GB2345257B - Chemical-mechanical polishing method and fabricating method - Google Patents
Chemical-mechanical polishing method and fabricating methodInfo
- Publication number
- GB2345257B GB2345257B GB9920574A GB9920574A GB2345257B GB 2345257 B GB2345257 B GB 2345257B GB 9920574 A GB9920574 A GB 9920574A GB 9920574 A GB9920574 A GB 9920574A GB 2345257 B GB2345257 B GB 2345257B
- Authority
- GB
- United Kingdom
- Prior art keywords
- chemical
- mechanical polishing
- fabricating
- polishing method
- fabricating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9920574A GB2345257B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing method and fabricating method |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW86214921U TW403002U (en) | 1997-09-01 | 1997-09-01 | Chip protecting ring of grinding head of chemical/mechanical grinder |
JP9313136A JPH1190819A (en) | 1997-09-01 | 1997-11-14 | Polishing head retaining ring of chemical-mechanical polishing machine |
TW086118024A TW369682B (en) | 1997-12-01 | 1997-12-01 | Chip retainer of polishing head for chemical mechanical polishing machine set |
JP10246219A JP3067741B2 (en) | 1997-09-01 | 1998-08-31 | Chemical mechanical polishing machine and manufacturing method using the polishing machine |
GB9920574A GB2345257B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing method and fabricating method |
GB9820209A GB2342605B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing machine and retainer ring thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9920574D0 GB9920574D0 (en) | 1999-11-03 |
GB2345257A GB2345257A (en) | 2000-07-05 |
GB2345257B true GB2345257B (en) | 2002-11-06 |
Family
ID=27517473
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9920573A Expired - Lifetime GB2344303B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing machine and retainer ring thereof |
GB9820209A Expired - Lifetime GB2342605B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing machine and retainer ring thereof |
GB9920574A Expired - Lifetime GB2345257B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing method and fabricating method |
GB9920572A Expired - Lifetime GB2344302B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing machine and retainer ring thereof |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9920573A Expired - Lifetime GB2344303B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing machine and retainer ring thereof |
GB9820209A Expired - Lifetime GB2342605B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing machine and retainer ring thereof |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9920572A Expired - Lifetime GB2344302B (en) | 1997-09-01 | 1998-09-16 | Chemical-mechanical polishing machine and retainer ring thereof |
Country Status (1)
Country | Link |
---|---|
GB (4) | GB2344303B (en) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4679359A (en) * | 1984-12-28 | 1987-07-14 | Fuji Seiki Machine Works, Ltd. | Method for preparation of silicon wafer |
EP0623949A1 (en) * | 1993-01-25 | 1994-11-09 | Telefonaktiebolaget Lm Ericsson | A dielectrically isolated semiconductor device and a method for its manufacture |
GB2292254A (en) * | 1994-08-10 | 1996-02-14 | Nec Corp | Method for polishing semiconductor substrate |
EP0737546A2 (en) * | 1995-04-10 | 1996-10-16 | Matsushita Electric Industrial Co., Ltd. | Apparatus for holding substrate to be polished and apparatus and method for polishing substrate |
US5597346A (en) * | 1995-03-09 | 1997-01-28 | Texas Instruments Incorporated | Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process |
US5643061A (en) * | 1995-07-20 | 1997-07-01 | Integrated Process Equipment Corporation | Pneumatic polishing head for CMP apparatus |
US5695392A (en) * | 1995-08-09 | 1997-12-09 | Speedfam Corporation | Polishing device with improved handling of fluid polishing media |
GB2315694A (en) * | 1996-07-30 | 1998-02-11 | Tokyo Seimitsu Co Ltd | Wafer polishing machine |
US5738573A (en) * | 1997-01-29 | 1998-04-14 | Yueh; William | Semiconductor wafer polishing apparatus |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE398709A (en) * | 1932-09-22 | |||
NL91439C (en) * | 1952-03-20 | |||
JP2544027B2 (en) * | 1990-05-24 | 1996-10-16 | 株式会社東芝 | Low power consumption programmable logic array and information processing apparatus using the same |
-
1998
- 1998-09-16 GB GB9920573A patent/GB2344303B/en not_active Expired - Lifetime
- 1998-09-16 GB GB9820209A patent/GB2342605B/en not_active Expired - Lifetime
- 1998-09-16 GB GB9920574A patent/GB2345257B/en not_active Expired - Lifetime
- 1998-09-16 GB GB9920572A patent/GB2344302B/en not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4679359A (en) * | 1984-12-28 | 1987-07-14 | Fuji Seiki Machine Works, Ltd. | Method for preparation of silicon wafer |
US4738056A (en) * | 1984-12-28 | 1988-04-19 | Fuji Seiki Machine Works, Ltd. | Method and blasting apparatus for preparation of silicon wafer |
EP0623949A1 (en) * | 1993-01-25 | 1994-11-09 | Telefonaktiebolaget Lm Ericsson | A dielectrically isolated semiconductor device and a method for its manufacture |
GB2292254A (en) * | 1994-08-10 | 1996-02-14 | Nec Corp | Method for polishing semiconductor substrate |
US5597346A (en) * | 1995-03-09 | 1997-01-28 | Texas Instruments Incorporated | Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process |
EP0737546A2 (en) * | 1995-04-10 | 1996-10-16 | Matsushita Electric Industrial Co., Ltd. | Apparatus for holding substrate to be polished and apparatus and method for polishing substrate |
US5643061A (en) * | 1995-07-20 | 1997-07-01 | Integrated Process Equipment Corporation | Pneumatic polishing head for CMP apparatus |
US5695392A (en) * | 1995-08-09 | 1997-12-09 | Speedfam Corporation | Polishing device with improved handling of fluid polishing media |
GB2315694A (en) * | 1996-07-30 | 1998-02-11 | Tokyo Seimitsu Co Ltd | Wafer polishing machine |
US5738573A (en) * | 1997-01-29 | 1998-04-14 | Yueh; William | Semiconductor wafer polishing apparatus |
Also Published As
Publication number | Publication date |
---|---|
GB2344303A (en) | 2000-06-07 |
GB2344302A (en) | 2000-06-07 |
GB9920572D0 (en) | 1999-11-03 |
GB2342605B (en) | 2002-06-05 |
GB2344302B (en) | 2002-11-06 |
GB2344303B (en) | 2002-12-11 |
GB2345257A (en) | 2000-07-05 |
GB9920574D0 (en) | 1999-11-03 |
GB9820209D0 (en) | 1998-11-11 |
GB2342605A (en) | 2000-04-19 |
GB9920573D0 (en) | 1999-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Expiry date: 20180915 |