GB2345257B - Chemical-mechanical polishing method and fabricating method - Google Patents

Chemical-mechanical polishing method and fabricating method

Info

Publication number
GB2345257B
GB2345257B GB9920574A GB9920574A GB2345257B GB 2345257 B GB2345257 B GB 2345257B GB 9920574 A GB9920574 A GB 9920574A GB 9920574 A GB9920574 A GB 9920574A GB 2345257 B GB2345257 B GB 2345257B
Authority
GB
United Kingdom
Prior art keywords
chemical
mechanical polishing
fabricating
polishing method
fabricating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9920574A
Other versions
GB2345257A (en
GB9920574D0 (en
Inventor
Juen-Kuen Lin
Chien-Hsin Lai
Peng-Yih Peng
Kun-Lin Wu
Daniel Chiu
Chih-Chiang Yang
Juan-Yuan Wu
Hao-Kuang Chiu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW86214921U external-priority patent/TW403002U/en
Priority claimed from JP9313136A external-priority patent/JPH1190819A/en
Priority claimed from TW086118024A external-priority patent/TW369682B/en
Priority claimed from JP10246219A external-priority patent/JP3067741B2/en
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to GB9920574A priority Critical patent/GB2345257B/en
Publication of GB9920574D0 publication Critical patent/GB9920574D0/en
Publication of GB2345257A publication Critical patent/GB2345257A/en
Application granted granted Critical
Publication of GB2345257B publication Critical patent/GB2345257B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB9920574A 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method Expired - Lifetime GB2345257B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9920574A GB2345257B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
TW86214921U TW403002U (en) 1997-09-01 1997-09-01 Chip protecting ring of grinding head of chemical/mechanical grinder
JP9313136A JPH1190819A (en) 1997-09-01 1997-11-14 Polishing head retaining ring of chemical-mechanical polishing machine
TW086118024A TW369682B (en) 1997-12-01 1997-12-01 Chip retainer of polishing head for chemical mechanical polishing machine set
JP10246219A JP3067741B2 (en) 1997-09-01 1998-08-31 Chemical mechanical polishing machine and manufacturing method using the polishing machine
GB9920574A GB2345257B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method
GB9820209A GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Publications (3)

Publication Number Publication Date
GB9920574D0 GB9920574D0 (en) 1999-11-03
GB2345257A GB2345257A (en) 2000-07-05
GB2345257B true GB2345257B (en) 2002-11-06

Family

ID=27517473

Family Applications (4)

Application Number Title Priority Date Filing Date
GB9920573A Expired - Lifetime GB2344303B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9820209A Expired - Lifetime GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9920574A Expired - Lifetime GB2345257B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing method and fabricating method
GB9920572A Expired - Lifetime GB2344302B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Family Applications Before (2)

Application Number Title Priority Date Filing Date
GB9920573A Expired - Lifetime GB2344303B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof
GB9820209A Expired - Lifetime GB2342605B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB9920572A Expired - Lifetime GB2344302B (en) 1997-09-01 1998-09-16 Chemical-mechanical polishing machine and retainer ring thereof

Country Status (1)

Country Link
GB (4) GB2344303B (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679359A (en) * 1984-12-28 1987-07-14 Fuji Seiki Machine Works, Ltd. Method for preparation of silicon wafer
EP0623949A1 (en) * 1993-01-25 1994-11-09 Telefonaktiebolaget Lm Ericsson A dielectrically isolated semiconductor device and a method for its manufacture
GB2292254A (en) * 1994-08-10 1996-02-14 Nec Corp Method for polishing semiconductor substrate
EP0737546A2 (en) * 1995-04-10 1996-10-16 Matsushita Electric Industrial Co., Ltd. Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
GB2315694A (en) * 1996-07-30 1998-02-11 Tokyo Seimitsu Co Ltd Wafer polishing machine
US5738573A (en) * 1997-01-29 1998-04-14 Yueh; William Semiconductor wafer polishing apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE398709A (en) * 1932-09-22
NL91439C (en) * 1952-03-20
JP2544027B2 (en) * 1990-05-24 1996-10-16 株式会社東芝 Low power consumption programmable logic array and information processing apparatus using the same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679359A (en) * 1984-12-28 1987-07-14 Fuji Seiki Machine Works, Ltd. Method for preparation of silicon wafer
US4738056A (en) * 1984-12-28 1988-04-19 Fuji Seiki Machine Works, Ltd. Method and blasting apparatus for preparation of silicon wafer
EP0623949A1 (en) * 1993-01-25 1994-11-09 Telefonaktiebolaget Lm Ericsson A dielectrically isolated semiconductor device and a method for its manufacture
GB2292254A (en) * 1994-08-10 1996-02-14 Nec Corp Method for polishing semiconductor substrate
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
EP0737546A2 (en) * 1995-04-10 1996-10-16 Matsushita Electric Industrial Co., Ltd. Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
GB2315694A (en) * 1996-07-30 1998-02-11 Tokyo Seimitsu Co Ltd Wafer polishing machine
US5738573A (en) * 1997-01-29 1998-04-14 Yueh; William Semiconductor wafer polishing apparatus

Also Published As

Publication number Publication date
GB2344303A (en) 2000-06-07
GB2344302A (en) 2000-06-07
GB9920572D0 (en) 1999-11-03
GB2342605B (en) 2002-06-05
GB2344302B (en) 2002-11-06
GB2344303B (en) 2002-12-11
GB2345257A (en) 2000-07-05
GB9920574D0 (en) 1999-11-03
GB9820209D0 (en) 1998-11-11
GB2342605A (en) 2000-04-19
GB9920573D0 (en) 1999-11-03

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20180915