TW348279B - Substrate grinding method - Google Patents

Substrate grinding method

Info

Publication number
TW348279B
TW348279B TW086100157A TW86100157A TW348279B TW 348279 B TW348279 B TW 348279B TW 086100157 A TW086100157 A TW 086100157A TW 86100157 A TW86100157 A TW 86100157A TW 348279 B TW348279 B TW 348279B
Authority
TW
Taiwan
Prior art keywords
fluid
substrate
holding head
supply path
substrate holding
Prior art date
Application number
TW086100157A
Other languages
English (en)
Inventor
Mikio Nishio
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31297895A external-priority patent/JP2758152B2/ja
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW348279B publication Critical patent/TW348279B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW086100157A 1995-04-10 1996-03-07 Substrate grinding method TW348279B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8386095 1995-04-10
JP14153695 1995-06-08
JP31297895A JP2758152B2 (ja) 1995-04-10 1995-11-30 被研磨基板の保持装置及び基板の研磨方法

Publications (1)

Publication Number Publication Date
TW348279B true TW348279B (en) 1998-12-21

Family

ID=27304352

Family Applications (3)

Application Number Title Priority Date Filing Date
TW086100157A TW348279B (en) 1995-04-10 1996-03-07 Substrate grinding method
TW085102803A TW353203B (en) 1995-04-10 1996-03-07 Apparatus for holding substrate to be polished
TW086100159A TW400567B (en) 1995-04-10 1996-03-07 The polishing device and its polishing method for the substrate

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW085102803A TW353203B (en) 1995-04-10 1996-03-07 Apparatus for holding substrate to be polished
TW086100159A TW400567B (en) 1995-04-10 1996-03-07 The polishing device and its polishing method for the substrate

Country Status (7)

Country Link
US (2) US5791973A (zh)
EP (1) EP0737546B1 (zh)
KR (1) KR100209383B1 (zh)
CN (2) CN1494982A (zh)
CA (1) CA2173639A1 (zh)
DE (1) DE69611851T2 (zh)
TW (3) TW348279B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556881B (zh) * 2012-02-21 2016-11-11 荏原製作所股份有限公司 基板處理裝置及基板處理方法

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JP6891847B2 (ja) * 2018-04-05 2021-06-18 信越半導体株式会社 研磨ヘッド及びウェーハの研磨方法
CN108381376B (zh) * 2018-04-10 2020-01-24 中北大学 一种超声研磨蓝宝石镜片的加工装置
JP7075814B2 (ja) * 2018-05-21 2022-05-26 株式会社荏原製作所 基板保持装置、基板研磨装置、弾性部材および基板保持装置の製造方法
KR102712571B1 (ko) * 2018-08-06 2024-10-04 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 기판 연마 장치
CN110695849B (zh) * 2019-10-23 2020-09-15 清华大学 一种晶圆厚度测量装置和磨削机台
CN111922883A (zh) * 2020-07-17 2020-11-13 涂凯飞 一种抛光时自动添加抛光液的抛光装置
CN111922882A (zh) * 2020-07-17 2020-11-13 严满生 模具抛光研磨用边角保护条
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Publication number Priority date Publication date Assignee Title
TWI556881B (zh) * 2012-02-21 2016-11-11 荏原製作所股份有限公司 基板處理裝置及基板處理方法
US10328465B2 (en) 2012-02-21 2019-06-25 Ebara Corporation Substrate processing apparatus and substrate processing method
TWI669160B (zh) * 2012-02-21 2019-08-21 日商荏原製作所股份有限公司 基板處理裝置
US10799917B2 (en) 2012-02-21 2020-10-13 Ebara Corporation Substrate processing apparatus and substrate processing method
US11192147B2 (en) 2012-02-21 2021-12-07 Ebara Corporation Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
TW353203B (en) 1999-02-21
EP0737546A2 (en) 1996-10-16
KR100209383B1 (ko) 1999-07-15
DE69611851T2 (de) 2001-06-13
US5921853A (en) 1999-07-13
US5791973A (en) 1998-08-11
EP0737546B1 (en) 2001-02-28
CN1138745A (zh) 1996-12-25
CA2173639A1 (en) 1996-10-11
CN1141202C (zh) 2004-03-10
CN1494982A (zh) 2004-05-12
TW400567B (en) 2000-08-01
KR960039173A (ko) 1996-11-21
DE69611851D1 (de) 2001-04-05
EP0737546A3 (en) 1997-01-29

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