CN111584568A - Display device and method for manufacturing the same - Google Patents
Display device and method for manufacturing the same Download PDFInfo
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- CN111584568A CN111584568A CN202010398851.1A CN202010398851A CN111584568A CN 111584568 A CN111584568 A CN 111584568A CN 202010398851 A CN202010398851 A CN 202010398851A CN 111584568 A CN111584568 A CN 111584568A
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- 238000000034 method Methods 0.000 title claims description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 239000000463 material Substances 0.000 claims description 77
- 239000002096 quantum dot Substances 0.000 claims description 27
- 238000002161 passivation Methods 0.000 claims description 11
- 239000002274 desiccant Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 8
- -1 acryl Chemical group 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 abstract description 5
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- 239000007924 injection Substances 0.000 description 8
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- 229910004205 SiNX Inorganic materials 0.000 description 7
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- 239000004642 Polyimide Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
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- 229910052733 gallium Inorganic materials 0.000 description 4
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
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- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display device and a preparation method thereof, the display device comprises an array substrate, a first pixel definition layer, an organic light emitting diode, a first flat layer, a second pixel definition layer and a color film layer, the first pixel definition layer is arranged on the array substrate and comprises a plurality of first through holes, the organic light emitting diode is arranged in the first through holes to be electrically connected with the array substrate, the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, the first flat layer is arranged on the first pixel definition layer and the organic light emitting diode, the second pixel definition layer is arranged on the first flat layer and comprises a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, and the color film layer is arranged in the second through holes, the third through holes and the fourth through holes. The display performance and the service life of the display device are improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display device and a preparation method thereof.
Background
The OLED, i.e., an Organic Light-Emitting Diode (Organic Light-Emitting Diode), has characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, low power consumption, and the like, and thus has attracted much attention, and has begun to gradually replace a conventional LCD (Liquid crystal display) as a new generation of display mode, and is widely applied to a mobile phone screen, a computer display, a full-color television, and the like. The OLED is classified into a top emission type and a bottom emission type according to light emitting characteristics, and has a light and thin characteristic. However, the current display device has the problems of poor display performance and short service life.
Disclosure of Invention
The application provides a display device and a preparation method thereof, which aim to solve the problems of weak form performance and short service life of the display device in the prior art.
The application provides a display device, including:
an array substrate;
a first pixel defining layer disposed on the array substrate, the first pixel defining layer including a plurality of first through holes penetrating the first pixel defining layer to expose the array substrate;
the organic light emitting diode is arranged in the first through hole to be electrically connected with the array substrate and comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode;
a first planarization layer disposed on the first pixel defining layer and the organic light emitting diode;
a second pixel defining layer disposed on the first planar layer, the second pixel defining layer including a plurality of second through holes, a plurality of third through holes, and a plurality of fourth through holes, the plurality of second through holes, the plurality of third through holes, and the plurality of fourth through holes penetrating the second pixel defining layer to expose the first planar layer; and
the color film layer is arranged in the second through holes, the third through holes and the fourth through holes.
In the display device provided by the present application, the color film layer includes a plurality of first color film portions, a plurality of second color film portions, and a plurality of third color film portions, each of the first color film portions is disposed in one of the second through holes, each of the second color film portions is disposed in one of the third through holes, and each of the third color film portions is disposed in one of the fourth through holes.
In the display device provided by the application, the material of the first color film portion comprises a red quantum dot material, the material of the second color film portion comprises a green quantum dot material, and the material of the third color film portion comprises one of a blue quantum dot material and an acrylic material.
In the display device that this application provided, first various membrane portion receives organic light emitting diode excites and sends ruddiness, the various membrane portion of second receives organic light emitting diode excites and sends the green glow, the various membrane portion of third receives organic light emitting diode excites and sends the blue light.
In the display device provided by the present application, the material of the first color film portion, the material of the second color film portion, and the material of the third color film portion further include a liquid desiccant.
In the display device provided by the application, the liquid desiccant has a structural formula including
Wherein, R is1Radical, R2Group and R3The structural formula of the radical is CnH2n+1，n＝1-20。
In the display device provided by the present application, the display device further includes a passivation layer disposed on the first pixel defining layer and the organic light emitting diode.
The present application also provides a method for manufacturing a display device, including:
providing a carrier substrate;
arranging an array substrate on the carrier substrate;
forming a first pixel defining layer on the array substrate, the first pixel defining layer including a plurality of first through holes penetrating the first pixel defining layer to expose the array substrate;
arranging an organic light emitting diode in the first through hole, wherein the organic light emitting diode is electrically connected with the array substrate and comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode;
forming a first flat layer on the first pixel defining layer and the organic light emitting diode;
forming a second pixel defining layer on the first flat layer, wherein the second pixel defining layer comprises a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, and the plurality of second through holes, the plurality of third through holes and the plurality of fourth through holes penetrate through the second pixel defining layer to expose the first flat layer;
arranging color film layers in the second through holes, the third through holes and the fourth through holes; and
separating the carrier substrate from the array substrate.
In the method for manufacturing a display device provided by the present application, the step of disposing an organic light emitting diode in the first through hole, the organic light emitting diode being electrically connected to the array substrate, the step of disposing an organic light emitting diode including one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, further includes:
and forming a passivation layer on the first pixel defining layer and the organic light emitting diode.
In the method for manufacturing a display device provided by the present application, after the step of providing the color film layer in the second through holes, the third through holes, and the fourth through holes, the method further includes:
and forming an encapsulation layer on the second pixel defining layer and the organic light emitting diode.
The application provides a display device and a preparation method thereof, the display device comprises an array substrate, a first pixel definition layer, an organic light emitting diode, a first flat layer, a second pixel definition layer and a color film layer, wherein the first pixel definition layer is arranged on the array substrate and comprises a plurality of first through holes, the first through holes penetrate through the first pixel definition layer to expose the array substrate, the organic light emitting diode is arranged in the first through holes to be electrically connected with the array substrate, the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, the first flat layer is arranged on the first pixel definition layer and the organic light emitting diode, the second pixel definition layer is arranged on the first flat layer, and the second pixel definition layer comprises a plurality of second through holes, The second pixel definition layer is arranged on the first pixel definition layer, the first flat layer is exposed through the second pixel definition layer, the color film layer is arranged in the second through holes, the third through holes and the fourth through holes. In the application, the organic light emitting diode is adopted to excite the emergent light of the color film layer, so that the display performance and the service life of the display device are improved.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a cross-sectional view of a first structure of a display device provided in the present application.
Fig. 2 is a structural cross-sectional view of an array substrate provided in the present application.
Fig. 3 is a cross-sectional view of an organic light emitting diode provided in the present application.
Fig. 4 is a cross-sectional view of a second structure of the display device provided in the present application.
Fig. 5 is a flowchart of a method for manufacturing a display device provided in the present application.
Fig. 6 is a cross-sectional flow diagram illustrating a method for manufacturing a display device according to the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a cross-sectional view of a first structure of a display device provided in the present application. The present application provides a display device 10. The display device 10 includes an array substrate 100, a first pixel defining layer 200, an organic light emitting diode 300, a first flat layer 400, a second pixel defining layer 500, and a color film layer 600.
Referring to fig. 2, fig. 2 is a cross-sectional view of an array substrate according to the present disclosure. The array substrate 100 includes a flexible substrate 110 and a thin film transistor layer 120. The material of the flexible substrate 110 includes polyimide. The thin-film transistor layer 120 is disposed on the flexible substrate 110. The thin film transistor 120 includes a buffer layer 121, an active layer 122, a gate insulating layer 123, a gate layer 124, an interlayer dielectric layer 125, a source electrode 126, and a drain electrode 127. The buffer layer 121 is disposed on the substrate 110. The material of the buffer layer 121 includes SiOxAnd SiNx. The active layer 122 is disposed on the buffer layer 121. The material of the active layer 122 includes indium gallium zinc oxide, indium zinc tin oxide, gallium zinc oxide, zinc oxynitride, and indium gallium zinc titanium oxide. The gate insulating layer 123 is disposed on the active layer 122. The material of the gate insulating layer 123 includes SiOxAnd SiNx. The gate electrode layer 124 is disposed on the gate insulating layer 123. The material of the gate layer 124 includes one or a combination of Mo, Al, Cu and Ti. The interlayer dielectric layer 125 covers the buffer layer 121, the active layer 122, the gate insulating layer 123, and the gate layer 124. The interlayer dielectric layer 125 has a fifth via 1251 and a sixth via 1252. The fifth via 1251 penetrates the interlayer dielectric layer 125 to expose one side of the active layer 122. The sixth via 1252 penetrates the interlayer dielectric layer 125 to expose the other side of the active layer 122. The material of the interlayer dielectric layer 125 comprises SiOxAnd SiNx. The source 126 is filled in the fifth via 1251 and on the interlayer dielectric layer 125 to electrically connect toThe active layer 122. The drain 127 is filled in the sixth via 1252 and on the interlayer dielectric layer 125 to electrically connect to the active layer 122. The material of the source electrode 126 and the drain electrode 127 comprises one or a combination of Mo, Al, Cu and Ti.
