GB2342605B - Chemical-mechanical polishing machine and retainer ring thereof - Google Patents

Chemical-mechanical polishing machine and retainer ring thereof

Info

Publication number
GB2342605B
GB2342605B GB9820209A GB9820209A GB2342605B GB 2342605 B GB2342605 B GB 2342605B GB 9820209 A GB9820209 A GB 9820209A GB 9820209 A GB9820209 A GB 9820209A GB 2342605 B GB2342605 B GB 2342605B
Authority
GB
United Kingdom
Prior art keywords
chemical
mechanical polishing
retainer ring
polishing machine
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9820209A
Other versions
GB9820209D0 (en
GB2342605A (en
Inventor
Juen-Kuen Lin
Chien-Hsin Lai
Peng-Yih Peng
Kun-Lin Wu
Daniel Chiu
Chih-Chiang Yang
Juan-Yuan Wu
Hao-Kuang Chiu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW86214921U external-priority patent/TW403002U/en
Priority to US08/959,518 priority Critical patent/US5944593A/en
Priority to JP9313136A priority patent/JPH1190819A/en
Priority claimed from JP9313136A external-priority patent/JPH1190819A/en
Priority claimed from TW086118024A external-priority patent/TW369682B/en
Priority to US09/059,750 priority patent/US6062963A/en
Priority to DE19839086A priority patent/DE19839086B4/en
Priority to FR9810824A priority patent/FR2767735B1/en
Priority claimed from JP10246219A external-priority patent/JP3067741B2/en
Priority to JP10246219A priority patent/JP3067741B2/en
Priority to GB9820209A priority patent/GB2342605B/en
Priority to GB9920573A priority patent/GB2344303B/en
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to GB9920574A priority patent/GB2345257B/en
Priority to GB9920572A priority patent/GB2344302B/en
Priority to NL1010252A priority patent/NL1010252C2/en
Publication of GB9820209D0 publication Critical patent/GB9820209D0/en
Publication of GB2342605A publication Critical patent/GB2342605A/en
Publication of GB2342605B publication Critical patent/GB2342605B/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB9820209A 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof Expired - Lifetime GB2342605B (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
US08/959,518 US5944593A (en) 1997-09-01 1997-10-28 Retainer ring for polishing head of chemical-mechanical polish machines
JP9313136A JPH1190819A (en) 1997-09-01 1997-11-14 Polishing head retaining ring of chemical-mechanical polishing machine
US09/059,750 US6062963A (en) 1997-12-01 1998-04-14 Retainer ring design for polishing head of chemical-mechanical polishing machine
DE19839086A DE19839086B4 (en) 1997-09-01 1998-08-27 Retaining ring for a chemical mechanical polishing apparatus and chemical mechanical polishing apparatus therewith
FR9810824A FR2767735B1 (en) 1997-09-01 1998-08-28 CHEMICAL MECHANICAL POLISHING MACHINE AND METHOD AND RETAINING SLEEVE USED IN THIS MACHINE
JP10246219A JP3067741B2 (en) 1997-09-01 1998-08-31 Chemical mechanical polishing machine and manufacturing method using the polishing machine
GB9920572A GB2344302B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9920574A GB2345257B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method
GB9820209A GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9920573A GB2344303B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
NL1010252A NL1010252C2 (en) 1997-09-01 1998-10-05 Retaining ring for use in a chemical mechanical polishing machine and manufacturing process using it.

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
TW86214921U TW403002U (en) 1997-09-01 1997-09-01 Chip protecting ring of grinding head of chemical/mechanical grinder
JP9313136A JPH1190819A (en) 1997-09-01 1997-11-14 Polishing head retaining ring of chemical-mechanical polishing machine
TW086118024A TW369682B (en) 1997-12-01 1997-12-01 Chip retainer of polishing head for chemical mechanical polishing machine set
JP10246219A JP3067741B2 (en) 1997-09-01 1998-08-31 Chemical mechanical polishing machine and manufacturing method using the polishing machine
GB9820209A GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Publications (3)

Publication Number Publication Date
GB9820209D0 GB9820209D0 (en) 1998-11-11
GB2342605A GB2342605A (en) 2000-04-19
GB2342605B true GB2342605B (en) 2002-06-05

Family

ID=27517473

Family Applications (4)

Application Number Title Priority Date Filing Date
GB9920573A Expired - Lifetime GB2344303B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9820209A Expired - Lifetime GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9920574A Expired - Lifetime GB2345257B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method
GB9920572A Expired - Lifetime GB2344302B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB9920573A Expired - Lifetime GB2344303B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Family Applications After (2)

Application Number Title Priority Date Filing Date
GB9920574A Expired - Lifetime GB2345257B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method
GB9920572A Expired - Lifetime GB2344302B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Country Status (1)

Country Link
GB (4) GB2344303B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292254A (en) * 1994-08-10 1996-02-14 Nec Corp Method for polishing semiconductor substrate
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
GB2315694A (en) * 1996-07-30 1998-02-11 Tokyo Seimitsu Co Ltd Wafer polishing machine

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE398709A (en) * 1932-09-22
NL91439C (en) * 1952-03-20
JPS61159371A (en) * 1984-12-28 1986-07-19 Fuji Seiki Seizosho:Kk Lapping method for silicone wafer for substrate of integrated circuit, etc. and blasting device therefor
JP2544027B2 (en) * 1990-05-24 1996-10-16 株式会社東芝 Low power consumption programmable logic array and information processing apparatus using the same
SE500815C2 (en) * 1993-01-25 1994-09-12 Ericsson Telefon Ab L M Dielectrically isolated semiconductor device and method for its manufacture
TW348279B (en) * 1995-04-10 1998-12-21 Matsushita Electric Ind Co Ltd Substrate grinding method
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5738573A (en) * 1997-01-29 1998-04-14 Yueh; William Semiconductor wafer polishing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292254A (en) * 1994-08-10 1996-02-14 Nec Corp Method for polishing semiconductor substrate
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
GB2315694A (en) * 1996-07-30 1998-02-11 Tokyo Seimitsu Co Ltd Wafer polishing machine

Also Published As

Publication number Publication date
GB2344303A (en) 2000-06-07
GB2344302A (en) 2000-06-07
GB9920572D0 (en) 1999-11-03
GB2344302B (en) 2002-11-06
GB2344303B (en) 2002-12-11
GB2345257B (en) 2002-11-06
GB2345257A (en) 2000-07-05
GB9920574D0 (en) 1999-11-03
GB9820209D0 (en) 1998-11-11
GB2342605A (en) 2000-04-19
GB9920573D0 (en) 1999-11-03

Similar Documents

Publication Publication Date Title
GB2315694B (en) Wafer polishing machine
AU6568098A (en) Integrated pad and belt for chemical mechanical polishing
SG95588A1 (en) Polishing method
EP1095734A4 (en) Polishing machine
SG66487A1 (en) Wafer polishing apparatus
EP0773269A3 (en) Polishing slurry
SG77175A1 (en) Polishing apparatus
SG72926A1 (en) Carrier and cmp apparatus
HUP0000435A3 (en) Brush ring
IL134476A0 (en) Grinding mill
GB2331720B (en) Improved grinding machine
GB2320695B (en) Sphere polishing machine
GB2344303B (en) Chemical-mechanical polishing machine and retainer ring thereof
ZA963153B (en) Grinding cup and wear part
ZA959884B (en) Grinding cup and wear part therefor
GB2315824B (en) Dynamic wear ring
ZA971905B (en) Machine for polishing and/or grinding.
GB2312637B (en) Grinding tool
HK1016525A1 (en) Grinding device
GB9713055D0 (en) Abrasive elements
TW367805U (en) Grinder
TW349453U (en) Polished apparatus
IL122200A0 (en) Method and machine for diamond polishing
GB2334690B (en) Improved grinding machine
SG30405A1 (en) Dust boot retainer ring

Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20180915