DE60005270D1 - Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung - Google Patents

Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung

Info

Publication number
DE60005270D1
DE60005270D1 DE60005270T DE60005270T DE60005270D1 DE 60005270 D1 DE60005270 D1 DE 60005270D1 DE 60005270 T DE60005270 T DE 60005270T DE 60005270 T DE60005270 T DE 60005270T DE 60005270 D1 DE60005270 D1 DE 60005270D1
Authority
DE
Germany
Prior art keywords
wafer
support
stop plate
polishing
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60005270T
Other languages
English (en)
Other versions
DE60005270T2 (de
Inventor
Huey-Ming Wang
S Moloney
Scott Chin
J Geraghty
Dyson, Jr
K Dickey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/261,112 external-priority patent/US6231428B1/en
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Application granted granted Critical
Publication of DE60005270D1 publication Critical patent/DE60005270D1/de
Publication of DE60005270T2 publication Critical patent/DE60005270T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
DE60005270T 1999-03-03 2000-02-24 Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung Expired - Fee Related DE60005270T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US261112 1999-03-03
US09/261,112 US6231428B1 (en) 1999-03-03 1999-03-03 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US294547 1999-04-19
US09/294,547 US6309290B1 (en) 1999-03-03 1999-04-19 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
US390142 1999-09-03
US09/390,142 US6368189B1 (en) 1999-03-03 1999-09-03 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
PCT/IB2000/000508 WO2000054933A2 (en) 1999-03-03 2000-02-24 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control

Publications (2)

Publication Number Publication Date
DE60005270D1 true DE60005270D1 (de) 2003-10-23
DE60005270T2 DE60005270T2 (de) 2004-09-30

Family

ID=27401376

Family Applications (3)

Application Number Title Priority Date Filing Date
DE60005270T Expired - Fee Related DE60005270T2 (de) 1999-03-03 2000-02-24 Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung
DE60029490T Expired - Fee Related DE60029490T2 (de) 1999-03-03 2000-03-01 Eine Trägervorrichtung, mit einem direkten pneumatischen Drucksystem um ein Wafer zu polieren, verwendet in einer Vorrichtung und einem Verfahren zum chemisch-mechanischen Polieren
DE60011193T Expired - Fee Related DE60011193T2 (de) 1999-03-03 2000-03-01 Eine trägervorrichtung mit einem direkten pneumatischen drucksystem, um ein wafer zu polieren, verwendet in einer vorrichtung und einem verfahren zum chemisch-mechanischen polieren

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE60029490T Expired - Fee Related DE60029490T2 (de) 1999-03-03 2000-03-01 Eine Trägervorrichtung, mit einem direkten pneumatischen Drucksystem um ein Wafer zu polieren, verwendet in einer Vorrichtung und einem Verfahren zum chemisch-mechanischen Polieren
DE60011193T Expired - Fee Related DE60011193T2 (de) 1999-03-03 2000-03-01 Eine trägervorrichtung mit einem direkten pneumatischen drucksystem, um ein wafer zu polieren, verwendet in einer vorrichtung und einem verfahren zum chemisch-mechanischen polieren

Country Status (8)

Country Link
US (3) US6368189B1 (de)
EP (5) EP1091829B1 (de)
JP (3) JP4212776B2 (de)
AT (3) ATE249909T1 (de)
DE (3) DE60005270T2 (de)
HK (1) HK1037156A1 (de)
TW (2) TWI243084B (de)
WO (2) WO2000054933A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111168561A (zh) * 2019-12-26 2020-05-19 西安奕斯伟硅片技术有限公司 研磨头及晶圆研磨装置

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6776692B1 (en) * 1999-07-09 2004-08-17 Applied Materials Inc. Closed-loop control of wafer polishing in a chemical mechanical polishing system
US6206768B1 (en) * 1999-07-29 2001-03-27 Chartered Semiconductor Manufacturing, Ltd. Adjustable and extended guide rings
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
JP3816297B2 (ja) * 2000-04-25 2006-08-30 株式会社荏原製作所 研磨装置
TW579319B (en) * 2000-05-12 2004-03-11 Multi Planar Technologies Inc System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6808443B2 (en) * 2000-07-01 2004-10-26 Lam Research Corporation Projected gimbal point drive
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
JP4620072B2 (ja) * 2000-10-11 2011-01-26 株式会社荏原製作所 ポリッシング装置
JP2008188767A (ja) * 2000-10-11 2008-08-21 Ebara Corp 基板保持装置
JP2002187060A (ja) 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
CN1260778C (zh) 2000-12-04 2006-06-21 株式会社荏原制作所 基片加工方法
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6746318B2 (en) * 2001-10-11 2004-06-08 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
SG101493A1 (en) * 2001-10-17 2004-01-30 Yi Hsu Hung Wafer retaining ring
US6628886B2 (en) * 2002-01-04 2003-09-30 Iphotonics, Inc. Integrated processing system for optical devices
US6817102B2 (en) * 2002-04-23 2004-11-16 David Harris Trimmer head
US20060180486A1 (en) * 2003-04-21 2006-08-17 Bennett David W Modular panel and storage system for flat items such as media discs and holders therefor
US6964597B2 (en) * 2003-06-27 2005-11-15 Khuu's Inc. Retaining ring with trigger for chemical mechanical polishing apparatus
US20050070205A1 (en) * 2003-09-30 2005-03-31 Speedfam-Ipec Corporation Integrated pressure control system for workpiece carrier
WO2005049274A2 (en) 2003-11-13 2005-06-02 Applied Materials, Inc. Retaining ring with shaped surface
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US7063604B2 (en) * 2004-03-05 2006-06-20 Strasbaugh Independent edge control for CMP carriers
US6986359B2 (en) * 2004-03-09 2006-01-17 Mks Instruments, Inc. System and method for controlling pressure in remote zones
US8037896B2 (en) 2004-03-09 2011-10-18 Mks Instruments, Inc. Pressure regulation in remote zones
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
KR20070058445A (ko) * 2004-07-02 2007-06-08 스트라스바흐, 인코포레이티드 웨이퍼 처리 방법 및 시스템
JP4273056B2 (ja) * 2004-08-12 2009-06-03 不二越機械工業株式会社 研磨装置
EP2418677B1 (de) 2004-11-01 2016-12-07 Ebara Corporation Poliervorrichtung
US20070026772A1 (en) * 2005-07-28 2007-02-01 Dolechek Kert L Apparatus for use in processing a semiconductor workpiece
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
US20070246839A1 (en) * 2006-04-21 2007-10-25 Applied Materials, Inc. Method of proximity pin manufacture
JP2007307623A (ja) * 2006-05-16 2007-11-29 Elpida Memory Inc 研磨装置
JP5009101B2 (ja) * 2006-10-06 2012-08-22 株式会社荏原製作所 基板研磨装置
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
JP4534165B2 (ja) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
US20090124183A1 (en) * 2007-02-28 2009-05-14 Edgar Carballo Pneumatic adjustable sanding device
KR101057228B1 (ko) * 2008-10-21 2011-08-16 주식회사 엘지실트론 경면연마장치의 가압헤드
US8560111B2 (en) * 2008-12-31 2013-10-15 Stmicroelectronics, Inc. Method of determining pressure to apply to wafers during a CMP
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
KR101160266B1 (ko) * 2009-10-07 2012-06-27 주식회사 엘지실트론 웨이퍼 지지 부재, 그 제조방법 및 이를 포함하는 웨이퍼 연마 유닛
JP4927962B2 (ja) * 2010-01-21 2012-05-09 株式会社クレハ 研磨装置用ワークピース保持リング
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
KR101196652B1 (ko) 2011-05-31 2012-11-02 주식회사 케이씨텍 캐리어 헤드의 멤브레인 결합체 및 이를 구비한 캐리어 헤드
DE112012002493T8 (de) * 2011-06-29 2014-06-12 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
KR102014492B1 (ko) * 2011-09-12 2019-08-26 어플라이드 머티어리얼스, 인코포레이티드 복합 플라스틱 부분들을 구비한 캐리어 헤드
TWI639485B (zh) * 2012-01-31 2018-11-01 日商荏原製作所股份有限公司 Substrate holding device, polishing device, and polishing method
KR101597870B1 (ko) * 2012-04-02 2016-02-25 강준모 화학 기계적 연마 장치 용 캐리어 헤드
US8998676B2 (en) 2012-10-26 2015-04-07 Applied Materials, Inc. Retaining ring with selected stiffness and thickness
US9321184B2 (en) * 2013-05-09 2016-04-26 Lawrence E Baker Blade sharpening system for a log saw machine
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
JP2015196224A (ja) * 2014-04-01 2015-11-09 株式会社フジミインコーポレーテッド 研磨方法、及び保持具
CN105127890A (zh) * 2015-06-10 2015-12-09 上海新傲科技股份有限公司 抛光头
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
JP2018001290A (ja) * 2016-06-28 2018-01-11 株式会社ディスコ 加工装置
US10513008B2 (en) 2016-09-15 2019-12-24 Applied Materials, Inc. Chemical mechanical polishing smart ring
JP6833591B2 (ja) * 2016-10-28 2021-02-24 株式会社荏原製作所 基板保持装置、弾性膜、研磨装置、および弾性膜の交換方法
US11179823B2 (en) 2016-10-28 2021-11-23 Ebara Corporation Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane
CN108240612B (zh) * 2018-01-11 2020-01-31 深圳市百欧森环保科技股份有限公司 一种光等离子灯管快拆易维护结构
CN108098555B (zh) * 2018-02-09 2023-08-22 佛山市东信机械有限公司 一种曲面抛光机
JP7117171B2 (ja) * 2018-06-20 2022-08-12 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
JP7300297B2 (ja) * 2019-04-02 2023-06-29 株式会社荏原製作所 積層メンブレン、積層メンブレンを備える基板保持装置および基板処理装置
CN110411344B (zh) * 2019-08-06 2021-07-20 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种校准方法、校准装置、校准系统及电子设备
WO2022010687A1 (en) * 2020-07-08 2022-01-13 Applied Materials, Inc. Multi-toothed, magnetically controlled retaining ring
CN113829233B (zh) * 2021-08-21 2023-07-18 浙江晶盛机电股份有限公司 一种抛光载体
CN113752159B (zh) * 2021-08-21 2022-11-15 浙江晶盛机电股份有限公司 一种可在线测厚的抛光载体
CN115302403B (zh) * 2021-12-16 2023-04-21 清华大学 一种用于化学机械抛光的承载头及抛光设备
CN114718767B (zh) * 2022-03-31 2023-06-23 西安航天动力研究所 一种双路密封栓式喷注器装配测试方法
CN115091359B (zh) * 2022-05-26 2023-09-05 浙江晶盛机电股份有限公司 抛光载体
CN115431169B (zh) * 2022-08-24 2023-09-01 中国电子科技集团公司第十三研究所 真空连接转换装置、载片抛光方法及抛光机
CN115847263B (zh) * 2022-12-01 2023-11-03 张家港杰茂铝业有限公司 一种铝型材表面抛光设备
CN117245542B (zh) * 2023-11-17 2024-01-23 苏州博宏源机械制造有限公司 晶圆双面抛光设备及工艺

