TWI462237B - 佈線基板之製造方法，半導體裝置之製造方法及佈線基板 - Google Patents

佈線基板之製造方法，半導體裝置之製造方法及佈線基板 Download PDF

Info

Publication number
TWI462237B
TWI462237B TW097112856A TW97112856A TWI462237B TW I462237 B TWI462237 B TW I462237B TW 097112856 A TW097112856 A TW 097112856A TW 97112856 A TW97112856 A TW 97112856A TW I462237 B TWI462237 B TW I462237B
Authority
TW
Taiwan
Prior art keywords
layer
electrode pad
insulating layer
wiring substrate
opening
Prior art date
Application number
TW097112856A
Other languages
English (en)
Chinese (zh)
Other versions
TW200843045A (en
Inventor
小林和弘
中村順一
金子健太郎
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW200843045A publication Critical patent/TW200843045A/zh
Application granted granted Critical
Publication of TWI462237B publication Critical patent/TWI462237B/zh

Links

Classifications

    • H10P72/74—
    • H10W70/60—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H10P14/40—
    • H10W70/05—
    • H10W70/093—
    • H10W70/635—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H10P72/7424—
    • H10W70/655—
    • H10W72/07234—
    • H10W72/07236—
    • H10W72/075—
    • H10W72/251—
    • H10W72/952—
    • H10W90/724—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW097112856A 2007-04-13 2008-04-09 佈線基板之製造方法，半導體裝置之製造方法及佈線基板 TWI462237B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007105965A JP4881211B2 (ja) 2007-04-13 2007-04-13 配線基板の製造方法及び半導体装置の製造方法及び配線基板

Publications (2)

Publication Number Publication Date
TW200843045A TW200843045A (en) 2008-11-01
TWI462237B true TWI462237B (zh) 2014-11-21

Family

ID=39871381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112856A TWI462237B (zh) 2007-04-13 2008-04-09 佈線基板之製造方法，半導體裝置之製造方法及佈線基板

Country Status (5)

