GB2344302B - Chemical-mechanical polishing machine and retainer ring thereof - Google Patents

Chemical-mechanical polishing machine and retainer ring thereof

Info

Publication number
GB2344302B
GB2344302B GB9920572A GB9920572A GB2344302B GB 2344302 B GB2344302 B GB 2344302B GB 9920572 A GB9920572 A GB 9920572A GB 9920572 A GB9920572 A GB 9920572A GB 2344302 B GB2344302 B GB 2344302B
Authority
GB
United Kingdom
Prior art keywords
chemical
mechanical polishing
retainer ring
polishing machine
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9920572A
Other versions
GB2344302A (en
GB9920572D0 (en
Inventor
Juen-Kuen Lin
Chien-Hsin Lai
Peng-Yih Peng
Kun-Lin Wu
Daniel Chiu
Chih-Chiang Yang
Juan-Yuan Wu
Hao-Kuang Chiu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW86214921U external-priority patent/TW403002U/en
Priority claimed from JP9313136A external-priority patent/JPH1190819A/en
Priority claimed from TW086118024A external-priority patent/TW369682B/en
Priority claimed from JP10246219A external-priority patent/JP3067741B2/en
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to GB9920572A priority Critical patent/GB2344302B/en
Publication of GB9920572D0 publication Critical patent/GB9920572D0/en
Publication of GB2344302A publication Critical patent/GB2344302A/en
Application granted granted Critical
Publication of GB2344302B publication Critical patent/GB2344302B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB9920572A 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof Expired - Lifetime GB2344302B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9920572A GB2344302B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
TW86214921U TW403002U (en) 1997-09-01 1997-09-01 Chip protecting ring of grinding head of chemical/mechanical grinder
JP9313136A JPH1190819A (en) 1997-09-01 1997-11-14 Polishing head retaining ring of chemical-mechanical polishing machine
TW086118024A TW369682B (en) 1997-12-01 1997-12-01 Chip retainer of polishing head for chemical mechanical polishing machine set
JP10246219A JP3067741B2 (en) 1997-09-01 1998-08-31 Chemical mechanical polishing machine and manufacturing method using the polishing machine
GB9920572A GB2344302B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9820209A GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Publications (3)

Publication Number Publication Date
GB9920572D0 GB9920572D0 (en) 1999-11-03
GB2344302A GB2344302A (en) 2000-06-07
GB2344302B true GB2344302B (en) 2002-11-06

Family

ID=27517473

Family Applications (4)

Application Number Title Priority Date Filing Date
GB9920573A Expired - Lifetime GB2344303B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9920572A Expired - Lifetime GB2344302B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9820209A Expired - Lifetime GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9920574A Expired - Lifetime GB2345257B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB9920573A Expired - Lifetime GB2344303B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Family Applications After (2)

Application Number Title Priority Date Filing Date
GB9820209A Expired - Lifetime GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9920574A Expired - Lifetime GB2345257B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method

Country Status (1)

Country Link
GB (4) GB2344303B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB407407A (en) * 1932-09-22 1934-03-22 Pilkington Brothers Ltd Improvements in glass grinding apparatus
GB729683A (en) * 1952-03-20 1955-05-11 Glaceries Sambre Sa Improvements in or relating to the feeding of abrasive composition to grinding tools
GB2292254A (en) * 1994-08-10 1996-02-14 Nec Corp Method for polishing semiconductor substrate
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5634061A (en) * 1990-05-24 1997-05-27 Kabushiki Kaisha Toshiba Instruction decoder utilizing a low power PLA that powers up both AND and OR planes only when successful instruction fetch signal is provided
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
GB2315694A (en) * 1996-07-30 1998-02-11 Tokyo Seimitsu Co Ltd Wafer polishing machine

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159371A (en) * 1984-12-28 1986-07-19 Fuji Seiki Seizosho:Kk Lapping method for silicone wafer for substrate of integrated circuit, etc. and blasting device therefor
SE500815C2 (en) * 1993-01-25 1994-09-12 Ericsson Telefon Ab L M Dielectrically isolated semiconductor device and method for its manufacture
TW348279B (en) * 1995-04-10 1998-12-21 Matsushita Electric Ind Co Ltd Substrate grinding method
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5738573A (en) * 1997-01-29 1998-04-14 Yueh; William Semiconductor wafer polishing apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB407407A (en) * 1932-09-22 1934-03-22 Pilkington Brothers Ltd Improvements in glass grinding apparatus
GB729683A (en) * 1952-03-20 1955-05-11 Glaceries Sambre Sa Improvements in or relating to the feeding of abrasive composition to grinding tools
US5634061A (en) * 1990-05-24 1997-05-27 Kabushiki Kaisha Toshiba Instruction decoder utilizing a low power PLA that powers up both AND and OR planes only when successful instruction fetch signal is provided
GB2292254A (en) * 1994-08-10 1996-02-14 Nec Corp Method for polishing semiconductor substrate
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
GB2315694A (en) * 1996-07-30 1998-02-11 Tokyo Seimitsu Co Ltd Wafer polishing machine

Also Published As

Publication number Publication date
GB9920574D0 (en) 1999-11-03
GB2342605A (en) 2000-04-19
GB2345257B (en) 2002-11-06
GB2345257A (en) 2000-07-05
GB2342605B (en) 2002-06-05
GB2344302A (en) 2000-06-07
GB9920573D0 (en) 1999-11-03
GB2344303B (en) 2002-12-11
GB9820209D0 (en) 1998-11-11
GB9920572D0 (en) 1999-11-03
GB2344303A (en) 2000-06-07

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20180915