In another embodiment, the display device 10 further comprises a second planarization layer 700. The second planarization layer 700 is disposed on the array substrate 100. The material of the second planarization layer 700 includes polyimide. Second planarization layer 700 is used to planarize thin-film-transistor layer 120.
The first pixel defining layer 200 is disposed on the array substrate 100. The first pixel definition layer 200 includes a number of first via holes 210. The first via hole 210 penetrates the first pixel defining layer 200 to expose the array substrate 100. The material of the first pixel defining layer 200 includes polyimide.
Referring to fig. 3, fig. 3 is a cross-sectional view of an organic light emitting diode provided in the present application. The organic light emitting diode 300 is disposed in the first via hole 210 to be electrically connected to the array substrate 100. The organic light emitting diode 300 includes one or a combination of two of a blue organic light emitting diode and an ultraviolet organic light emitting diode. In this embodiment, the organic light emitting diode 300 is an ultraviolet organic light emitting diode. The organic light emitting diode 300 includes an anode 310, a hole injection layer 320, a hole transport layer 330, an emission layer 340, an electron transport layer 350, an electron injection layer 360, and a cathode 370. The hole injection layer 320 is disposed on the anode layer 310. The anode layer 310 is made of one or more of indium tin oxide, aluminum and silver. The hole transport layer 330 is disposed on the hole injection layer 320. The light emitting layer 340 is disposed on the hole transport layer 330. The light emitting layer 340 includes one or a combination of a blue light emitting layer and an ultraviolet light emitting layer. The electron transport layer 350 is disposed on the light emitting layer 340. The electron injection layer 360 is disposed on the electron transport layer 350. The cathode 370 is disposed on the electron injection layer 360.
In another embodiment, the display device 10 further includes a passivation layer 800. The passivation layer 800 is disposed on the first pixel defining layer 200 and the organic light emitting diode 300. The passivation layer 800 serves to passivate and protect the cathode 370 of the organic light emitting diode 300.
The first planarization layer 400 is disposed on the first pixel defining layer 200 and the organic light emitting diode 300. The material of the first planarization layer 400 includes SiOx、Al2O3And SiNxOne or a combination of several of them.
In this application, the first planarization layer 400 is used to planarize the passivation layer 800.
The second pixel defining layer 500 is disposed on the first planarization layer 400. The second pixel defining layer 500 includes a plurality of second through holes 510, a plurality of third through holes 520, and a plurality of fourth through holes 530. The number of second through holes 510, the number of third through holes 520, and the number of fourth through holes 530 penetrate the second pixel defining layer 500 to expose the first planarization layer 400. The material of the second pixel defining layer 500 includes a fluorine-containing organic polymer. The fluorine-containing organic polymer is used as the material of the second pixel defining layer, so that the hydrophobicity of the second pixel defining layer 500 is improved, the contact angle between the organic solvent and the second pixel defining layer is larger than 50 degrees, and the organic solvent is used for isolating the quantum dot layer of the color film layer 600.
The color film layer 600 is disposed in the second through holes 510, the third through holes 520, and the fourth through holes 530. The color film layer 600 includes a plurality of first color film portions 610, a plurality of second color film portions 620, and a plurality of third color film portions 630. Each first color film portion 610 is disposed in one of the second through holes 510. The material of the first color film portion 610 includes red quantum dot material. The first color film portion 610 is excited by the organic light emitting diode 300 to emit red light. Specifically, when the uv oled 300 emits uv light, the first color film portion 610 formed of a red quantum dot material is excited to emit red light. Each of the second color film portions 620 is disposed in one of the third through holes 520. The material of the second color film part 620 includes a green quantum dot material. The second color film part 620 is excited by the organic light emitting diode 300 to emit green light. Specifically, when the ultraviolet organic light emitting diode 300 emits ultraviolet light, the second color film part 620 formed of a green quantum dot material is excited to emit green light. Each of the third color film portions 630 is disposed in one of the fourth through holes 530. The material of the third color film part 630 includes one of a blue quantum dot material and an acryl material. In this embodiment, the third color film portion 630 is made of an acrylic material. The third color film portion 630 is excited by the organic light emitting diode 300 to emit blue light. When the ultraviolet organic light emitting diode 300 emits ultraviolet light, the third color film portion 630 formed of an acryl material is excited to emit blue light.
In another embodiment, the material of the first color film portion 610, the material of the second color film portion 620 and the material of the third color film portion 630 further comprise a liquid desiccant. Specifically, the structural formula of the liquid desiccant comprises
Wherein, R is1Radical, R2Group and R3The structural formula of the radical is CnH2n+1And n is 1-20, and the Al atom in the structural formula of the liquid desiccant can be replaced by B or Ga. For example, a particular desiccant may be
And
and the like.
In the application, the liquid desiccant is added into the red quantum dot material, the blue quantum dot material or the acrylic material and the green quantum dot material, and is used for adsorbing water vapor and oxygen, so that the organic light-emitting diode is prevented from being corroded due to the fact that the organic light-emitting diode is not reacted by the liquid desiccant.
In another embodiment, the display device 10 further comprises an encapsulation layer 900. The encapsulation layer 900 is disposed on the second pixel defining layer 500 and the color film layer 600. The encapsulation layer 900 is used to protect functional layers in the display device 10. The package layer 900 includes a first inorganic layer 910, an organic layer 920, and a second inorganic layerThe inorganic layer 930. The material of the first inorganic layer 910 and the second inorganic layer 930 comprises SiOxAnd SiNxOne or a combination of several of them. The material of the organic layer 920 includes an acryl material.
Referring to fig. 4, fig. 4 is a cross-sectional view of a second structure of the display device provided in the present application. Fig. 4 is different from fig. 1 in that the organic light emitting diode 300 of fig. 4 is a blue organic light emitting diode, the first color film part 610 is formed of a red quantum dot material, the second color film part 620 is formed of a green quantum dot material, and the third color film part 630 is formed of a blue quantum dot material. When the blue organic light emitting diode 300 emits blue light, the first color film portion 610 formed of a red quantum dot material is excited to emit red light, the second color film portion 620 formed of a green quantum dot material is excited to emit green light, and the third color film portion 630 formed of a blue quantum dot material is excited to emit blue light.
The application provides a display device, display device includes array substrate, first pixel definition layer, organic light emitting diode, first flat layer, second pixel definition layer and various rete, first pixel definition layer set up in on the array substrate, first pixel definition layer includes a plurality of first through-holes, first through-hole runs through first pixel definition layer is in order to expose the array substrate, organic light emitting diode set up in the first through-hole with the electricity connect the array substrate, organic light emitting diode includes one of blue organic light emitting diode and ultraviolet colour organic light emitting diode, first flat layer set up in first pixel definition layer and on the organic light emitting diode, second pixel definition layer set up in on the first flat layer, second pixel definition layer includes a plurality of second through-holes, The second pixel definition layer is arranged on the first pixel definition layer, the first flat layer is exposed through the second pixel definition layer, the color film layer is arranged in the second through holes, the third through holes and the fourth through holes. In this application, through adopting blue or ultraviolet colour organic light emitting diode to arouse various rete emergent light, improved organic light emitting diode's luminous efficacy and life, and then improve display device's display performance and life.
Referring to fig. 5, fig. 5 is a flowchart illustrating a method for manufacturing a display device according to the present disclosure. The present application also provides a method for manufacturing a display device, including:
20. a carrier substrate 101 is provided.
30. An array substrate 100 is disposed on the carrier substrate 101.
An array substrate 100 is disposed on the carrier substrate 101. The array substrate 100 includes a flexible substrate 110 and a thin film transistor layer 120. The material of the flexible substrate 110 includes polyimide. The thin-film transistor layer 120 is disposed on the flexible substrate 110.
In another embodiment, after the step of disposing the array substrate 100 on the carrier substrate 101, the method further includes forming a second planarization layer 700 on the array substrate 100. The material of the second planarization layer 700 includes polyimide. Second planarization layer 700 is used to planarize thin-film-transistor layer 120.
40. A first pixel defining layer 200 is formed on the array substrate 100. The first pixel definition layer 200 includes a number of first via holes 210. The first via hole 210 penetrates the first pixel defining layer 200 to expose the array substrate 100.
The material of the first pixel defining layer 200 includes polyimide.
50. An organic light emitting diode 300 is disposed in the first via hole 210. The organic light emitting diode 300 is electrically connected to the array substrate 100. The organic light emitting diode 300 includes one of a blue organic light emitting diode and an ultraviolet organic light emitting diode.
An anode 310, a hole injection layer 320, a hole transport layer 330, a light emitting layer 340, an electron transport layer 350, an electron injection layer 360, and a cathode 370 are sequentially stacked in the first via hole 210 by vacuum evaporation. The light emitting layer 340 includes one or a combination of a blue light emitting layer and an ultraviolet light emitting layer. In this embodiment, the light emitting layer 340 is an ultraviolet light emitting layer.
In another embodiment, after the step of disposing the organic light emitting diode 300 in the first via hole 210, a passivation layer 800 is formed on the first pixel defining layer 200 and the organic light emitting diode 300. The passivation layer 800 serves to passivate and protect the cathode 370 of the organic light emitting diode 300.
60. A first planarization layer 400 is formed on the first pixel defining layer 200 and the organic light emitting diode 300.
The material of the first planarization layer 400 includes SiOx、Al2O3And SiNxOne or a combination of several of them. The first planarization layer 400 serves to planarize the passivation layer 800.
70. A second pixel defining layer 500 is formed on the first planarization layer 400. The second pixel defining layer 500 includes a plurality of second through holes 510, a plurality of third through holes 520, and a plurality of fourth through holes 530. The number of second through holes 510, the number of third through holes 520, and the number of fourth through holes 530 penetrate the second pixel defining layer 500 to expose the first planarization layer 400.
The material of the second pixel defining layer 500 includes a fluorine-containing organic polymer. The fluorine-containing organic polymer is used as the material of the second pixel defining layer, so that the hydrophobicity of the second pixel defining layer 500 is improved, the contact angle between the organic solvent and the second pixel defining layer is larger than 50 degrees, and the organic solvent is used for isolating the quantum dot layer of the color film layer 600.
80. The color film layer 600 is disposed in the second through holes 510, the third through holes 520, and the fourth through holes 530.
Specifically, the color film layer 600 is formed by printing the color film layer 600 material in the second through holes 510, the third through holes 520, and the fourth through holes 530 in an inkjet printing manner. The color film layer 600 includes a plurality of first color film portions 610, a plurality of second color film portions 620, and a plurality of third color film portions 630. The first color film portion 610 is formed by printing red quantum dot material in the second through hole 510. The second color film part 620 is formed by printing green quantum dot materials in the third through hole 520. The third color film part 630 is formed by printing a blue quantum dot material or an acrylic material in the fourth through hole 530. In this embodiment, the third color film portion 630 is formed of an acryl material. When the ultraviolet organic light emitting diode 300 emits blue light, the first color film portion 610 formed of a red quantum dot material is excited to emit red light, the second color film portion 620 formed of a green quantum dot material is excited to emit green light, and the third color film portion 630 formed of an acryl material is excited to emit blue light.
In another embodiment, the step of disposing the color film layer 600 in the second through holes 510, the third through holes 520, and the fourth through holes 530 further includes:
an encapsulation layer 900 is formed on the second pixel defining layer 500 and the color film layer 600. The encapsulation layer 900 is used to protect functional layers in the display device 10. The encapsulation layer 900 includes a first inorganic layer 910, an organic layer 920, and a second inorganic layer 930. The material of the first inorganic layer 910 and the second inorganic layer 930 comprises SiOxAnd SiNxOne or a combination of several of them. The material of the organic layer 920 includes an acryl material.
90. Separating the carrier substrate 101 from the array substrate 100.
Referring to fig. 6, fig. 6 is a cross-sectional flow diagram illustrating a method for manufacturing a display device according to the present disclosure. And separating the carrier substrate 101 from the array substrate 100 to obtain the display device 10.
The application provides a display device and a preparation method thereof, the display device comprises an array substrate, a first pixel definition layer, an organic light emitting diode, a first flat layer, a second pixel definition layer and a color film layer, wherein the first pixel definition layer is arranged on the array substrate and comprises a plurality of first through holes, the first through holes penetrate through the first pixel definition layer to expose the array substrate, the organic light emitting diode is arranged in the first through holes to be electrically connected with the array substrate, the organic light emitting diode comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, the first flat layer is arranged on the first pixel definition layer and the organic light emitting diode, the second pixel definition layer is arranged on the first flat layer, and the second pixel definition layer comprises a plurality of second through holes, The second pixel definition layer is arranged on the first pixel definition layer, the first flat layer is exposed through the second pixel definition layer, the color film layer is arranged in the second through holes, the third through holes and the fourth through holes. In the application, the blue or ultraviolet organic light emitting diode is adopted to excite the emergent light of the color film layer, so that the display performance and the service life of the display device are improved.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display device, comprising:
an array substrate;
a first pixel defining layer disposed on the array substrate, the first pixel defining layer including a plurality of first through holes penetrating the first pixel defining layer to expose the array substrate;
the organic light emitting diode is arranged in the first through hole to be electrically connected with the array substrate and comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode;
a first planarization layer disposed on the first pixel defining layer and the organic light emitting diode;
a second pixel defining layer disposed on the first planar layer, the second pixel defining layer including a plurality of second through holes, a plurality of third through holes, and a plurality of fourth through holes, the plurality of second through holes, the plurality of third through holes, and the plurality of fourth through holes penetrating the second pixel defining layer to expose the first planar layer; and
the color film layer is arranged in the second through holes, the third through holes and the fourth through holes.
2. The display device according to claim 1, wherein the color film layers comprise a plurality of first color film portions, a plurality of second color film portions, and a plurality of third color film portions, each of the first color film portions is disposed in one of the second through holes, each of the second color film portions is disposed in one of the third through holes, and each of the third color film portions is disposed in one of the fourth through holes.
3. The display device of claim 2, wherein the material of the first color film portion comprises a red quantum dot material, the material of the second color film portion comprises a green quantum dot material, and the material of the third color film portion comprises one of a blue quantum dot material and an acryl material.
4. The display device as claimed in claim 3, wherein the first color film portion is excited by the organic light emitting diode to emit red light, the second color film portion is excited by the organic light emitting diode to emit green light, and the third color film portion is excited by the organic light emitting diode to emit blue light.
5. The display device of claim 1, wherein the material of the first color film portion, the material of the second color film portion, and the material of the third color film portion further comprise a liquid desiccant.
6. The display device of claim 1, wherein the liquid desiccant has a structure comprising
Wherein, R is1Radical, R2Group and R3The structural formula of the radical is CnH2n+1，n＝1-20。
7. The display device of claim 1, further comprising a passivation layer disposed on the first pixel defining layer and the organic light emitting diode.
8. A method of manufacturing a display device, comprising:
providing a carrier substrate;
arranging an array substrate on the carrier substrate;
forming a first pixel defining layer on the array substrate, the first pixel defining layer including a plurality of first through holes penetrating the first pixel defining layer to expose the array substrate;
arranging an organic light emitting diode in the first through hole, wherein the organic light emitting diode is electrically connected with the array substrate and comprises one of a blue organic light emitting diode and an ultraviolet organic light emitting diode;
forming a first flat layer on the first pixel defining layer and the organic light emitting diode;
forming a second pixel defining layer on the first flat layer, wherein the second pixel defining layer comprises a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, and the plurality of second through holes, the plurality of third through holes and the plurality of fourth through holes penetrate through the second pixel defining layer to expose the first flat layer;
arranging color film layers in the second through holes, the third through holes and the fourth through holes; and
separating the carrier substrate from the array substrate.
9. The method of manufacturing a display device according to claim 8, wherein the step of providing an organic light emitting diode in the first via hole, the organic light emitting diode being electrically connected to the array substrate, the organic light emitting diode including one of a blue organic light emitting diode and an ultraviolet organic light emitting diode, further comprises, after the step of:
and forming a passivation layer on the first pixel defining layer and the organic light emitting diode.
10. The method for manufacturing a display device according to claim 8, wherein after the step of disposing the color film layer in the second through holes, the third through holes, and the fourth through holes, the method further comprises:
and forming an encapsulation layer on the second pixel defining layer and the organic light emitting diode.
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