JPS55157473A - Polishing method - Google Patents

Polishing method

Info

Publication number
JPS55157473A
JPS55157473A JP6226879A JP6226879A JPS55157473A JP S55157473 A JPS55157473 A JP S55157473A JP 6226879 A JP6226879 A JP 6226879A JP 6226879 A JP6226879 A JP 6226879A JP S55157473 A JPS55157473 A JP S55157473A
Authority
JP
Japan
Prior art keywords
polisher
work
grinding fluid
dust
polishing space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6226879A
Other languages
Japanese (ja)
Inventor
Atsushi Une
Yoshiyuki Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP6226879A priority Critical patent/JPS55157473A/en
Publication of JPS55157473A publication Critical patent/JPS55157473A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE: To utilize effectively a grinding fluid and prevent intrusion of dust, by filling a clearance between a work and a polisher with the fluid and blocking the polishing space.
CONSTITUTION: Grinding fluid is fed in a clearance between a work 1 and polisher 5 through an abrasive liquid feed pipe 7 penetrating through a work bonding dish 2 to which the work 1 is bonded and a hose 8 set above the feed pipe 7. A correcting ring 6 is set close the external circumference of the work bonding dish 2 to block the polishing space, store the grinding fluid and prevent intrusion of dust. Since the flat bottom of the correcting ring 6 is pressed due to its dead weight to the surface of the polisher 5, the polisher 5 is elastically deformed, being in close contact with the ring bottom and the polishing space is blocked by the correcting ring 6, polisher 5, and the lower side of the work bonding dish 2, thus the grinding fluid is utilized effectively and intrusion of dust is inhibited.
COPYRIGHT: (C)1980,JPO&Japio
JP6226879A 1979-05-22 1979-05-22 Polishing method Pending JPS55157473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6226879A JPS55157473A (en) 1979-05-22 1979-05-22 Polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6226879A JPS55157473A (en) 1979-05-22 1979-05-22 Polishing method

Publications (1)

Publication Number Publication Date
JPS55157473A true JPS55157473A (en) 1980-12-08

Family

ID=13195224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6226879A Pending JPS55157473A (en) 1979-05-22 1979-05-22 Polishing method

Country Status (1)

Country Link
JP (1) JPS55157473A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768148A1 (en) * 1995-10-09 1997-04-16 Ebara Corporation Apparatus for and method of polishing workpiece
EP0786310A1 (en) * 1996-01-24 1997-07-30 Ontrak Systems, Inc. Wafer polishing head
US5857899A (en) * 1997-04-04 1999-01-12 Ontrak Systems, Inc. Wafer polishing head with pad dressing element
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
EP1254743A2 (en) * 2001-05-02 2002-11-06 Hitoshi Suwabe Polishing machine
US6533646B2 (en) 1997-04-08 2003-03-18 Lam Research Corporation Polishing head with removable subcarrier
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768148A1 (en) * 1995-10-09 1997-04-16 Ebara Corporation Apparatus for and method of polishing workpiece
US6033520A (en) * 1995-10-09 2000-03-07 Ebara Corporation Apparatus for and method of polishing workpiece
US6432258B1 (en) * 1995-10-09 2002-08-13 Ebara Corporation Apparatus for and method of polishing workpiece
EP0786310A1 (en) * 1996-01-24 1997-07-30 Ontrak Systems, Inc. Wafer polishing head
US5803799A (en) * 1996-01-24 1998-09-08 Ontrak Systems, Inc. Wafer polishing head
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
US5857899A (en) * 1997-04-04 1999-01-12 Ontrak Systems, Inc. Wafer polishing head with pad dressing element
US5913714A (en) * 1997-04-04 1999-06-22 Ontrak Systems, Inc. Method for dressing a polishing pad during polishing of a semiconductor wafer
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6533646B2 (en) 1997-04-08 2003-03-18 Lam Research Corporation Polishing head with removable subcarrier
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US7029382B2 (en) 1999-03-03 2006-04-18 Ebara Corporation Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US7311586B2 (en) 1999-03-03 2007-12-25 Ebara Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
EP1254743A2 (en) * 2001-05-02 2002-11-06 Hitoshi Suwabe Polishing machine
EP1254743A3 (en) * 2001-05-02 2004-01-21 Hitoshi Suwabe Polishing machine
EP1611996A1 (en) * 2001-05-02 2006-01-04 Hitoshi Suwabe Polishing machine

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