel defining layer being greater than 50 degrees; and
the color film layer comprises a plurality of first color film parts, a plurality of second color film parts and a plurality of third color film parts, wherein each first color film part is arranged in one second through hole, each second color film part is arranged in one third through hole, each third color film part is arranged in one fourth through hole, the material of the third color film part comprises an acrylic material, the first color film part comprises a red quantum dot material, the second color film part comprises a green quantum dot material, and the material of the first color film part, the material of the second color film part and the material of the third color film part further comprise a liquid desiccant.
2. The display device of claim 1, wherein the first color film portion is excited by the organic light emitting diode to emit red light, the second color film portion is excited by the organic light emitting diode to emit green light, and the third color film portion is excited by the organic light emitting diode to emit blue light.
3. The display device of claim 1, wherein the liquid desiccant has a formula comprisingWherein the R is 1 Radicals, R 2 Radicals and R 3 The structural formula of the group is C n H 2n+1 ，n＝1-20。
4. A method of manufacturing a display device, comprising:
providing a carrier substrate;
arranging an array substrate on the carrier substrate;
forming a first pixel definition layer on the array substrate, wherein the first pixel definition layer comprises a plurality of first through holes, and the first through holes penetrate through the first pixel definition layer to expose the array substrate;
an organic light emitting diode is arranged in the first through hole, and is electrically connected with the array substrate, wherein the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode;
forming a passivation layer on the first pixel definition layer and the organic light emitting diode, wherein the thickness of the passivation layer on the organic light emitting diode is equal to the thickness of the passivation layer on the first pixel definition layer;
forming a first planarization layer on the passivation layer, wherein a thickness of the first planarization layer on the organic light emitting diode is greater than a thickness of the first planarization layer on the first pixel defining layer;
forming a second pixel defining layer on the first planarization layer, the second pixel defining layer including a plurality of second through holes, a plurality of third through holes, and a plurality of fourth through holes, the plurality of second through holes, the plurality of third through holes, and the plurality of fourth through holes penetrating the second pixel defining layer to expose the first planarization layer, a material of the second pixel defining layer including a fluorine-containing organic polymer, and a contact angle of an organic solvent with the second pixel defining layer being greater than 50 degrees;
a color film layer is arranged in the second through holes, the third through holes and the fourth through holes, the color film layer comprises a plurality of first color film parts, a plurality of second color film parts and a plurality of third color film parts, each first color film part is arranged in one second through hole, each second color film part is arranged in one third through hole, each third color film part is arranged in one fourth through hole, wherein the material of the third color film part comprises an acrylic material, the first color film part comprises a red quantum dot material, the second color film part comprises a green quantum dot material, and the material of the first color film part, the material of the second color film part and the material of the third color film part further comprise a liquid desiccant; and
and separating the carrier substrate from the array substrate.
5. The method of manufacturing a display device according to claim 4, wherein an organic light emitting diode is disposed in the first through hole, the organic light emitting diode is electrically connected to the array substrate, and the organic light emitting diode includes one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, and further includes:
and forming a passivation layer on the first pixel defining layer and the organic light emitting diode.
6. The method of manufacturing a display device according to claim 4, wherein after the step of disposing the color film layer in the plurality of second through holes, the plurality of third through holes, and the plurality of fourth through holes, further comprising:
and forming an encapsulation layer on the second pixel definition layer and the organic light emitting diode.
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| CN116997200A (en) * | 2022-04-22 | 2023-11-03 | 北京京东方技术开发有限公司 | Display substrate and display device |
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