TWI537340B - 可固化之有機聚矽氧烷組合物及半導體裝置 - Google Patents

可固化之有機聚矽氧烷組合物及半導體裝置 Download PDF

Info

Publication number
TWI537340B
TWI537340B TW098117525A TW98117525A TWI537340B TW I537340 B TWI537340 B TW I537340B TW 098117525 A TW098117525 A TW 098117525A TW 98117525 A TW98117525 A TW 98117525A TW I537340 B TWI537340 B TW I537340B
Authority
TW
Taiwan
Prior art keywords
sio
group
range
groups
composition
Prior art date
Application number
TW098117525A
Other languages
English (en)
Chinese (zh)
Other versions
TW201000561A (en
Inventor
佐川貴志
寺田匡慶
吉武誠
Original Assignee
道康寧東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 道康寧東麗股份有限公司 filed Critical 道康寧東麗股份有限公司
Publication of TW201000561A publication Critical patent/TW201000561A/zh
Application granted granted Critical
Publication of TWI537340B publication Critical patent/TWI537340B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Epoxy Resins (AREA)
TW098117525A 2008-06-18 2009-05-26 可固化之有機聚矽氧烷組合物及半導體裝置 TWI537340B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008159722A JP5972512B2 (ja) 2008-06-18 2008-06-18 硬化性オルガノポリシロキサン組成物及び半導体装置

Publications (2)

Publication Number Publication Date
TW201000561A TW201000561A (en) 2010-01-01
TWI537340B true TWI537340B (zh) 2016-06-11

Family

ID=40943617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098117525A TWI537340B (zh) 2008-06-18 2009-05-26 可固化之有機聚矽氧烷組合物及半導體裝置

Country Status (9)

Country Link
US (1) US8299186B2 (enExample)
EP (1) EP2326686B1 (enExample)
JP (1) JP5972512B2 (enExample)
KR (2) KR101780458B1 (enExample)
CN (1) CN102066493B (enExample)
MY (1) MY156257A (enExample)
RU (1) RU2503696C2 (enExample)
TW (1) TWI537340B (enExample)
WO (1) WO2009154260A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI758330B (zh) * 2016-09-30 2022-03-21 日商日產化學工業股份有限公司 交聯性有機聚矽氧烷組成物、其硬化物及ｌｅｄ裝置

