AU2792797A - Polishing method and semiconductor device manufacturing method using the same - Google Patents
Polishing method and semiconductor device manufacturing method using the sameInfo
- Publication number
- AU2792797A AU2792797A AU27927/97A AU2792797A AU2792797A AU 2792797 A AU2792797 A AU 2792797A AU 27927/97 A AU27927/97 A AU 27927/97A AU 2792797 A AU2792797 A AU 2792797A AU 2792797 A AU2792797 A AU 2792797A
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor device
- same
- device manufacturing
- polishing
- polishing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1997/001754 WO1998054756A1 (en) | 1997-05-26 | 1997-05-26 | Polishing method and semiconductor device manufacturing method using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2792797A true AU2792797A (en) | 1998-12-30 |
Family
ID=14180575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU27927/97A Abandoned AU2792797A (en) | 1997-05-26 | 1997-05-26 | Polishing method and semiconductor device manufacturing method using the same |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2792797A (en) |
TW (1) | TW358763B (en) |
WO (1) | WO1998054756A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1243071C (en) | 1998-12-28 | 2006-02-22 | 日立化成工业株式会社 | Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it |
JP5429104B2 (en) * | 1998-12-28 | 2014-02-26 | 日立化成株式会社 | Polishing liquid for metal and polishing method using the same |
JP4555936B2 (en) * | 1999-07-21 | 2010-10-06 | 日立化成工業株式会社 | CMP polishing liquid |
JP4657408B2 (en) * | 1999-10-13 | 2011-03-23 | 株式会社トクヤマ | Metal film abrasive |
JP4967110B2 (en) * | 2008-04-24 | 2012-07-04 | スパンション エルエルシー | Manufacturing method of semiconductor device |
WO2010140671A1 (en) | 2009-06-05 | 2010-12-09 | 株式会社Sumco | Silicon wafer polishing method and silicon wafer |
JP2016069535A (en) * | 2014-09-30 | 2016-05-09 | 株式会社フジミインコーポレーテッド | Polishing composition and producing method thereof and polishing method |
KR20200010071A (en) * | 2018-07-20 | 2020-01-30 | 주식회사 동진쎄미켐 | Chemical mechanical polishing composition, polishinbg slurry, and polishing method for substrate |
WO2020017894A1 (en) | 2018-07-20 | 2020-01-23 | 주식회사 동진쎄미켐 | Chemical-mechanical polishing composition, chemical-mechanical polishing slurry, and method for polishing substrate |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0475338A (en) * | 1990-07-18 | 1992-03-10 | Seiko Epson Corp | Mechanochemical polishing method |
US5244534A (en) * | 1992-01-24 | 1993-09-14 | Micron Technology, Inc. | Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs |
JPH0794455A (en) * | 1993-09-24 | 1995-04-07 | Sumitomo Metal Ind Ltd | Formation of wiring |
JP3397501B2 (en) * | 1994-07-12 | 2003-04-14 | 株式会社東芝 | Abrasive and polishing method |
JPH08264480A (en) * | 1995-03-20 | 1996-10-11 | Fujitsu Ltd | Method of fabricating semiconductor device |
-
1997
- 1997-05-26 AU AU27927/97A patent/AU2792797A/en not_active Abandoned
- 1997-05-26 WO PCT/JP1997/001754 patent/WO1998054756A1/en active Application Filing
- 1997-07-18 TW TW086110229A patent/TW358763B/en active
Also Published As
Publication number | Publication date |
---|---|
WO1998054756A1 (en) | 1998-12-03 |
TW358763B (en) | 1999-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |