JPS55157473A - Polishing method - Google Patents
Polishing methodInfo
- Publication number
- JPS55157473A JPS55157473A JP6226879A JP6226879A JPS55157473A JP S55157473 A JPS55157473 A JP S55157473A JP 6226879 A JP6226879 A JP 6226879A JP 6226879 A JP6226879 A JP 6226879A JP S55157473 A JPS55157473 A JP S55157473A
- Authority
- JP
- Japan
- Prior art keywords
- polisher
- work
- grinding fluid
- dust
- polishing space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE: To utilize effectively a grinding fluid and prevent intrusion of dust, by filling a clearance between a work and a polisher with the fluid and blocking the polishing space.
CONSTITUTION: Grinding fluid is fed in a clearance between a work 1 and polisher 5 through an abrasive liquid feed pipe 7 penetrating through a work bonding dish 2 to which the work 1 is bonded and a hose 8 set above the feed pipe 7. A correcting ring 6 is set close the external circumference of the work bonding dish 2 to block the polishing space, store the grinding fluid and prevent intrusion of dust. Since the flat bottom of the correcting ring 6 is pressed due to its dead weight to the surface of the polisher 5, the polisher 5 is elastically deformed, being in close contact with the ring bottom and the polishing space is blocked by the correcting ring 6, polisher 5, and the lower side of the work bonding dish 2, thus the grinding fluid is utilized effectively and intrusion of dust is inhibited.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6226879A JPS55157473A (en) | 1979-05-22 | 1979-05-22 | Polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6226879A JPS55157473A (en) | 1979-05-22 | 1979-05-22 | Polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55157473A true JPS55157473A (en) | 1980-12-08 |
Family
ID=13195224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6226879A Pending JPS55157473A (en) | 1979-05-22 | 1979-05-22 | Polishing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55157473A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0768148A1 (en) * | 1995-10-09 | 1997-04-16 | Ebara Corporation | Apparatus for and method of polishing workpiece |
EP0786310A1 (en) * | 1996-01-24 | 1997-07-30 | Ontrak Systems, Inc. | Wafer polishing head |
US5857899A (en) * | 1997-04-04 | 1999-01-12 | Ontrak Systems, Inc. | Wafer polishing head with pad dressing element |
US5876273A (en) * | 1996-04-01 | 1999-03-02 | Kabushiki Kaisha Toshiba | Apparatus for polishing a wafer |
US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US6425812B1 (en) | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
EP1254743A2 (en) * | 2001-05-02 | 2002-11-06 | Hitoshi Suwabe | Polishing machine |
US6533646B2 (en) | 1997-04-08 | 2003-03-18 | Lam Research Corporation | Polishing head with removable subcarrier |
US6666756B1 (en) | 2000-03-31 | 2003-12-23 | Lam Research Corporation | Wafer carrier head assembly |
-
1979
- 1979-05-22 JP JP6226879A patent/JPS55157473A/en active Pending
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0768148A1 (en) * | 1995-10-09 | 1997-04-16 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US6033520A (en) * | 1995-10-09 | 2000-03-07 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US6432258B1 (en) * | 1995-10-09 | 2002-08-13 | Ebara Corporation | Apparatus for and method of polishing workpiece |
EP0786310A1 (en) * | 1996-01-24 | 1997-07-30 | Ontrak Systems, Inc. | Wafer polishing head |
US5803799A (en) * | 1996-01-24 | 1998-09-08 | Ontrak Systems, Inc. | Wafer polishing head |
US5876273A (en) * | 1996-04-01 | 1999-03-02 | Kabushiki Kaisha Toshiba | Apparatus for polishing a wafer |
US5857899A (en) * | 1997-04-04 | 1999-01-12 | Ontrak Systems, Inc. | Wafer polishing head with pad dressing element |
US5913714A (en) * | 1997-04-04 | 1999-06-22 | Ontrak Systems, Inc. | Method for dressing a polishing pad during polishing of a semiconductor wafer |
US6425812B1 (en) | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
US6533646B2 (en) | 1997-04-08 | 2003-03-18 | Lam Research Corporation | Polishing head with removable subcarrier |
US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US7029382B2 (en) | 1999-03-03 | 2006-04-18 | Ebara Corporation | Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US7311586B2 (en) | 1999-03-03 | 2007-12-25 | Ebara Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US6666756B1 (en) | 2000-03-31 | 2003-12-23 | Lam Research Corporation | Wafer carrier head assembly |
EP1254743A2 (en) * | 2001-05-02 | 2002-11-06 | Hitoshi Suwabe | Polishing machine |
EP1254743A3 (en) * | 2001-05-02 | 2004-01-21 | Hitoshi Suwabe | Polishing machine |
EP1611996A1 (en) * | 2001-05-02 | 2006-01-04 | Hitoshi Suwabe | Polishing machine |
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