Country Link
US (2) US7915088B2 (enExample)
JP (1) JP4881211B2 (enExample)
KR (1) KR20080092851A (enExample)
CN (1) CN101286456B (enExample)
TW (1) TWI462237B (enExample)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7918018B2 (en) * 2007-06-12 2011-04-05 Texas Instruments Incorporated Method of fabricating a semiconductor device
US8132321B2 (en) * 2008-08-13 2012-03-13 Unimicron Technology Corp. Method for making embedded circuit structure
TW201010557A (en) * 2008-08-22 2010-03-01 World Wiser Electronics Inc Method for fabricating a build-up printing circuit board of high fine density and its structure
JP2010087229A (ja) * 2008-09-30 2010-04-15 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法および携帯機器
JP4803844B2 (ja) * 2008-10-21 2011-10-26 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体パッケージ
TWI421992B (zh) * 2009-08-05 2014-01-01 欣興電子股份有限公司 封裝基板及其製法
JP5649805B2 (ja) * 2009-08-12 2015-01-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2011138868A (ja) * 2009-12-28 2011-07-14 Ngk Spark Plug Co Ltd 多層配線基板
JP2011138869A (ja) * 2009-12-28 2011-07-14 Ngk Spark Plug Co Ltd 多層配線基板の製造方法及び多層配線基板
US8581388B2 (en) * 2009-12-28 2013-11-12 Ngk Spark Plug Co., Ltd Multilayered wiring substrate
JP5566720B2 (ja) 2010-02-16 2014-08-06 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP4823375B1 (ja) * 2010-05-28 2011-11-24 株式会社東芝 電子機器
US8755196B2 (en) * 2010-07-09 2014-06-17 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
TWI384922B (zh) * 2010-10-22 2013-02-01 Inventec Corp 電路板的電子零組件佈局方法及其電路板結構
JP5462777B2 (ja) * 2010-12-09 2014-04-02 日本特殊陶業株式会社 多層配線基板の製造方法
JP2012164965A (ja) * 2011-01-21 2012-08-30 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2012169591A (ja) * 2011-01-24 2012-09-06 Ngk Spark Plug Co Ltd 多層配線基板
JP5530955B2 (ja) * 2011-02-21 2014-06-25 日本特殊陶業株式会社 多層配線基板
JP5273749B2 (ja) * 2011-03-09 2013-08-28 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線板の製造方法
CN103460818B (zh) 2011-03-25 2017-08-04 株式会社村田制作所 陶瓷多层基板
US8624323B2 (en) * 2011-05-31 2014-01-07 International Business Machines Corporation BEOL structures incorporating active devices and mechanical strength
US20130241058A1 (en) * 2012-03-16 2013-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wire Bonding Structures for Integrated Circuits
JP5977051B2 (ja) * 2012-03-21 2016-08-24 新光電気工業株式会社 半導体パッケージ、半導体装置及び半導体パッケージの製造方法
KR101932727B1 (ko) * 2012-05-07 2018-12-27 삼성전자주식회사 범프 구조물, 이를 갖는 반도체 패키지 및 이의 제조 방법
US10128175B2 (en) * 2013-01-29 2018-11-13 Taiwan Semiconductor Manufacturing Company Packaging methods and packaged semiconductor devices
KR102037866B1 (ko) * 2013-02-05 2019-10-29 삼성전자주식회사 전자장치
US9087777B2 (en) * 2013-03-14 2015-07-21 United Test And Assembly Center Ltd. Semiconductor packages and methods of packaging semiconductor devices
US9642261B2 (en) * 2014-01-24 2017-05-02 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Composite electronic structure with partially exposed and protruding copper termination posts
JP5906264B2 (ja) * 2014-02-12 2016-04-20 新光電気工業株式会社 配線基板及びその製造方法
TWI551199B (zh) * 2014-04-16 2016-09-21 矽品精密工業股份有限公司 具電性連接結構之基板及其製法
JP5795415B1 (ja) * 2014-08-29 2015-10-14 新光電気工業株式会社 配線基板及びその製造方法
TWI554174B (zh) * 2014-11-04 2016-10-11 上海兆芯集成電路有限公司 線路基板和半導體封裝結構
KR20160080965A (ko) 2014-12-30 2016-07-08 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
JP2017022213A (ja) * 2015-07-08 2017-01-26 凸版印刷株式会社 プリント配線基板
CN105025652B (zh) * 2015-07-28 2018-06-08 苏州斯尔特微电子有限公司 一种电子印刷电路板
CN105007689B (zh) * 2015-07-28 2018-09-28 苏州斯尔特微电子有限公司 一种电子印刷电路板
CN105025651B (zh) * 2015-07-28 2018-09-14 苏州斯尔特微电子有限公司 一种手机摄像头用印刷电路板
TWI559465B (zh) * 2015-08-14 2016-11-21 恆勁科技股份有限公司 封裝基板及其製作方法
CN106469711B (zh) * 2015-08-14 2019-01-22 恒劲科技股份有限公司 封装基板及其制作方法
JP2017108070A (ja) * 2015-12-11 2017-06-15 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
CN106960798B (zh) * 2016-01-08 2019-05-24 恒劲科技股份有限公司 封装基板的制作方法
TWI566309B (zh) * 2016-01-08 2017-01-11 恆勁科技股份有限公司 封裝基板之製作方法
JP2017135193A (ja) * 2016-01-26 2017-08-03 イビデン株式会社 プリント配線板、及び、そのプリント配線板の製造方法
CN109075769B (zh) * 2016-04-28 2022-05-27 株式会社村田制作所 弹性波装置
JP6712050B2 (ja) * 2016-06-21 2020-06-17 富士通株式会社 樹脂基板及びその製造方法、並びに回路基板及びその製造方法
US10325842B2 (en) * 2017-09-08 2019-06-18 Advanced Semiconductor Engineering, Inc. Substrate for packaging a semiconductor device package and a method of manufacturing the same
KR102019355B1 (ko) 2017-11-01 2019-09-09 삼성전자주식회사 반도체 패키지
KR102530754B1 (ko) * 2018-08-24 2023-05-10 삼성전자주식회사 재배선층을 갖는 반도체 패키지 제조 방법
KR102542573B1 (ko) 2018-09-13 2023-06-13 삼성전자주식회사 재배선 기판, 이의 제조 방법, 및 이를 포함하는 반도체 패키지
JP7198154B2 (ja) * 2019-05-22 2022-12-28 新光電気工業株式会社 配線基板、及び配線基板の製造方法
KR102551352B1 (ko) * 2019-06-28 2023-07-04 삼성전자 주식회사 반도체 패키지 및 그 제조 방법
JP7443092B2 (ja) * 2020-03-04 2024-03-05 日東電工株式会社 配線回路基板
KR102863078B1 (ko) 2020-03-27 2025-09-19 삼성전자주식회사 반도체 패키지
EP4192202A4 (en) * 2020-07-29 2024-09-04 Kyocera Corporation CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
US12094772B2 (en) * 2021-01-15 2024-09-17 Advanced Semiconductor Engineering, Inc. Electronic device package and method of manufacturing the same
WO2025206133A1 (ja) * 2024-03-27 2025-10-02 京セラ株式会社 バンプ用電極構造、バンプ構造およびサーマルヘッド

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200507214A (en) * 2003-08-13 2005-02-16 Phoenix Prec Technology Corp Semiconductor package substrate with protective metal layer on pads formed thereon and method for fabricating the same
JP2005244108A (ja) * 2004-02-27 2005-09-08 Ngk Spark Plug Co Ltd 配線基板、及び配線基板の製造方法
TW200610457A (en) * 1998-12-16 2006-03-16 Ibiden Co Ltd Conductive connecting pin and package board
TW200625559A (en) * 2004-07-07 2006-07-16 Nec Corp Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4135839A1 (de) * 1991-10-31 1993-05-06 Huels Troisdorf Ag, 5210 Troisdorf, De Verfahren zur herstellung einer mehrlagigen gedruckten schaltung sowie mehrlagige gedruckte schaltung
JP3361903B2 (ja) * 1994-01-06 2003-01-07 凸版印刷株式会社 プリント配線板の製造方法
DE19548046C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen
JPH09298252A (ja) * 1996-05-01 1997-11-18 Shinko Electric Ind Co Ltd 半導体パッケージ及びこれを用いた半導体装置
JPH10209163A (ja) * 1997-01-21 1998-08-07 Citizen Watch Co Ltd 半導体装置およびその製造方法
US5807660A (en) * 1997-02-03 1998-09-15 Taiwan Semiconductor Manufacturing Company Ltd. Avoid photoresist lifting by post-oxide-dep plasma treatment
JP3635219B2 (ja) 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
JP3990962B2 (ja) * 2002-09-17 2007-10-17 新光電気工業株式会社 配線基板の製造方法
US6709965B1 (en) * 2002-10-02 2004-03-23 Taiwan Semiconductor Manufacturing Company Aluminum-copper bond pad design and method of fabrication
JP2005116909A (ja) * 2003-10-10 2005-04-28 Hitachi Cable Ltd 電子装置及び電子装置に用いる配線板
JP4541763B2 (ja) * 2004-01-19 2010-09-08 新光電気工業株式会社 回路基板の製造方法
JP2007012715A (ja) * 2005-06-28 2007-01-18 Rohm Co Ltd 半導体装置及び基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200610457A (en) * 1998-12-16 2006-03-16 Ibiden Co Ltd Conductive connecting pin and package board
TW200507214A (en) * 2003-08-13 2005-02-16 Phoenix Prec Technology Corp Semiconductor package substrate with protective metal layer on pads formed thereon and method for fabricating the same
JP2005244108A (ja) * 2004-02-27 2005-09-08 Ngk Spark Plug Co Ltd 配線基板、及び配線基板の製造方法
TW200625559A (en) * 2004-07-07 2006-07-16 Nec Corp Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

Also Published As

Publication number Publication date
JP4881211B2 (ja) 2012-02-22
US20080258300A1 (en) 2008-10-23
KR20080092851A (ko) 2008-10-16
US7915088B2 (en) 2011-03-29
JP2008263125A (ja) 2008-10-30
CN101286456A (zh) 2008-10-15
US20110139502A1 (en) 2011-06-16
US8237270B2 (en) 2012-08-07
CN101286456B (zh) 2012-03-21
TW200843045A (en) 2008-11-01

Similar Documents

Publication Publication Date Title
TWI462237B (zh) 佈線基板之製造方法，半導體裝置之製造方法及佈線基板
US8225502B2 (en) Wiring board manufacturing method
TWI443791B (zh) 佈線基板之製造方法、半導體裝置之製造方法及佈線基板
US10892216B2 (en) Wiring substrate and semiconductor device
JP5977051B2 (ja) 半導体パッケージ、半導体装置及び半導体パッケージの製造方法
JP6584939B2 (ja) 配線基板、半導体パッケージ、半導体装置、配線基板の製造方法及び半導体パッケージの製造方法
US9338886B2 (en) Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
JP7202785B2 (ja) 配線基板及び配線基板の製造方法
JP2010192781A (ja) 半導体装置及びその製造方法
US8053886B2 (en) Semiconductor package and manufacturing method thereof
US8062927B2 (en) Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same
US12526922B2 (en) Wiring board
US20210202412A1 (en) Semiconductor device package and method of manufacturing the same
US12200871B2 (en) Component-containing substrate
US11749596B2 (en) Wiring substrate
US20250113438A1 (en) Wiring board and semiconductor device
US20240096838A1 (en) Component-embedded packaging structure
JP2022133182A (ja) 部品内蔵基板及び部品内蔵基板の製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees