JPS6451267A - Seasoning device for abrasive pad - Google Patents

Seasoning device for abrasive pad

Info

Publication number
JPS6451267A
JPS6451267A JP62208418A JP20841887A JPS6451267A JP S6451267 A JPS6451267 A JP S6451267A JP 62208418 A JP62208418 A JP 62208418A JP 20841887 A JP20841887 A JP 20841887A JP S6451267 A JPS6451267 A JP S6451267A
Authority
JP
Japan
Prior art keywords
seasoning
carrier
packing material
abrasive pad
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62208418A
Other languages
Japanese (ja)
Other versions
JPH0775828B2 (en
Inventor
Takayoshi Yamazaki
Hajime Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RODEELE NITTA KK
Original Assignee
RODEELE NITTA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RODEELE NITTA KK filed Critical RODEELE NITTA KK
Priority to JP62208418A priority Critical patent/JPH0775828B2/en
Publication of JPS6451267A publication Critical patent/JPS6451267A/en
Publication of JPH0775828B2 publication Critical patent/JPH0775828B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To improve the extent of seasoning efficiency as well as to make packing material function as a buffer and facilitate pressure control at the time of seasoning by attaching a seasoning material to a carrier plate via the packing material. CONSTITUTION:A packing material 20 is installed interposingly between a plate 11 of a carrier 10 and a base body 31 of a seasoning material 30. This seasoning material 30 is strongly pressed to the plate 11 of the carrier 10 whereby the packing material is compressed, and the seasoning material 30 is closely stuck to a surface of the carrier 10 and supported thereon by a liquid of water or the like dropped on the packing material 20. When the plate 11 of the carrier 10 is relatively rotated to an abrasive pad, the seasoning material 30 is rotated to the packing material 20. With this rotation, the seasoning material 30 seasons a surface of this abrasive pad, smoothing this surface. At the time of this seasoning work, polishing fluid is made to flow between the abrasive pad surface and the seasoning material 30, thus swarf is removed form this clearance.
JP62208418A 1987-08-21 1987-08-21 Seasoning device for polishing pad Expired - Lifetime JPH0775828B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62208418A JPH0775828B2 (en) 1987-08-21 1987-08-21 Seasoning device for polishing pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62208418A JPH0775828B2 (en) 1987-08-21 1987-08-21 Seasoning device for polishing pad

Publications (2)

Publication Number Publication Date
JPS6451267A true JPS6451267A (en) 1989-02-27
JPH0775828B2 JPH0775828B2 (en) 1995-08-16

Family

ID=16555903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62208418A Expired - Lifetime JPH0775828B2 (en) 1987-08-21 1987-08-21 Seasoning device for polishing pad

Country Status (1)

Country Link
JP (1) JPH0775828B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11138417A (en) * 1997-11-07 1999-05-25 Nippon Steel Corp Dresser for semiconductor substrate abrasive cloth and its manufacture
US6302770B1 (en) 1998-07-28 2001-10-16 Nikon Research Corporation Of America In-situ pad conditioning for CMP polisher
JP2002208575A (en) * 2001-01-10 2002-07-26 Sony Corp Semiconductor grinding device
JP2010274408A (en) * 2009-06-01 2010-12-09 Nitta Haas Inc Conditioner of polishing pad
JP2010274407A (en) * 2009-06-01 2010-12-09 Nitta Haas Inc Conditioner of polishing pad

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149158A (en) * 1981-03-09 1982-09-14 Fujimi Kenmazai Kogyo Kk Method of removing choke in grinding pad and dresser

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149158A (en) * 1981-03-09 1982-09-14 Fujimi Kenmazai Kogyo Kk Method of removing choke in grinding pad and dresser

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11138417A (en) * 1997-11-07 1999-05-25 Nippon Steel Corp Dresser for semiconductor substrate abrasive cloth and its manufacture
US6302770B1 (en) 1998-07-28 2001-10-16 Nikon Research Corporation Of America In-situ pad conditioning for CMP polisher
US6733370B2 (en) 1998-07-28 2004-05-11 Nikon Research Corporation Of America In-situ pad conditioning apparatus for CMP polisher
JP2002208575A (en) * 2001-01-10 2002-07-26 Sony Corp Semiconductor grinding device
JP2010274408A (en) * 2009-06-01 2010-12-09 Nitta Haas Inc Conditioner of polishing pad
JP2010274407A (en) * 2009-06-01 2010-12-09 Nitta Haas Inc Conditioner of polishing pad

Also Published As

Publication number Publication date
JPH0775828B2 (en) 1995-08-16

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