Family Cites Families (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR557656A (fr) 1922-10-20 1923-08-13 Procédé et dispositif pour le nettoyage des filtres à sable de grande surface
US3579916A (en) 1968-11-15 1971-05-25 Speedfam Corp Polishing machine
US3631634A (en) 1970-01-26 1972-01-04 John L Weber Polishing machine
US3841028A (en) 1972-08-24 1974-10-15 Crane Packing Co Apparatus for handling workpieces to be polished
JPS5911423B2 (ja) 1974-04-10 1984-03-15 株式会社日立製作所 ラツピング装置
US4081928A (en) 1974-05-16 1978-04-04 Texas Instruments Incorporated Silicon slice carrier block and plug assembly
DK276678A (da) 1977-06-28 1978-12-29 Woellner Werke Klaebemiddel indeholdende fintfordelt uorganisk pulver og organiske polymerer
JPS5943051B2 (ja) 1977-10-26 1984-10-19 日本原子力研究所 プラスチツクス表面処理剤
DE2809274A1 (de) 1978-03-03 1979-09-13 Wacker Chemitronic Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren
JPS55157473A (en) 1979-05-22 1980-12-08 Nippon Telegr & Teleph Corp <Ntt> Polishing method
US4270314A (en) 1979-09-17 1981-06-02 Speedfam Corporation Bearing mount for lapping machine pressure plate
US4519168A (en) 1979-09-18 1985-05-28 Speedfam Corporation Liquid waxless fixturing of microsize wafers
US4316757A (en) 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
JPS56146667A (en) 1980-04-18 1981-11-14 Hitachi Ltd Mirror surface grinder
JPS5879216A (ja) 1981-11-06 1983-05-13 Hitachi Ltd ２ビ−ム走査光学系
JPS5919671A (ja) 1982-07-22 1984-02-01 Disco Abrasive Sys Ltd ポリツシング装置
JPS60129522A (ja) 1983-12-15 1985-07-10 Shimizu Constr Co Ltd スタツクレイン防止装置
JPS6152967A (ja) 1984-08-22 1986-03-15 Nippon Kokan Kk <Nkk> 連続鋳造における鋳込方法
JPS61193781A (ja) 1985-02-20 1986-08-28 Akira Hina 溶接ｈ形鋼もしくはｔ形鋼自動製作機
US4680893A (en) 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
JPH0775825B2 (ja) 1986-01-07 1995-08-16 東芝機械株式会社 片面研磨装置
US4918870A (en) 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
JP2552306B2 (ja) 1987-09-30 1996-11-13 東芝機械株式会社 片面研磨装置
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
WO1989007508A1 (en) 1988-02-17 1989-08-24 Gruzinsky Politekhnichesky Institut Imeni V.I.Leni Method and cassette for abrasive machining of the surface of parts
JPH01216768A (ja) 1988-02-25 1989-08-30 Showa Denko Kk 半導体基板の研磨方法及びその装置
US4954142A (en) 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5212910A (en) 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5205082A (en) 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5216843A (en) 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5635083A (en) 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
US5554064A (en) 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5443416A (en) 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
US5582534A (en) 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5624299A (en) 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5820448A (en) 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
US5643053A (en) 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5547417A (en) 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
JPH0811055A (ja) * 1994-06-28 1996-01-16 Sony Corp 研磨装置、研磨装置の被研磨材の保持方法、及び被研磨材の保持構造
US5651724A (en) * 1994-09-08 1997-07-29 Ebara Corporation Method and apparatus for polishing workpiece
JPH08218783A (ja) * 1995-02-17 1996-08-27 Kajima Corp シールド機テールシール交換方法
JP3158934B2 (ja) 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US5775983A (en) 1995-05-01 1998-07-07 Applied Materials, Inc. Apparatus and method for conditioning a chemical mechanical polishing pad
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5681215A (en) 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP3129172B2 (ja) * 1995-11-14 2001-01-29 日本電気株式会社 研磨装置及び研磨方法
GB2307432B (en) 1995-11-21 1999-05-26 Rolls Royce & Ass A sample removing tool
EP0786310B1 (de) 1996-01-24 2002-12-04 Lam Research Corporation Halbleiterscheiben-Polierkopf
JPH09225819A (ja) * 1996-02-21 1997-09-02 Shin Etsu Handotai Co Ltd 被加工物の保持機構
US5679065A (en) * 1996-02-23 1997-10-21 Micron Technology, Inc. Wafer carrier having carrier ring adapted for uniform chemical-mechanical planarization of semiconductor wafers
JP3133249B2 (ja) * 1996-02-26 2001-02-05 株式会社東芝 原子力発電プラント
JP3106418B2 (ja) * 1996-07-30 2000-11-06 株式会社東京精密 研磨装置
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
US5716258A (en) * 1996-11-26 1998-02-10 Metcalf; Robert L. Semiconductor wafer polishing machine and method
JP3784477B2 (ja) * 1996-12-06 2006-06-14 株式会社荏原製作所 ウェーハ研磨装置及びそれに用いるウェーハ保持ヘッド
DE19651761A1 (de) 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US5857899A (en) * 1997-04-04 1999-01-12 Ontrak Systems, Inc. Wafer polishing head with pad dressing element
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
EP0881039B1 (de) 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Halbleiterscheibe Poliervorrichtung mit Halterring
DE19755975A1 (de) * 1997-12-16 1999-06-17 Wolters Peter Werkzeugmasch Halter für flache Werkstücke, insbesondere Halbleiterwafer
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6113480A (en) * 1998-06-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for polishing semiconductor wafers and method of testing same
US6413459B1 (en) * 1998-08-05 2002-07-02 Micron Technology, Inc. Method for handling and processing microelectronic-device substrate assemblies
US6093089A (en) * 1999-01-25 2000-07-25 United Microelectronics Corp. Apparatus for controlling uniformity of polished material
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6077151A (en) * 1999-05-17 2000-06-20 Vlsi Technology, Inc. Temperature control carrier head for chemical mechanical polishing process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111168561A (zh) * 2019-12-26 2020-05-19 西安奕斯伟硅片技术有限公司 研磨头及晶圆研磨装置
CN111168561B (zh) * 2019-12-26 2022-05-13 西安奕斯伟材料科技有限公司 研磨头及晶圆研磨装置

