TWI326103B - - Google Patents

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Publication number
TWI326103B
TWI326103B TW093102420A TW93102420A TWI326103B TW I326103 B TWI326103 B TW I326103B TW 093102420 A TW093102420 A TW 093102420A TW 93102420 A TW93102420 A TW 93102420A TW I326103 B TWI326103 B TW I326103B
Authority
TW
Taiwan
Prior art keywords
semiconductor substrate
germanium
plane
germanium semiconductor
patent application
Prior art date
Application number
TW093102420A
Other languages
English (en)
Chinese (zh)
Other versions
TW200416806A (en
Inventor
Ohmi Tadahiro
Akinobu Teramoto
Shigetoshi Sugawa
Original Assignee
Shinetsu Handotai Kk
Ohmi Tadahiro
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32844274&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI326103(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shinetsu Handotai Kk, Ohmi Tadahiro filed Critical Shinetsu Handotai Kk
Publication of TW200416806A publication Critical patent/TW200416806A/zh
Application granted granted Critical
Publication of TWI326103B publication Critical patent/TWI326103B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01332—Making the insulator
    • H10D64/01336—Making the insulator on single crystalline silicon, e.g. chemical oxidation using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10D62/405—Orientations of crystalline planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/14—Preparing bulk and homogeneous wafers by setting crystal orientation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2902—Materials being Group IVA materials
    • H10P14/2905—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2924—Structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926—Crystal orientations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/36—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW093102420A 2003-02-07 2004-02-03 Silicon semiconductor substrate and its manufacturing method TW200416806A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003030642A JP4190906B2 (ja) 2003-02-07 2003-02-07 シリコン半導体基板及びその製造方法

Publications (2)

Publication Number Publication Date
TW200416806A TW200416806A (en) 2004-09-01
TWI326103B true TWI326103B (https=) 2010-06-11

Family

ID=32844274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102420A TW200416806A (en) 2003-02-07 2004-02-03 Silicon semiconductor substrate and its manufacturing method

Country Status (7)

Country Link
US (1) US7411274B2 (https=)
EP (1) EP1592045A4 (https=)
JP (1) JP4190906B2 (https=)
KR (1) KR101030455B1 (https=)
CN (1) CN100380580C (https=)
TW (1) TW200416806A (https=)
WO (1) WO2004070798A1 (https=)

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JP2004296496A (ja) * 2003-03-25 2004-10-21 Fujitsu Ltd 半導体装置の製造方法
JP3979412B2 (ja) * 2004-09-29 2007-09-19 株式会社Ｓｕｍｃｏ シリコンエピタキシャルウェーハの製造方法
JP2007070131A (ja) * 2005-09-05 2007-03-22 Sumco Corp エピタキシャルウェーハの製造方法およびエピタキシャルウェーハ
JP2008060355A (ja) * 2006-08-31 2008-03-13 Sumco Corp 貼り合わせウェーハの製造方法および貼り合わせウェーハ
JP5023900B2 (ja) 2006-09-05 2012-09-12 株式会社Ｓｕｍｃｏ エピタキシャルシリコンウェーハ
JP2008177530A (ja) * 2006-12-21 2008-07-31 Covalent Materials Corp 半導体基板およびその製造方法
JP2008177529A (ja) * 2006-12-21 2008-07-31 Covalent Materials Corp 半導体基板およびその製造方法
US20080164572A1 (en) * 2006-12-21 2008-07-10 Covalent Materials Corporation Semiconductor substrate and manufacturing method thereof
JP2009094156A (ja) * 2007-10-04 2009-04-30 Tohoku Univ 半導体基板および半導体装置
US8623137B1 (en) 2008-05-07 2014-01-07 Silicon Genesis Corporation Method and device for slicing a shaped silicon ingot using layer transfer
DE102008026784A1 (de) 2008-06-04 2009-12-10 Siltronic Ag Epitaxierte Siliciumscheibe mit <110>-Kristallorientierung und Verfahren zu ihrer Herstellung
US8815710B2 (en) 2008-06-10 2014-08-26 Sumco Corporation Silicon epitaxial wafer and method for production thereof
JP2010018504A (ja) * 2008-07-14 2010-01-28 Japan Atomic Energy Agency Ｓｉ（１１０）表面の一次元ナノ構造及びその製造方法
JP5593107B2 (ja) 2009-04-02 2014-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
US9157681B2 (en) 2010-02-04 2015-10-13 National University Corporation Tohoku University Surface treatment method for atomically flattening a silicon wafer and heat treatment apparatus
JPWO2011096417A1 (ja) * 2010-02-04 2013-06-10 国立大学法人東北大学 シリコンウェーハおよび半導体装置
JP5359991B2 (ja) 2010-05-20 2013-12-04 信越半導体株式会社 シリコンエピタキシャルウェーハ及びその製造方法
JP5375768B2 (ja) * 2010-08-17 2013-12-25 信越半導体株式会社 シリコンエピタキシャルウェーハの製造方法
US9064808B2 (en) 2011-07-25 2015-06-23 Synopsys, Inc. Integrated circuit devices having features with reduced edge curvature and methods for manufacturing the same
US8609550B2 (en) 2011-09-08 2013-12-17 Synopsys, Inc. Methods for manufacturing integrated circuit devices having features with reduced edge curvature
KR102046761B1 (ko) 2013-01-14 2019-12-02 삼성전자 주식회사 비휘발성 메모리 장치
JP2013254982A (ja) * 2013-08-21 2013-12-19 Tohoku Univ 半導体基板および半導体装置
JP6973475B2 (ja) * 2017-04-06 2021-12-01 株式会社Sumco エピタキシャルシリコンウェーハの製造方法およびエピタキシャルシリコンウェーハ
US11139402B2 (en) 2018-05-14 2021-10-05 Synopsys, Inc. Crystal orientation engineering to achieve consistent nanowire shapes
KR102662765B1 (ko) * 2018-08-02 2024-05-02 삼성전자주식회사 기판과 이를 포함하는 집적회로 소자 및 그 제조 방법
US11264458B2 (en) 2019-05-20 2022-03-01 Synopsys, Inc. Crystal orientation engineering to achieve consistent nanowire shapes
KR102523367B1 (ko) * 2020-02-13 2023-04-21 세메스 주식회사 실리콘 구조물 표면 러프니스 개선 방법 및 기판 처리 장치
CN111364097A (zh) * 2020-04-15 2020-07-03 晶科能源有限公司 一种定向凝固铸锭的单晶硅籽晶、硅锭、硅块、硅片及其制备方法和应用
DE102020209092A1 (de) * 2020-07-21 2022-01-27 Sicrystal Gmbh Kristallstrukturorientierung in Halbleiter-Halbzeugen und Halbleitersubstraten zum Verringern von Sprüngen und Verfahren zum Einstellen von dieser
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JP2026065931A (ja) * 2024-10-04 2026-04-16 信越半導体株式会社 シリコン基板の処理方法

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Also Published As

Publication number Publication date
KR20050098860A (ko) 2005-10-12
EP1592045A1 (en) 2005-11-02
TW200416806A (en) 2004-09-01
JP4190906B2 (ja) 2008-12-03
EP1592045A4 (en) 2010-09-08
CN100380580C (zh) 2008-04-09
CN1748287A (zh) 2006-03-15
US20060131553A1 (en) 2006-06-22
JP2004265918A (ja) 2004-09-24
WO2004070798A1 (ja) 2004-08-19
US7411274B2 (en) 2008-08-12
KR101030455B1 (ko) 2011-04-25

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