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5667740B2 (ja) 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
CN104479359B (zh) * 2010-01-25 2018-04-03 Lg化学株式会社 可固化组合物
US9299896B2 (en) 2010-01-25 2016-03-29 Lg Chem, Ltd. Curable composition
JP5826767B2 (ja) * 2010-01-25 2015-12-02 エルジー・ケム・リミテッド シリコーン樹脂
US9410018B2 (en) 2010-01-25 2016-08-09 Lg Chem, Ltd. Curable composition
EP2530123B1 (en) * 2010-01-25 2015-11-11 LG Chem, Ltd. Curable composition
JP5640476B2 (ja) * 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
JP5170471B2 (ja) 2010-09-02 2013-03-27 信越化学工業株式会社 低ガス透過性シリコーン樹脂組成物及び光半導体装置
TWI401829B (zh) * 2010-10-07 2013-07-11 Advanced Optoelectronic Tech 發光二極體封裝結構及其製造方法
JP5524017B2 (ja) * 2010-10-08 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
JP2012111875A (ja) * 2010-11-25 2012-06-14 Daicel Corp 硬化性樹脂組成物及び硬化物
JP5690571B2 (ja) * 2010-12-07 2015-03-25 株式会社ダイセル 硬化性樹脂組成物
JP6300218B2 (ja) * 2010-12-31 2018-03-28 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子
WO2012093909A2 (ko) * 2011-01-06 2012-07-12 주식회사 엘지화학 경화성 조성물
JP5522111B2 (ja) 2011-04-08 2014-06-18 信越化学工業株式会社 シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
EP2706095B1 (en) * 2011-05-04 2021-03-03 LG Chem, Ltd. Curable composition
JP5992666B2 (ja) * 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
JP5893874B2 (ja) 2011-09-02 2016-03-23 信越化学工業株式会社 光半導体装置
JP5937798B2 (ja) * 2011-09-07 2016-06-22 株式会社ダイセル ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物
TWI473839B (zh) * 2011-11-25 2015-02-21 Ｌｇ化學股份有限公司 可固化組成物
WO2013077708A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
JP5805883B2 (ja) * 2011-11-25 2015-11-10 エルジー・ケム・リミテッド 硬化性組成物
KR101560037B1 (ko) * 2011-11-25 2015-10-15 주식회사 엘지화학 경화성 조성물
EP2784125B1 (en) * 2011-11-25 2020-12-30 LG Chem, Ltd. Curable composition
EP2784105B1 (en) * 2011-11-25 2017-05-10 LG Chem, Ltd. Method for producing organopolysiloxane
KR101409537B1 (ko) * 2011-11-25 2014-06-19 주식회사 엘지화학 경화성 조성물
CN104066795B (zh) * 2011-11-25 2016-06-08 Lg化学株式会社 可固化组合物
WO2013077705A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 오가노폴리실록산
JP2013139547A (ja) * 2011-12-05 2013-07-18 Jsr Corp 硬化性組成物、硬化物および光半導体装置
JP5652387B2 (ja) 2011-12-22 2015-01-14 信越化学工業株式会社 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置
JP2013159671A (ja) 2012-02-02 2013-08-19 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2014017884A1 (ko) * 2012-07-27 2014-01-30 주식회사 엘지화학 경화성 조성물
CN104487517B (zh) * 2012-07-27 2017-06-13 Lg化学株式会社 可固化组合物
JP6066385B2 (ja) * 2012-07-27 2017-01-25 エルジー・ケム・リミテッド 硬化性組成物
WO2014017888A1 (ko) * 2012-07-27 2014-01-30 주식회사 엘지화학 경화성 조성물
JP2015528046A (ja) * 2012-07-27 2015-09-24 エルジー・ケム・リミテッド 硬化性組成物
JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP5985981B2 (ja) * 2012-12-28 2016-09-06 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
TWI616489B (zh) * 2013-02-18 2018-03-01 永信新材料有限公司 可應用於發光二極體元件之聚矽氧烷組合物、基座配方及其發光二極體元件
JP2014169415A (ja) * 2013-03-05 2014-09-18 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP2014169414A (ja) * 2013-03-05 2014-09-18 Dow Corning Toray Co Ltd オルガノポリシロキサンおよびその製造方法
JP6237880B2 (ja) * 2013-04-04 2017-11-29 エルジー・ケム・リミテッド 硬化性組成物
KR101667839B1 (ko) * 2013-04-04 2016-10-19 주식회사 엘지화학 경화성 조성물
CN105121554B (zh) * 2013-04-04 2017-12-29 株式会社Lg化学 可固化组合物
ES3054095T3 (en) * 2013-07-08 2026-01-29 Momentive Performance Mat Jp Adhesiveness-imparting agent, adhesive polyorganosiloxane composition, and optical semiconductor device
WO2015030224A1 (en) * 2013-08-29 2015-03-05 Dow Corning Corporation Curable silicone composition, cured product thereof, and optical semiconductor device
CN105745252B (zh) 2014-01-28 2018-12-25 株式会社Lg化学 固化产物
TWI624510B (zh) * 2014-02-04 2018-05-21 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
TWI653295B (zh) * 2014-02-04 2019-03-11 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
CN106715591A (zh) * 2014-06-03 2017-05-24 道康宁东丽株式会社 可固化有机硅组合物及光半导体装置
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
TW201601358A (zh) * 2014-06-19 2016-01-01 道康寧公司 用於晶圓級ｚ軸熱中介層的可光圖案化聚矽氧
KR102370815B1 (ko) * 2014-06-20 2022-03-08 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 핫 멜트성 실리콘 및 경화성 핫 멜트 조성물
WO2015194159A1 (ja) * 2014-06-20 2015-12-23 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびその製造方法
CN104140681B (zh) * 2014-07-25 2017-12-05 东莞市贝特利新材料有限公司 一种用于电子器件密封的有机硅组合物
KR101980935B1 (ko) * 2015-01-27 2019-05-21 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
GB201603107D0 (en) * 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
US11028266B2 (en) * 2016-08-12 2021-06-08 Wacker Chemie Ag Curable organopolysiloxane composition, encapsulant and semiconductor device
WO2018047633A1 (ja) * 2016-09-07 2018-03-15 株式会社ダイセル 硬化性樹脂組成物、その硬化物、及び半導体装置
BR112019016363B1 (pt) * 2017-02-08 2023-03-28 Elkem Silicones Usa Corp Composição de organopolissiloxano e espuma sintática de borracha de silicone
TW201917173A (zh) * 2017-10-20 2019-05-01 日商道康寧東麗股份有限公司 固化性矽組合物以及光半導體裝置
JP7838778B2 (ja) * 2019-07-30 2026-04-01 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、光半導体装置、および光半導体装置の製造方法
JP7578279B2 (ja) 2020-12-28 2024-11-06 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
CN116940637A (zh) 2021-03-08 2023-10-24 杜邦东丽特殊材料株式会社 可固化硅酮组合物、封装剂以及光学半导体装置
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
CN118085575A (zh) * 2023-11-28 2024-05-28 东莞市贝特利新材料有限公司 有机聚硅氧烷组合物、密封材料和半导体器件

