JPS54112087A - Grinding stone for wafer bevel - Google Patents

Grinding stone for wafer bevel

Info

Publication number
JPS54112087A
JPS54112087A JP1923278A JP1923278A JPS54112087A JP S54112087 A JPS54112087 A JP S54112087A JP 1923278 A JP1923278 A JP 1923278A JP 1923278 A JP1923278 A JP 1923278A JP S54112087 A JPS54112087 A JP S54112087A
Authority
JP
Japan
Prior art keywords
grinding
grinding stone
grinding layer
notch
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1923278A
Other languages
Japanese (ja)
Inventor
Seiji Inokuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1923278A priority Critical patent/JPS54112087A/en
Publication of JPS54112087A publication Critical patent/JPS54112087A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PURPOSE: Rotating body of grinding stone is equipped with discontinued portion in its grinding layer. By doing so, ground tips of wafer is discharged from the discontinued portion in its grinding layer to the outside smoothly during the grinding stone rotation so as to reduce remarkably the clogging in grinding layer.
CONSTITUTION: Mild steel made rotating body 11 has a rotating part 12 which has some curvature in its inside and that the body 11 has a plural numbered profound notch 13 which is located right angle to a rotating surface. Then, a grinding layer 14 formed on the rotating surface 12 becomes discontinued by the notch 13. When semiconductor wafer is machined by the grinding stone for bevel thus formed, cutting tips of wafer can easily discharged outside through the notch 13 of the grinding stone during its rotation so that clogging in the grinding layer 14 and frequemcy of dressing can remarkably be reduced.
COPYRIGHT: (C)1979,JPO&Japio
JP1923278A 1978-02-22 1978-02-22 Grinding stone for wafer bevel Pending JPS54112087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1923278A JPS54112087A (en) 1978-02-22 1978-02-22 Grinding stone for wafer bevel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1923278A JPS54112087A (en) 1978-02-22 1978-02-22 Grinding stone for wafer bevel

Publications (1)

Publication Number Publication Date
JPS54112087A true JPS54112087A (en) 1979-09-01

Family

ID=11993628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1923278A Pending JPS54112087A (en) 1978-02-22 1978-02-22 Grinding stone for wafer bevel

Country Status (1)

Country Link
JP (1) JPS54112087A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994004319A2 (en) * 1992-08-19 1994-03-03 Klaus Voigt Grinding tool

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994004319A2 (en) * 1992-08-19 1994-03-03 Klaus Voigt Grinding tool
WO1994004319A3 (en) * 1992-08-19 1994-04-28 Klaus Voigt Grinding tool

Similar Documents

Publication Publication Date Title
JPS5429189A (en) Abrasive wheel for glinding purpose
JPS54112087A (en) Grinding stone for wafer bevel
JPS5429188A (en) Abrasive wheel for grinding machine and method of producing the same
JPS5783320A (en) Method of grinding trough of female screw
JPS5662753A (en) Surface grinder
JPS5253594A (en) Method of controlling grinding operation for internal grinding machine
JPS5351589A (en) Apparatus for controlling truing and dressing
JPS55106762A (en) Grinding method of glass side edge
JPS5741171A (en) Grindstone for grinding and cutting
JPS55144953A (en) Grinding method
JPS569172A (en) Diamond grindstone for surface grinder
JPS51147091A (en) Method for controlling grinding
JPS51140294A (en) Apparatus for compenstating for wearing down in grinding machine
JPS5463487A (en) Grinding
JPS55101358A (en) Grinding machine
JPS5639865A (en) Rotary grindstone
JPS563179A (en) Forming dressor
JPS5389089A (en) Method of dressing spherical surface grinder
JPS5339591A (en) Method of grinding outer surface of circular-section workpiece
JPS56126576A (en) Grinding method in dressing
JPS54131195A (en) Grinding of multi-layer grinding wheels
JPS538896A (en) Process for grinding spherical surface
JPS51143981A (en) Method of simultaneously truing and dressing grindstone
JPS55120966A (en) Grinding method
JPS55144951A (en) Grinding method