JPS57149158A - Method of removing choke in grinding pad and dresser - Google Patents

Method of removing choke in grinding pad and dresser

Info

Publication number
JPS57149158A
JPS57149158A JP56033542A JP3354281A JPS57149158A JP S57149158 A JPS57149158 A JP S57149158A JP 56033542 A JP56033542 A JP 56033542A JP 3354281 A JP3354281 A JP 3354281A JP S57149158 A JPS57149158 A JP S57149158A
Authority
JP
Japan
Prior art keywords
pad
dresser
objects
grinding pad
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56033542A
Other languages
Japanese (ja)
Inventor
Hiroyuki Nakagawa
Tetsuji Senda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Kenmazai Kogyo Co Ltd
Fujimi Inc
Original Assignee
Fujimi Abrasives Co Ltd
Fujimi Kenmazai Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Abrasives Co Ltd, Fujimi Kenmazai Kogyo Co Ltd filed Critical Fujimi Abrasives Co Ltd
Priority to JP56033542A priority Critical patent/JPS57149158A/en
Publication of JPS57149158A publication Critical patent/JPS57149158A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Abstract

PURPOSE:To efficiently remove the plugging in a grinding pad by bringing a grinding pad dresser fitted to a rotating board for objects of grinding in place of said objects, into contact with a grinding pad stuck to a rotating board for said pad and putting the dresser in sliding motion. CONSTITUTION:When the plugging due to abrasive on a grinding pad 2 is removed, a dresser 21 for grinding pad 2 made of small disc-shaped plastics and the like forming cone-like projections on one surface is stuck to rotary boards 10, 10 for objects to be ground which are normally fitted with objects to be ground in place of an object 12 to be ground. Then, the rotating boards 10, 10 for objects to be ground are brought into contact with said pad 2 fitted to the surface of a pad rotating board 3, and driven by sliding contact.
JP56033542A 1981-03-09 1981-03-09 Method of removing choke in grinding pad and dresser Pending JPS57149158A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56033542A JPS57149158A (en) 1981-03-09 1981-03-09 Method of removing choke in grinding pad and dresser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56033542A JPS57149158A (en) 1981-03-09 1981-03-09 Method of removing choke in grinding pad and dresser

Publications (1)

Publication Number Publication Date
JPS57149158A true JPS57149158A (en) 1982-09-14

Family

ID=12389448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56033542A Pending JPS57149158A (en) 1981-03-09 1981-03-09 Method of removing choke in grinding pad and dresser

Country Status (1)

Country Link
JP (1) JPS57149158A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161557U (en) * 1984-03-31 1985-10-26 ホ−ヤ株式会社 Polishing cloth dressing tool
JPS6295865U (en) * 1985-12-04 1987-06-18
JPS642858A (en) * 1987-03-02 1989-01-06 Rodeele Nitta Kk Material and method for seasoning polishing pad
JPS6451267A (en) * 1987-08-21 1989-02-27 Rodeele Nitta Kk Seasoning device for abrasive pad
JPH01103260A (en) * 1987-10-14 1989-04-20 Hitachi Ltd Wafer polishing device
JPH04105977U (en) * 1991-02-22 1992-09-11 日機装株式会社 Compression coil spring support structure
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5531635A (en) * 1994-03-23 1996-07-02 Mitsubishi Materials Corporation Truing apparatus for wafer polishing pad
EP0812656A2 (en) * 1992-09-24 1997-12-17 Ebara Corporation Dressing device for dressing a polishing pad in a lapping machine
US5779521A (en) * 1995-03-03 1998-07-14 Sony Corporation Method and apparatus for chemical/mechanical polishing
US5885140A (en) * 1996-05-29 1999-03-23 Speedfam Co., Ltd. Single-side abrasion apparatus with dresser
US5890951A (en) * 1996-04-15 1999-04-06 Lsi Logic Corporation Utility wafer for chemical-mechanical planarization
US6951507B2 (en) 1993-11-16 2005-10-04 Applied Materials, Inc. Substrate polishing apparatus
JP2013215885A (en) * 2013-06-24 2013-10-24 Nikon Corp Polishing device and dress method of polishing pad in the polishing device
CN109894975A (en) * 2017-12-07 2019-06-18 有研半导体材料有限公司 A kind of single side polishing machine deep bid repairs disk method

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161557U (en) * 1984-03-31 1985-10-26 ホ−ヤ株式会社 Polishing cloth dressing tool
JPS6295865U (en) * 1985-12-04 1987-06-18
JPS642858A (en) * 1987-03-02 1989-01-06 Rodeele Nitta Kk Material and method for seasoning polishing pad
JPS6451267A (en) * 1987-08-21 1989-02-27 Rodeele Nitta Kk Seasoning device for abrasive pad
JPH01103260A (en) * 1987-10-14 1989-04-20 Hitachi Ltd Wafer polishing device
JPH04105977U (en) * 1991-02-22 1992-09-11 日機装株式会社 Compression coil spring support structure
EP0812656A2 (en) * 1992-09-24 1997-12-17 Ebara Corporation Dressing device for dressing a polishing pad in a lapping machine
EP0812656A3 (en) * 1992-09-24 1998-07-15 Ebara Corporation Dressing device for dressing a polishing pad in a polishing machine
USRE38228E1 (en) 1992-09-24 2003-08-19 Ebara Corporation Polishing apparatus
US6951507B2 (en) 1993-11-16 2005-10-04 Applied Materials, Inc. Substrate polishing apparatus
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5531635A (en) * 1994-03-23 1996-07-02 Mitsubishi Materials Corporation Truing apparatus for wafer polishing pad
US5779521A (en) * 1995-03-03 1998-07-14 Sony Corporation Method and apparatus for chemical/mechanical polishing
US5890951A (en) * 1996-04-15 1999-04-06 Lsi Logic Corporation Utility wafer for chemical-mechanical planarization
US5885140A (en) * 1996-05-29 1999-03-23 Speedfam Co., Ltd. Single-side abrasion apparatus with dresser
JP2013215885A (en) * 2013-06-24 2013-10-24 Nikon Corp Polishing device and dress method of polishing pad in the polishing device
CN109894975A (en) * 2017-12-07 2019-06-18 有研半导体材料有限公司 A kind of single side polishing machine deep bid repairs disk method
CN109894975B (en) * 2017-12-07 2020-07-10 有研半导体材料有限公司 Method for repairing large disc of single-side polishing machine

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