Also Published As

Publication number Publication date
US20060128277A1 (en) 2006-06-15
DE60011193T2 (de) 2005-07-07
US20020077045A1 (en) 2002-06-20
EP1075351B1 (de) 2004-06-02
DE60005270T2 (de) 2004-09-30
DE60011193D1 (de) 2004-07-08
ATE268247T1 (de) 2004-06-15
EP1837122A3 (de) 2007-10-17
WO2000054933A2 (en) 2000-09-21
TWI243084B (en) 2005-11-11
ATE249909T1 (de) 2003-10-15
TW534850B (en) 2003-06-01
JP3595266B2 (ja) 2004-12-02
EP1075351A1 (de) 2001-02-14
WO2000051782B1 (en) 2001-05-25
JP4212776B2 (ja) 2009-01-21
EP1091829A2 (de) 2001-04-18
EP1371449A2 (de) 2003-12-17
US7311586B2 (en) 2007-12-25
JP2002539620A (ja) 2002-11-19
WO2000054933B1 (en) 2001-03-01
WO2000054933A3 (en) 2001-01-25
EP1371449A3 (de) 2004-04-21
EP1437197A1 (de) 2004-07-14
WO2000051782A1 (en) 2000-09-08
EP1837122B1 (de) 2009-12-02
HK1037156A1 (en) 2002-02-01
EP1091829B1 (de) 2003-09-17
US6368189B1 (en) 2002-04-09
EP1437197B1 (de) 2006-07-19
ATE333342T1 (de) 2006-08-15
JP2002538611A (ja) 2002-11-12
DE60029490D1 (de) 2006-08-31
US7029382B2 (en) 2006-04-18
EP1837122A2 (de) 2007-09-26
JP2004048082A (ja) 2004-02-12
DE60029490T2 (de) 2007-02-08

Similar Documents

Publication Publication Date Title
DE60005270D1 (de) Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung
KR100385373B1 (ko) 가변 연마력 웨이퍼 캐리어 헤드를 구비하는 반도체웨이퍼 연마 장치
US7040971B2 (en) Carrier head with a flexible membrane
US7357699B2 (en) Substrate holding apparatus and polishing apparatus
US5964653A (en) Carrier head with a flexible membrane for a chemical mechanical polishing system
US6645044B2 (en) Method of chemical mechanical polishing with controllable pressure and loading area
US5899801A (en) Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system
US6277009B1 (en) Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US8454413B2 (en) Multi-chamber carrier head with a textured membrane
US20080014842A1 (en) Polishing head for polishing semiconductor wafers
KR20000048476A (ko) 화학 기계적 연마를 위한 제어가능한 압력 및 부하 영역을갖는 캐리어 헤드
US6517421B2 (en) Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer
JPS62124844A (ja) 研磨、研削用真空吸着装置

Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: EBARA CORP., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee