JPS6451267A - Seasoning device for abrasive pad - Google Patents
Seasoning device for abrasive padInfo
- Publication number
- JPS6451267A JPS6451267A JP62208418A JP20841887A JPS6451267A JP S6451267 A JPS6451267 A JP S6451267A JP 62208418 A JP62208418 A JP 62208418A JP 20841887 A JP20841887 A JP 20841887A JP S6451267 A JPS6451267 A JP S6451267A
- Authority
- JP
- Japan
- Prior art keywords
- seasoning
- carrier
- packing material
- abrasive pad
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To improve the extent of seasoning efficiency as well as to make packing material function as a buffer and facilitate pressure control at the time of seasoning by attaching a seasoning material to a carrier plate via the packing material. CONSTITUTION:A packing material 20 is installed interposingly between a plate 11 of a carrier 10 and a base body 31 of a seasoning material 30. This seasoning material 30 is strongly pressed to the plate 11 of the carrier 10 whereby the packing material is compressed, and the seasoning material 30 is closely stuck to a surface of the carrier 10 and supported thereon by a liquid of water or the like dropped on the packing material 20. When the plate 11 of the carrier 10 is relatively rotated to an abrasive pad, the seasoning material 30 is rotated to the packing material 20. With this rotation, the seasoning material 30 seasons a surface of this abrasive pad, smoothing this surface. At the time of this seasoning work, polishing fluid is made to flow between the abrasive pad surface and the seasoning material 30, thus swarf is removed form this clearance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62208418A JPH0775828B2 (en) | 1987-08-21 | 1987-08-21 | Seasoning device for polishing pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62208418A JPH0775828B2 (en) | 1987-08-21 | 1987-08-21 | Seasoning device for polishing pad |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6451267A true JPS6451267A (en) | 1989-02-27 |
JPH0775828B2 JPH0775828B2 (en) | 1995-08-16 |
Family
ID=16555903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62208418A Expired - Lifetime JPH0775828B2 (en) | 1987-08-21 | 1987-08-21 | Seasoning device for polishing pad |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0775828B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11138417A (en) * | 1997-11-07 | 1999-05-25 | Nippon Steel Corp | Dresser for semiconductor substrate abrasive cloth and its manufacture |
US6302770B1 (en) | 1998-07-28 | 2001-10-16 | Nikon Research Corporation Of America | In-situ pad conditioning for CMP polisher |
JP2002208575A (en) * | 2001-01-10 | 2002-07-26 | Sony Corp | Semiconductor grinding device |
JP2010274408A (en) * | 2009-06-01 | 2010-12-09 | Nitta Haas Inc | Conditioner of polishing pad |
JP2010274407A (en) * | 2009-06-01 | 2010-12-09 | Nitta Haas Inc | Conditioner of polishing pad |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57149158A (en) * | 1981-03-09 | 1982-09-14 | Fujimi Kenmazai Kogyo Kk | Method of removing choke in grinding pad and dresser |
-
1987
- 1987-08-21 JP JP62208418A patent/JPH0775828B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57149158A (en) * | 1981-03-09 | 1982-09-14 | Fujimi Kenmazai Kogyo Kk | Method of removing choke in grinding pad and dresser |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11138417A (en) * | 1997-11-07 | 1999-05-25 | Nippon Steel Corp | Dresser for semiconductor substrate abrasive cloth and its manufacture |
US6302770B1 (en) | 1998-07-28 | 2001-10-16 | Nikon Research Corporation Of America | In-situ pad conditioning for CMP polisher |
US6733370B2 (en) | 1998-07-28 | 2004-05-11 | Nikon Research Corporation Of America | In-situ pad conditioning apparatus for CMP polisher |
JP2002208575A (en) * | 2001-01-10 | 2002-07-26 | Sony Corp | Semiconductor grinding device |
JP2010274408A (en) * | 2009-06-01 | 2010-12-09 | Nitta Haas Inc | Conditioner of polishing pad |
JP2010274407A (en) * | 2009-06-01 | 2010-12-09 | Nitta Haas Inc | Conditioner of polishing pad |
Also Published As
Publication number | Publication date |
---|---|
JPH0775828B2 (en) | 1995-08-16 |
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Legal Events
Date | Code | Title | Description |
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S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
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R350 | Written notification of registration of transfer |
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EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080816 Year of fee payment: 13 |