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224258A (en) * 1975-08-19 1977-02-23 Toray Silicone Co Ltd Curable organopolysiloxane composition
JPS5287454A (en) * 1976-01-16 1977-07-21 Toray Silicone Co Ltd Organopolysiloxane resin composition
JPS52147657A (en) * 1976-06-02 1977-12-08 Toray Silicone Co Ltd Curable organopolysiloxane compositions
RU2105778C1 (ru) * 1996-03-26 1998-02-27 Государственное предприятие Научно-исследовательский институт синтетического каучука им.акад.С.В.Лебедева Кремнийорганическая композиция холодного отверждения
JP3420473B2 (ja) * 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 シリコーン系接着性シート、その製造方法、および半導体装置
JP3344286B2 (ja) 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
US6551676B1 (en) * 1998-09-04 2003-04-22 Dow Corning Toray Silicone Company, Ltd. Silicone-based adhesive sheet method for manufacturing same and semiconductor device
US6124407A (en) * 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
JP3523098B2 (ja) 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
JP4009067B2 (ja) * 2001-03-06 2007-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4180474B2 (ja) 2003-09-03 2008-11-12 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加硬化型シリコーン組成物
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP4503271B2 (ja) * 2003-11-28 2010-07-14 東レ・ダウコーニング株式会社 シリコーン積層体の製造方法
JP4676735B2 (ja) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
JP4741230B2 (ja) * 2004-12-28 2011-08-03 東レ・ダウコーニング株式会社 フィルム状シリコーンゴム接着剤
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP4648146B2 (ja) * 2005-09-26 2011-03-09 信越化学工業株式会社 耐クラック性に優れた付加硬化型シリコーン組成物
KR20080104279A (ko) * 2006-02-24 2008-12-02 다우 코닝 코포레이션 실리콘으로 캡슐화된 발광 장치 및 실리콘 제조용의 경화성실리콘 조성물
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5667740B2 (ja) 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI758330B (zh) * 2016-09-30 2022-03-21 日商日產化學工業股份有限公司 交聯性有機聚矽氧烷組成物、其硬化物及ｌｅｄ裝置

Also Published As

Publication number Publication date
RU2010151565A (ru) 2012-07-27
JP5972512B2 (ja) 2016-08-17
US20110160410A1 (en) 2011-06-30
EP2326686A1 (en) 2011-06-01
RU2503696C2 (ru) 2014-01-10
TW201000561A (en) 2010-01-01
MY156257A (en) 2016-01-29
KR20110018916A (ko) 2011-02-24
KR20160075791A (ko) 2016-06-29
KR101780458B1 (ko) 2017-09-21
CN102066493A (zh) 2011-05-18
EP2326686B1 (en) 2012-08-08
CN102066493B (zh) 2013-01-02
JP2010001335A (ja) 2010-01-07
US8299186B2 (en) 2012-10-30
KR101730840B1 (ko) 2017-04-27
WO2009154260A1 (en) 2009-12-23

Similar Documents

Publication Publication Date Title
TWI470029B (zh) 可固化之有機聚矽氧烷組合物及半導體裝置
CN102066493B (zh) 可固化的有机基聚硅氧烷组合物和半导体器件
KR101436800B1 (ko) 경화성 오가노폴리실록산 조성물 및 반도체 디바이스
TWI640577B (zh) 可硬化性聚矽氧組合物及光半導體裝置
TWI495688B (zh) 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置
TWI567112B (zh) 可硬化性聚矽氧組合物、其硬化產品及光半導體裝置
KR20050072123A (ko) 경화성 오가노폴리실록산 조성물 및 당해 조성물을사용하여 제조한 반도체 장치
JP6654593B2 (ja) ダイボンディング用シリコーン樹脂組成物及び硬化物
US10096754B2 (en) Silicone resin film, curable silicone resin composition, optical semiconductor device, and packaging method for optical semiconductor device
CN110382625B (zh) 可固化的有机聚硅氧烷组合物和半导体器件
TW201412878A (zh) 加成硬化型聚矽氧組成物、及半導體元件受該組成物之硬化物所被覆之半導體裝置
CN106009687A (zh) 有机硅材料、可固化有机硅组合物和光学器件
JP5913538B2 (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
US20050181213A1 (en) Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition